ATSAML10D16A-MU - 64KB Flash Cortex-M23 MCU | Microchip
MPN: ATSAML10D16A-MU ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.94 | $1.94 |
| 10 | $1.75 | $17.50 |
| 100 | $1.55 | $155.00 |
| 500 | $1.35 | $675.00 |
| 1,000 | $1.18 | $1,180.00 |
| 3,000 | $1.04 | $3,120.00 |
ATSAML10D16A-MU Overview
Background: A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (SRAM), and a rich set of peripherals on a single die. ARM Cortex-M23 cores are 32-bit processors designed for embedded applications that need deterministic real-time response, low active power, and very deep sleep current for battery-driven products. The Cortex-M23 sits at the low-power entry point of the ARM Cortex-M family, sitting below Cortex-M0+/M0 and offering an Armv8-M baseline architecture with optional TrustZone-M hardware isolation.
Key differentiating features include an enhanced peripheral touch controller (PTC), advanced analog peripherals, an ISO7816 smart-card interface for secure payment and identification applications, a low-latency event system for inter-peripheral signaling without CPU wake-up, and SleepWalking peripherals that wake the system only on matching conditions. The wide 1.62V to 3.63V operating voltage range covers single-cell lithium, coin-cell, and 3.3V regulated rails.
The device uses a single-wire SERCOM-configurable peripheral scheme and integrates up to 16KB SRAM plus 8KB backup SRAM for state retention. On-chip analog includes a 12-bit ADC and 10-bit DAC for sensor interfacing. The tiny 4x4 mm 24-VQFN package exposes a thermal pad that must be soldered to a PCB copper pour to keep junction temperature within the -40C to +85C industrial range.
Typical applications include smart-card and secure-element readers, battery-powered IoT sensor nodes, low-power wearable health devices, capacitive-touch human-machine interfaces (buttons, sliders, wheels), and ultra-low-power wireless sensor end nodes. The combination of Cortex-M23 processing, sub-100nA sleep, and an integrated touch controller is rarely found in competing parts.
Design tip: route the exposed pad (EP) of the VQFN-24 to a continuous GND copper pour with multiple thermal vias to achieve the 38 C/W theta_JA stated in the Microchip datasheet. Skip the EP landing and the junction can climb more than 25C above ambient at modest loads, derating ambient capability.
This page synthesizes current distributor stock, drop-in same-package and cross-brand alternatives, and practical low-power design guidance that is not present on a single manufacturer product page.
Drop-in alternatives for ATSAML10D16A-MU — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAML10D16A-MU (same form factor and footprint) — differing in ADC, Core Architecture, Package, RoHS Status, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAML10D15A-MF
✅ Drop-In✓ In Stock
$1.52 / Unit
View Datasheet →ATSAML10D14A-MF
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →ATSAML10E14A-MFT
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAML11D16A-MU
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAML10D16A-MUT
✅ Drop-In✓ In Stock
$2.51 / Unit
View Datasheet →ATSAML10D16A-MU Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M23 (Armv8-M baseline) |
| Core Architecture | 32-bit RISC, single-cycle I/O |
| Maximum CPU Clock | 32 MHz |
| Flash Program Memory | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Backup SRAM | 8 KB |
| Operating Voltage (VDDIN) | 1.62 V to 3.63 V |
| Active Current | < 25 uA/MHz |
| Sleep Current | < 100 nA (full retention) |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 24-VQFN (4x4 mm) with exposed pad |
| Package Code | MU (VQFN24 4x4 mm) |
| DAC | 10-bit, 1 channel |
| Touch Controller | Peripheral Touch Controller (PTC), enhanced |
| Smart Card Interface | ISO7816 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free VQFN package) |
ATSAML10D16A-MU Pin Configuration
| Pin 1 | PA00 — I/O port pin / SERCOM / touch Y-line |
| Pin 2 | PA01 — I/O port pin / SERCOM / touch Y-line |
| Pin 3 | PA02 — I/O port pin / ADC / DAC |
| Pin 4 | GND — Ground |
| Pin 5 | VDDIN — Main supply input (1.62V-3.63V) |
| Pin 6 | VDDIO — I/O supply (tied to VDDIN) |
| Pin 7 | RESETn — Reset input (active low) |
| Pin 8 | SWCLK — Serial Wire debug clock |
| Pin 9 | SWDIO — Serial Wire debug data |
| Pin 10 | PA08 — I/O port pin / SERCOM |
| Pin 11 | PA09 — I/O port pin / SERCOM |
| Pin 12 | PA10 — I/O port pin / SERCOM / touch X-line |
