Renesas Electronics

DF2166VT33V - H8S/2100 16-bit MCU 33MHz 512KB Flash | Renesas

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3.0 V to 3.6 V Vdss 144-TQFP (16x16 mm) Package 33 MHz Speed 512 KB (512K x 8) Flash Memory
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DF2166VT33V Overview

The Renesas DF2166VT33V is a 16-bit H8S/2100 family (2168 Group) CISC microcontroller running at 33 MHz, with 512KB (512K x 8) on-chip flash program memory, 40KB RAM, 106 I/O pins, and a 3.0V to 3.6V supply, housed in a 144-pin TQFP (16x16 mm, PTQP0144LC-A) package.

A microcontroller (MCU) is a single-chip computer integrating a CPU core, program memory, data memory, and peripherals such as timers, serial interfaces, and analog converters. Within the semiconductor hierarchy, the H8S/2100 sits in the 16-bit microcontroller category, positioned between 8-bit MCUs for simple control tasks and 32-bit MCUs for compute-heavy embedded systems. MCUs of this class are the backbone of industrial control boards, motor drives, and instrumentation front ends.

Key differentiating specifications include the 512KB flash program memory - large for a 16-bit core - supporting complex firmware with in-field update capability; 40KB of on-chip RAM for buffering and protocol stacks; 106 general-purpose I/O lines for dense peripheral interfacing; and on-chip peripherals including LPC, CRC, H8S serial interfaces, and JTAG boundary scan for board-level test. The 33 MHz maximum clock delivers roughly 16.5 MIPS-class throughput on the H8S CISC architecture.

The DF2166VT33V operates from a single 3.0V to 3.6V supply (Vcc), simplifying power design in 3.3V logic systems, and its device suffix indicates the V-speed grade and 3.3V operating class. The package code PTQP0144LC-A corresponds to a JEDEC-compliant lead-free 144-TQFP (16x16 mm body) suitable for surface-mount assembly with standard reflow profiles. The operating temperature range is -20C to +75C, targeting commercial and light-industrial environments rather than automotive or extended-temperature applications.

Typical applications include industrial automation controllers, embedded instrumentation, motor control and inverter panels, building control, and legacy telecommunications equipment where the H8S instruction-set compatibility protects existing firmware investments.

A key design consideration is memory wait-state configuration: at the full 33 MHz clock, verify flash access wait states and bus settings per the Renesas hardware manual to avoid illegal-access resets, and decouple all Vcc pins with 0.1uF ceramics placed at each corner of the 144-TQFP.

This page synthesizes distributor pricing, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for DF2166VT33V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DF2167VT33V

✅ Drop-In
📦 144-TQFP
Adjacent 2167 Group die: different on-chip peripheral/register map, same H8S 16-bit core, 33 MHz, 3.0-3.6V supply and 144-TQFP-class package

📋 Reference alternative (not in catalog)

DF2166VT33WV

✅ Drop-In
📦 144-TQFP
Same 2166/2168 Group die and specs (16-bit, 33 MHz, 512KB flash, 3.3V class), different package suffix option - verify package drawing before layout reuse

📋 Reference alternative (not in catalog)

DF2168VT33V

✅ Drop-In ⚠️ Specs Unverified
📦 144-TQFP
Same H8S/2100 2168 Group family per Veswin listing, same core and memory class; verify exact flash size and pin map against datasheet before substitution

📋 Reference alternative (not in catalog)

DF2166TTF13V

✅ Drop-In ⚠️ Specs Unverified
📦 144-TQFP
Same 2166 Group die family, 5V-tolerant I/O variant line; clock/supply class differs (13 MHz grade vs 33 MHz), same H8S instruction set

📋 Reference alternative (not in catalog)

DF2166VT33V Maximum Ratings & Electrical Characteristics

Core Architecture H8S/2000 (H8S/2100 family, 2168 Group)
Core Width 16-bit CISC
Maximum Clock Frequency 33 MHz
Program Memory Size 512 KB (512K x 8) Flash
RAM Size 40 KB (40K x 8)
Number of I/O 106
Supply Voltage (Vcc) 3.0 V to 3.6 V
Operating Temperature -20C to +75C
Package / Case 144-TQFP (16x16 mm)
Package Code PTQP0144LC-A
Mounting Type Surface Mount
Peripherals LPC, CRC, H8S serial, Boundary scan (JTAG)
RoHS / Pb-Free Pb-Free, JEDEC compliant
Family H8S/2000 H8 H8S/2100
Program Memory Type FLASH
Core Supplier Series H8S/2168 Group

DF2166VT33V ptqp0144lc-a Pin Configuration Guide

Pin configuration for DF2166VT33V (ptqp0144lc-a package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

ptqp0144lc-a package pinout diagram for DF2166VT33V

No detailed pinout data available for DF2166VT33V.

