ATSAM4SD32CA-ANR - 120MHz Cortex-M4 MCU 2MB Flash | Microchip
부품 번호: ATSAM4SD32CA-ANR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.85 | $985.00 |
| 500 | $8.75 | $4,375.00 |
| 1,000 | $7.95 | $7,950.00 |
ATSAM4SD32CA-ANR 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The Cortex-M4 core is a 32-bit processor widely adopted across industrial, IoT, and motor-control applications because it combines Thumb-2 instruction efficiency with DSP extensions and an optional single-precision FPU. The SAM4S series, built around this core, sits within Microchip's portfolio of mainstream ARM Cortex-M microcontrollers and is typically chosen when deterministic interrupt latency, large on-chip Flash (>= 1 MB), and a rich peripheral set (USB FS, CAN, Ethernet MAC, HS SDIO/MMC, multiple UART/SPI/TWI, ADC, PWM) are required in one device.
Key features of the ATSAM4SD32CA-ANR include a maximum core clock of 120 MHz, 2 MB (2M x 8) Flash program memory, 160 KB SRAM, a full-speed USB 2.0 device/host controller, a 10/100 Ethernet MAC, a CAN controller, a high-speed SDIO/MMC interface, up to 47 user I/O lines, and multiple 16-bit timers plus a 12-bit ADC. The integrated FPU accelerates single-precision floating-point math, while the on-chip voltage regulator and Power-on Reset reduce external BOM. A 64-pin LQFP package offers an easy-to-assemble, hand-solderable footprint suitable for prototypes and mid-volume production.
Architecturally, the SAM4S uses a multi-layer AHB bus matrix that allows simultaneous accesses to Flash, SRAM, and peripherals without contention. The Flash controller incorporates a 128-bit-wide prefetch buffer and a write buffer, allowing the Cortex-M4 to execute code from Flash with zero-wait-state performance at up to 120 MHz under specified conditions. Peripherals are connected via separate peripheral bridges so that DMA activity does not stall CPU code fetches.
Typical applications include industrial automation controllers (PLC modules, sensor hubs, smart gateways), human-machine interface (HMI) panels, USB peripherals (data loggers, mass-storage devices, CDC + HID bridges), CAN node interfaces in vehicles or factory equipment, and motor-control boards that benefit from the FPU for field-oriented control (FOC) loops. The integrated Ethernet MAC also makes the part a fit for low-cost networked embedded nodes.
When designing with the ATSAM4SD32CA-ANR, pay attention to decoupling: place a 100 nF X7R ceramic plus a 4.7 uF bulk capacitor close to each VDDCORE and VDDBU supply pin. The 64-pin LQFP has a thermal pad-free design, so the die dissipates heat mainly through the package leads; however, at industrial temperatures (-40 C to +85 C) and 120 MHz operation, modest copper pour is sufficient.
This page synthesizes distributor stock, drop-in pin-compatible alternatives, and practical PCB/thermal design notes not found in the manufacturer datasheet alone.
드롭인 대체품: ATSAM4SD32CA-ANR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: ATSAM4SD32CA-ANR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Program Memory (Flash), Mounting Type, SRAM.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
ATSAM4SD16CA-ANR
✅ 드롭인✓ 재고 있음
$6.72 / 개
데이터시트 보기 →ATSAM4SA16CA-ANR
✅ 드롭인✓ 재고 있음
$5.38 / 개
데이터시트 보기 →ATSAM4S8CA-AU
✅ 드롭인✓ 재고 있음
$5.74 / 개
데이터시트 보기 →ATSAM4SD32CA-ANR 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4 with FPU |
| Bit Width | 32-bit |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 2 MB (2M x 8) |
| SRAM | 160 KB |
| 패키지 | 64-LQFP (10x10 mm) |
| Operating Voltage (VDDCORE) | 1.2 V |
| Operating Voltage (VDDIO) | 3.3 V |
| I/O Lines | Up to 47 |
| ADC | 12-bit, 16 channels |
| Communication Interfaces | USB FS, Ethernet MAC, CAN, HS SDIO/MMC, UART, SPI, TWI/I2C |
| Timers | Multiple 16/32-bit timers, PWM, RTC |
| 동작 온도 | -40 C to +85 C (Industrial) |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| RoHS 상태 | Compliant |
ATSAM4SD32CA-ANR 64-lqfp (10x10 mm) 핀 구성 가이드
ATSAM4SD32CA-ANR(64-lqfp (10x10 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: ATSAM4SD32CA-ANR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
ATSAM4SD32CA-ANR 적합 용도: 6 애플리케이션s: Industrial Automation Controller, Human-Machine Interface (HMI) Panels, USB Peripherals and Data Loggers, CAN Node Interface (Automotive / Industrial), Motor Control / FOC Drives, Networked IoT Gateway / Edge Node.
