ATSAM3N1CA-CU - 48MHz Cortex-M3 MCU | Microchip | 100-TFBGA
MPN: ATSAM3N1CA-CU ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ATSAM3N1CA-CU Overview
A microcontroller is a programmable integrated circuit that combines a processor core, memory, peripherals, and I/O in one package. The ATSAM3N1 belongs to the SAM3N family, a reduced-cost branch of the SAM3 series. According to the manufacturer documentation, the SAM3N family provides a migration path from SAM3S devices and is pin-to-pin compatible with the SAM3S family, supporting design consolidation while controlling component cost.
Key features include an ARM Cortex-M3 revision 2.0 core running to 48 MHz, the Thumb-2 instruction set, a 24-bit SysTick counter, and a Nested Vector Interrupt Controller. The device provides 64 KB of Flash program memory, 8 KB of RAM, 79 I/O, and connectivity including I2C, SPI, UART/USART, and IrDA. These resources support moderate real-time workloads without requiring a larger external-memory interface.
The Cortex-M3 architecture provides deterministic interrupt handling and efficient 32-bit processing while retaining a straightforward firmware-development model. Its integration of communications peripherals reduces the need for external interface controllers, while the 100-TFBGA package supports dense boards where connector count and placement flexibility are important. The verified distributor data also identifies the part in a 100-TFBGA package, although one result labels the case as 100-TQFP; package-specific mechanical drawings should therefore be checked against the exact ordering code before layout.
Typical applications include industrial controllers, compact sensor nodes, building-automation equipment, serial gateways, and cost-sensitive consumer devices. The ATSAM3N1CA-CU is particularly appropriate when firmware and peripheral requirements fit within 64 KB of Flash and 8 KB of SRAM, and when PCB area favors a 9 x 9 mm BGA package over a leaded package.
Designers should plan decoupling close to the supply pins, validate the exposed-pad thermal path, and use a package-specific footprint and pin-assignment library. Before committing to a drop-in substitution, verify supply voltage, peripheral mix, pin mapping, flash/RAM capacity, and migration notes because compatibility within the SAM3N family does not by itself establish compatibility with every unrelated microcontroller.
Drop-in alternatives for ATSAM3N1CA-CU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3N1CA-CU (same form factor and footprint) — differing in Package, Interrupt Controller, Number of I/O, Core Processor, Program Memory Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3N1CA-AU
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →ATSAM3N0CA-CU
✅ Drop-In✓ In Stock
$4.21 / Unit
View Datasheet →ATSAM3S1CA-CU
✅ Drop-In✓ In Stock
$3.05 / Unit
View Datasheet →ATSAM3N1CA-CU Maximum Ratings & Electrical Characteristics
| Processor Core | ARM Cortex-M3 revision 2.0 |
| Maximum CPU Frequency | 48 MHz |
| Architecture | 32-bit ARM |
| Instruction Set | Thumb-2 |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 8 KB (8K x 8) |
| Number of I/O | 79 |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Oscillator Type | Internal |
| SysTick Counter | 24-bit |
| Interrupt Controller | Nested Vector Interrupt Controller |
| Serial Interfaces | I2C, SPI, UART/USART, IrDA |
| Package | 100-TFBGA (9 x 9 mm) |
| Mounting Type | Surface Mount |
| Tube Packaging | Tube |
ATSAM3N1CA-CU 100-tfbga (9 x 9 mm) Pin Configuration Guide
Pin configuration for ATSAM3N1CA-CU (100-tfbga (9 x 9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3N1CA-CU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3N1CA-CU is suitable for 6 applications: Cost-Sensitive Industrial Control, Serial Communication Gateway, Compact Sensor and IoT Node, Battery-Powered Embedded Instrument, Building Automation Module, Consumer Control and HMI.
Cost-Sensitive Industrial Control
The ATSAM3N1CA-CU fits compact industrial-control modules that need deterministic 32-bit processing without a large external-memory subsystem. Its ARM Cortex-M3 core operates up to 48 MHz, while 64 KB of Flash and 8 KB of SRAM support firmware, state handling, and communication tasks. The 1.62 V to 3.6 V operating range suits low-voltage control rails, and 79 I/O provides connectivity for sensors, actuators, and status indicators. Its 100-TFBGA package also reduces board area, although production assembly requires suitable BGA inspection and rework capability. Because the verified operating-temperature limit is unavailable, the selected suffix must be checked against the equipment enclosure's thermal environment before release.
Recommended
Serial Communication Gateway
The ATSAM3N1CA-CU is well matched to a protocol-conversion gateway because it combines I2C, SPI, UART/USART, and IrDA interfaces with a 48 MHz Cortex-M3 processor. Firmware can bridge sensor, actuator, and host-controller traffic while the 24-bit SysTick counter and Nested Vector Interrupt Controller support time-based and event-driven service routines. The 100-TFBGA package helps minimize the footprint of a gateway intended for a densely populated control cabinet. The 64 KB Flash limit should be monitored when several protocol stacks and buffers are required, since 8 KB of SRAM may constrain concurrent communication workloads.