Refer to the datasheet for full pin configuration.

Typical Applications

DF2166VT33V is suitable for 6 applications: Industrial Automation Controllers, Embedded Instrumentation, Motor Control and Inverter Panels, Building Control and HVAC, Legacy Telecommunications Equipment, Security and Access Control Systems.

🏭

Industrial Automation Controllers

The DF2166VT33V fits industrial automation controllers because its 33 MHz 16-bit H8S core, 512KB flash, and 106 I/O lines provide the throughput and connectivity density needed for PLC-style sequencing, sensor polling, and actuator drive logic. Its on-chip CRC accelerates communication integrity checks on Modbus-class links, while JTAG boundary scan simplifies production test of dense I/O boards. In a typical deployment, the MCU runs control firmware from flash while a 3.3V rail powers the entire logic domain directly, eliminating level shifting against external 3.3V peripherals. The main trade-off versus a 32-bit MCU is integer-only arithmetic, which is acceptable for ladder-logic-class control loops up to the kHz range but not for high-resolution motion planning.

🔧

Embedded Instrumentation

Bench and field instrumentation benefits from the DF2166VT33V's combination of 512KB flash - ample for menus, calibration tables, and communication stacks - and 40KB RAM for data buffering. The 3.0V to 3.6V supply range matches common 3.3V analog front-end rails, and the -20C to +75C rating covers typical laboratory and light-industrial environments. Firmware stores in flash allows field updates through the H8S serial bootloader, a practical advantage for deployed instruments. In a typical design, the MCU reads an external ADC over a serial interface and drives a display plus serial port; the H8S CISC core's predictable execution simplifies timing-critical acquisition sequencing. The limitation is the absence of a hardware floating-point unit, so DSP-heavy instruments should offload math to a companion DSP.

⚙️

Motor Control and Inverter Panels

Low- and medium-complexity motor drives use the DF2166VT33V for sequencing, protection monitoring, and host communication, leveraging its 106 I/O lines to interface gate drivers, current-sense comparators, and fault latches. The 33 MHz clock provides deterministic interrupt latency for overcurrent protection loops, while the CRC peripheral validates control messages on field buses. Operated from a 3.3V rail with 5V-tolerant H8S I/O characteristics noted in family documentation, it bridges cleanly to legacy 5V signal conditioning stages common in retrofit panels. In a typical topology, this MCU supervises while a dedicated gate-driver IC handles PWM power stages. Its -20C to +75C range suits enclosed panels; extended outdoor ambient requires derating review against the Renesas datasheet.

🧩

Building Control and HVAC

Building automation nodes benefit from the DF2166VT33V's large 512KB flash, which holds protocol stacks, schedules, and logging tables without external memory, and its 40KB RAM for network buffering. The 3.0V to 3.6V supply supports battery-backed or mains-derived 3.3V domains, and the 106 I/O lines accommodate relay drives, damper actuators, and multiple sensor buses simultaneously. JTAG boundary scan supports in-production testing of the dense I/O boards typical of controllers. In a typical node, the MCU polls sensors, executes PID loops for temperature control, and communicates over RS-485-class serial links using the H8S on-chip serial units with CRC validation. The mature H8S toolchain and stable silicon are advantages for long-lifecycle building products with decade-long service expectations.

