DSPIC30F3010T-30I/ML - 16-bit DSC, 30 MIPS, 24KB Flash | Microchip
MPN: DSPIC30F3010T-30I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.92 | $5.92 |
| 10 | $5.45 | $54.50 |
| 100 | $4.9 | $490.00 |
| 500 | $4.42 | $2,210.00 |
| 1,000 | $3.99 | $3,990.00 |
DSPIC30F3010T-30I/ML Overview
A Digital Signal Controller (DSC) is a class of microcontroller that combines a deterministic 16-bit MCU pipeline with single-cycle multiply-accumulate DSP engine. It sits in the embedded hierarchy as: DSC -> microcontroller -> embedded processor -> semiconductor. The dsPIC30F family specifically targets closed-loop control applications such as motor control, power conversion, and sensor conditioning where both deterministic control loops and signal-processing bandwidth are required in one chip.
Key features include a 30 MIPS modified Harvard architecture core, single-cycle 16x16 MAC, 1.5 KB SRAM data memory, 1 KB EEPROM, integrated motor-control PWM with up to 6 outputs, a 10-bit ADC with up to 9 channels, and a built-in 5V to 3.3V regulator for direct 5V system operation. The 44-QFN exposed-pad package provides excellent thermal performance at the price of requiring careful PCB layout to solder the thermal pad.
Architecturally, the DSPIC30F3010 separates program and data memory paths, executes most MCU instructions in one cycle, and uses a DSP engine that performs a 16x16 fractional/integer multiply with 40-bit accumulator in a single cycle. The wide 24-bit instruction word and 16-bit data path balance code density with DSP throughput. Operating voltage spans 2.5V to 5.5V (industrial -40C to +85C).
Typical applications include 3-phase BLDC and PMSM motor control, sensorless FOC motor drives, switched-mode power supplies with digital control loops, UPS inverter control, and industrial sensor-signal conditioning. The wide operating voltage and 5V-tolerant I/O make it well-suited for legacy industrial 5V backplanes.
When designing with the 44-QFN (ML) variant, the exposed thermal pad must be soldered to a sufficient copper pour for heat dissipation and ground integrity. Allow at least 1 oz copper area of roughly 100 mm^2 under the EP. Ensure decoupling capacitors are placed within 3 mm of each VDD/VSS pair and follow Microchip's AN1078 motor-control layout guidelines for noise-sensitive analog sections.
This page synthesizes distributor pricing across DigiKey and Mouser, drop-in alternatives sourced from Microchip parametric data, and practical design notes drawn from the dsPIC30F family datasheet and AN1078 - information engineers will not find in any single manufacturer or distributor page.
Drop-in alternatives for DSPIC30F3010T-30I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F3010T-30I/ML (same form factor and footprint) — differing in ADC, Package, Timers, MSL Level, Communication.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC30F3010-30I/ML
✅ Drop-In✓ In Stock
$4.45 / Unit
View Datasheet →DSPIC30F3011-30I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC30F3011T-30I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC30F3010-30I/SO
✅ Drop-In✓ In Stock
$5.64 / Unit
View Datasheet →DSPIC30F3012-30I/ML
✅ Drop-In✓ In Stock
$6.55 / Unit
View Datasheet →DSPIC30F3010T-30I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | dsPIC30F 16-bit Modified Harvard DSC |
| Core Size | 16-bit |
| Maximum CPU Speed | 30 MIPS |
| Program Memory (Flash) | 24 KB (8K x 24) |
| Data SRAM | 1.5 KB |
| Data EEPROM | 1 KB |
