EFM32TG840F32-QFN64 - 32MHz Cortex-M3 MCU | Silicon Labs
MPN: EFM32TG840F32-QFN64 ✓ ActiveEFM32TG840F32-QFN64 Overview
A microcontroller is a programmable system-on-chip that integrates a processor core, memory, digital I/O, timers, communication peripherals, and supporting power-management functions. The EFM32 Tiny Gecko belongs to the hierarchy of microcontroller ICs, embedded processors, and general-purpose semiconductors. Its ARM Cortex-M3 architecture provides a 32-bit instruction set and up to 32 MHz operating speed, while the energy-management architecture supports battery-operated and intermittently powered systems.
The EFM32TG840F32-QFN64 provides 32 KB of Flash for firmware and 4 KB of RAM for working data. Its 56 digital I/O pins support external sensors, displays, communication interfaces, and control signals. Two 16-bit timers add resources for periodic events, timing, input capture, or output comparison. The listed distributor records also identify the device as an LCD and AES MCU, indicating support for display-oriented and security-related application requirements.
The device is built around the low-power Tiny Gecko platform, which combines a conventional Cortex-M3 processing core with energy-saving modes and short wake-up times. This architecture is useful when the system spends much of its operating life in a low-power state and must resume measurement or control activity quickly. The 32 MHz maximum clock also provides sufficient performance for protocol handling, sensor fusion, user-interface logic, and supervisory tasks in compact embedded products.
Typical applications include battery-powered sensor nodes, industrial condition-monitoring equipment, building-control endpoints, portable health and wellness products, small motor-control systems, and low-power connected instruments. Designers should select the appropriate operating voltage, clock configuration, memory layout, and peripheral assignments from the manufacturer documentation before finalizing the PCB and firmware.
A critical hardware consideration is exposed-pad thermal management in the 64-QFN package. The exposed pad should be connected to the ground plane using the manufacturer’s recommended land pattern and thermal-via arrangement, while supply and ground connections should be routed to minimize noise and voltage loss.
This product page consolidates verified manufacturer and distributor information, practical package guidance, and an honest assessment of available drop-in alternatives. It also distinguishes verified facts from parameters that remain unavailable in the supplied source data, helping engineers avoid unsupported substitutions or assumptions.
Drop-in alternatives for EFM32TG840F32-QFN64 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
EFM32TG840F32-D-QFN64
✅ Drop-In📋 Reference alternative (not in catalog)
EFM32TG840F32-QFN64 Maximum Ratings & Electrical Characteristics
| Product Type | ARM Cortex-M3 Tiny Gecko Microcontroller |
| Processor Core | ARM Cortex-M3 |
| Architecture | 32-bit |
| Maximum CPU Frequency | 32 MHz |
| Flash Memory | 32 KB (32K x 8) |
| RAM Memory | 4 KB |
| Digital I/O Pins | 56 |
| Timer Count | 2 x 16-bit timers |
| Core Count | Single-core |
| Package | 64-QFN (9 x 9 mm) |
| Mounting Type | Surface mount |
| Supply Voltage | 2.5 V / 3.3 V |
| Application Feature | LCD MCU |
| Security Feature | AES MCU |
| Low-Power Features | Energy-saving modes and fast wake-up times |
EFM32TG840F32-QFN64 64-qfn (9 x 9 mm) Pin Configuration Guide
Pin configuration for EFM32TG840F32-QFN64 (64-qfn (9 x 9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EFM32TG840F32-QFN64.
Refer to the datasheet for full pin configuration.
Typical Applications
EFM32TG840F32-QFN64 is suitable for 6 applications: Battery-Powered Sensor Node, Industrial Condition Monitoring, Low-Power Connected Instrument, Portable Health and Wellness Device, Compact Motor and Actuator Controller, Building Control and Automation Endpoint.
Battery-Powered Sensor Node
The EFM32TG840F32-QFN64 fits battery-powered sensor nodes because its Tiny Gecko platform combines a 32 MHz ARM Cortex-M3 core with energy-saving modes and fast wake-up times. The 32 KB of Flash can hold acquisition, filtering, and low-power networking firmware, while 4 KB of RAM provides working space for sampled data and protocol state. Its 56 digital I/O pins provide flexible sensor, interrupt, and actuator connections. The principal design trade-off is that code size and runtime power must be controlled carefully: unused peripherals should be disabled, clocks should be gated where supported, and the system should spend as much time as practical in a low-energy state.
Recommended
Industrial Condition Monitoring
The EFM32TG840F32-QFN64 is suitable for industrial condition-monitoring endpoints that combine sensor acquisition, local filtering, status indication, and intermittent communications. Its 32-bit Cortex-M3 processor can operate up to 32 MHz, providing margin for digital filtering and protocol handling, while the 32 KB Flash and 4 KB RAM support a compact embedded application. The 56 digital I/O pins allow connection of digital sensors, alarm signals, and discrete controls. In an industrial installation, the designer should prioritize deterministic interrupt handling, robust input conditioning, and a conservative power budget because the supplied verified data does not establish the full operating-temperature range or automotive qualification status.
Recommended
Low-Power Connected Instrument
The EFM32TG840F32-QFN64 can serve as the control processor in a low-power connected measuring instrument where the display or communication interface is active only intermittently. The 32 MHz Cortex-M3 core and 32 KB of Flash support firmware for sensor control, calibration, local status reporting, and packet preparation, while fast wake-up behavior helps shorten the interval between user activity and a useful response. Its LCD-oriented feature positioning makes it relevant for compact panel instruments. The 4 KB RAM limit requires disciplined buffer allocation, and the final design should verify exact display-interface resources, pin multiplexing, and low-energy timing against the complete manufacturer documentation.
