Microchip Technology

ATSAM3N0CA-CU - ARM Cortex-M3 48MHz MCU 32KB Flash | Microchip

MPN: ATSAM3N0CA-CU βœ“ Active
In Stock Ships in 1-3 business days
1.62 V to 3.6 V Vdss 100-TFBGA (9x9 mm) Package 48 MHz Speed 32KB (32K x 8) Memory
From $4.21 USD / Unit
MOQ: 1 |
Price updated: 2026-09-19
Volume Pricing
Qty Unit Price Extended
1 $6.42 $6.42
10 $5.78 $57.80
100 $5.12 $512.00
500 $4.63 $2,315.00
1,000 $4.21 $4,210.00
ℹ️ All prices are in USD

ATSAM3N0CA-CU Overview

The Microchip Technology ATSAM3N0CA-CU is a 32-bit ARM Cortex-M3 flash microcontroller running at up to 48 MHz with 32KB Flash program memory and 8KB SRAM, housed in a 100-ball TFBGA (9x9 mm) package. Operating from a 1.62V to 3.6V supply (1.8V/2.5V/3.3V typical rails), it belongs to the SAM3N series of entry-level, general-purpose MCUs.

A flash microcontroller (MCU) is a single-chip embedded processor that integrates a CPU core, non-volatile program memory, SRAM data memory, and a rich set of peripherals onto one die. MCUs sit at the device level of the embedded-system hierarchy: microcontroller -> embedded processor -> system-on-chip, and they directly drive sensors, actuators, and communication links in end equipment.

Key features of the ATSAM3N0CA-CU include the ARM Cortex-M3 revision 2.0 core with Thumb-2 instruction set, a 24-bit SysTick counter, and a nested vector interrupt controller (NVIC). Peripherals and clocking support deterministic real-time behavior, while the green, halogen-free, RoHS-compliant TFBGA package conserves board area in dense layouts.

The SAM3N series is pin-to-pin compatible with the legacy SAM7S (48- and 64-pin versions) and with the SAM3S series (48-, 64- and 100-pin versions), enabling firmware and board reuse across migration paths. Microchip supports the family with a complete set of software libraries, project examples, and development tools, shortening design cycles.

Typical applications include consumer appliances, industrial sensing nodes, metering front ends, and PC peripherals where a balance of 48 MHz performance, low cost, and compact 100-ball packaging is required.

Design consideration: the 9x9 mm TFBGA requires controlled-impedance PCB fan-out and reflow assembly; verify your CMOS process capability and plan power decoupling on all VDD/VDDIO ball pairs before layout.

This page synthesizes distributor pricing context, drop-in same-family alternatives, and practical design notes not consolidated in the manufacturer datasheet.

Drop-in alternatives for ATSAM3N0CA-CU β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with ATSAM3N0CA-CU (same form factor and footprint) β€” differing in SRAM, Core Processor, Mounting Type, Instruction Set, Maximum Clock Speed.

Microchip Technology
SRAM: 24 KB (24K x 8)
Core Processor: ARM Cortex-M3 revision 2.0
Maximum Clock Speed: 48 MHz
Compare with ATSAM3N0CA-CU β†’
Microchip Technology
SRAM: 32 KB (32K x 8)
Core Processor: ARM Cortex-M3
Mounting Type: Surface Mount (BGA)
Compare with ATSAM3N0CA-CU β†’
Microchip Technology
SRAM: 48 KB
Core Processor: ARM Cortex-M3
Instruction Set: Thumb-2 (RISC)
Compare with ATSAM3N0CA-CU β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

ATSAM3N1CA-CU

βœ… Drop-In
πŸ“¦ 100-TFBGA (9x9 mm)
Flash 64KB vs 32KB (+100%), same 48 MHz Cortex-M3 core and 100-TFBGA ball map, pin-to-pin

πŸ“‹ Reference alternative (not in catalog)

ATSAM3N2CA-CU

βœ… Drop-In
πŸ“¦ 100-TFBGA (9x9 mm)
Flash 128KB vs 32KB (+300%), same family core/peripherals and identical 100-TFBGA footprint

πŸ“‹ Reference alternative (not in catalog)

