ATSAM4CMS32CA-AUR - Dual-Core 120MHz 2MB Flash MCU | Microchip
MPN: ATSAM4CMS32CA-AUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.8 | $13.80 |
| 10 | $12.55 | $125.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $10.45 | $5,225.00 |
| 1,000 | $9.75 | $9,750.00 |
ATSAM4CMS32CA-AUR Overview
A microcontroller (MCU) is a single-chip computer that integrates a processor core, memory, and peripherals on one die, forming the lowest tier of the embedded processing hierarchy: microcontroller -> embedded processor -> SoC. The ATSAM4CM family belongs to Microchip's SAM4 ARM Flash MCU portfolio and is unusual in offering two independent Cortex-M4F cores with floating-point units on a single device.
Key features include the dual-core 120 MHz Cortex-M4F architecture, 2 MB on-chip Flash, 256 KB SRAM, a hardware cryptographic engine (CRYPTO per Mouser listing), and industrial temperature range. The MRLA (microcontroller reprogramming) capability and dual-phase operation noted in distributor listings support secure, field-updatable designs.
Technically, each Cortex-M4F core integrates a hardware FPU, DSP instructions (SIMD, MAC), and a 3-stage pipeline, letting one core handle application logic while the second manages secure or real-time tasks. Peripherals and bus matrix arbitration allow the cores to share Flash and SRAM with hardware mutual exclusion.
Typical applications include industrial control and automation, secure connected IoT nodes exploiting the crypto engine, and motor/power conversion systems where one core runs control loops while the other handles communication.
Design consideration: dual-core Flash MCUs require careful partitioning of code and shared RAM; consult the Microchip SAM4CM family datasheet for core-to-peripheral mapping before layout.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone. Pricing shown is as of 2026-09-20.
Drop-in alternatives for ATSAM4CMS32CA-AUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4CMS32CA-AUR (same form factor and footprint) β differing in RoHS Status, Core Processor, Packaging, Series, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesATSAM4CMS32CA-AUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M4/M4F |
| Core Architecture | 32-Bit Dual-Core |
| Maximum Clock Frequency | 120 MHz |
| Flash Memory Size | 2 MB (2M x 8) |
| RAM Size | 256 KB (256K x 8) |
| Series | SAM4CM (ATSAM4CM) |
| Operating Temperature | -40C to +85C (TA) |
| Package | 100-LQFP (14 x 14 mm) |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (TR) |
| Security Feature | Hardware crypto engine (CRYPTO) |
| FPU | Yes (Cortex-M4F, per core) |
| Special Features | Dual phase, Rework GND + VddCore, MRLA |
| RoHS Status | Green (per Mouser listing) |
ATSAM4CMS32CA-AUR 100-lqfp (14 x 14 mm) Pin Configuration Guide
Pin configuration for ATSAM4CMS32CA-AUR (100-lqfp (14 x 14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4CMS32CA-AUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4CMS32CA-AUR is suitable for 6 applications: Industrial Automation and Control, Secure IoT Edge Nodes, Motor Control and Power Conversion, Building Automation and HVAC Controllers, Test and Measurement Instrumentation, Point-of-Sale and Payment Terminals.
Industrial Automation and Control
The ATSAM4CMS32CA-AUR fits industrial automation nodes because its dual-core 120 MHz Cortex-M4F architecture separates hard real-time control (one core) from supervisory logic and fieldbus communication (the other), eliminating priority inversion on a single core. Its -40C to +85C industrial rating and Green LQFP-100 packaging meet factory-floor environmental requirements, while 2 MB Flash reserves space for protocol stacks (Modbus, PROFINET-class stacks) and firmware updates. DSP instructions (MAC, SIMD) accelerate PID loops and FFT-based condition monitoring. Designers typically allocate one core to a deterministic control loop at microsecond jitter and the second to HMI and diagnostics, sharing 256 KB SRAM through the bus matrix with hardware semaphores.
Recommended
Secure IoT Edge Nodes
For secure IoT edge nodes, the ATSAM4CMS32CA-AUR's hardware crypto engine offloads AES-class operations from the Cortex-M4F cores, while the dual-core split isolates the security-critical firmware from application code, shrinking the attack surface. The 2 MB Flash supports dual-bank OTA updates: one core executes from bank A while bank B is erased and programmed, so a failed update can roll back without bricking the node. The 256 KB SRAM accommodates TLS 1.3 session state alongside sensor buffering. Running the network stack at 120 MHz with FPU-accelerated JSON/MQTT processing leaves ample margin, and the industrial temperature rating covers outdoor enclosures.
Recommended
Motor Control and Power Conversion
In motor drives and power conversion, one Cortex-M4F core of the ATSAM4CMS32CA-AUR executes the current loop (FOC or hysteretic control) using its single-cycle MAC and hardware FPU for Clarke/Park transforms at 120 MHz, while the second core handles host communication, parameter tuning, and fault logging. The dual-phase capability noted in the Mouser listing supports complementary PWM generation with dead-time insertion in hardware. 2 MB Flash stores multiple motor profiles and field-updatable control firmware, and the -40C to +85C range covers drive enclosures. Typical designs pair the MCU PWM outputs with gate drivers on a shared ground reference defined by the Rework GND + VddCore architecture.
