ATPL250AG55J19-Y - PLC MCU, SAMG55J19A + PL250A | Microchip
MPN: ATPL250AG55J19-Y β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.6 | $116.00 |
| 100 | $10.4 | $1,040.00 |
| 500 | $9.3 | $4,650.00 |
| 1,000 | $8.25 | $8,250.00 |
ATPL250AG55J19-Y Overview
An embedded-application-specific microcontroller is a device that augments a general-purpose MCU core with dedicated application hardware, so that a single chip can run user firmware and perform a specialized physical-layer task simultaneously. In this case the category sits within the hierarchy: embedded MCU -> ARM Cortex-M4 microcontroller -> application-specific MCU -> PLC SoC, with the PL250A block handling the proprietary PLC modulation and the SAMG55J19A handling the protocol stack and application code.
Key features include the PL250A-AKU-Y PLC modem function paired with the SAMG55J19A-MU MCU, LQFP surface-mount packaging, and tray packaging format as indicated by the -Y suffix. The MCU side is based on the Atmel/Microchip SAM G55 family, which provides an ARM Cortex-M4 core with DSP and floating-point instructions, suitable for running the PLC physical-layer algorithms and application stack on one die.
Technical depth: the integration of the PLC modem with the Cortex-M4 core removes the need for a separate host processor in power line communication nodes, reducing BOM count, board area, and inter-chip communication latency. The LQFP leaded package offers good solderability and simplified inspection compared with fine-pitch BGA alternatives.
Typical applications include smart energy metering, street lighting control, home automation gateways, and industrial power line networks, all of which require robust communication over existing mains wiring.
Design consideration: PLC designs require careful analog front-end coupling to the mains via a coupling transformer and protection network; follow the Microchip reference design for the PL250A signal path.
This page synthesizes distributor inventory data, packaging information, and sourcing guidance not consolidated in the manufacturer product listing.
Drop-in alternatives for ATPL250AG55J19-Y β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATPL250AG55J19-Y (same form factor and footprint) β differing in Core Processor.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATPL250A-G55J19AU
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATPL230A-G55J19AU
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATPL100A-AZU-Y
β Drop-Inβ In Stock
$9.49 / Unit
View Datasheet βATPL250AG55J19-Y Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | ATPL250AG55J19-Y |
| Base Product Description | PL250A-AKU-Y + SAMG55J19A-MU |
| Category | Embedded - Application Specific Microcontrollers |
| Applications | Power Line Communications |
| Core Processor | ARM Cortex-M4 (SAMG55J19A) |
| Package Family | LQFP |
| Packaging | Tray |
| Mounting Type | Surface Mount |
| PLC Standard | PL250A PLC modem (Microchip proprietary) |
ATPL250AG55J19-Y lqfp Pin Configuration Guide
Pin configuration for ATPL250AG55J19-Y (lqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATPL250AG55J19-Y.
Refer to the datasheet for full pin configuration.
Typical Applications
ATPL250AG55J19-Y is suitable for 6 applications: Smart Energy Metering, Street Lighting Control, Industrial Automation Networks, Home Automation Gateways, Solar Photovoltaic Monitoring, Building Management Systems.
Smart Energy Metering
The ATPL250AG55J19-Y fits smart energy metering because the PL250A PLC modem provides communication over existing mains wiring while the SAMG55J19A ARM Cortex-M4 core runs metering firmware and the PLC protocol stack on a single solution. In a typical node, the MCU samples energy measurements, computes billing-grade registers, and transmits them via the PL250A front end through a coupling transformer onto the 230/110 V mains. Quantified benefit: removing a separate host MCU reduces BOM count and board area, and the Cortex-M4 DSP capability accelerates metering math. Design consideration: PLC node certification depends on the modulation profile implemented, so align firmware with local regulatory requirements before deployment.
Recommended
Street Lighting Control
Street lighting control networks benefit from the ATPL250AG55J19-Y because power line communication avoids installing dedicated RF or data cabling across municipal lighting circuits. The PL250A modem section drives and receives PLC signals on the lighting mains, while the SAMG55J19A Cortex-M4 core executes lighting schedules, dimming control, and reporting firmware locally. In this topology each luminaire controller is addressed over the power line, and the Cortex-M4 DSP instructions help with real-time signal processing. A quantified trade-off: PLC data rates are lower than wireless backhaul, so firmware should minimize payload sizes, but reliability in metal-dense outdoor environments is typically higher than RF alternatives.