🌐

Legacy Telecommunications Equipment

The H8S family has a long heritage in telecom line-card and network-equipment supervision, and the DF2166VT33V maintains that role: 512KB flash stores firmware including management interfaces, 40KB RAM buffers packet metadata, and the 16-bit CISC core at 33 MHz handles supervisory tasks with predictable timing. JTAG boundary scan supports the high pin-count board test procedures standard in telecom manufacturing, and the JEDEC-compliant lead-free 144-TQFP meets modern assembly requirements even for legacy designs being re-released. In a typical application, the MCU monitors power supplies, fans, and alarms, reporting to a backplane controller over serial links with CRC-checked frames. The -20C to +75C rating covers central-office environments; outside-plant deployments need a hardened enclosure.

🎥

Security and Access Control Systems

Access-control panels and surveillance controllers leverage the DF2166VT33V's 512KB flash for credential databases and event logs, its 106 I/O lines for keypad, reader, lock, and sensor interfacing, and its CRC peripheral for tamper-evident serial communication. The 3.0V to 3.6V single-supply operation simplifies power design in mixed 3.3V/12V security panels, with the MCU isolated on the logic rail. Flash-based firmware supports on-site updates when security policies change, and boundary scan eases manufacturing test of the dense I/O boards. In a typical controller, the MCU runs the decision engine and communicates upstream over RS-485. The -20C to +75C range covers protected indoor installations; unheated gate enclosures should be evaluated against the datasheet limits.

