DSPIC33CK256MP306-I/PT - 100MIPS 16-bit DSC 256KB | Microchip
MPN: DSPIC33CK256MP306-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.9 | $4.90 |
| 10 | $4.55 | $45.50 |
| 100 | $4.2 | $420.00 |
| 500 | $3.95 | $1,975.00 |
| 1,000 | $3.7 | $3,700.00 |
DSPIC33CK256MP306-I/PT Overview
A digital signal controller combines the compute power of a DSP with the peripheral integration and control peripherals of a microcontroller. In the embedded hierarchy, the DSC sits between a general-purpose MCU and a dedicated DSP: it executes deterministic control loops in C while performing MAC (multiply-accumulate) heavy signal processing on-chip. Microchip's dsPIC33C family targets real-time control systems such as digital power conversion and precision motor control, where loop rates of 100 kHz to 1 MHz are common.
Key features include the 100 MIPS single-core CPU with DSP instruction extensions, 256 KB of dual-panel flash enabling live firmware updates, 64 KB of RAM for control buffers and communication stacks, integrated operational amplifiers, 12-bit ADCs with high sample rates for simultaneous sampling, and advanced high-resolution PWM peripherals. The part is designated Functional Safety (FuSa) supporting safety-oriented designs.
Architecturally, the dsPIC33CK core uses a modified Harvard pipeline with zero-overhead loops, hardware division, and single-cycle MAC, keeping ISR latency low for tightly timed control loops. Eight DMA channels move ADC results and UART/SPI data without CPU intervention. Multiple pairs of PGECx/PGEDx pins support In-Circuit Serial Programming (ICSP); any pair can be used, but ICSPCLK and ICSPDAT must come from the same pair.
Typical applications include brushless DC and PMSM motor drives, digital switched-mode power supplies (LLC, totem-pole PFC), solar inverters, and wireless charging transmitters, all leveraging the ADC + op-amp + PWM signal chain.
Design consideration: the supply range is 3.0 V to 3.6 V - power it from a 3.3 V LDO or buck regulator with adequate decoupling, and route analog op-amp/ADC pins away from PWM switching nodes.
This page adds value beyond the manufacturer datasheet by synthesizing distributor pricing, drop-in same-family alternatives, comparison tables, and practical layout and programming notes in one citable reference.
Drop-in alternatives for DSPIC33CK256MP306-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK256MP306-I/PT (same form factor and footprint) — differing in ADC, Core, Mounting Type, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK256MP306-E/PT
✅ Drop-In✓ In Stock
$1.99 / Unit
View Datasheet →DSPIC33CK256MP306-H/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK256MP306-I/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33C 16-bit DSC, single core |
| Maximum Clock / MIPS | 100 MHz / 100 MIPS |
| Program Memory (Flash) | 256 KB (256K x 8), dual panel |
| RAM | 64 KB (64K x 8) |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Count | 53 I/O |
| ADC | 12-bit ADCs |
| Op Amps | Integrated operational amplifiers |
| PWM | High-resolution PWM peripherals |
| DMA Channels | 8 |
| Package | 64-TQFP (10x10 mm), 0.5 mm pitch |
| Mounting Type | Surface Mount (Gull Wing) |
| Temperature Grade | -40C to +85C (I grade) |
| Functional Safety | FuSa designated |
| Programming | ICSP via PGECx/PGEDx pairs |
| RoHS Status | Compliant |
DSPIC33CK256MP306-I/PT 64-tqfp (10x10 mm), 0.5 mm pitch Pin Configuration Guide
Pin configuration for DSPIC33CK256MP306-I/PT (64-tqfp (10x10 mm), 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP306-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP306-I/PT is suitable for 6 applications: BLDC/PMSM Precision Motor Control, Digital Power Conversion (LLC, Totem-Pole PFC), Solar Inverters and Microinverters, Wireless Charging Transmitters, Industrial Automation and Sensing Nodes, Functional Safety-Oriented Embedded Systems.
BLDC/PMSM Precision Motor Control
The DSPIC33CK256MP306-I/PT is purpose-built for field-oriented control (FOC) of brushless DC and PMSM motors. Its 100 MIPS core executes current-loop interrupts above 100 kHz with deterministic latency, while the 12-bit ADC captures simultaneous phase-current samples and the integrated op amps condition shunt-resistor signals without external amplifiers. The high-resolution PWM block generates three complementary pairs with cycle-accurate dead-time insertion, critical for inverter efficiency and shoot-through protection. In a typical servo drive, the DSC closes the current loop in software at 100 kHz and the speed loop at 1-10 kHz, with 8 DMA channels streaming ADC data to RAM for observers and position estimation, eliminating external sensing ICs.
Recommended
Digital Power Conversion (LLC, Totem-Pole PFC)
For digitally controlled switched-mode power supplies such as LLC resonant converters and totem-pole PFC stages, the DSPIC33CK256MP306-I/PT provides the control bandwidth and peripheral precision required at switching frequencies of 100 kHz to 1 MHz. The high-resolution PWM offers sub-nanosecond effective resolution for frequency and phase control in resonant topologies, while fast 12-bit ADC sampling synchronizes to PWM triggers for cycle-by-cycle current sensing. The dual-panel 256 KB flash supports in-system firmware updates of control laws without bricking the supply, and the FuSa designation supports safety-relevant power stages. The 100 MIPS headroom accommodates nonlinear control and predictive algorithms beyond simple PID.
