DSPIC30F3012-30I/ML - 16-Bit 30MIPs DSC, 24KB Flash | Microchip
MPN: DSPIC30F3012-30I/ML β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.5 | $9.50 |
| 10 | $8.85 | $88.50 |
| 100 | $7.95 | $795.00 |
| 500 | $7.2 | $3,600.00 |
| 1,000 | $6.55 | $6,550.00 |
DSPIC30F3012-30I/ML Overview
A Digital Signal Controller is a hybrid device that merges a microcontroller's deterministic peripherals and C-friendly programming model with a DSP's single-cycle MAC engine, dual 40-bit accumulators, and barrel shifter. DSCs sit in the hierarchy between microcontrollers (slow control loops, no MAC) and full DSP processors (high MAC throughput, no general peripherals). The dsPIC30F family is Microchip's entry-level DSC line, optimized for cost-sensitive embedded signal processing such as motor control, power conversion, and sensor conditioning.
The DSPIC30F3012 features 24 KB of Flash program memory organized as 8K x 24 words, 2 KB of RAM (1K x 16), and a 17-bit x 17-bit single-cycle hardware multiplier. On-chip peripherals include a 12-bit 200 Ksps Analog-to-Digital Converter (A/D) with up to 8 input channels, multiple timers, an Input Capture module, an Output Compare/PWM module, a UART, an SPI port, an I2C port, and a Controller Area Network (CAN) module. Self-reprogrammable Flash and robust code protection support field upgrades and IP security.
Architecturally, the device uses a modified Harvard bus with separate program and data paths, enabling simultaneous instruction fetch and data access. The 24-bit instruction word is a key dsPIC30F trait: it provides compact encoding of DSP operations (MAC, ED, EDAC) that a 16-bit MCU cannot express in one cycle. Operating current is typically 70 mA at 5V/30 MHz and falls below 1 uA in Sleep mode.
Typical applications include BLDC and PMSM motor control (sensored and sensorless FOC), uninterruptible power supplies, digital power conversion, automotive sensor interfacing, and industrial control loops. The 30 MIPS headroom comfortably runs FOC algorithms at 10-20 kHz PWM with margin for housekeeping tasks.
When designing with the DSPIC30F3012, ensure the exposed pad (EP) on the QFN-44 package is soldered to a sufficient copper pour to meet the thermal resistance of 29 C/W. Decoupling requires a 0.1 uF ceramic on each VDD/AVDD pair placed within 3 mm of the pin. Use the MPLAB XC-DSC compiler for code development and the MPLAB ICD 3 or REAL ICE for in-circuit debug.
This page consolidates distributor pricing for the DSPIC30F3012-30I/ML, dsPIC30F family drop-in alternatives (including the site-published DSPIC30F3012-20I/P and DSPIC30F3012-20E/ML variants), and practical design notes not assembled in the manufacturer datasheet alone.