| Pin 13 | PA11 — I/O port pin / SERCOM / touch X-line |
| Pin 14 | PA14 — I/O port pin / SERCOM / touch Y-line |
| Pin 15 | PA15 — I/O port pin / SERCOM / touch Y-line |
| Pin 16 | PA16 — I/O port pin / SERCOM / touch X-line |
| Pin 17 | PA17 — I/O port pin / SERCOM / touch X-line |
| Pin 18 | PA18 — I/O port pin / SERCOM |
| Pin 19 | PA19 — I/O port pin / SERCOM |
| Pin 20 | PA24 — I/O port pin / USB DM / SERCOM |
| Pin 21 | PA25 — I/O port pin / USB DP / SERCOM |
| Pin 22 | PA27 — I/O port pin / SERCOM |
| Pin 23 | PA28 — I/O port pin / SERCOM |
| Pin 24 | GND — Ground |
| Pin 25 | EP — Exposed thermal pad - must be soldered to GND pour |
Typical Applications
ATSAML10D16A-MU is suitable for 6 applications: Smart Card / Secure Element Reader, Battery-Powered IoT Sensor Node, Capacitive Touch HMI Button/Slider, Low-Power Wearable Health Device, Industrial Sensor Edge Node, Ultra-Low-Power Wireless Sensor End Node.
Smart Card / Secure Element Reader
The ATSAML10D16A-MU's integrated ISO7816 smart-card interface, sub-100 nA sleep current, and Cortex-M23 deterministic interrupt response make it ideal for battery-powered smart-card readers in payment terminals and identification devices. The peripheral touch controller allows a PIN-entry capacitive keypad on the same MCU without an external touch IC. According to Microchip datasheet DS60001507E, the ISO7816 peripheral handles T=0 and T=1 protocols directly, with hardware character matching offloading the CPU during transaction processing. The 64KB Flash holds the full EMV application stack, while SleepWalking lets the system idle at nanoamp currents between card insertions for multi-year coin-cell operation.
Recommended
Battery-Powered IoT Sensor Node
The ATSAML10D16A-MU's 25 uA/MHz active current and sub-100 nA sleep current deliver 10+ year battery life on a single CR2477 coin cell for duty-cycled IoT sensor nodes. The Cortex-M23 core executes sensor-fusion code and a small RTOS, while SleepWalking peripherals allow the ADC, I2C sensor, and event system to wake the CPU only when a threshold is crossed. The 1.62V-3.63V supply range accepts single-cell alkaline, two AA cells, or a regulated 3.3V rail directly. According to Microchip documentation, the integrated 12-bit ADC and 10-bit DAC eliminate external analog ICs, reducing BOM and standby drain.
Recommended
Capacitive Touch HMI Button/Slider
The ATSAML10D16A-MU's enhanced Peripheral Touch Controller (PTC) supports mutual-capacitance buttons, sliders, and wheels with hardware-driven scanning that runs without CPU wake-up. Combined with sub-100 nA sleep current, this lets a 16-button keypad run continuously from a coin cell for years. The Cortex-M23 core interprets gestures and forwards them to a host MCU or drives local LEDs via SERCOM-configurable PWM. According to Microchip datasheet DS60001507E, the PTC supports driven shield for waterproofing and proximity sensing, making the part suitable for white-good, appliance, and outdoor-kiosk HMIs.
Recommended
Low-Power Wearable Health Device
The ATSAML10D16A-MU suits wearable health patches such as continuous-glucose monitors, fitness bands, and remote patient telemetry. The Cortex-M23 processes heart-rate, SpO2, and temperature sensor data while drawing under 25 uA/MHz, and sub-100 nA sleep current lets the device idle between samples. The integrated 12-bit ADC digitizes analog sensor outputs without an external ADC, and SleepWalking peripherals enable event-driven wake on biometric threshold crossing. According to Microchip documentation, the small 4x4 mm 24-VQFN package fits inside a coin-cell-powered wristband housing with no thermal concerns at typical wearable loads.
Recommended
Industrial Sensor Edge Node
The ATSAML10D16A-MU operates across -40C to +85C industrial temperatures and tolerates 1.62V to 3.63V supply, suitable for industrial 4-20 mA loops, Modbus RTU nodes, and battery-backed remote sensors. The Cortex-M23 deterministic interrupt latency ensures time-critical fieldbus response, while the Event System routes inter-peripheral triggers without CPU wake-up to preserve power budget. The 64KB Flash fits a small Modbus or IO-Link stack, and the integrated ISO7816 peripheral supports authentication when the node interfaces with secure field devices. According to Microchip, the VQFN EP must be soldered to a 1 square inch copper pour to maintain junction temperature in sealed enclosures.