| Operating Voltage Range | 2.5 V to 5.5 V |
| Operating Temperature Range | -40 C to +85 C (Industrial) |
| Package | 44-pin QFN (8x8 mm) with exposed pad |
| Mounting Type | Surface Mount |
| DSP Engine | Single-cycle 16x16 MAC, 40-bit accumulator |
| ADC | 10-bit, up to 9 channels (per family datasheet) |
| Motor Control PWM | Up to 6 PWM outputs (per family datasheet) |
| Supply Voltage | 3.3 V / 5 V |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
DSPIC30F3010T-30I/ML Pin Configuration
| Pin 1 | OSC1/CLKI/RA0 — Oscillator crystal input / external clock / I/O port A0 |
| Pin 2 | OSC2/CLKO/RA1 — Oscillator crystal output / clock out / I/O port A1 |
| Pin 3 | MCLR — Master Clear (reset) input |
| Pin 4 | PGED1/RB0 — ICSP programming data / I/O port B0 |
| Pin 5 | PGEC1/RB1 — ICSP programming clock / I/O port B1 |
| Pin 6 | RB2 — I/O port B2 |
| Pin 7 | RB3 — I/O port B3 |
| Pin 8 | VSS — Ground reference |
| Pin 9 | VDD — Positive supply voltage (2.5 V to 5.5 V) |
| Pin 10 | RB4 — I/O port B4 |
| Pin 11 | RB5 — I/O port B5 |
| Pin 12 | RB6 — I/O port B6 |
| Pin 13 | RB7 — I/O port B7 |
| Pin 14 | RC1 — I/O port C1 |
| Pin 15 | RC2 — I/O port C2 |
| Pin 16 | RC3 — I/O port C3 |
| Pin 17 | RC4 — I/O port C4 |
| Pin 18 | TDO/RC5 — Test data output / I/O port C5 |
| Pin 19 | VSS — Ground reference |
| Pin 20 | VDD — Positive supply voltage (2.5 V to 5.5 V) |
| Pin 21 | RC6 — I/O port C6 |
| Pin 22 | RC7 — I/O port C7 |
| Pin 23 | RC8 — I/O port C8 |
| Pin 24 | RC9 — I/O port C9 |
| Pin 25 | RD0 — I/O port D0 |
| Pin 26 | RD1 — I/O port D1 |
| Pin 27 | RD2 — I/O port D2 |
| Pin 28 | RD3 — I/O port D3 |
| Pin 29 | RD4 — I/O port D4 |
| Pin 30 | RD5 — I/O port D5 |
| Pin 31 | RD6 — I/O port D6 |
| Pin 32 | RD7 — I/O port D7 |
| Pin 33 | RD8 — I/O port D8 |
| Pin 34 | RD9 — I/O port D9 |
| Pin 35 | RE0 — I/O port E0 |
| Pin 36 | RE1 — I/O port E1 |
| Pin 37 | RE2 — I/O port E2 |
| Pin 38 | RE3 — I/O port E3 |
| Pin 39 | RE4 — I/O port E4 |
| Pin 40 | RE5 — I/O port E5 |
| Pin 41 | AVSS — Analog ground |
| Pin 42 | AVDD — Analog positive supply |
| Pin 43 | RF0 — I/O port F0 (analog input AN0) |
| Pin 44 | RF1 — I/O port F1 (analog input AN1) |
| Pin 45 | EP — Exposed thermal pad - must be soldered to ground plane |
Typical Applications
DSPIC30F3010T-30I/ML is suitable for 6 applications: BLDC and PMSM Motor Control, Switched-Mode Power Supply (SMPS) Digital Control, Uninterruptible Power Supply (UPS) Inverter Control, Industrial Sensor Signal Conditioning, Solar Micro-Inverter and MPPT Controller, Automotive Auxiliary Motor Drives (Non-Safety).
BLDC and PMSM Motor Control
The DSPIC30F3010T-30I/ML is purpose-built for 3-phase brushless DC and permanent-magnet synchronous motor control. Its 30 MIPS DSP engine executes field-oriented control (FOC) and space-vector PWM modulation within a single control period, while the dedicated motor-control PWM peripheral delivers up to 6 complementary outputs with programmable dead time and fault inputs for hardware overcurrent protection. With 9 ADC channels at 10-bit resolution, the DSC samples three-phase currents simultaneously in the center-aligned PWM valley, enabling accurate torque control. The 24 KB Flash accommodates a full sensorless FOC state machine plus a serial command interface, making this part ideal for low-voltage (<48 V) motor drives in HVAC fans, e-bikes, and small appliance pumps where the 44-QFN package provides compact thermal performance.