Industrial Automation Controller
The ATSAM4SD32CA-ANR fits industrial PLC modules and sensor hubs because its 120 MHz Cortex-M4 core with FPU executes real-time control loops in well under 100 microseconds, while the 2 MB Flash holds a full Modbus/TCP or EtherCAT slave stack alongside application firmware. The on-chip 10/100 Ethernet MAC and CAN 2.0B controller let a single MCU bridge fieldbus networks without external bridges. The 64-LQFP footprint is hand-solderable, easing prototyping, and the industrial -40 C to +85 C temperature grade matches factory-floor requirements. With up to 47 GPIO and 16-channel 12-bit ADC, the part can read multiple analog sensors and drive relays or solid-state outputs directly.
추천
Human-Machine Interface (HMI) Panels
The ATSAM4SD32CA-ANR's combination of 2 MB Flash, 160 KB SRAM, HS SDIO/MMC, and an LCD-friendly peripheral set makes it a strong host for small color-TFT HMI panels up to QVGA. The HS SDIO/MMC controller can drive an SD card for bitmap assets and data logging at up to 50 MHz bus speed. The FPU accelerates touch-panel gesture math, while 47 GPIO lines route directly to TFT data, SPI touch ICs, and backlight PWM. The 64-LQFP package keeps the PCB compact and reduces assembly cost for mid-volume panel production runs.
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USB Peripherals and Data Loggers
The ATSAM4SD32CA-ANR integrates a full-speed USB 2.0 device/host controller with on-chip transceivers, enabling USB CDC, HID, MSD, or composite devices without external PHY chips. The 2 MB Flash is sufficient to embed a full USB MSD bootloader plus application, and the 160 KB SRAM supports USB HS isochronous endpoints with double buffering. In data-logger designs the SDIO/MMC plus RTC time-stamps samples to SD card while USB streams live data to a host PC. The Cortex-M4 FPU accelerates pre-log compression and filtering.
추천
CAN Node Interface (Automotive / Industrial)
The ATSAM4SD32CA-ANR's hardware CAN 2.0B controller with 8 mailboxes supports CANopen and J1939 stacks that often exceed 1 MB of code, fitting comfortably in the 2 MB Flash. The Cortex-M4 core's deterministic interrupt latency keeps CAN message timing within 50 microsecond loops, critical for vehicle body and chassis networks. While this industrial-grade part is not AEC-Q100 qualified, it is widely used in non-safety automotive subsystems such as body controllers and aftermarket telematics. The 64-LQFP package's exposed lead frame simplifies heat-sinking under sustained CAN bus load.
추천
Motor Control / FOC Drives
The ATSAM4SD32CA-ANR is well suited to low-power BLDC and PMSM motor drives up to a few hundred watts, where Field-Oriented Control loops require single-precision floating-point math at PWM rates of 10-20 kHz. The Cortex-M4 FPU computes the Park/Clarke transforms and PI controllers in roughly 5-10 microseconds per cycle, leaving headroom for housekeeping. The peripheral set includes three 16-bit timer/counter blocks with complementary PWM outputs and dead-time insertion, directly driving a 3-phase inverter. Quadrature encoder and Hall-sensor inputs are also supported for sensor-based FOC.
