ATSAM3S1BB-MU - 64MHz Cortex-M3 MCU 64KB Flash | Microchip
MPN: ATSAM3S1BB-MU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.58 | $1.58 |
| 10 | $1.46 | $14.60 |
| 100 | $1.32 | $132.00 |
| 500 | $1.21 | $605.00 |
| 1,000 | $1.12 | $1,120.00 |
ATSAM3S1BB-MU Overview
A microcontroller (MCU) is a single integrated circuit that combines a processor core, memory, and peripherals into one chip, forming the compute tier at the device level of an embedded system hierarchy: semiconductor -> microcontroller -> embedded system -> IoT device. The SAM3S series belongs to Microchip (formerly Atmel) ARM-based flash MCU portfolio and executes the Thumb-2 instruction set of the ARMv7-M architecture, giving designers high code density and deterministic interrupt handling for real-time applications.
Key differentiating features of the ATSAM3S1BB include a 64 MHz Cortex-M3 core with nested vectored interrupt controller (NVIC), a fast flash accelerator, an integrated USB 2.0 Full-Speed device port, and low-power operating modes suited to battery-powered designs. Peripherals typically include USART/UART channels, SPI, TWI (I2C), PWM timers, a 12-bit ADC, and a real-time timer/clock, enabling single-chip designs for sensing and control nodes.
The Cortex-M3 architecture pairs the 32-bit core with tightly coupled memory interfaces and hardware division, achieving efficient real-time performance without an external memory bus. Flash memory is programmed in-system via JTAG or SWD, and the SAM3S family shares a common peripheral set across density variants, simplifying firmware reuse and migration between 64 KB, 128 KB, and 256 KB memory options within the same 64-pin footprint.
Typical applications include industrial sensor nodes and HMI boards, consumer appliance control panels, USB-connected data loggers, and battery-powered metering products where 64 MHz performance, USB connectivity, and industrial temperature operation are required.
A key design consideration is power budgeting: the SAM3S provides multiple sleep and wait modes, and peripheral clock gating should be applied to minimize current draw; verify the exact current figures in the manufacturer datasheet before finalizing battery sizing.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet, providing engineers with a single citable reference for the ATSAM3S1BB-MU.
Drop-in alternatives for ATSAM3S1BB-MU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM3S1BB-MU (same form factor and footprint) — differing in Package, Flash Memory, ADC Resolution, Core Processor, Core Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM3S2BA-MU
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM3S4BA-MU
✅ Drop-In✓ In Stock
$5.12 / Unit
View Datasheet →ATSAM3N4BA-MU
✅ Drop-In✓ In Stock
$3.48 / Unit
View Datasheet →ATSAM3S8BA-MU
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.72 / Unit
View Datasheet →ATSAM3S1BB-MU Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Maximum Clock Frequency | 64 MHz |
| Flash Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Series | SAM3S |
| Package | 64-QFN (9 x 9 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | Industrial (-40C to +85C) |
| USB | USB 2.0 Full-Speed Device |
| Connectivity Peripherals | USB, SPI, UART/USART, TWI (I2C) |
| Program Memory Type | Flash |
| Package Color / Material | QFN, Green |
| MSL Rating | MRL B (per Mouser listing) |
| RoHS Status | Compliant (Green package) |
ATSAM3S1BB-MU qfn, green Pin Configuration Guide
Pin configuration for ATSAM3S1BB-MU (qfn, green package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM3S1BB-MU.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM3S1BB-MU is suitable for 6 applications: Industrial Sensor Nodes, USB Data Loggers, Consumer Appliance Control Panels, Battery-Powered Metering, IoT Edge Sensing and Actuation, Test and Measurement Accessories.
Industrial Sensor Nodes
The ATSAM3S1BB-MU fits industrial sensor acquisition nodes because its 64 MHz Cortex-M3 core delivers the real-time deterministic performance needed to time-sample ADC channels while servicing communication stacks, and its 64 KB Flash is sufficient for a sensing application with a slim RTOS or bare-metal firmware. In a typical node the MCU reads analog sensors via its ADC, applies filtering and scaling in firmware, and forwards processed data over UART, SPI, or I2C to a gateway. Industrial temperature rating (-40C to +85C per distributor listings) supports cabinet-mounted and outdoor installations. Low-power sleep modes reduce average current in periodically-waking nodes, extending battery life in metering-class deployments.
Recommended
USB Data Loggers
The integrated USB 2.0 Full-Speed device peripheral is the decisive feature for USB data-logger designs: the ATSAM3S1BB-MU can enumerate as a USB mass-storage or virtual COM-port device, streaming logged data directly to a PC without an external USB interface chip. Its 16 KB SRAM buffers burst-sampled data between USB transfers, while the 64 MHz core executes CRC and formatting tasks with ample margin. Compared with bit-banged USB solutions on smaller MCUs, hardware USB reduces firmware complexity and guarantees timing compliance with the USB specification. Firmware updates can also be delivered over the same USB link, simplifying field maintenance of deployed loggers in industrial and laboratory environments.
