DSPIC33CK512MP306-I/PT - 16-bit 100MIPS DSC 512KB | Microchip
MPN: DSPIC33CK512MP306-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.79 | $5.79 |
| 10 | $5.23 | $52.30 |
| 100 | $4.71 | $471.00 |
| 500 | $4.35 | $2,175.00 |
| 1,000 | $3.98 | $3,980.00 |
DSPIC33CK512MP306-I/PT Overview
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control architecture of a microcontroller. In the embedded-systems hierarchy, a DSC sits above general-purpose MCUs and beside DSPs: it executes single-cycle MAC and DSP instructions while retaining deterministic interrupt latency and rich motor-control peripherals. The dsPIC33CK family is Microchip's single-core member of the dsPIC33C generation, complemented by the dual-core dsPIC33CH family.
Key features include a dual-panel flash architecture supporting live firmware updates with one partition executing while the other is reprogrammed, CAN Flexible Data-Rate (CAN FD) for modern in-vehicle and industrial networks, three integrated op-amps that offload external analog signal conditioning, and a high-resolution PWM module suited to precision power conversion. The 12-bit ADC pipeline supports simultaneous multi-channel sampling for current and voltage sensing.
Technically, the 100 MHz core pairs with DSP instructions for FOC (field-oriented control) motor algorithms, while the functional-safety-oriented peripheral set aids compliance-driven industrial designs. The dual-panel flash enables safe in-field bootloader upgrades without external memory.
Typical applications are brushless DC and PMSM motor control, digital power supplies and PFC stages, automotive and industrial CAN FD nodes, and precision inverters.
Design consideration: the device requires a regulated 3.0V-3.6V supply, so plan a 3.3V LDO or buck rail with adequate decoupling on all VDD/VDDCORE pins; verify flash partition configuration early, as it determines code space per partition.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for DSPIC33CK512MP306-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK512MP306-I/PT (same form factor and footprint) — differing in Package, Operating Temperature, PWM, Core, Data SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK512MP306-E/PT
✅ Drop-In✓ In Stock
$3.51 / Unit
View Datasheet →DSPIC33CK512MP306-H/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CK512MP305-I/PT
✅ Drop-In✓ In Stock
$4.36 / Unit
View Datasheet →DSPIC33CK256MP205-I/PT
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33CK128MP506-E/MR
✅ Drop-In✓ In Stock
$4.42 / Unit
View Datasheet →DSPIC33CK32MP506-E/MR
✅ Drop-In✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33CK512MP306-I/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33C 16-bit DSC core |
| Core Frequency | 100 MHz |
| Performance | 100 MIPS |
| Program Memory Size | 512KB (512K x 8) Flash |
| Program Memory Type | Dual Partition Flash |
| RAM Size | 64KB |
| Supply Voltage Range | 3V to 3.6V |
| Operating Temperature | -40C to +125C |
| ADC Resolution | 12 bit |
| Integrated Op-Amps | Yes (3 on-chip op-amps) |
| PWM | High-Resolution PWM |
| CAN Interface | CAN FD (Flexible Data-Rate) |
| Package | 64-TQFP (10x10 mm), 0.5 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
DSPIC33CK512MP306-I/PT 64-tqfp (10x10 mm), 0.5 mm pitch Pin Configuration Guide
Pin configuration for DSPIC33CK512MP306-I/PT (64-tqfp (10x10 mm), 0.5 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK512MP306-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK512MP306-I/PT is suitable for 6 applications: Precision BLDC/PMSM Motor Control, Digital Power Supplies and PFC, Automotive CAN FD Nodes, Industrial Automation and PLC I/O, Solar Inverters and Energy Storage, Embedded Sensing and Signal Processing Nodes.
Precision BLDC/PMSM Motor Control
The DSPIC33CK512MP306-I/PT fits high-performance precision motor control by design: its 100 MHz/100 MIPS DSP core executes field-oriented control current loops at tens of kHz with single-cycle MAC operations, while the integrated op-amps amplify shunt-current sense signals on-chip and the 12-bit ADC samples phase currents with tight synchronization to the PWM carrier. In a typical FOC servo drive, the part generates center-aligned high-resolution PWM for the three-phase inverter, closes the current loop deterministically, and runs CAN FD for command and telemetry on industrial networks. The dual-partition flash allows firmware updates in the field without an external memory device, an important reliability feature for deployed motor drives. The -40C to +125C industrial grade covers cabinet and drivetrain environments.
Recommended
Digital Power Supplies and PFC
Switching power converters benefit directly from this DSC's high-resolution PWM, whose fine duty-cycle resolution reduces output ripple and jitter compared with conventional integer PWM, and from the 12-bit ADC's synchronized sampling that aligns current readings to the switching period. A 100 MHz core executes average-current-mode control loops for LLC, buck, boost, and PFC stages with sufficient headroom for nonlinear control laws and compensation. The on-chip op-amps can buffer current-sense signals, trimming external component count on dense power boards. Operating from a 3V to 3.6V rail simplifies bias generation from an auxiliary winding, and the -40C to +125C rating suits outdoor telecom rectifiers and industrial power shelves. Dual-partition flash enables remote firmware updates of deployed power systems.
Recommended
Automotive CAN FD Nodes
With integrated CAN Flexible Data-Rate, dual-panel flash, and industrial-to-extended temperature options, this DSC serves as an intelligent actuator or sensor node on modern vehicle and industrial-vehicle networks. CAN FD raises the data-phase bitrate beyond classical CAN, letting one node carry richer diagnostics and calibration traffic; the DSC's deterministic interrupt architecture keeps communication latencies predictable while motor-control or power-conversion tasks run concurrently. The 512KB flash hosts protocol stacks plus application logic with room for bootloader and calibration tables, and the dual-panel architecture performs fail-safe in-field reflashing over the vehicle bus. Distributor positioning explicitly cites automotive and industrial-control leverage for the 64-pin TQFP family, and the -E variant extends qualification headroom for harsher zones.