ATSAM3N4CA-CU

βœ… Drop-In
Microchip Technology
πŸ“¦ 100-TFBGA (9x9 mm)
ARM Cortex-M3 revision 2.0 Β· 32-bit Β· 48 MHz Β· Thumb-2 Β· 256 KB (256K x 8) Β· 24 KB (24K x 8) Β· 79 Β· 1.62 V to 3.6 V

βœ“ In Stock

Contact for price

View Datasheet β†’

ATSAM3S4CA-CU

βœ… Drop-In
Microchip Technology
πŸ“¦ 100-TFBGA (9x9 mm)
ARM Cortex-M3 Β· 32-Bit Β· 64 MHz Β· 256 KB (256K x 8) Β· 48 KB Β· 1.62 V to 3.6 V Β· 1.08 V to 1.32 V (1.2 V nominal) Β· 100-TFBGA (9x9 mm)

βœ“ In Stock

$4.95 / Unit

View Datasheet β†’

ATSAM3S2CA-CU

βœ… Drop-In
Microchip Technology
πŸ“¦ 100-TFBGA (9x9 mm)
ARM Cortex-M3 Β· 32-bit Β· 64 MHz Β· 128 KB (128K x 8) Β· 32 KB (32K x 8) Β· 1.62 V to 3.6 V Β· 100-TFBGA (9x9 mm) Β· 100

βœ“ In Stock

$3.6 / Unit

View Datasheet β†’

ATSAM3N0CA-CU Maximum Ratings & Electrical Characteristics

Core Processor ARM Cortex-M3 (revision 2.0)
Core Size 32-bit
Maximum Clock Frequency 48 MHz
Flash Program Memory 32KB (32K x 8)
SRAM 8KB
Supply Voltage Range 1.62 V to 3.6 V
Typical Supply Rails 1.8 V / 2.5 V / 3.3 V
Series SAM3N
Instruction Set Thumb-2
SysTick Timer 24-bit
Interrupt Controller NVIC (Nested Vector Interrupt Controller)
Package 100-TFBGA (9x9 mm)
Pin-to-Pin Compatibility SAM7S (48/64-pin) and SAM3S (48/64/100-pin)
Mounting Type Surface Mount
RoHS Status Compliant (Green)
Supplier Device Package TFBGA-100

ATSAM3N0CA-CU tfbga-100 Pin Configuration Guide

Pin configuration for ATSAM3N0CA-CU (tfbga-100 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

tfbga-100 package pinout diagram for ATSAM3N0CA-CU

No detailed pinout data available for ATSAM3N0CA-CU.

Refer to the datasheet for full pin configuration.

Typical Applications

ATSAM3N0CA-CU is suitable for 6 applications: Industrial Sensing Nodes, Consumer Appliances, Metering Front Ends, PC Peripherals and HID Devices, Building Automation Actuators, Handheld Instrumentation.

🏭

Industrial Sensing Nodes

The ATSAM3N0CA-CU fits industrial sensor acquisition nodes that need deterministic 32-bit processing in a compact footprint. Its 48 MHz ARM Cortex-M3 core with Thumb-2 instructions and the nested vector interrupt controller provide responsive, prioritized interrupt handling for periodic ADC sampling and communication stacks, while the 32KB Flash and 8KB SRAM are sufficient for a slim RTOS-free control loop with a protocol stack. In a typical node the MCU polls analog front ends, applies filtering, and forwards data over UART/SPI/I2C links. The 9x9 mm 100-TFBGA conserves PCB area in dense DIN-rail or wall-mounted sensor housings, and the 1.62V-3.6V supply range tolerates industrial 3.3V rail variation.

πŸ”§

Consumer Appliances

White goods and small appliances need a low-cost controller that manages user interfaces, motor start logic, and safety interlocks. The ATSAM3N0CA-CU serves this role with its 48 MHz Cortex-M3 core delivering headroom over 8-bit MCUs while remaining at the entry level of the SAM3N cost ladder. The 32KB Flash holds a UI state machine, button/encoder scanning, and display driving code, and the 8KB SRAM accommodates buffering without external memory. Its green, RoHS-compliant TFBGA-100 package meets consumer environmental directives, and pin-to-pin compatibility with SAM3S lets one PCB platform scale across appliance tiers by swapping memory-graded variants without layout changes.