Drop-in alternatives for DSPIC30F3012-30I/ML β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC30F3012-30I/ML (same form factor and footprint) β differing in ADC, Package, Operating Temperature, Timers, Core Architecture.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC30F3012-20I/ML
β Drop-Inπ Reference alternative (not in catalog)
DSPIC30F3012-20E/ML
β Drop-Inβ In Stock
$5.42 / Unit
View Datasheet βDSPIC30F3011T-30I/ML
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC30F3012-30I/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC30F 16-bit DSC |
| Instruction Set | 16-bit data, 24-bit instruction (modified Harvard) |
| Maximum CPU Speed | 30 MIPS at 30 MHz |
| Operating Voltage | 2.5 V to 5.5 V |
| Program Flash Memory | 24 KB (8K x 24 words) |
| RAM | 2 KB (1K x 16) |
| EEPROM | 1 KB |
| Hardware Multiplier | 17-bit x 17-bit single-cycle |
| Accumulators | Dual 40-bit |
| ADC | 12-bit, 200 Ksps, up to 8 input channels |
| Timers | 5 x 16-bit |
| Input Capture | 4 channels |
| Output Compare / PWM | 4 channels |
| Communication | 1x UART, 1x SPI, 1x I2C, 1x CAN |
| Package | 44-pin QFN (8x8 mm, ML) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial, "I") |
| Thermal Resistance (theta-JA) | 29 C/W (with exposed pad soldered) |
| Typical Operating Current | 70 mA at 5V / 30 MHz |
| Sleep Current | < 1 uA typical |
| RoHS Status | Compliant |
| MSL Level | 3 |
DSPIC30F3012-30I/ML Pin Configuration
| Pin 1 | SDA/RG3 β I2C data / port G bit 3 |
| Pin 2 | SCL/RG2 β I2C clock / port G bit 2 |
| Pin 3 | MCLR β Master clear reset (active low) |
| Pin 4 | AN0/RA0 β Analog input 0 / port A bit 0 |
| Pin 5 | AN1/RA1 β Analog input 1 / port A bit 1 |
| Pin 6 | AN2/RA2 β Analog input 2 / port A bit 2 |
| Pin 7 | AN3/RA3 β Analog input 3 / port A bit 3 |
| Pin 8 | AVDD β Analog supply voltage |
| Pin 9 | AVSS β Analog ground |
| Pin 10 | AN4/RB0 β Analog input 4 / port B bit 0 |
| Pin 11 | AN5/RB1 β Analog input 5 / port B bit 1 |
| Pin 12 | AN6/RB2 β Analog input 6 / port B bit 2 |
| Pin 13 | AN7/RB3 β Analog input 7 / port B bit 3 |
| Pin 14 | VDD β Digital supply voltage |
| Pin 15 | VSS β Digital ground |
| Pin 16 | OSC1/CLKI/RA4 β Crystal input / external clock / port A bit 4 |
| Pin 17 | OSC2/CLKO/RA5 β Crystal output / clock output / port A bit 5 |
| Pin 18 | IC1/RD8 β Input capture 1 / port D bit 8 |
| Pin 19 | IC2/RD9 β Input capture 2 / port D bit 9 |
| Pin 20 | IC3/RD10 β Input capture 3 / port D bit 10 |
| Pin 21 | IC4/RD11 β Input capture 4 / port D bit 11 |
| Pin 22 | OC1/RD0 β Output compare 1 / port D bit 0 |
| Pin 23 | OC2/RD1 β Output compare 2 / port D bit 1 |
| Pin 24 | OC3/RD2 β Output compare 3 / port D bit 2 |
| Pin 25 | OC4/RD3 β Output compare 4 / port D bit 3 |
| Pin 26 | C1RX/RF0 β CAN1 receive / port F bit 0 |
| Pin 27 | C1TX/RF1 β CAN1 transmit / port F bit 1 |
| Pin 28 | U1RX/RF2 β UART1 receive / port F bit 2 |
| Pin 29 | U1TX/RF3 β UART1 transmit / port F bit 3 |
| Pin 30 | SCK1/RF6 β SPI1 clock / port F bit 6 |
| Pin 31 | SDO1/RF7 β SPI1 data out / port F bit 7 |
| Pin 32 | SDI1/RF8 β SPI1 data in / port F bit 8 |
| Pin 33 | T1CK/RC1 β Timer1 clock / port C bit 1 |
| Pin 34 | T2CK/RC2 β Timer2 clock / port C bit 2 |
| Pin 35 | T3CK/RC3 β Timer3 clock / port C bit 3 |
| Pin 36 | T4CK/RC4 β Timer4 clock / port C bit 4 |
| Pin 37 | INT0/RD4 β External interrupt 0 / port D bit 4 |
| Pin 38 | INT1/RD5 β External interrupt 1 / port D bit 5 |
| Pin 39 | INT2/RE8 β External interrupt 2 / port E bit 8 |
| Pin 40 | FLTA/RE9 β PWM fault input A / port E bit 9 |
| Pin 41 | RE0 β Port E bit 0 |
| Pin 42 | RE1 β Port E bit 1 |
| Pin 43 | RE2 β Port E bit 2 |
| Pin 44 | RE3 β Port E bit 3 |
Typical Applications
DSPIC30F3012-30I/ML is suitable for 6 applications: BLDC / PMSM Motor Control (Sensored FOC), Uninterruptible Power Supply (UPS) and Inverter Control, Automotive Sensor Interface and Body Controllers, Industrial Sensor Conditioning and 4-20 mA Loop Transmitters, Digital Power Conversion (DC-DC and PFC), Audio Processing and Active Noise Cancellation.