Recommended
Portable Health and Wellness Device
The EFM32TG840F32-QFN64 fits portable health and wellness products that combine sensor sampling, user feedback, and battery-conscious operation. Its low-power platform, energy-saving modes, and fast wake-up times support devices that remain inactive for long periods but must respond quickly to a measurement or user action. The 32-bit Cortex-M3 core can process acquisition and filtering logic up to 32 MHz, and the AES MCU feature can support applications that value hardware-oriented security assistance. Medical claims must be treated separately from component capability: designers must verify the exact peripheral implementation, regulatory requirements, operating-temperature limits, and production suitability in the target enclosure.
Recommended
Compact Motor and Actuator Controller
The EFM32TG840F32-QFN64 is applicable to compact motor and actuator controllers where a fast 32-bit control loop must coexist with low-power standby operation. The two listed 16-bit timers can support periodic timing and output-comparison functions, while the 56 digital I/O pins provide signals for sensors, switches, encoders, and drivers. Fast wake-up behavior can reduce latency between a control event and actuator response, and the 32 KB Flash supports compact closed-loop logic. Exact pin multiplexing and timer capabilities must be checked against the complete 64-QFN pinout, while the exposed pad and power-supply layout require careful thermal and return-path design.
Recommended
Building Control and Automation Endpoint
The EFM32TG840F32-QFN64 supports compact building-control endpoints that monitor inputs, operate actuators, and report status through low-power wired or wireless communication. Its 56 digital I/O pins offer ample connections for switches, sensors, indicators, and discrete control signals, while 32 KB of Flash and 4 KB of RAM are sufficient for a focused embedded application. The Cortex-M3 core reaches 32 MHz for protocol and control processing, and energy-saving modes are valuable in systems that operate intermittently. The designer should use the manufacturer’s recommended QFN land pattern, provide a low-impedance ground plane for the exposed pad, and verify the final voltage, timing, and temperature constraints for the installation environment.
Recommended
Recommended Products Summary
Engineering reference data for EFM32TG840F32-QFN64 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EFM32TG840F32-D-QFN64 |
|---|---|---|
| Brand | Silicon Labs | Silicon Labs |
| Package | 64-QFN (9 x 9 mm) | 64-QFN (9 x 9 mm) |
| Processor Core | ARM Cortex-M3 | ARM Cortex-M3 |
| Maximum Frequency | 32 MHz | 32 MHz |
| Flash Memory | 32 KB | 32 KB |
| RAM Memory | 4 KB | 4 KB |
| Digital I/O Pins | 56 | 56 |
| Timer Configuration | 2 x 16-bit timers | 2 x 16-bit timers |
| Supply Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Low-Power Architecture | Energy-saving modes and fast wake-up times | Energy-saving modes and fast wake-up times |
Key Differentiators
- Four times the Flash of the lower-memory family option (vs EFM32TG840F8-QFN64)
- Twice the RAM of the lower-memory family option (vs EFM32TG840F8-QFN64)
- Same core speed and I/O count within the verified Tiny Gecko family (vs EFM32TG840F8-QFN64)
Design Notes
Treat the 64-QFN exposed pad as a critical thermal and electrical feature rather than an unused center pin. Follow the manufacturer’s land pattern, connect the pad to ground, and place thermal vias where the recommended pattern allows them. Keep high-current return paths close to the supply and ground pins so switching currents do not flow through sensitive signal areas. Because the supplied data does not provide a verified junction-temperature limit, thermal qualification must be completed using the current manufacturer package data and the actual PCB copper area.
Use the manufacturer’s 64-QFN 9 x 9 mm land pattern and verify pin 1 orientation against the package drawing before fabrication. Preserve a continuous ground reference beneath the device and decouple each required supply rail at the closest available pins. The verified data confirms the package dimensions but not the exact pin table, exposed-pad geometry, or recommended via count, so those details must be copied from the official package drawing rather than inferred from a generic QFN footprint.
Plan the power tree around the MCU’s 2.5 V or 3.3 V operating options and the low-energy operating strategy. If the board also powers sensors or radio equipment, prevent their switching current from disturbing the MCU supply through shared high-impedance routes. Confirm the exact absolute maximum and recommended supply ranges in the current manufacturer documentation, because the supplied search results do not establish those limits. Firmware should disable unused peripherals and select a suitable low-energy mode to realize the expected battery-life benefit.
Do not treat a shared package name as proof of drop-in compatibility. The closest verified candidate, EFM32TG840F32-D-QFN64, has a suffix whose exact electrical, temperature, qualification, or ordering meaning is not present in the supplied snippets. Before substitution, compare the pin table, memory configuration, supply limits, peripheral mapping, boot behavior, package drawing, and lifecycle documentation. Avoid the EFM32TG840F8-QFN64 as a direct replacement because its 8 KB Flash is 75% below the target’s 32 KB.
Compliance Information
The supplied verified search data does not state RoHS, REACH, halogen-free, lead-free, conflict-minerals, or AEC-Q100 status. AEC-Q100 is marked not_applicable because this is an MCU rather than an automotive-qualified device, but that field should not be interpreted as a statement about automotive suitability.