⚑

Metering Front Ends

Electricity and utility meters benefit from the ATSAM3N0CA-CU's combination of 32-bit computation and small footprint. The Cortex-M3 core at 48 MHz executes metrology-related math, such as RMS accumulation and tariff accounting, faster than comparable low-cost MCUs, and the 24-bit SysTick timer provides a deterministic tick for sampling schedules. The 32KB Flash stores metrology firmware and calibration tables, and SRAM-backed accumulators survive normal operation. Because the SAM3N series is pin-to-pin compatible with SAM3S in the 100-pin version, meter platforms can migrate to analog-enhanced SAM3S variants as metrology requirements grow, protecting the PCB investment across product generations.

πŸ–₯️

PC Peripherals and HID Devices

Keyboards, presentation controllers, and other HID-class peripherals need quiet, efficient firmware execution with minimal board space. The ATSAM3N0CA-CU's 48 MHz Cortex-M3 handles scan matrices, debouncing, and report assembly with large timing margins, while its 32KB/8KB memory pair matches the footprint of lean USB-class firmware. The 100-ball TFBGA allows routing beneath the device, freeing outer board layers for the USB differential pair and LED driving circuitry. The industrial temperature grade provides margin for peripherals that sit near warm host electronics, and the device's low-cost tier keeps the bill of materials competitive in consumer accessory markets.

🏭

Building Automation Actuators

Dampers, valve actuators, and relay-control nodes in building automation use the ATSAM3N0CA-CU as the local control processor. The NVIC-based interrupt architecture supports precise PWM generation for motor drive and periodic scheduling of bus communication, while the 48 MHz core executes PID loops with ample cycle margin. Its 1.62V-3.6V operating range aligns with 3.3V logic used by RS-485 transceivers and room-controller links. The compact 9x9 mm TFBGA enables dense actuator PCBs, and the SAM3N-to-SAM3S pin compatibility documented by Microchip allows a single actuator board design to serve economy (SAM3N0) and premium (SAM3S4, richer analog) product lines.

πŸ”§

Handheld Instrumentation

Portable meters and diagnostic tools pair the ATSAM3N0CA-CU with battery-fed 3.3V rails. The device's supply range of 1.62V-3.6V maximizes usable battery voltage span, and the efficient Cortex-M3 core with Thumb-2 code density extends runtime compared with wider-instruction cores at equal performance. The 24-bit SysTick supports precise measurement timing, and the 32KB Flash accommodates data-logging plus display-driving firmware typical of handheld instruments. The 100-TFBGA's small 9x9 mm body helps meet slim enclosure targets, though designers must budget for BGA assembly in low-volume production, or use pin-compatible QFP SAM3N siblings for hand-assembly prototypes.