추천
Networked IoT Gateway / Edge Node
The ATSAM4SD32CA-ANR's integrated 10/100 Ethernet MAC combined with 2 MB Flash lets it host a lightweight TCP/IP stack (lwIP or uIP) alongside TLS libraries and application logic, making it a fit for sub-dollar networked sensors and protocol bridges. The multi-layer AHB bus matrix prevents DMA from stalling CPU code fetches during continuous network traffic. Designers can connect an external PHY via RMII in a small footprint, while the 64-LQFP keeps the BOM minimal. Industrial temperature grade ensures reliable operation in outdoor enclosures.
추천
추천 제품 요약
엔지니어링 참조 데이터: ATSAM4SD32CA-ANR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | ATSAM4SD16CA-ANR | ATSAM4SA16CA-ANR | ATSAM4S8CA-AU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-LQFP (10x10 mm) | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same | 64-LQFP (10x10 mm) - same |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 2 MB | 1 MB (-50%) | 1 MB (-50%) | 512 KB (-75%) |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB (-20%) |
| Ethernet MAC | Yes (10/100) | Yes (10/100) | No | No |
| USB FS | Yes (Device/Host) | Yes | Yes | Yes |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
주요 차별점
- Largest Flash in 64-LQFP SAM4S family (vs ATSAM4SD16CA-ANR)
- Includes Ethernet MAC (vs ATSAM4SA16CA-ANR)
- Highest SRAM in 64-LQFP sub-family (vs ATSAM4S8CA-AU)
설계 노트
Place a 100 nF X7R ceramic decoupling capacitor within 3 mm of every VDDCORE pin and a 4.7 uF X5R bulk capacitor on the same net to suppress switching noise from the internal 1.2 V regulator. Add a 10 uF bulk plus 100 nF on VDDBU for RTC retention. Per the SAM4S datasheet, VDDCORE must rise monotonically and reach 0.9 V within 60 ms of VDDIO to avoid POR latch-up; an RC reset delay is normally handled internally but a manual reset circuit is recommended for safety-critical designs.
Estimated: At industrial temperature +85 C ambient and maximum 120 MHz operation with all peripherals active, the 64-LQFP (10x10 mm) dissipates up to approximately 0.5 W. The junction-to-ambient thermal resistance (theta_JA) for a 64-LQFP on a 2-layer JEDEC EIA/JESD51 test board is typically around 50 C/W, producing a junction temperature rise of about 25 C above ambient - within the 125 C maximum. Designers should still add a copper pour under the package leads to spread heat and reduce the rise to under 15 C in dense layouts.
Route the 50 MHz external crystal traces symmetrically within 5 mm of the XIN/XOUT pins and guard them with a ground pour on both sides; keep digital signals away to avoid coupling. The SWD/JTAG signals (TCK, TMS, TDI, TDO, NRST) should be brought to a 0.05-inch header or Tag-Connect pads for in-circuit debugging. The USB DP/DM traces must be 90-ohm differential with length matching within 150 mil per USB 2.0 spec.
Do not apply VDDIO before VDDCORE or vice versa with a delay exceeding 50 ms; the SAM4S requires coordinated power sequencing to avoid latch-up. The ERASE pin, if left floating, may accidentally trigger full-chip erase in noisy environments - tie it to VDDIO via 10 kohm if not used. When migrating firmware from SAM3 to SAM4S, verify that the HSMCI peripheral register map matches - some legacy code assumes SAM3 naming conventions.
규정 준수 정보
RoHS compliant per Microchip product page. Industrial temperature grade (-40 C to +85 C). Not AEC-Q100 qualified - for automotive applications, contact Microchip about AEC-Q100 variants.