BLDC / PMSM Motor Control (Sensored FOC)
The DSPIC30F3012-30I/ML's 30 MIPS C-friendly core runs sensorless or Hall-sensored Field-Oriented Control on BLDC and PMSM motors at PWM frequencies up to 20 kHz, leaving headroom for speed/current PI loops, Clarke/Park transforms, and inverse Park/SVPWM. Its 12-bit 200 Ksps ADC samples two phase currents plus DC-bus voltage within the 50 us PWM period with margin for trigger latency. The 17-bit x 17-bit single-cycle MAC executes a Park transform in roughly 30 cycles, and the dedicated 4-channel Output Compare/PWM module generates complementary 3-phase signals with programmable dead time. Unlike a generic Cortex-M0, the single-cycle MAC keeps the ISR well under the PWM period, avoiding torque ripple.
Recommended
Uninterruptible Power Supply (UPS) and Inverter Control
In a double-conversion UPS, the DSPIC30F3012-30I/ML executes the digital control loop for the PFC stage and the DC-AC inverter. Its 30 MIPS throughput handles average-current-mode control, RMS voltage computation, and battery state-of-charge monitoring in real time at 16 kHz switching frequency. The 12-bit ADC synchronizes to the PWM trigger for sub-microsecond sample timing, and the on-chip CAN module reports telemetry to a system controller. The 44-QFN package with exposed pad sustains continuous operation at 70 mA typical / 5V with the recommended 1 square-inch copper thermal pour.
Recommended
Automotive Sensor Interface and Body Controllers
Recommended
Industrial Sensor Conditioning and 4-20 mA Loop Transmitters
In a 4-20 mA current-loop transmitter, the DSPIC30F3012-30I/ML acquires a bridge or thermocouple signal via its 12-bit ADC, applies digital linearization and cold-junction compensation, then drives a 16-bit PWM output that a precision op-amp converts to loop current. Its DSP MAC accelerates polynomial compensation routines that a 16-bit MCU would handle slowly in software. The 2.5V-5.5V supply works directly from a loop-powered 24V rail after a low-dropout regulator, and the CAN module adds optional HART-style digital diagnostics over the same loop.
Recommended
Digital Power Conversion (DC-DC and PFC)
The DSPIC30F3012-30I/ML executes average-current-mode control for PFC boost converters and voltage-mode control for synchronous buck regulators. At 30 MIPS it sustains a 50-100 kHz control loop with proportional-integral compensation, input voltage feed-forward, and brown-out protection. The 12-bit ADC samples inductor current and output voltage synchronously with the PWM, and the 4-channel Output Compare/PWM module generates leading-edge-modulated gate drives with programmable dead time. Although it does not include the dsPIC33F family's high-speed PWM and 10-bit DAC, the DSPIC30F3012 remains adequate for sub-100 kHz converters under 1 kW.