Recommended Products Summary

ATSAM3N1CA-CU Same-family drop-in with 64KB Flash for larger sensor firmware Used in: Industrial Sensing Nodes, PC Peripherals and HID Devices ATSAM3S4CA-CU Microchip Technology Used in: Industrial Sensing Nodes, Building Automation Actuators ATSAM3N2CA-CU Higher-flash drop-in for feature-rich appliance UI firmware Used in: Consumer Appliances, Handheld Instrumentation ATSAM3S2CA-CU Microchip Technology Used in: Metering Front Ends
What is the ATSAM3N0CA-CU and what are its key specifications?
The ATSAM3N0CA-CU is a 32-bit ARM Cortex-M3 flash microcontroller from Microchip Technology (originally Atmel) that runs at up to 48 MHz with 32KB Flash and 8KB SRAM. It operates from 1.62V to 3.6V and is packaged in a 100-ball TFBGA measuring 9x9 mm. According to the SAM3N family datasheet, it includes a 24-bit SysTick counter and an NVIC, and is pin-to-pin compatible with the SAM7S and SAM3S series, making it a compact, low-cost entry into the SAM3N MCU family.
Where can I download the ATSAM3N0CA-CU datasheet PDF?
The ATSAM3N0CA-CU datasheet, titled 'ARM-based Flash MCU' from Atmel Corporation (now Microchip Technology), is available in PDF form from datasheet archives such as alldatasheet.com and from the official Microchip product page. The document covers the full SAM3N series including the SAM3N0C variant, with the 60-page ARM-based Flash MCU document describing the core, memory map, peripherals, and the 100-TFBGA ball map for the -CU package.
What is the price of ATSAM3N0CA-CU and where can I buy it online?
ATSAM3N0CA-CU pricing varies by distributor; as of 2026-09-19, comparison sites such as Octopart list offers from 11 distributors, and Mouser and DigiKey Marketplace (Rochester Electronics) both carry stock or inventory listings. Typical single-unit pricing falls in the mid single-digit USD range, with meaningful discounts at 100+ pieces. For XAIPART's current quoted price, see the tier table on this page, which reflects bulk quantity breaks from 1 to 1000 pieces.
Is ATSAM3N0CA-CU in stock and what is the lead time?
Availability fluctuates because this SAM3N device is frequently sourced through the Rochester Electronics channel for legacy demand. DigiKey Marketplace lists it as 'ships today' through Rochester Electronics, and Mouser shows inventory, but lead times at other distributors can extend several weeks when allocation occurs. Buyers with production schedules should verify real-time stock at their preferred distributor and consider the pin-compatible, flash-larger ATSAM3N1CA-CU or ATSAM3N2CA-CU as alternates when SAM3N0CA availability is constrained.
What is the best drop-in replacement for ATSAM3N0CA-CU?
The best drop-in replacements are same-package 100-TFBGA members of the SAM3N family: ATSAM3N1CA-CU (64KB Flash) and ATSAM3N2CA-CU (128KB Flash) are pin-to-pin compatible in the 100-ball TFBGA footprint, so they solder onto the same land pattern without PCB rework. According to Microchip's family documentation, the SAM3N series facilitates migration within the family, meaning firmware compiled for the Cortex-M3 core requires only a linker-script and flash-size update when moving up the memory ladder.
What is the difference between ATSAM3N0CA-CU and ATSAM3N2CA-CU?
The primary difference is memory size: the ATSAM3N0CA-CU provides 32KB Flash and 8KB SRAM, while the ATSAM3N2CA-CU doubles and quadruples this to 128KB Flash with more SRAM, at the same 48 MHz Cortex-M3 core speed and identical 100-TFBGA package. Both share the same peripheral set and pin map, so the choice is purely a program-memory budget decision. If your compiled image plus reserve margin exceeds roughly 26KB, choose the SAM3N2CA; otherwise the SAM3N0CA offers the lowest cost point in the family.
ATSAM3N0CA-CU vs ATSAM3S4CA-CU - which is better for my application?
Both are 48 MHz Cortex-M3 MCUs in a pin-to-pin compatible 100-TFBGA footprint, so the PCB is identical. The ATSAM3S4CA-CU (SAM3S series) adds higher-specification analog peripherals and is aimed at applications needing richer on-chip analog integration, while the ATSAM3N0CA-CU is the entry-level, cost-optimized part with 32KB Flash versus the SAM3S4's larger memory. Choose the SAM3N0CA when cost and footprint dominate and 32KB/8KB suffices; choose the SAM3S4 when you need its additional flash and enhanced peripherals without changing the board.
When should I choose ATSAM3N0CA-CU over a larger SAM3N variant?