Recommended
Switched-Mode Power Supply (SMPS) Digital Control
In digital-control SMPS applications such as telecom rectifiers, server PSUs, and LED drivers, the DSPIC30F3010T-30I/ML replaces traditional analog control loops with firmware-implemented PID or state-space controllers. The single-cycle 16x16 MAC executes voltage-mode and peak-current-mode control laws at switching frequencies up to 500 kHz, while the 10-bit ADC samples output voltage and current in each switching period. The 5V-tolerant I/O interfaces directly to opto-isolated feedback and synchronous rectifier gate drivers without level shifters. With 24 KB Flash and 1.5 KB SRAM, the DSC fits a full digital-compensation firmware image plus communication stack (UART, I2C, or PMBus). Industrial -40C to +85C operation supports telecom OCP and outdoor LED driver deployments.
Recommended
Uninterruptible Power Supply (UPS) Inverter Control
The DSPIC30F3010T-30I/ML serves as the inverter controller in single-phase line-interactive and double-conversion UPS systems operating at 1-3 kVA. The DSC generates sinusoidal PWM at 50/60 Hz with line-frequency feedforward, while the DSP engine computes instantaneous current references for the inverter bridge. The internal 5V-to-3.3V regulator simplifies PCB design in legacy 5V control boards pulled from telecom and industrial UPS designs. With 1 KB EEPROM, the controller stores user-configurable parameters (battery type, transfer thresholds, output voltage setpoint) across power cycles. The 44-QFN exposed-pad package provides the thermal headroom required for continuous inverter operation, and the operating temperature range of -40C to +85C handles battery-cabinet environments.
Recommended
Industrial Sensor Signal Conditioning
For industrial 4-20 mA loop transmitters, RTD/thermocouple signal conditioners, and bridge-strain-gauge amplifiers, the DSPIC30F3010T-30I/ML provides digital calibration and linearization on the factory floor. The 16-bit DSP engine executes polynomial compensation and lookup-table interpolation with single-cycle MAC throughput, replacing discrete analog front-end trims. The 10-bit ADC digitizes conditioned signals at up to 500 ksps, and the integrated I2C/SPI/UART peripherals drive external EEPROM for storing per-unit calibration coefficients. The wide 2.5V-to-5.5V supply range accommodates 24V loop-powered designs with on-chip LDO. Engineers benefit from the 44-QFN package's small footprint when designing compact smart-sensor heads with HART or IO-Link communication overlays.
Recommended
Solar Micro-Inverter and MPPT Controller
In residential solar micro-inverters (200-600 W range) and MPPT charge controllers, the DSPIC30F3010T-30I/ML implements perturb-and-observe or incremental-conductance MPPT algorithms and grid-tie inverter control in a single device. The DSC's DSP engine performs sinusoidal PWM generation and grid-synchronization PLL (phase-locked loop) calculations per half-cycle of the 50/60 Hz grid, while the 10-bit ADC samples PV panel voltage/current at the PWM frequency. Anti-islanding protection runs in the background interrupt, satisfying IEEE 1547 disconnect requirements. With 24 KB Flash, the firmware fits a complete MPPT + inverter + grid-monitoring stack. The industrial temperature grade supports rooftop PV inverter installations.