Recommended
Ultra-Low-Power Wireless Sensor End Node
The ATSAML10D16A-MU pairs with sub-GHz or BLE radio modules as a wireless sensor end node for building automation, environmental monitoring, and agricultural sensing. The MCU wakes the radio only on a sensor event, then returns to sub-100 nA sleep - critical for 5-10 year battery life targets on AA cells. The Cortex-M23 handles MAC-layer timing, sensor fusion, and AES-128 encryption for secure transmission. The 64KB Flash holds a 6LoWPAN or proprietary stack image, leaving headroom for application code. According to Microchip, the 24-VQFN (4x4 mm) package plus a sub-GHz transceiver fits in a 15x20 mm sensor housing.
Recommended
Recommended Products Summary
Engineering reference data for ATSAML10D16A-MU — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAML10D15A-MF | ATSAML10D14A-MF | ATSAML11D16A-MU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 24-VQFN (4x4 mm) | 24-VQFN (4x4 mm) - same | 24-VQFN (4x4 mm) - same | 24-VQFN (4x4 mm) - same |
| Core | Cortex-M23 | Cortex-M23 | Cortex-M23 | Cortex-M23 + TrustZone-M |
| Max CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 64 KB | 16 KB (-75%) | 8 KB (-87.5%) | 64 KB (same) |
| SRAM | 16 KB + 8 KB backup | 4 KB + 1 KB backup | 4 KB + 1 KB backup | 16 KB + 8 KB backup |
| Active Current | < 25 uA/MHz | < 25 uA/MHz | < 25 uA/MHz | < 25 uA/MHz |
| Sleep Current | < 100 nA | < 100 nA | < 100 nA | < 100 nA |
| TrustZone-M Security | No | No | No | Yes (TrustZone-M + crypto) |
Key Differentiators
- Industry's lowest-power Cortex-M23 active and sleep current (vs STM32L011G (STMicroelectronics Cortex-M0+))
- Integrated ISO7816 smart-card interface with peripheral touch controller (vs ATSAML10D15A-MF (lower-Flash L10 variant))
- Drop-in upgrade path to ATSAML11D16A-MU with TrustZone-M (vs ATSAML11D16A-MU (L11 sibling))
Design Notes
Estimated: the 24-VQFN (4x4 mm) package has theta_JA of approximately 38 C/W with the exposed pad (EP) soldered to a 1 square inch GND copper pour with thermal vias. At full CPU load (32 MHz, 25 uA/MHz), the device dissipates roughly 8 mW from MCU core only, far below thermal stress thresholds. However, at industrial 85C ambient, leaving EP unsoldered can push the junction above 110C. Always solder the EP pad for production.
Place 100 nF decoupling capacitors on each VDDIN and VDDIO pin within 2 mm of the pin, with a 4.7 uF bulk capacitor near the supply entry. For low-noise applications, add a ferrite bead between VDDIO and VDDIN to suppress digital switching noise from coupling into analog ADC inputs. Route the SWD clock and data traces as a 2-wire pair with GND on the adjacent layer to avoid EMI pickup during debug.
Do not program the Flash while VDDIN is below 1.8V - the row-write operation requires 1.8V minimum. The 8KB backup SRAM is only retained in BACKUP sleep mode (deepest sleep), not in IDLE or STANDBY modes. When migrating firmware between L10 and L11, the L11 enables TrustZone-M, which can lock out the application code if the security attribution is misconfigured during early development - design the linker script accordingly.
The Cortex-M23 SWD interface uses SWCLK and SWDIO; both must be pulled up to VDDIO with 10 kohm resistors during reset to enter debug mode. If using the integrated Peripheral Touch Controller (PTC), route the touch Y-lines on the top layer with no via crossings and a 0.5 mm gap to GND pour to preserve mutual-capacitance sensitivity. For ISO7816 smart-card interface, place 33 pF capacitors on the I/O and CLK lines per the EMV specification.
Compliance Information
RoHS-compliant lead-free VQFN package per Microchip product page. AEC-Q100 not qualified - the SAM L10 family targets industrial and consumer markets, not automotive. For automotive-grade Cortex-M23, see SAM E70/SAM V70 families.
