ATSAM3N00BA-MUR - ARM Cortex-M3 48MHz MCU 16KB Flash | Microchip
MPN: ATSAM3N00BA-MUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.32 | $3.32 |
| 10 | $3.1 | $31.00 |
| 100 | $2.85 | $285.00 |
| 500 | $2.6 | $1,300.00 |
| 1,000 | $2.4 | $2,400.00 |
ATSAM3N00BA-MUR Overview
An ARM Cortex-M3 based MCU is a 32-bit reduced-instruction-set (RISC) processor core implementing the ARMv7-M architecture, which combines efficient thumb-2 instruction execution with a nested vectored interrupt controller (NVIC) for deterministic, low-latency interrupt handling. Within the embedded system hierarchy, the MCU sits at the control layer above discrete logic and below application processors, integrating CPU, Flash, SRAM, peripherals, and clocking into a single chip for cost-sensitive embedded control.
Key differentiating specifications of the ATSAM3N00BA-MUR include its 48 MHz maximum core frequency, 16 KB (16K x 8) Flash memory, 4 KB SRAM, and the compact 64-QFN (9x9 mm) surface-mount package with exposed thermal pad. The -MUR suffix denotes tape-and-reel packaging for automated high-volume assembly, and the device is specified for industrial temperature-grade operation.
Architecturally, the SAM3N series is Microchip's entry-level, general-purpose Cortex-M3 family, focusing on low power consumption and a rich peripheral set rather than the higher integration of the SAM4 series. The Cortex-M3 core executes the Thumb-2 instruction set, delivering high code density that is particularly valuable in Flash-constrained designs like this 16 KB part.
Typical applications include industrial control nodes, consumer appliances, metering front-ends, and portable battery-powered devices where a small footprint, low power, and adequate 48 MHz processing headroom are required without the cost of larger Flash densities.
When designing with this MCU, budget Flash carefully: 16 KB must hold the application plus an optional small bootloader, so use size-optimized (-Os) compilation and consider the pin-compatible larger-memory SAM3N family members for future headroom.
This page synthesizes distributor pricing, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for ATSAM3N00BA-MUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3N00BA-MUR (same form factor and footprint) β differing in Core Processor, Operating Temperature, Package, Packaging.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM3N004BA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N002BA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM3N001BA-MUR
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
ATSAM4S16BA-MUR
β Drop-Inπ Reference alternative (not in catalog)
ATSAM4LS4AA-AUR
β Drop-Inβ In Stock
$3.98 / Unit
View Datasheet βATSAM3N00BA-MUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 48 MHz |
| Program Memory Size | 16 KB (16K x 8) FLASH |
| SRAM Size | 4 KB |
| Series | SAM3N |
| Package | 64-QFN (9x9 mm), exposed pad |
| Package Code (JEDEC style) | HVQCCN |
| Mounting Type | Surface Mount |
| Number of Terminals | 64 |
| Operating Temperature | -40C to +85C (Industrial) |
| Packaging | Tape & Reel (MUR suffix) |
| RoHS Status | RoHS compliant (Green package per Utmel listing) |
ATSAM3N00BA-MUR hvqccn Pin Configuration Guide
Pin configuration for ATSAM3N00BA-MUR (hvqccn package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3N00BA-MUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3N00BA-MUR is suitable for 6 applications: Industrial Control Nodes, Consumer Appliances, Metering and Utility Front-Ends, Portable Battery-Powered Devices, Building Automation Sensors, Embedded Peripheral Bridges.
Industrial Control Nodes
The ATSAM3N00BA-MUR fits industrial control and monitoring nodes where a 48 MHz Cortex-M3 provides ample processing for control loops, sensor acquisition, and communication protocol handling, while the industrial -40C to +85C temperature rating guarantees reliability on the factory floor. In a typical node, the MCU reads analog sensors through its peripheral channels, executes a fixed-point control algorithm within its 4 KB SRAM, and reports status over UART or I2C. The 16 KB Flash is sufficient for compact control firmware compiled with size optimization, and the 64-QFN 9x9 mm footprint keeps the controller section small on dense IO boards. Because the SAM3N family scales pin-to-pin to larger Flash variants, designers can reuse the PCB for richer firmware later without relayout.
Recommended
Consumer Appliances
White goods, small kitchen appliances, and HVAC controls benefit from the ATSAM3N00BA-MUR's combination of adequate 48 MHz processing, low system cost near $3.32 per unit, and a compact 64-QFN package that fits tight control PCBs behind user panels. The Cortex-M3 core handles touch-debounce, state machines, and display refresh concurrently under the nested vectored interrupt controller, while 16 KB Flash holds appliance firmware including simple UI logic and safety interlocks. The exposed-pad QFN provides good thermal and grounding behavior for EMI-sensitive motor-adjacent environments. The MUR tape-and-reel format supports high-volume automated assembly lines typical of appliance manufacturing, and distributor stock above 5,000 pieces eases production planning.