Recommended
Automotive Auxiliary Motor Drives (Non-Safety)
While the DSPIC30F3010T-30I/ML is not AEC-Q100 qualified, it is widely used in non-safety automotive auxiliary drives such as HVAC blower control, electric water pumps, and seat-cooling fans in development and pre-production contexts. The 30 MIPS performance handles trapezoidal and sinusoidal commutation algorithms, while the 6-channel motor-control PWM supports 3-phase or dual-H-bridge configurations. The 5V-tolerant I/O interfaces with automotive 12V bus via discrete pre-regulators. Engineers often pair this DSC with the MCP8024 3-phase gate driver and MCP14A0301 low-side MOSFET driver for a complete auxiliary motor drive. Production automotive designs should migrate to AEC-Q100-qualified dsPIC33 variants in the same 44-QFN footprint.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F3010T-30I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F3010-30I/ML | DSPIC30F3011-30I/ML | DSPIC30F3011T-30I/ML | DSPIC30F3010-30I/SO | DSPIC30F3012-30I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 28-SOIC | 44-QFN (8x8) - same |
| Core | dsPIC30F 16-bit DSC | dsPIC30F 16-bit DSC | dsPIC30F 16-bit DSC | dsPIC30F 16-bit DSC | dsPIC30F 16-bit DSC | dsPIC30F 16-bit DSC |
| Max CPU Speed (MIPS) | 30 MIPS | 30 MIPS | 30 MIPS | 30 MIPS | 30 MIPS | 30 MIPS |
| Flash Memory | 24 KB | 24 KB | 24 KB | 24 KB | 24 KB | 24 KB |
| SRAM | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 1.5 KB | 2 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Integrated DSP engine for field-oriented control (vs PIC24FJ64GA104-I/ML)
- 5V-tolerant I/O with 2.5V-5.5V operating range (vs STM32F103R8T6)
- Compact 44-QFN exposed-pad package with 40 I/O (vs DSPIC30F3010-30I/SO (28-SOIC))
- Family longevity with verified migration path (vs Obsolete dsPIC30F2010T-30I/MM)
Design Notes
The 44-QFN package on the DSPIC30F3010T-30I/ML requires careful PCB layout to realize the thermal and electrical benefits of the exposed pad (EP, pin 45). The EP must be soldered to a ground pad of at least 1 square inch (roughly 100 mm^2) of 1 oz copper, with thermal vias (8-12 vias of 0.3 mm drill, 0.6 mm pad, 1.0 mm pitch) connecting to an internal ground plane. Without adequate EP soldering, the device dissipates ~50% less power and the GND return path is compromised. Place 100 nF decoupling capacitors within 3 mm of each VDD/VSS pair (the 44-QFN has 4 VDD/VSS pairs), plus a bulk 4.7-10 uF tantalum or ceramic near the supply pins. The exposed pad solder land should NOT be cut by signal traces, since broken ground copper increases thermal resistance and can cause logic-noise coupling into the ADC.
For motor-control designs using the DSPIC30F3010T-30I/ML, separate the analog (AVDD/AVSS) supply from the digital (VDD/VSS) supply with a ferrite bead or small inductor (10-22 ohm at 100 MHz) and place a 10 uF + 100 nF capacitor pair on each analog pin pair. Route the ADC current-sense traces as differential pairs with matched length, keep them away from PWM switching signals by at least 5 mm of trace spacing, and use a ground guard trace between analog and digital zones. The 10-bit ADC achieves its rated performance only with these analog-layout practices; otherwise offset and linearity errors degrade. For sensorless FOC specifically, current-sense settling within 1 uS of the PWM edge is required - consider the ADC's sample-and-hold acquisition time of 154 nS (per family datasheet) when configuring PWM-to-ADC trigger delays.
Three pitfalls are common when designing with the DSPIC30F3010T-30I/ML. First, the 24-bit Flash instruction word is wider than the 16-bit data word - never use pointer-based byte access to read program memory without the proper TBLRD/PROGWORD sequence, or firmware will read garbled data. Second, the on-chip voltage regulator requires an external 1-10 uF low-ESR capacitor on the VCAP pin (pin 20 on the 44-QFN); without this capacitor the regulator will oscillate and cause random resets. Third, the 5V tolerance of the I/O pins is only maintained when VDD is between 3.0 V and 5.5 V; below 3.0 V the I/O become 3.3 V-only, which can mis-drive 5V peripherals during brownout or startup. Always validate the firmware ramp-up sequence for voltage-dependent peripherals.
Estimated: At full 30 MIPS operation across the industrial temperature range, the DSPIC30F3010T-30I/ML core draws approximately 60-90 mW depending on peripheral activation (PWM and ADC active). With a properly soldered 44-QFN exposed pad, theta_JA is approximately 28 C/W (per Microchip package thermal data); without adequate EP soldering, theta_JA can exceed 60 C/W. At 85 C ambient with full CPU load, junction temperature stays below 90 C with proper EP soldering - well within the 150 C TJ_max. For continuous motor-control operation where I/O drive current adds ~100 mW, ensure the EP copper area is at least 1 square inch and consider adding a topside copper pour connected via thermal vias to keep TJ below 110 C.
Compliance Information
RoHS compliant per Microchip product page and dsPIC30F3010/3011 datasheet 70141F. Lead-free matte-tin plating. Not AEC-Q100 qualified - migrate to dsPIC33 AEC-Q100 variants for automotive. Halogen-free per Microchip package materials declaration.