Recommended
Industrial Automation and PLC I/O
Factory automation nodes need deterministic control, robust communication, and analog conditioning in one device - exactly the dsPIC33CK512MP306's profile. The 100 MIPS core executes PID and sequencing logic with predictable timing; the 12-bit ADC digitizes transducer inputs; the op-amps condition signals close to the sensor; and CAN FD links the node to machine controllers. The -40C to +125C industrial temperature grade tolerates panel and cabinet environments, and the functional-safety-oriented family positioning (noted by distributors for the FuSa family) supports compliance-driven designs. Dual-partition flash enables remote feature updates on installed machinery without physical access. The 64-TQFP 10x10 mm footprint provides enough I/O for counters, limit switches, and PWM-driven actuators within a compact surface-mount outline.
Recommended
Solar Inverters and Energy Storage
Photovoltaic micro-inverters, string optimizers, and battery-storage converters combine MPPT algorithms, grid-synchronization, and safety monitoring - workloads the DSPIC33CK512MP306 handles with its DSP-accelerated 100 MHz core and high-resolution PWM. The 12-bit ADC samples DC bus voltage, AC grid voltage, and current sense channels with PWM-synchronized triggers that reject switching noise; the on-chip op-amps amplify shunt or current-transformer signals, reducing board area in sealed outdoor enclosures. CAN FD (or its peripherals repurposed) supports inter-module communication in battery packs. The -40C to +125C range and 3.0V-3.6V supply fit auxiliary-supply architectures derived from the DC bus. Dual-partition flash permits firmware field updates preserving certified control-law images in the second partition as fallback.
Recommended
Embedded Sensing and Signal Processing Nodes
Systems that digitize analog signals and make local real-time decisions - vibration analyzers, ultrasonic drivers, weight scales, and acoustic nodes - leverage this DSC's DSP instruction set (single-cycle MAC, bit-reversed addressing for FFTs) alongside its analog front end. The integrated op-amps provide programmable-gain first-stage conditioning directly on chip, the 12-bit ADC streams multi-channel data into 64KB RAM, and the 100 MIPS core performs windowing and spectral math without an external DSP. Results can be shipped over CAN FD or UART-class peripherals to a host. The dual-partition flash supports algorithm upgrades in the field. Compared with an MCU-plus-external-amplifier-plus-ADC solution, this integration shortens the analog chain, reduces BOM count, and improves noise performance at the 64-TQFP's modest 10x10 mm footprint.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK512MP306-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK512MP306-E/PT | DSPIC33CK512MP305-I/PT | DSPIC33CK256MP205-I/PT | DSPIC33CK128MP506-E/MR | DSPIC33CK32MP506-E/MR |
|---|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS | 100 MHz / 100 MIPS |
| Flash Memory | 512 KB dual-partition | 512 KB dual-partition | 512 KB dual-partition | 256 KB | 128 KB | 32 KB |
| Operating Temperature | -40C to +125C (I grade) | Extended grade (E) | -40C to +125C (I grade) | -40C to +125C (I grade) | Extended grade (E) | Extended grade (E) |
| Key Peripherals | Op-amps, 12-bit ADC, Hi-Res PWM, CAN FD | Same (identical die) | Reduced I/O, same peripheral set | Op-amps, ADC, PWM; reduced pin count peripherals | Op-amps, ADC, PWM, CAN FD | Op-amps, ADC, PWM, CAN FD |
| Relative Cost Position | Baseline (full memory) | Premium (extended temp) | Comparable | Lower (half flash) | Lower | Lowest in family |
Key Differentiators
- Maximum flash in the 64-pin dsPIC33CK family (vs DSPIC33CK256MP205-I/PT)
- Extended-temperature drop-in option (vs DSPIC33CK512MP306-E/PT)
- Dual-core upgrade path (vs DSPIC33CH512MP506T-I/PT)
Design Notes
Supply all VDD pins from a common regulated 3.0V-3.6V rail; 3.3V nominal is standard. Decouple every VDD and VDDCORE pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus bulk 10uF at the board entry point. Estimate: at 100 MIPS with typical peripheral load, core current is on the order of tens of mA (exact figure per datasheet IDD curves), so a small LDO suffices, but PWM-driven gate-charge currents return through VDD, so size the rail for peripheral switching, not just core logic.
Route analog and digital grounds as a single plane but keep the op-amp and ADC input traces away from PWM and CAN FD lines to prevent switching-coupled offset errors. The 64-TQFP's 0.5 mm pitch requires a solder-mask-defined land pattern per the Microchip packaging specification; verify your fab can hold 0.25 mm trace clearance between pins. Place the CAN FD transceiver close to the CAN pins with a local ground reference, and terminate the bus at both ends with 120 ohm resistors per the network design.
Decide flash partitioning early: the dual-panel architecture is configured at programming time, and switching between unpartitioned (0x000000-0x058000) and dual-boot layouts changes the linker script and bootloader. Teams that defer this decision often discover their application exceeds the 256KB-per-partition limit late in development. Also confirm the temperature suffix (-I vs -E vs -H) on purchase orders - they share the same footprint but are not interchangeable for qualification purposes.
Compliance Information
RoHS compliance explicitly stated in LCSC distributor listing for DSPIC33CK512MP306-I/PT. REACH, halogen-free, and conflict-minerals status not stated in provided data - request official Microchip compliance documentation.
