ATSAM4SD32CA-ANR - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
MPN: ATSAM4SD32CA-ANR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.75 | $4,375.00 |
| 1,000 | $7.95 | $7,950.00 |
ATSAM4SD32CA-ANR Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The Cortex-M4 core is a 32-bit processor widely adopted across industrial, IoT, and motor-control applications because it combines Thumb-2 instruction efficiency with DSP extensions and an optional single-precision FPU. The SAM4S series, built around this core, sits within Microchip's portfolio of mainstream ARM Cortex-M microcontrollers and is typically chosen when deterministic interrupt latency, large on-chip Flash (>= 1 MB), and a rich peripheral set (USB FS, CAN, Ethernet MAC, HS SDIO/MMC, multiple UART/SPI/TWI, ADC, PWM) are required in one device.
Key features of the ATSAM4SD32CA-ANR include a maximum core clock of 120 MHz, 2 MB (2M x 8) Flash program memory, 160 KB SRAM, a full-speed USB 2.0 device/host controller, a 10/100 Ethernet MAC, a CAN controller, a high-speed SDIO/MMC interface, up to 47 user I/O lines, and multiple 16-bit timers plus a 12-bit ADC. The integrated FPU accelerates single-precision floating-point math, while the on-chip voltage regulator and Power-on Reset reduce external BOM. A 64-pin LQFP package offers an easy-to-assemble, hand-solderable footprint suitable for prototypes and mid-volume production.
Architecturally, the SAM4S uses a multi-layer AHB bus matrix that allows simultaneous accesses to Flash, SRAM, and peripherals without contention. The Flash controller incorporates a 128-bit-wide prefetch buffer and a write buffer, allowing the Cortex-M4 to execute code from Flash with zero-wait-state performance at up to 120 MHz under specified conditions. Peripherals are connected via separate peripheral bridges so that DMA activity does not stall CPU code fetches.
Typical applications include industrial automation controllers (PLC modules, sensor hubs, smart gateways), human-machine interface (HMI) panels, USB peripherals (data loggers, mass-storage devices, CDC + HID bridges), CAN node interfaces in vehicles or factory equipment, and motor-control boards that benefit from the FPU for field-oriented control (FOC) loops. The integrated Ethernet MAC also makes the part a fit for low-cost networked embedded nodes.
When designing with the ATSAM4SD32CA-ANR, pay attention to decoupling: place a 100 nF X7R ceramic plus a 4.7 uF bulk capacitor close to each VDDCORE and VDDBU supply pin. The 64-pin LQFP has a thermal pad-free design, so the die dissipates heat mainly through the package leads; however, at industrial temperatures (-40 C to +85 C) and 120 MHz operation, modest copper pour is sufficient.
This page synthesizes distributor stock, drop-in pin-compatible alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for ATSAM4SD32CA-ANR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD32CA-ANR (same form factor and footprint) — differing in Package, ADC, Program Memory (Flash), Mounting Type, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16CA-ANR
✅ Drop-In✓ In Stock
$6.72 / Unit
View Datasheet →ATSAM4SA16CA-ANR
✅ Drop-In✓ In Stock
$5.38 / Unit
View Datasheet →ATSAM4S8CA-AU
✅ Drop-In✓ In Stock
$5.74 / Unit
View Datasheet →ATSAM4SD32CA-ANR Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4 with FPU |
| Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 160 KB |
| Package | 64-LQFP (10x10 mm) |
| Operating Voltage (VDDCORE) | 1.2 V |
| Operating Voltage (VDDIO) | 3.3 V |
| I/O Lines | Up to 47 |
| ADC | 12-bit, 16 channels |
| Communication Interfaces | USB FS, Ethernet MAC, CAN, HS SDIO/MMC, UART, SPI, TWI/I2C |
| Timers | Multiple 16/32-bit timers, PWM, RTC |
| Operating Temperature | -40 C to +85 C (Industrial) |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
ATSAM4SD32CA-ANR 64-lqfp (10x10 mm) Pin Configuration Guide
Pin configuration for ATSAM4SD32CA-ANR (64-lqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4SD32CA-ANR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4SD32CA-ANR is suitable for 6 applications: Industrial Automation Controller, Human-Machine Interface (HMI) Panels, USB Peripherals and Data Loggers, CAN Node Interface (Automotive / Industrial), Motor Control / FOC Drives, Networked IoT Gateway / Edge Node.
Industrial Automation Controller
The ATSAM4SD32CA-ANR fits industrial PLC modules and sensor hubs because its 120 MHz Cortex-M4 core with FPU executes real-time control loops in well under 100 microseconds, while the 2 MB Flash holds a full Modbus/TCP or EtherCAT slave stack alongside application firmware. The on-chip 10/100 Ethernet MAC and CAN 2.0B controller let a single MCU bridge fieldbus networks without external bridges. The 64-LQFP footprint is hand-solderable, easing prototyping, and the industrial -40 C to +85 C temperature grade matches factory-floor requirements. With up to 47 GPIO and 16-channel 12-bit ADC, the part can read multiple analog sensors and drive relays or solid-state outputs directly.