Choose the ATSAM3N0CA-CU when your firmware image fits comfortably within 32KB Flash and 8KB SRAM, since it is the lowest-cost 100-pin member of the SAM3N family. Its 48 MHz Cortex-M3 performance and compact 9x9 mm TFBGA suit cost-sensitive, space-constrained designs such as sensor nodes and consumer appliances. If your code size leaves less than about 20% headroom, or you plan OTA firmware expansion, select the pin-compatible ATSAM3N1CA-CU or ATSAM3N2CA-CU instead to avoid a costly memory-forced redesign later.
Can the ATSAM3N0CA-CU replace legacy AT91SAM7S parts?
Yes. According to Microchip's SAM3N family documentation, the SAM3N series is pin-to-pin compatible with the SAM7S legacy products in the 48- and 64-pin versions and with SAM3S in 48-, 64- and 100-pin versions, which facilitates migration. In the 100-TFBGA package the ATSAM3N0CA-CU shares the same ball map as corresponding SAM3S devices, and moving from ARM7TDMI-based SAM7S to Cortex-M3-based SAM3N gives the Thumb-2 instruction set, NVIC, and 24-bit SysTick with a firmware port rather than a hardware redesign.
Is there a cross-brand equivalent for the ATSAM3N0CA-CU in the same 100-ball BGA package?
No direct cross-brand drop-in equivalent is recommended. Competing Cortex-M3/M7 devices in TFBGA-100 packages, such as the Microchip ATSAME70N20B-CN or AT91SAM7X128B-CU, share the package style but are not pin-to-pin compatible with the SAM3N ball map, and third-party comparison listings (e.g., Avaq, Utmel) present them as parametric comparisons only, not drop-ins. Cross-brand MCU substitution generally requires PCB rework and firmware rewrite; for a true drop-in, stay within the Microchip SAM3N/SAM3S 100-pin family.
Hey Google, what can replace ATSAM3N0CA-CU?
You can replace the ATSAM3N0CA-CU directly with other 100-TFBGA SAM3N family members: the ATSAM3N1CA-CU (64KB Flash) and ATSAM3N2CA-CU (128KB Flash) are pin-to-pin drop-ins on the same board. The ATSAM3S series 100-pin parts are also pin-to-pin compatible per Microchip documentation. Outside the SAM3N/SAM3S family, no verified cross-brand pin-compatible replacement exists, so avoid designs that assume a generic BGA-100 Cortex-M3 footprint will match.
Is the ATSAM3N0CA-CU the same as the ATSAM3N0CB-CU?
The ATSAM3N0CA and related SAM3N0 variants belong to the same SAM3N series with the same 48 MHz Cortex-M3 core and 32KB Flash class, but suffix letters denote package and feature-step differences, so they are not guaranteed identical. The -CU suffix specifically identifies the green, RoHS-compliant 100-TFBGA package with industrial temperature range in this listing. Always confirm the exact ordering code against the Microchip ordering-information table in the SAM3N datasheet before substituting, because package code changes can alter the ball map.
How should I power the ATSAM3N0CA-CU on my PCB?
Power the ATSAM3N0CA-CU from a 1.62V to 3.6V supply, with 3.3V being the most common rail in SAM3N designs. Place a 100 nF ceramic decoupling capacitor at each VDD/VDDIO ball pair, as close to the balls as the fan-out allows, plus bulk 4.7 uF to 10 uF near the device. Because a 100-ball TFBGA has VDD and GND balls distributed across the array, follow the datasheet power-plane recommendations to keep supply impedance low, and confirm brown-out and supervisor settings in firmware for reliable reset behavior.
What PCB considerations does the 100-TFBGA package of the ATSAM3N0CA-CU require?
The 100-TFBGA (9x9 mm) uses a 0.8 mm ball pitch requiring a fan-out via-in-pad or dog-bone escape strategy on at least a 4-layer board for clean power and ground planes. Follow IPC assembly guidance for BGA reflow profiles and X-ray inspection. Provide keep-out clearance for under-package routing, and confirm your fabricator supports the ball-pad geometry from the SAM3N datasheet package drawing. Prototype builds should validate solder-joint reliability before volume production, since BGA rework is costly compared with QFP alternatives.
Is the ATSAM3N0CA-CU RoHS compliant and suitable for industrial temperature ranges?
Yes. The -CU suffix denotes a green, RoHS-compliant, halogen-free package; Mouser lists the part as 'BGA, Grn, IT, MRL A', where Grn indicates green packaging and IT indicates industrial temperature qualification. The device is lead-free and suitable for standard industrial assembly processes. For specific AEC-Q100 automotive qualification status, consult Microchip directly, since this commercial/industrial SAM3N grade is generally not the automotive-qualified variant of the family.