Recommended
Audio Processing and Active Noise Cancellation
Audio applications benefit from the DSPIC30F3012-30I/ML's single-cycle MAC and dual 40-bit accumulators, which implement FIR and IIR filters, biquad stages, and basic ANC algorithms at 48 kHz sample rate. The 24 KB Flash accommodates a 100-tap FIR plus housekeeping, and the 2 KB RAM buffers a stereo 16-bit audio stream. I2S can be implemented via the SPI module with DMA-like double-buffered transfers. The 30 MIPS throughput delivers approximately 600 cycles per sample, sufficient for a small feedforward ANC algorithm on a headphone or hearing-aid prototype.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC30F3012-30I/ML β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC30F3012-20I/ML | DSPIC30F3012-20E/ML |
|---|---|---|---|
| Package | 44-pin QFN (8x8 mm, ML) with EP | 44-pin QFN (8x8 mm, ML) with EP - same | 44-pin QFN (8x8 mm, ML) with EP - same |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same |
| Maximum CPU Speed | 30 MIPS at 30 MHz | 20 MIPS at 20 MHz (-33%) | 20 MIPS at 20 MHz (-33%) |
| Program Flash Memory | 24 KB | 24 KB - same | 24 KB - same |
| RAM | 2 KB | 2 KB - same | 2 KB - same |
| Operating Voltage | 2.5 V to 5.5 V | 2.5 V to 5.5 V - same | 2.5 V to 5.5 V - same |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C - same | -40C to +125C (Extended, +40C vs target) |
| Hardware Multiplier | 17-bit x 17-bit single-cycle MAC | 17-bit x 17-bit single-cycle MAC - same | 17-bit x 17-bit single-cycle MAC - same |
| ADC | 12-bit, 200 Ksps, 8 channels | 12-bit, 200 Ksps, 8 channels - same | 12-bit, 200 Ksps, 8 channels - same |
| CAN Module | CAN 2.0B (1 channel) | CAN 2.0B (1 channel) - same | CAN 2.0B (1 channel) - same |
Key Differentiators
- Highest CPU speed in the DSPIC30F3012 QFN-44 family (vs DSPIC30F3012-20I/ML)
- Integrated hardware CAN 2.0B controller (vs DSPIC30F3010-30I/ML)
- Industrial temperature range for cost-sensitive projects (vs DSPIC30F3012-20E/ML)
Design Notes
The 44-pin QFN (ML) package exposes a central thermal pad on the underside that must be soldered to a PCB ground plane for both electrical return and heat dissipation. With theta-JA of 29 C/W (with the EP soldered), the device dissipates approximately 350 mW at typical 5V/30 MHz operation (70 mA) and reaches a 10 C temperature rise above ambient without additional cooling. Estimate: input power 5V x 70 mA = 350 mW; dT = 0.35 W x 29 C/W = 10.15 C. Recommended copper pour: at least 1 square inch (645 mm^2) of 1 oz copper on the top layer, plus thermal vias to an internal ground plane.
Decouple each VDD/AVDD pin with a 0.1 uF X7R ceramic placed within 3 mm of the package pin. Add a bulk 10 uF tantalum or polymer capacitor near the supply pins to support the 70 mA active current transients. Keep the AVDD trace short and isolated from digital switching currents; use a ferrite bead or filter resistor between VDD and AVDD if the digital rail is noisy. The exposed pad must connect to a clean ground pour with at least 9 thermal vias (0.3 mm drill, 0.6 mm pad) for thermal performance.
Do not confuse the DSPIC30F3012-30I/ML with the DSPIC30F3012-30I/P (40-pin PDIP). The /ML package is a 44-pin QFN, the /P package is a 40-pin PDIP, and the two parts do NOT share a PCB footprint. Also note that the industrial (-40C to +85C) and extended (-40C to +125C) grades differ only in temperature rating - same die, same package. Programming voltage on MCLR is 13V typical for high-voltage ICSP; the on-chip regulator does NOT require an external programming voltage supply during normal run-time operation.
When sampling high-impedance analog sources with the 12-bit ADC, add an external buffer op-amp (such as MCP6001 or MCP6N11) within 10 mm of the analog input pin. The ADC sample-and-hold capacitance (typically 4.5 pF) draws transient current that can introduce settling error if the source impedance exceeds 5 kohm. For 12-bit accuracy (1 LSB at 5V = 1.22 mV), the input settling error must remain below 0.5 LSB, which requires source impedance below approximately 2 kohm at the default 200 Ksps sample rate.
Compliance Information
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; AEC-Q100 variants are available in the same family under separate part numbers. Lead-free matte-tin finish; MSL-3 floor life per JEDEC J-STD-020.