Recommended
Consumer Appliance Control Panels
Appliance control panels require an MCU that can drive displays, scan keypads, and manage actuators concurrently, which the ATSAM3S1BB-MU handles with its 64 MHz Cortex-M3 core and PWM/timer peripherals. The green QFN package supports lead-free consumer manufacturing requirements, and 64 KB Flash accommodates UI logic, menu structures, and communication routines with room for localization strings. TWI (I2C) and SPI interfaces connect EEPROM, display drivers, and touch controllers, while the ADC reads thermistors and user analog controls. Its SAM3S family membership lets manufacturers scale to 128 KB or 256 KB Flash variants (ATSAM3S2BA-MU/ATSAM3S4BA-MU) on the same PCB as feature sets grow across product tiers.
Recommended
Battery-Powered Metering
Metering products benefit from the ATSAM3S1BB-MU's combination of low-power operating modes, industrial temperature rating, and sufficient compute for measurement algorithms such as energy accumulation and tamper detection. The MCU sleeps between sample intervals, wakes on timer interrupts to read the ADC and update accumulation registers, and periodically reports via UART to a communication module. Because Metrology firmware must run continuously for years, peripheral clock gating and sleep-mode discipline are essential design practices with this device. The 64-pin QFN provides enough GPIO to drive segmented LCDs via external drivers and manage isolation and tamper-switch inputs, making it a compact single-chip measurement engine within a metering board.
Recommended
IoT Edge Sensing and Actuation
In IoT edge designs, the ATSAM3S1BB-MU commonly acts as the local sensing and actuation controller beneath a wireless module: it reads sensors through ADC, SPI, and I2C peripherals, runs threshold and control-loop logic on the 64 MHz core, and hands data to a radio module over UART. This split architecture keeps real-time duties on the deterministic Cortex-M3 while the module manages protocol complexity. The industrial temperature rating and green QFN package support both indoor smart-building nodes and light-industrial deployments. Firmware growth such as added security features can be absorbed by migrating to the pin-compatible, higher-Flash SAM3S variants without PCB redesign, protecting the hardware investment across product generations.
Recommended
Test and Measurement Accessories
Handheld and benchtop test accessories - probe interfaces, calibration pods, and small data-capture pods - use the ATSAM3S1BB-MU because it couples fast 12-bit-class ADC acquisition with USB connectivity for PC-based control and readout. The 64 MHz core executes trigger logic and time-stamping deterministically, an advantage over slower 8-bit controllers in timing-sensitive capture tasks. Firmware and calibration constants fit comfortably in 64 KB Flash, and the USB device port allows the same physical connector to serve as both programming interface (with appropriate bootloader) and instrument link. Industrial temperature operation keeps the pod usable on production floors and in environmental chambers where instruments are routinely pushed to their rating limits.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM3S1BB-MU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM3S2BA-MU | ATSAM3S4BA-MU | ATSAM3N4BA-MU | ATSAM3S8BA-MU |
|---|---|---|---|---|---|
| Package | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) - same | 64-QFN (9 x 9 mm) - same | 64-QFN (9 x 9 mm) - same | 64-QFN (9 x 9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
Key Differentiators
- Lowest Flash density = lowest cost in the SAM3S 64-pin family (vs ATSAM3S4BA-MU)
- USB 2.0 Full-Speed device integrated on-chip (vs ATSAM3N4BA-MU)
- Pin-compatible memory migration path (vs ATSAM3S2BA-MU)
Design Notes
The 64-QFN (9 x 9 mm) package uses a perimeter pad array with a central exposed thermal pad. Follow Microchip's recommended QFN land pattern: use thermal vias (typically a 3x3 or 4x4 via array) under the exposed pad, connected to a ground pour on inner or bottom layers to dissipate heat and provide a solid ground reference. Ensure the stencil aperture for the exposed pad is segmented (approximately 50-70% coverage) to avoid excessive solder paste and floating the package during reflow. Verify the exact land pattern dimensions against the Microchip package drawing in the official datasheet.
Decouple each VDD pin pair with 100 nF ceramic capacitors placed as close to the pins as possible, and add a bulk capacitor (4.7 uF to 10 uF) near the supply entry. The exact supply voltage range and current consumption must be taken from the SAM3S datasheet electrical characteristics table; the verified web data does not state these figures. Use the datasheet values to estimate power. Exploit the SAM3S peripheral clock gating: disable clocks to unused peripherals (USB, USARTs, timers) in the Power Management Controller to reduce current in active mode, and use sleep/wait modes for idle periods in battery applications.
Three common mistakes when migrating within the SAM3S 64-pin family: (1) assuming Flash size only differs - check the datasheet for SRAM and peripheral-count differences between SAM3S1B, SAM3S2B, and SAM3S4B before reusing firmware; (2) forgetting that bootloader and vector-table assumptions break when moving between memory densities; (3) treating cross-brand Cortex-M3 MCUs as drop-ins - they are not pin-compatible with this 64-QFN footprint despite similar functionality. Always download the current Microchip SAM3S datasheet and confirm the pin multiplexing table for your selected peripherals during schematic capture.
Compliance Information
Mouser listing describes the part as 'QFN, Green' and Partstack lists industrial temperature grade with HVQCCN package. REACH, halogen-free, and conflict-minerals status are not stated in the verified web data.