Recommended
Solar Inverters and Microinverters
Grid-tied solar inverter designs leverage the DSPIC33CK256MP306-I/PT for maximum power point tracking (MPPT), grid synchronization, and inverter modulation in one device. The 100 MHz core runs MPPT algorithms while simultaneously executing the grid current-control loop; the 12-bit ADC samples DC bus voltage, panel current, and grid waveforms synchronously with the PWM carrier. Integrated op amps condition current-sense signals directly, and the high-resolution PWM shapes the output waveform with low harmonic distortion. Dual-panel flash enables field firmware updates for changing grid codes, and the 53 I/O support relays, communication (RS-485, CAN), and safety interlocks without a companion controller.
Recommended
Wireless Charging Transmitters
Qi-style wireless power transmitter designs use the DSPIC33CK256MP306-I/PT to drive the resonant half-bridge and control foreign-object detection and power negotiation. The high-resolution PWM generates the operating-frequency drive with precise frequency tracking of the resonant tank, while the 12-bit ADC monitors coil current, voltage, and temperature via integrated op-amp buffers. The 100 MIPS core implements demodulation of the receiver's communication signal and closed-loop power regulation in software. Eight DMA channels handle the sensing streams with minimal CPU overhead, and the 64 KB RAM supports buffers for demodulation and safety algorithms, allowing a single-chip transmitter controller solution.
Recommended
Industrial Automation and Sensing Nodes
In factory automation, the DSPIC33CK256MP306-I/PT serves as a smart sensor or actuator controller, combining 16-bit DSP signal processing with rich connectivity. The 12-bit ADC plus integrated op amps digitize bridge sensors (pressure, load cells) with on-chip amplification, and the DSP engine applies digital filtering (FIR/IIR) at 100 MIPS - tasks that would need an external DSP on lesser MCUs. Multiple UART/SPI/I2C interfaces plus 53 I/O integrate with PLC I/O racks, and dual-panel flash supports field reconfiguration. The industrial -40C to +85C grade and RoHS compliance fit standard factory equipment qualification requirements.
Recommended
Functional Safety-Oriented Embedded Systems
Designers building safety-relevant equipment select the DSPIC33CK256MP306-I/PT because DigiKey and Microchip classify this dsPIC33CK part under the Functional Safety (FuSa) designation, with supporting safety documentation available from Microchip. The dual-panel flash architecture allows validated firmware to boot and update safely, the deterministic 100 MIPS core simplifies worst-case execution-time analysis, and the 64 KB RAM supports redundant data structures for diagnostics. Typical uses include safety interlock controllers in motor drives, monitored power stages, and industrial equipment where control and diagnostics must run on one certified-supportable device rather than a split MCU plus supervisor architecture.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP306-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP306-E/PT | DSPIC33CK256MP306-H/PT | DSPIC33CK256MP205-I/PT |
|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TFQFP (0.5 mm pitch) - same footprint | 48-TQFP (7x7 mm) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS |
| Flash Memory | 256 KB dual panel | 256 KB dual panel | 256 KB dual panel | 256 KB dual panel |
| RAM | 64 KB | 64 KB | 64 KB | 64 KB |
| Temperature Range | -40C to +85C (I) | -40C to +125C (E) | Automotive grade | -40C to +85C (I) |
| AEC-Q100 | Not qualified (industrial) | Not qualified | Qualified | Not qualified |
Key Differentiators
- Identical die in extended temperature grade (vs DSPIC33CK256MP306-E/PT)
- Automotive qualification path on same footprint (vs DSPIC33CK256MP306-H/PT)
- Maximum I/O in the 256 KB dsPIC33CK family (vs DSPIC33CK256MP205-I/PT)
Design Notes
Power the DSPIC33CK256MP306-I/PT from a regulated 3.3 V supply within the 3.0 V to 3.6 V datasheet range. Place 0.1 uF ceramic decoupling capacitors at every VDD/VSS pair plus one bulk 10 uF capacitor near the device. Split the analog supply per datasheet AVDD guidance and filter it with an LC or ferrite bead from the digital rail so the ADC and op amps see clean power - PWM switching noise on AVDD directly degrades 12-bit conversion accuracy.
Use the 10x10 mm 64-TQFP land pattern per the Microchip datasheet with 0.5 mm pitch. Route PWM outputs to gate drivers away from op-amp/ADC analog traces; place a ground plane under the device and do not break it under analog routing. Assign shunt-sense routing as Kelvin connections to the integrated op-amp inputs. Group crystals within a few mm of the OSC pins with short traces and local ground guard.
For in-circuit serial programming (ICSP), remember the device offers multiple PGECx/PGEDx pairs and ICSPCLK/ICSPDAT must come from the SAME pair (e.g., PGEC2 with PGED2) - mixing pairs is the most common programming failure. Also, firmware compiled for dsPIC33CK family parts is portable across MP205/MP306 variants, but verify peripheral instance counts and pin mapping when moving between 48-pin and 64-pin packages before reusing linker and pin-configuration files.
Compliance Information
RoHS compliance stated by LCSC listing (C3228353). The related -H/PT variant is AEC-Q100 qualified; this -I/PT industrial grade is not. REACH, halogen-free, and conflict-minerals status not stated in provided data.