What is the DF2166VT33V microcontroller?
The DF2166VT33V is a Renesas Electronics H8S/2100 family (2168 Group) 16-bit CISC microcontroller running at up to 33 MHz. It integrates 512KB of flash program memory, 40KB of RAM, 106 I/O pins, and peripherals including LPC, CRC, serial interfaces, and JTAG boundary scan. It operates from a single 3.0V to 3.6V supply in a 144-pin TQFP (16x16 mm) package over a -20C to +75C temperature range.
What are the key specifications of DF2166VT33V that engineers should know?
The DF2166VT33V is a 16-bit H8S/2168 Group MCU with a 33 MHz maximum clock, 512KB (512K x 8) flash, 40KB (40K x 8) RAM, 106 I/O lines, and a 3.0V to 3.6V supply. It is packaged in a lead-free 144-TQFP (16x16 mm, code PTQP0144LC-A), rated -20C to +75C, and includes on-chip LPC, CRC, H8S serial peripherals, and boundary-scan test logic. These figures come from the DigiKey and Renesas product listings.
What is the price of DF2166VT33V?
Distributor pricing for the DF2166VT33V varies by supplier and quantity break, and Octopart lists 16 distributors carrying this part, so price comparison is recommended before purchase. As of 2026-10-07, unit pricing on this page is pending verification against current DigiKey/Mouser quotes - request a quote for an exact figure. Because this is a mature H8S family part, stock is often limited to broker and authorized-surplus channels rather than standard DigiKey shelf stock.
Where to buy DF2166VT33V online?
The DF2166VT33V can be purchased through DigiKey (which lists it with ship-today availability at times), Mouser, Octopart's 16-distributor network, TrustedParts.com, OEMsTrade, and XAIPART. According to the Octopart listing, 16 distributors stock or quote this Renesas part. For production volumes, request quotes from multiple sources since stock for this mature H8S/2100 family member is concentrated in a limited number of authorized channels.
What is the lead time for DF2166VT33V?
Lead time for the DF2166VT33V depends on channel: DigiKey's listing shows ship-today availability when in stock, while factory orders for the H8S/2100 family can carry multi-week lead times given the product's maturity. As of 2026-10-07, XAIPART recommends checking current stock at DigiKey, Mouser, and Octopart-aggregated distributors before committing to a production schedule, and qualifying a same-family substitute if factory lead time extends.
What is the difference between DF2166VT33V and DF2167VT33V?
The DF2166VT33V and DF2167VT33V are adjacent members of Renesas' H8S/2100 family in the same 144-pin TQFP-class packaging. The primary difference lies in the on-chip peripheral set and memory configuration between the 2166 Group and 2167 Group dies; the core (16-bit H8S, 33 MHz, 3.0-3.6V supply) is shared. According to the Utmel comparison of the DF2167 group parts, pin compatibility within the family is generally maintained, but firmware must be revalidated against the different peripheral register map before substitution.
Is DF2166VT33V the same as DF2166VT33WV?
No - they are closely related but not identical. The DF2166VT33V and DF2166VT33WV both belong to the H8S/2166/2168 group with the same 16-bit core, 512KB flash, and 3.3V class supply, but the suffix letter (V versus WV) denotes a different package/lead-form option, which affects the physical package body and possibly pin pitch. According to the Utmel comparison, always verify the package drawing in the Renesas datasheet before treating the WV variant as a drop-in on a 144-TQFP footprint.
What is the best drop-in replacement for DF2166VT33V?
The best drop-in candidates are same-family Renesas parts: the DF2167VT33V (adjacent 2167 Group with the same 3.3V, 33 MHz, 144-pin TQFP-class format) and the DF2166VT33WV (same die group, different package suffix). For legacy designs, matching the exact package code PTQP0144LC-A footprint is the decisive constraint - same-family H8S parts preserve the H8S instruction set, minimizing firmware changes to peripheral-init code only. No cross-brand 144-pin pin-compatible H8S equivalent exists.
What is the best cross-brand equivalent for DF2166VT33V?
There is no verified cross-brand drop-in equivalent for the DF2166VT33V - its 144-pin TQFP pinout and H8S CISC instruction set are Renesas-specific. While aggregator pages mention functionally similar 16-bit/32-bit MCUs such as TI's TMS320C28x family or NXP (Freescale) MC9S08 parts, those are functional alternatives only, not pin-compatible replacements; adopting them means a new PCB layout and a firmware rewrite. For minimal design risk, stay within the Renesas H8S/2100 family.
Where to download the DF2166VT33V datasheet PDF?
The DF2166VT33V datasheet PDF (approximately 4.6 MB, published 2004-03-12 per FindIC) is available from the Renesas Electronics support site, Octopart's datasheet repository, and distributor pages such as DigiKey and Mouser. The authoritative source is Renesas' H8S/2100 (2168 Group) hardware manual and datasheet package, which cover electrical characteristics, timing, and the PTQP0144LC-A package drawing. Always download from Renesas or an authorized distributor to get the latest revision.
Where can I find the DF2166VT33V pinout?
The complete 144-pin pinout for the DF2166VT33V is specified in the Renesas H8S/2100 (2168 Group) datasheet and hardware manual, in the PTQP0144LC-A package section, along with 106 I/O assignments and power/oscillator pins. Distributors such as Veswin also provide pinout and application support on request. Because the full 144-pin table is lengthy, it should be taken directly from the manufacturer datasheet rather than reconstructed from secondary sources.
Is DF2166VT33V suitable for industrial motor control applications?
Yes - the DF2166VT33V is well suited to light-industrial control applications. Its 33 MHz 16-bit H8S core, 512KB flash for control firmware, 40KB RAM, and 106 I/O lines support dense peripheral interfacing, while the on-chip CRC and boundary-scan logic aid diagnostics and production test. Note the -20C to +75C operating range: for outdoor or high-temperature enclosures, verify ambient conditions stay within spec or select an extended-temperature variant.
When should I choose DF2166VT33V over DF2167VT33V?
Choose the DF2166VT33V when your firmware targets the 2166/2168 Group peripheral set and register map, when a design is already qualified on this exact die, or when the 2166 Group's memory/peripheral configuration matches your requirement. Choose the DF2167VT33V only if its slightly different peripheral configuration is needed, accepting a firmware revalidation effort. Both share the H8S 16-bit core at 33 MHz, 3.0-3.6V operation, and comparable TQFP packaging, so the deciding factors are die compatibility and sourcing availability.
Is DF2166VT33V RoHS compliant and lead-free?
Yes. According to the Mouser listing, the DF2166VT33V is described as an 'MCU 3V 512K PB-Free 144-TQFP JEDEC' part, meaning it is supplied in a lead-free, JEDEC-compliant 144-TQFP package suitable for RoHS assembly processes. Its package code PTQP0144LC-A corresponds to the lead-free TQFP option. For formal compliance documentation, obtain the Renesas material declaration sheet for this specific ordering code, as suffix letters denote different plating and package options.
What supply voltage and temperature range does DF2166VT33V support?
The DF2166VT33V operates from a 3.0V to 3.6V single supply per the Veswin specification (Vcc = 3.0 to 3.6 volts), matching standard 3.3V logic rails with margin, and is rated for a -20C to +75C ambient temperature range. This makes it appropriate for commercial and light-industrial environments. Designs operating near either temperature extreme should account for derating of maximum clock frequency and verify flash retention characteristics per the Renesas datasheet.