Recommended
Building Automation and HVAC Controllers
Building automation controllers benefit from the ATSAM4CMS32CA-AUR's combination of 2 MB Flash (room for BACnet or Modbus stacks plus web server assets), dual-core isolation of the protocol task from control loops, and the crypto engine for authenticated network access. The 120 MHz cores process multiple PID HVAC loops simultaneously, while FPU-accelerated floating-point math simplifies sensor linearization code. The 100-pin LQFP provides enough GPIO for relay banks, one-wire sensor buses, and display interfaces without external I/O expanders. Its Green, industrial-temperature LQFP-100 package suits both DIN-rail controllers and rooftop unit boards exposed to wide ambient swings.
Recommended
Test and Measurement Instrumentation
Compact test instruments use the ATSAM4CMS32CA-AUR to run signal processing and user interface concurrently: the FPU and DSP instructions perform windowing, decimation, and RMS/THD computation at 120 MHz, while the second core drives USB or UART command interfaces and display rendering. 2 MB Flash holds calibration tables, waveform libraries, and multiple instrument personalities, enabling field-upgradable features. The 256 KB SRAM buffers multi-channel ADC streams from external converters via DMA through the bus matrix. Industrial temperature rating supports bench and field service environments alike, and the crypto engine can enforce licensed feature activation in commercial instruments.
Recommended
Point-of-Sale and Payment Terminals
Payment and POS terminals exploit the ATSAM4CMS32CA-AUR's hardware crypto engine for transaction encryption and the dual-core architecture to isolate the secure payment application from the touch-display UI task. The 2 MB Flash accommodates EMV kernels, receipt rendering assets, and dual-bank firmware updates for PCI-relevant patchability; 256 KB SRAM sustains concurrent session buffering. Peripherals on the 100-pin LQFP cover magnetic-stripe heads, smart-card interfaces via UART/TWI, printers via PWM/timers, and keypads on GPIO. The -40C to +85C rating plus Green LQFP-100 packaging address both outdoor kiosks and indoor countertop terminals.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4CMS32CA-AUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4CMP32CA-AUR | ATSAM4C8CA-AUR | ATSAM4CMS16CA-AUR |
|---|---|---|---|---|
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | Dual-core ARM Cortex-M4F | Dual-core ARM Cortex-M4F | Dual-core ARM Cortex-M4F | Dual-core ARM Cortex-M4F |
| Max Clock Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 2 MB (2048 KB) | Smaller Flash density (see datasheet) | Smaller Flash density (C8 option) | Smaller Flash density (16 option) |
| Crypto Engine | Yes | Yes (family feature) | Yes (family feature) | Yes (family feature) |
Key Differentiators
- Largest on-chip Flash in the same 100-LQFP SAM4CM footprint (vs ATSAM4CMP32CA-AUR)
- Dual-core Cortex-M4F concurrency with hardware isolation (vs ATSAM4C8CA-AUR)
- Hardware crypto engine as a family-standard feature (vs Typical single-core Cortex-M4 competitors)
Design Notes
The Mouser listing flags a 'Rework GND + VddCore' power configuration, meaning the SAM4CM uses separate VDDCORE and VDDIO domains with an internal LDO arrangement. Estimated: budget core current for two 120 MHz Cortex-M4F cores plus Flash - plan the VDDCORE rail per the SAM4CM family datasheet current-consumption tables rather than assuming a single-core figure, then add roughly 30-50% margin for peak dual-core Flash execution. Sequence VDDCORE before or with VDDIO per the datasheet power-up specification to avoid latch-up.
For the 14 x 14 mm 100-LQFP, use a fanout-friendly 0.5 mm pitch pattern with via-in-pad avoided; place 100 nF ceramic decoupling capacitors on every VDD/VDDCORE pair within 2 mm of the pin, one bulk 10 uF per domain. Tie the exposed thermal/electrical requirements per the Microchip SAM4CM hardware design guidelines (available on microchip.com). Keep the crystal pair (if used) short with ground guard traces, and route USB or high-speed bus signals differentially with controlled impedance.
Dual-core pitfalls dominate first-revision failures on SAM4CM designs: (1) forgetting hardware semaphore protection on shared SRAM regions leads to intermittent corruption that looks like a compiler bug; (2) assuming both cores can simultaneously program Flash causes bus stalls - arbitrate Flash writes; (3) using the same ordering-code suffix conventions across the family ladder (C8/CMS16/CMP32/CMS32) without re-verifying Flash and RAM linker scripts when swapping memory-density variants on the same footprint.
Compliance Information
Mouser listing describes the part as 'LQFP, Green, IND TEMP' indicating Green (RoHS-type) lead-free packaging. Full RoHS/REACH declarations should be obtained from Microchip's compliance portal.