DS3231N/DIP - Precision I2C RTC with TCXO | Maxim Integrated
MPN: DS3231N/DIP ✓ ActiveDS3231N/DIP Overview
A real-time clock is a clock-and-timing integrated circuit that maintains date and time independently of the system processor. The I2C real-time clock hierarchy connects this device to serial real-time clocks, clock-and-timing ICs, and broader power-management and embedded-control systems. The DS3231N/DIP combines a crystal oscillator with an integrated temperature-compensated crystal and digital compensation to reduce timing drift caused by temperature variation.
The principal feature of the DS3231N/DIP is its integrated TCXO and crystal, which support accurate timekeeping without a separate discrete crystal. Its I2C interface provides a straightforward connection to a host processor, while the integrated battery input allows the clock and calendar to continue operating when the main supply is removed. The stated ±2 ppm accuracy from 0°C to +40°C is the principal selection criterion for precision timekeeping designs.
Within its broad operating-temperature range, accuracy changes to ±3.5 ppm from -40°C to +85°C. This distinction matters when comparing the component across industrial temperature environments rather than only at room temperature. The 2.3 V to 5.5 V supply range supports both lower-voltage embedded systems and conventional 5 V logic environments, although interface voltage compatibility must be checked against the host controller.
Typical uses include industrial embedded controllers, data-acquisition equipment, access-control systems, instrumentation, network appliances, and battery-backed logging platforms. The integrated TCXO and crystal simplify the oscillator design, while the I2C interface reduces the number of host GPIO connections required for calendar and alarm functions. Systems requiring a larger I2C bus can place the device on the same bus as other compatible peripherals.
When laying out a circuit, use the manufacturer's pin-description and connection tables to assign VCC, ground, I2C, interrupt, and battery-related connections. Confirm pull-up voltage and logic levels against the host supply. Route the backup-battery connection according to the manufacturer's guidance and verify backup-current behavior when the main rail is unavailable.
This page consolidates the manufacturer's product information, distributor records, package details, application guidance, and practical replacement considerations. It also identifies where the available cross-reference records do not establish additional same-package drop-in parts, helping engineers avoid treating merely similar RTC devices as direct board-level replacements.
Drop-in alternatives for DS3231N/DIP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
No drop-in alternatives available for this product.
Request AlternativesDS3231N/DIP Specifications
| Product Type | I2C real-time clock with integrated TCXO and crystal |
| Timekeeping Accuracy at 0°C to +40°C | ±2 ppm |
| Timekeeping Accuracy at -40°C to +85°C | ±3.5 ppm |
| Operating Supply Voltage Range | 2.3 V to 5.5 V |
| Clock Interface | I2C |
| Oscillator Type | Temperature-compensated crystal oscillator (TCXO) |
| Integrated Crystal | Yes |
| Battery Input | Integrated |
| Backup Timekeeping | Supported with backup battery |
| Package | 16-pin DIP |
| Mounting Type | Through-hole |
| Operating Temperature Range | -40°C to +85°C |
| Manufacturer Document Length | 20 pages |
| Manufacturer Document File Size | 297 kB |
DS3231N/DIP 16-pin dip Pin Configuration Guide
Pin configuration for DS3231N/DIP (16-pin dip package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for DS3231N/DIP.
Refer to the datasheet for full pin configuration.
Typical Applications
DS3231N/DIP is suitable for 6 applications: Industrial Data-Acquisition Equipment, Battery-Backed Security and Access Control, Precision Test and Measurement Instruments, Network and Communication Equipment, Battery-Backed Environmental Monitoring, Instrumented Logging Platforms.
Industrial Data-Acquisition Equipment
The DS3231N/DIP fits data-acquisition equipment that must preserve timestamps when the main supply is interrupted. Its integrated temperature-compensated crystal oscillator and crystal provide stated accuracy of ±2 ppm from 0°C to +40°C and ±3.5 ppm from -40°C to +85°C, while the 2.3 V to 5.5 V operating range supports varied embedded supply plans. Connect it through I2C to the controller, retain backup-battery support for power-loss continuity, and validate the complete timestamp tolerance against the acquisition system specification.
Recommended
Battery-Backed Security and Access Control
The DS3231N/DIP is suited to access-control and security equipment that must retain accurate calendar time through a temporary power interruption. The integrated battery input supports backup operation, and the I2C interface permits the host controller to read time and calendar data without allocating multiple GPIO lines for a calendar interface. The stated ±2 ppm accuracy from 0°C to +40°C supports precise event timestamping. The backup-battery circuit and current budget should be reviewed against the required outage duration.