Engineering reference data for DF2166VT33V — comparison, design guidance, and compliance information.

Selection Guide

Choose the DF2166VT33V when you need a mature 16-bit H8S MCU with maximum on-chip memory - 512KB flash plus 40KB RAM - 106 I/O lines, and 3.3V single-supply operation in a 144-TQFP, especially for existing H8S firmware or light-industrial control, instrumentation, building-control, and telecom supervision boards. Choose the DF2166VT33WV if its package suffix option matches your footprint and stock is better. Choose the DF2167VT33V only if the 2167 Group peripheral map suits your design and you accept revalidation. There is no cross-brand pin-compatible alternative: adopting a TI TMS320C28x or NXP MC9S08 part means a new PCB and a firmware port, justified only for new designs. For designs at either temperature extreme, remember the -20C to +75C commercial rating.

Comparison with Alternatives

Parameter This Product DF2167VT33V DF2166VT33WV DF2168VT33V
Package 144-TQFP (16x16 mm, PTQP0144LC-A) 144-TQFP class - same 144-TQFP class (different suffix package option) 144-TQFP class - same
Brand Renesas Electronics Renesas Electronics Renesas Electronics Renesas Electronics
Core / Width H8S 16-bit CISC H8S 16-bit CISC H8S 16-bit CISC H8S 16-bit CISC
Peripheral Set / Group 2168 Group: LPC, CRC, H8S serial, boundary scan 2167 Group (different peripheral map) 2166/2168 Group - same 2168 Group

Key Differentiators

  • Largest flash in its H8S class (vs DF2167VT33V)
  • Highest I/O count for dense boards (vs DF2166VT33WV)
  • Integrated test and integrity peripherals (vs DF2168VT33V)

Design Notes

Power the DF2166VT33V from a regulated 3.3V rail within the 3.0V to 3.6V datasheet window. Place 0.1uF ceramic decoupling capacitors at each of the four Vcc pin groups on the 144-TQFP, plus one 4.7-10uF bulk capacitor near the device. Because the flash core draws transient current at 33 MHz, keep the power plane impedance low under the package center. Verify power-up ramp rate against the Renesas H8S hardware manual oscillator/latch-up requirements; if the rail ramps slowly, add a supervisor reset (e.g., a voltage-monitor reset IC) to hold the RES pin valid until Vcc stabilizes.

The PTQP0144LC-A 144-TQFP has 0.5 mm lead pitch; design land patterns per the Renesas package drawing rather than generic IPC calculators to ensure reliable solder fillets. Route the JTAG boundary-scan pins to a test header if in-circuit test is planned - the on-chip boundary scan is most useful when the chain is accessible. Keep crystal/oscillator traces short and guard them with ground, since the H8S clock input is sensitive to coupling from switching loads. For rework, the 16x16 mm body allows hot-air removal but requires a preheater below the board.

Do not assume all family suffixes are interchangeable: the 'V' in DF2166VT33V denotes the 33 MHz / 3.3V class, and the WV variant uses a different package option - verify the mechanical drawing before reusing a footprint. Also confirm flash wait-state and bus settings at full 33 MHz clock per the H8S hardware manual; running with incorrect wait states can cause illegal-access resets. Finally, the -20C to +75C rating excludes automotive-grade use; do not deploy this commercial-grade part in under-hood or extended-temperature environments.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Mouser lists the part as 'Pb-Free 144-TQFP JEDEC', indicating lead-free, JEDEC-compliant packaging. Not an automotive (AEC-Q100) device - commercial -20C to +75C rating. Formal REACH and conflict-minerals declarations should be requested from Renesas for the exact ordering code.

Data verified on: 2026-10-07 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Renesas Electronics DF2166VT33V DF2167VT33V DF2166VT33WV DF2168VT33V H8S/2100 H8S/2000 2168 Group 16-bit CISC microcontroller MCU TQFP-144 PTQP0144LC-A JEDEC RoHS / Pb-Free boundary scan (JTAG) CRC LPC industrial automation motor control flash program memory
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