Recommended
Industrial Automation Networks
In industrial automation, the ATPL250AG55J19-Y enables control and status communication over factory power distribution lines where RF propagation is degraded by metal machinery. The SAMG55J19A ARM Cortex-M4 MCU hosts the application logic and sensor interfaces while the PL250A modem handles the PLC physical layer through a coupling network on the industrial mains. The integrated architecture reduces latency compared with two-chip MCU-plus-modem designs because there is no external host-to-modem serial link. Performance consideration: industrial environments introduce impulsive noise on the mains, so the PL250A error-handling features should be enabled and coupling transformers rated for the local voltage class must be used.
Recommended
Home Automation Gateways
Home automation gateways use the ATPL250AG55J19-Y to bridge smart-home devices that communicate over in-house mains wiring to a central controller. The PL250A PLC modem manages node discovery and data transfer on the residential power network, and the SAMG55J19A Cortex-M4 core with floating-point and DSP support runs the gateway protocol translation. Compared with wireless-only gateways, power line communication reaches appliances behind metal enclosures and basement distribution boards where RF is weak. A quantified design note: household appliances create burst noise on the mains, so the PL250A retry and channel-adaptation features materially improve delivered throughput, and firmware should schedule bulk transfers during low-noise periods.
Recommended
Solar Photovoltaic Monitoring
Solar photovoltaic installations can use the ATPL250AG55J19-Y for panel-level and string-level monitoring where DC wiring between junction boxes and the inverter doubles as a communication medium. The PL250A modem transmits voltage, current, and temperature telemetry over the existing PV wiring, while the SAMG55J19A Cortex-M4 MCU aggregates sensor data and handles the communication schedule. This reduces cabling cost versus a dedicated RS-485 bus across rooftop installations. Performance trade-off: PLC over DC PV wiring requires coupling capacitors rated for the DC string voltage, and shadow-induced load changes on the string can modulate the channel, so the modem adaptation algorithms should be enabled for reliable links.
Recommended
Building Management Systems
Building management systems use the ATPL250AG55J19-Y to connect HVAC controllers, occupancy sensors, and energy submeters over a building's existing power distribution network. The SAMG55J19A ARM Cortex-M4 core runs the node application and reports to a central BMS controller, while the PL250A PLC modem carries the data over mains wiring, avoiding costly structured cabling retrofits in older buildings. The single-solution architecture means each node needs only one main controller rather than separate MCU and modem ICs, cutting BOM cost per node. Deployment consideration: three-phase distribution splits the PLC network into phase segments, so coupling across phases or careful node placement on the target phase is required for full coverage.
Recommended
Recommended Products Summary
Engineering reference data for ATPL250AG55J19-Y β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATPL250A-G55J19AU | ATPL230A-G55J19AU | ATPL100A-AZU-Y |
|---|---|---|---|---|
| Package | LQFP | LQFP-64 - same | LQFP-64 - same | LQFP - same family |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Atmel / Microchip Technology |
| PLC Modem Generation | PL250A | PL250A | ATPL230A (older generation) | ATPL100A (obsolete generation) |
| Application Domain | Power Line Communications | Power Line Communications | Power Line Communications | Power Line Communications |
Key Differentiators
- Integrated PLC modem plus Cortex-M4 on one solution (vs ATPL100A-AZU-Y)
- Active lifecycle status (vs ATPL100A-AZU-Y)
- Trade-off: proprietary PLC profile limits second sources (vs ATPL230A-G55J19AU)
Design Notes
The ATPL250AG55J19-Y integrates a PLC modem whose analog front end is noise-sensitive. Keep the coupling transformer, protection network, and modem analog pins on a clean ground area separated from the MCU switching domain, and follow the Microchip PL250A reference design for the mains-coupling network. LQFP gull-wing leads simplify inspection, but the LQFP land pattern should follow the datasheet footprint dimensions exactly since this part is not footprint-compatible with other PLC solutions.
Because the ATPL250AG55J19-Y is a solution-level part number combining the PL250A-AKU-Y and SAMG55J19A-MU, firmware teams sometimes order the wrong variant by quoting only the base part number. Always quote the complete MPN including the -Y packaging suffix. Additionally, the related ATPL100A family is obsolete; do not qualify it into new designs, and qualify supply continuity for the ATPL250A family directly with Microchip before committing production volume.
Estimated: PLC transmit bursts draw significantly higher peak current than the MCU core alone, since the PL250A front end drives the coupling network during transmission. Size the local regulator and input bulk capacitance for the PLC transmit peak current, not just the Cortex-M4 average current, and add local decoupling at the analog supply pins to prevent transmit bursts from resetting the MCU. Confirm exact peak current figures from the PL250A/SAM G55 datasheets before finalizing the power budget.
Compliance Information
Compliance data was not present in the verified web data for this MPN; consult the Microchip product page or datasheet for RoHS/REACH declarations.