Engineering reference data for ATSAM3N0CA-CU β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the ATSAM3N0CA-CU when your firmware fits within 32KB Flash and 8KB SRAM with comfortable headroom and you want the lowest-cost 100-pin member of the SAM3N family in a compact 9x9 mm TFBGA. If code size approaches the limit, move up the pin-compatible ladder: ATSAM3N1CA-CU (64KB) for modest growth, ATSAM3N2CA-CU (128KB) for protocol-heavy firmware, or ATSAM3N4CA-CU (256KB) for maximum reserve - all on the same PCB with no layout change. If your application needs SAM3S enhanced analog peripherals, the ATSAM3S4CA-CU or ATSAM3S2CA-CU are datasheet-confirmed pin-compatible at 100 pins. Avoid cross-brand TFBGA-100 parts such as the AT91SAM7X128B-CU, which are package-similar but not drop-ins. For hand-assembled prototypes, consider SAM3N QFP variants; reserve the BGA for production boards with qualified BGA assembly.

Comparison with Alternatives

Parameter This Product ATSAM3N1CA-CU ATSAM3N2CA-CU ATSAM3N4CA-CU ATSAM3S4CA-CU
Package 100-TFBGA (9x9 mm) 100-TFBGA (9x9 mm) - same 100-TFBGA (9x9 mm) - same 100-TFBGA (9x9 mm) - same 100-TFBGA (9x9 mm) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core / Max Speed ARM Cortex-M3, 48 MHz ARM Cortex-M3, 48 MHz ARM Cortex-M3, 48 MHz ARM Cortex-M3, 48 MHz ARM Cortex-M3, 48 MHz
Flash Memory 32KB 64KB 128KB 256KB 256KB
Series / Analog Features SAM3N (entry level) SAM3N (entry level) SAM3N (entry level) SAM3N (top grade) SAM3S (enhanced analog)
Pin-to-Pin Compatibility SAM7S / SAM3S compatible Yes - same SAM3N family Yes - same SAM3N family Yes - same SAM3N family Yes - SAM3N pin-to-pin compatible with SAM3S 100-pin
RoHS / Green Package Compliant (Grn) Compliant (Grn, -CU suffix) Compliant (Grn, -CU suffix) Compliant (Grn, -CU suffix) Compliant (Grn, -CU suffix)

Key Differentiators

  • Lowest-cost memory grade with 100-pin scalability (vs ATSAM3N4CA-CU)
  • Pin-to-pin migration from legacy ARM7 designs (vs AT91SAM7X128B-CU)
  • Upgrade path with enhanced analog (vs ATSAM3S4CA-CU)

Design Notes

The 100-TFBGA (9x9 mm) uses a fine ball pitch that requires a 4-layer PCB with dedicated power and ground planes for reliable fan-out. Use dog-bone escapes or via-in-pad (with fill and plating) beneath the array, and confirm your fabricator's BGA capability and IPC-compliant reflow profile. BGA rework is expensive, so prototype the land pattern against the SAM3N datasheet package drawing before committing to the panel. If hand assembly or low-volume prototyping is planned, consider the pin-compatible SAM3N QFP siblings instead of the -CU BGA variant.

Power the ATSAM3N0CA-CU from a regulated 3.3V rail within the 1.62V-3.6V datasheet range. Decouple every VDD/VDDIO ball pair with 100 nF ceramics placed as close to the balls as the escape routing allows, and add 4.7 uF-10 uF of bulk capacitance near the device. Distribute ground return vias across the array so that I/O switching currents do not share high-impedance return paths. Verify brown-out detector thresholds against your supply's ramp and transient behavior so the core never executes from Flash during an undervoltage event.

A frequent migration mistake is assuming any 'BGA-100 Cortex-M3' shares the SAM3N ball map: devices such as the AT91SAM7X128B-CU or SAM E70 in TFBGA-100 are package-similar only and are NOT drop-ins. Restrict substitutions to SAM3N 100-pin family members or the datasheet-confirmed SAM3S 100-pin compatible parts. Also budget firmware size against the 32KB Flash with at least 20% headroom, and remember that -CU suffix ordering codes must match exactly, as other suffix letters denote different packages or temperature grades.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Unknown

Mouser lists the part as 'BGA, Grn, IT, MRL A' - Grn indicates green (halogen-free/lead-free) packaging and IT indicates industrial temperature. REACH and conflict-minerals status not stated in provided data.

Data verified on: 2026-09-19 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology Atmel Corporation ATSAM3N0CA-CU ATSAM3N1CA-CU ATSAM3N2CA-CU ATSAM3N4CA-CU ATSAM3S4CA-CU SAM3N series ARM Cortex-M3 microcontroller flash MCU TFBGA-100 BGA package RoHS NVIC Thumb-2 SysTick industrial sensing metering SAM7S SAM3S series Rochester Electronics DigiKey Mouser
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