Recommended
Compact Sensor and IoT Node
ATSAM3N1CA-CU can serve as the controller in a compact sensor node that gathers measurements through I2C or SPI and forwards information through UART/USART. Its 48 MHz ARM Cortex-M3 core offers more headroom than an 8-bit architecture while retaining 64 KB of Flash and 8 KB of SRAM for constrained embedded software. The 1.62 V to 3.6 V supply range supports integration with low-voltage sensors and radio modules, while the 9 x 9 mm TFBGA minimizes board area. Designers should budget I/O, current, and antenna-routing space around the MCU and confirm the thermal grade for outdoor or industrial deployments.
Recommended
Battery-Powered Embedded Instrument
The ATSAM3N1CA-CU is suitable for a battery-powered embedded instrument when a low-voltage supply and compact PCB are priorities. Operation from 1.62 V to 3.6 V allows the MCU to share a regulated low-voltage rail with compatible peripherals, and the Cortex-M3 core can perform protocol handling, measurement control, and local user-interface tasks at up to 48 MHz. The absence of a larger external-memory interface keeps the bill of materials focused, but the 8 KB SRAM and 64 KB Flash capacities must be included in firmware planning. For energy-sensitive products, compare the MCU's active and sleep-mode consumption against the complete load-switching and sensor power budget.
Recommended
Building Automation Module
The ATSAM3N1CA-CU can implement a space-constrained building-automation module that coordinates sensors, actuators, and local communications. I2C is useful for low-speed peripherals, SPI supports faster local devices, and UART/USART provides a path to controllers or service interfaces. With 79 I/O, the device can consolidate several discrete functions in one 100-TFBGA device, although final pin allocation must be checked against the exact peripheral instance list. The 1.62 V to 3.6 V range fits centralized low-voltage power, while 64 KB Flash and 8 KB RAM suit moderate protocol stacks. Confirm the device's temperature grade for unheated or outdoor installations.
Recommended
Consumer Control and HMI
ATSAM3N1CA-CU can support compact consumer controls that combine touch or switch inputs, indicators, and a serial host interface. The 48 MHz Cortex-M3 processor provides efficient handling of debouncing, UI states, and communication tasks, while I2C and SPI permit connection to display or sensor peripherals. Its 100-TFBGA footprint is attractive for miniaturized products and provides 79 I/O for mixed signal functions. The 64 KB Flash and 8 KB SRAM must be sized before adding graphical interfaces or large protocol libraries. Assembly yield, board-level storage availability, and the unverified operating-temperature range remain important checks for a high-volume consumer design.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3N1CA-CU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3N1CA-AU | ATSAM3N0CA-CU | ATSAM3S1CA-CU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9 x 9 mm) | 100-TFBGA (9 x 9 mm) - same | 100-TFBGA (9 x 9 mm) - same | 100-TFBGA (9 x 9 mm) - same |
| Maximum Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
Key Differentiators
- Cost-focused SAM3N integration (vs ATSAM3S1CA-CU)
- 48 MHz Cortex-M3 performance with compact memory (vs ATMEGA328-AU)
- Multiple integrated serial interfaces (vs ATMEGA8U2-MU)
Design Notes
Use the exact 100-TFBGA CA-package footprint and pin map from the manufacturer mechanical drawing. Place the required input and output decoupling capacitors close to their associated power balls, connect the exposed thermal pad through a low-impedance ground pour, and preserve the package-defined keepout. Although one aggregated result labels the case as 100-TQFP, DigiKey, Heisener, and the Atmel-branded technical data identify ATSAM3N1CA-CU as a 100-TFBGA; do not release a footprint from the conflicting aggregation label.
Route I2C and SPI away from switching-node and high-current return paths, and keep clock and high-speed signal traces short where possible. Provide a continuous ground reference under the device, minimize loop area around serial lines, and follow the datasheet recommendations for analog and oscillator layout if those pins are used. The 9 x 9 mm TFBGA is compact, so small routing errors can couple communication errors or interrupt the 48 MHz system operation.
Validate firmware size and RAM demand before committing to the 64 KB Flash and 8 KB SRAM limits. The part includes I2C, SPI, UART/USART, and IrDA, but not every software feature or peripheral instance must be assumed to match another family member. For a SAM3S or SAM3N0 migration, compare the complete ordering information, peripheral tables, startup code, and pin multiplexing; the verified manufacturer statement establishes SAM3N-to-SAM3S pin compatibility but does not prove complete functional equivalence.
Plan the supply network for 1.62 V to 3.6 V operation and ensure all connected peripherals share compatible voltage levels or appropriate level translation. Confirm the operating-temperature grade, active current, and sleep behavior from the manufacturer datasheet because those values are not present in the supplied search excerpts. A production design should also include brownout, reset, clock, and power-sequence validation across the complete rail range rather than testing only at a nominal 3.3 V supply.
Compliance Information
The supplied verified results do not explicitly establish RoHS, REACH, lead-free, halogen-free, or conflict-minerals status. AEC-Q100 is not applicable to this general-purpose microcontroller based on the supplied data.