Recommended
Precision Test and Measurement Instruments
The DS3231N/DIP can provide the time reference for test and measurement instruments whose records depend on accurate event timing. Its integrated TCXO and crystal avoid the need for a separate oscillator assembly, and the stated ±2 ppm accuracy at room temperature supports precise timestamp correlation. The 2.3 V to 5.5 V supply range fits multiple embedded power architectures. Designers should connect the I2C interface with compatible pull-ups and account for the wider ±3.5 ppm specification outside 0°C to +40°C.
Recommended
Network and Communication Equipment
The DS3231N/DIP is appropriate for network appliances and communication equipment that maintain event logs, schedules, or protocol timing across brief supply interruptions. Its I2C interface integrates cleanly with embedded processors while the integrated crystal and TCXO simplify oscillator construction. The stated operating-temperature coverage of -40°C to +85°C accommodates many indoor industrial and communications environments. Firmware should handle clock-validity checks after power restoration, and the backup-battery endurance should be matched to the expected outage profile.
Recommended
Battery-Backed Environmental Monitoring
The DS3231N/DIP supports environmental-monitoring nodes that must retain timestamps while sensors or radio hardware are power-cycled. Its backup-battery input protects calendar continuity, and the integrated TCXO and crystal deliver stated accuracy of ±2 ppm from 0°C to +40°C. The I2C interface allows time data to share a bus with compatible sensors and radio controllers. Because the real-time clock accuracy becomes ±3.5 ppm from -40°C to +85°C, field requirements should use the full environmental temperature range when defining acceptable timestamp error.
Recommended
Instrumented Logging Platforms
The DS3231N/DIP is useful in portable and instrumented logging platforms where each sample must carry an accurate date and time. The integrated crystal and temperature compensation provide a compact timekeeping solution, while the I2C interface reduces host GPIO requirements. Its stated ±2 ppm accuracy at 0°C to +40°C is appropriate for high-resolution event ordering, and backup operation preserves time during battery replacement or service. PCB layout should provide stable supply bypassing and should follow the manufacturer's pin and battery-connection guidance.
Recommended
Recommended Products Summary
Engineering reference data for DS3231N/DIP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Maxim Integrated |
| Package | 16-pin DIP |
| Product Type | I2C real-time clock with integrated TCXO and crystal |
| Operating Supply Voltage Range | 2.3 V to 5.5 V |
| Accuracy at 0°C to +40°C | ±2 ppm |
| Accuracy at -40°C to +85°C | ±3.5 ppm |
| Clock Interface | I2C |
| Integrated Crystal | Yes |
| Backup Battery Input | Yes |
| Operating Temperature Range | -40°C to +85°C |
Design Notes
Place the DS3231N/DIP in a location with minimal thermal gradients across the device and away from high-temperature regulators, power inductors, and airflow obstructions. The integrated TCXO supports temperature compensation, but mechanical temperature gradients can still affect local crystal temperature. Preserve the manufacturer's recommended grounding and decoupling arrangement around VCC and ground, and route the I2C traces away from switching-node and high-current return paths.
Design the main supply and backup-battery paths so the RTC can transition between them without corrupting timekeeping. Follow the manufacturer's battery-input connection and capacitor recommendations, verify the logic levels at VCC, and account for quiescent and backup current when estimating battery life. If the host operates from a different voltage, use compatible level translation and confirm that the I2C pull-ups remain within the allowed range.
Do not treat the DS3231N, DS3231SN, and DS3231MZ ordering codes as interchangeable without checking package geometry and pin assignment. A surface-mount ordering code cannot replace a DIP part on an unmodified board. Also avoid assuming the ±2 ppm figure applies across the full temperature range; the stated accuracy is ±3.5 ppm from -40°C to +85°C. Validate the complete clock specification against the product's required timestamp tolerance.
Keep I2C clock and data traces short, route them away from noisy power stages, and use pull-ups matched to the bus voltage and capacitance. Because several low-speed peripherals can share the bus, confirm address compatibility and avoid excessively long branches. Add the device close to the controller's power entry and ground reference when possible, while maintaining the clearance required by the manufacturer's PCB guidance.
Compliance Information
Compliance status was not established from the listed product information. Confirm current declarations with the manufacturer before a regulated production release.