Recommended
Metering and Utility Front-Ends
Utility metering equipment, including energy, water, and heat meters, uses the ATSAM3N00BA-MUR as the computation core that accumulates sensor pulses, executes metering algorithms, and drives communication interfaces for data collection. The 32-bit Cortex-M3 at 48 MHz executes fixed-point accumulation and CRC/checksum computations efficiently, while the 16 KB Flash accommodates metrology firmware with communication stacks kept lean. The industrial temperature grade supports outdoor and unconditioned installations, and the low-power-oriented SAM3N architecture suits battery-backed meter operation between wake events. The 9x9 mm 64-QFN package allows two-sided PCB placement in compact meter housings, and the same-package SAM3N family enables memory upgrades if metering features expand.
Recommended
Portable Battery-Powered Devices
Handheld instruments, remote controls, and portable data loggers take advantage of the SAM3N series' low-power design philosophy and the ATSAM3N00BA-MUR's small, efficient footprint. The Cortex-M3 core delivers high performance per clock, letting the device finish tasks quickly and return to low-power wait states, which directly extends battery life compared to slower cores staying active longer. Four KB of SRAM is sufficient for buffering sensor samples and protocol frames in logging applications, and 16 KB Flash suits compact firmware. The 64 GPIO-capable pins provide flexibility for keys, indicators, and multiple sensor buses in a single 9x9 mm chip. Exact sleep-mode currents should be confirmed from the Microchip datasheet during the power budget phase.
Recommended
Building Automation Sensors
Occupancy sensors, thermostats, and environmental monitoring nodes in building automation systems map well to the ATSAM3N00BA-MUR. The MCU samples temperature, humidity, or PIR sensors on its peripheral channels, applies threshold or simple PI compensation logic, and communicates over serial buses to room controllers. The 48 MHz Cortex-M3 comfortably handles multiple concurrent tasks under interrupt, the industrial -40C to +85C rating covers unconditioned ceiling and rooftop installations, and the 16 KB Flash holds sensor plus communication firmware. The 64-QFN 9x9 mm package minimizes sensor-node PCB area for cost-effective volume manufacturing, and the RoHS-compliant green package supports the environmental requirements of commercial building certifications.
Recommended
Embedded Peripheral Bridges
The ATSAM3N00BA-MUR serves effectively as a protocol bridge or translator between systems using different serial interfaces, for example connecting a legacy UART device to an I2C or SPI-based host. The 48 MHz Cortex-M3 processes buffering, framing, and error checking with deterministic latency via the NVIC, while 4 KB SRAM provides dual buffers for store-and-forward translation. Its 16 KB Flash leaves room for a small configuration bootloader, and the 64-pin package exposes enough GPIO for handshake, flow-control, and status signaling lines. Because the device is field-programmable via the SAM-BA bootloader, bridge behavior can be updated in the field without desoldering, an advantage in installed infrastructure equipment.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3N00BA-MUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3N004BA-MUR | ATSAM3N002BA-MUR | ATSAM3N001BA-MUR | ATSAM4S16BA-MUR | ATSAM4LS4AA-AUR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M3 | ARM Cortex-M4 | ARM Cortex-M4 |
| Packaging Format | Tape & Reel (MUR) | Tape & Reel (MUR) | Tape & Reel (MUR) | Tape & Reel (MUR) | Tape & Reel (MUR) | Tape & Reel (AUR) |
Key Differentiators
- Lowest cost-per-feature in the same footprint (vs ATSAM4S16BA-MUR)
- Guaranteed pin-compatible memory scaling (vs ATSAM3N004BA-MUR)
- Mature low-power entry platform (vs ATSAM4LS4AA-AUR)
Design Notes
Estimated: budget the 3.3V rail for the MCU core and I/O per the SAM3N datasheet supply table (exact figures not in retrieved web data). Place a 100 nF ceramic decoupling capacitor at each supply pin pair plus a 10 uF bulk capacitor near the 64-QFN exposed pad. The exposed pad should be soldered to a ground pour for both thermal dissipation and low-inductance grounding - omitting the exposed-pad connection is a common reliability failure on QFN packages. Verify sleep-mode current in firmware by measuring board current in each power mode.
The 9x9 mm 64-QFN footprint requires a 0.5 mm pitch land pattern per the Microchip datasheet mechanical drawing; use non-solder-mask-defined pads and via-in-pad or perimeter vias to tie the exposed pad to the ground plane. Keep the SWD debug pins (SWCLK/SWDIO) accessible on test points even in production boards, since the 16 KB Flash leaves no room for extensive debug instrumentation in firmware. Program the device in-circuit through SAM-BA or SWD before final conformal coating.
With only 16 KB Flash, code size is the top project risk: enable compiler size optimization (-Os), avoid heavyweight RTOS ports, and check the linker map early. If a bootloader is planned, reserve its Flash region up front (for example 4 KB) since retrofitting one into a full image is not possible. Confirm pin multiplexing assignments against the SAM3N alternate-function tables before routing - GPIO functions are configured at run time through the PIO controller, and two peripherals often share one pin.
Compliance Information
Listed as 'QFN, GREEN, IND TEMP, MRL' in comparison data, indicating Microchip green/RoHS packaging. Formal REACH and conflict-minerals declarations must be obtained from Microchip product compliance documents.