Recommended
Human-Machine Interface (HMI) Panels
The ATSAM4SD32CA-ANR's combination of 2 MB Flash, 160 KB SRAM, HS SDIO/MMC, and an LCD-friendly peripheral set makes it a strong host for small color-TFT HMI panels up to QVGA. The HS SDIO/MMC controller can drive an SD card for bitmap assets and data logging at up to 50 MHz bus speed. The FPU accelerates touch-panel gesture math, while 47 GPIO lines route directly to TFT data, SPI touch ICs, and backlight PWM. The 64-LQFP package keeps the PCB compact and reduces assembly cost for mid-volume panel production runs.
Recommended
USB Peripherals and Data Loggers
The ATSAM4SD32CA-ANR integrates a full-speed USB 2.0 device/host controller with on-chip transceivers, enabling USB CDC, HID, MSD, or composite devices without external PHY chips. The 2 MB Flash is sufficient to embed a full USB MSD bootloader plus application, and the 160 KB SRAM supports USB HS isochronous endpoints with double buffering. In data-logger designs the SDIO/MMC plus RTC time-stamps samples to SD card while USB streams live data to a host PC. The Cortex-M4 FPU accelerates pre-log compression and filtering.
Recommended
CAN Node Interface (Automotive / Industrial)
The ATSAM4SD32CA-ANR's hardware CAN 2.0B controller with 8 mailboxes supports CANopen and J1939 stacks that often exceed 1 MB of code, fitting comfortably in the 2 MB Flash. The Cortex-M4 core's deterministic interrupt latency keeps CAN message timing within 50 microsecond loops, critical for vehicle body and chassis networks. While this industrial-grade part is not AEC-Q100 qualified, it is widely used in non-safety automotive subsystems such as body controllers and aftermarket telematics. The 64-LQFP package's exposed lead frame simplifies heat-sinking under sustained CAN bus load.
Recommended
Motor Control / FOC Drives
The ATSAM4SD32CA-ANR is well suited to low-power BLDC and PMSM motor drives up to a few hundred watts, where Field-Oriented Control loops require single-precision floating-point math at PWM rates of 10-20 kHz. The Cortex-M4 FPU computes the Park/Clarke transforms and PI controllers in roughly 5-10 microseconds per cycle, leaving headroom for housekeeping. The peripheral set includes three 16-bit timer/counter blocks with complementary PWM outputs and dead-time insertion, directly driving a 3-phase inverter. Quadrature encoder and Hall-sensor inputs are also supported for sensor-based FOC.
Recommended
Networked IoT Gateway / Edge Node
The ATSAM4SD32CA-ANR's integrated 10/100 Ethernet MAC combined with 2 MB Flash lets it host a lightweight TCP/IP stack (lwIP or uIP) alongside TLS libraries and application logic, making it a fit for sub-dollar networked sensors and protocol bridges. The multi-layer AHB bus matrix prevents DMA from stalling CPU code fetches during continuous network traffic. Designers can connect an external PHY via RMII in a small footprint, while the 64-LQFP keeps the BOM minimal. Industrial temperature grade ensures reliable operation in outdoor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD32CA-ANR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16CA-ANR | ATSAM4SA16CA-ANR | ATSAM4S8CA-AU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 512 KB (-75%) |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | No | No |
| USB FS | Yes (Device/Host) | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- Largest Flash in 64-LQFP SAM4S family (vs ATSAM4SD16CA-ANR)
- Includes Ethernet MAC (vs ATSAM4SA16CA-ANR)
- Highest SRAM in 64-LQFP sub-family (vs ATSAM4S8CA-AU)
Design Notes
Place a 100 nF X7R ceramic decoupling capacitor within 3 mm of every VDDCORE pin and a 4.7 uF X5R bulk capacitor on the same net to suppress switching noise from the internal 1.2 V regulator. Add a 10 uF bulk plus 100 nF on VDDBU for RTC retention. Per the SAM4S datasheet, VDDCORE must rise monotonically and reach 0.9 V within 60 ms of VDDIO to avoid POR latch-up; an RC reset delay is normally handled internally but a manual reset circuit is recommended for safety-critical designs.
Estimated: At industrial temperature +85 C ambient and maximum 120 MHz operation with all peripherals active, the 64-LQFP (10x10 mm) dissipates up to approximately 0.5 W. The junction-to-ambient thermal resistance (theta_JA) for a 64-LQFP on a 2-layer JEDEC EIA/JESD51 test board is typically around 50 C/W, producing a junction temperature rise of about 25 C above ambient - within the 125 C maximum. Designers should still add a copper pour under the package leads to spread heat and reduce the rise to under 15 C in dense layouts.
Route the 50 MHz external crystal traces symmetrically within 5 mm of the XIN/XOUT pins and guard them with a ground pour on both sides; keep digital signals away to avoid coupling. The SWD/JTAG signals (TCK, TMS, TDI, TDO, NRST) should be brought to a 0.05-inch header or Tag-Connect pads for in-circuit debugging. The USB DP/DM traces must be 90-ohm differential with length matching within 150 mil per USB 2.0 spec.
Do not apply VDDIO before VDDCORE or vice versa with a delay exceeding 50 ms; the SAM4S requires coordinated power sequencing to avoid latch-up. The ERASE pin, if left floating, may accidentally trigger full-chip erase in noisy environments - tie it to VDDIO via 10 kohm if not used. When migrating firmware from SAM3 to SAM4S, verify that the HSMCI peripheral register map matches - some legacy code assumes SAM3 naming conventions.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C). Not AEC-Q100 qualified - for automotive applications, contact Microchip about AEC-Q100 variants.
