DSPIC33CK256MP606-I/PT - 16-bit 100MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33CK256MP606-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.2 | $6.20 |
| 10 | $5.58 | $55.80 |
| 100 | $4.96 | $496.00 |
| 500 | $4.46 | $2,230.00 |
| 1,000 | $3.98 | $3,980.00 |
DSPIC33CK256MP606-I/PT Overview
A digital signal controller combines the computational capability of a digital signal processor with the peripheral set and ease of use of a microcontroller, sitting in the hierarchy between a general-purpose MCU and a dedicated DSP. DSCs are widely used in embedded control systems where fast, deterministic execution of control loops, such as field-oriented motor control or digital power conversion, is required alongside standard firmware tasks.
Key features of the DSPIC33CK256MP606 include a 100 MHz single-core dsPIC DSC engine with DSP instruction extensions, dual-panel flash supporting live firmware updates, CAN FD for modern in-vehicle and industrial networking, multiple 12-bit ADCs with high sample rates for simultaneous multi-channel sampling, and dedicated high-resolution PWM peripherals tailored for power conversion. On-chip operational amplifiers reduce external component count in current-sense and filter stages.
The architecture emphasizes precision motor control and digital power: the ADC-to-PWM deterministic latency path enables fast control-loop closure, while the DSP engine executes single-cycle MAC operations required by FOC algorithms. Functional Safety (FuSa) support documentation is available per Microchip product pages, easing ISO 26262 and IEC 61508 oriented designs.
Typical applications include brushless DC and PMSM motor drives, solar inverters, UPS systems, battery chargers, and industrial automation nodes requiring CAN FD connectivity. The 64-pin TQFP offers a balanced mix of up to 53 general-purpose I/O and analog-capable pins for dense sensor interfaces.
Design consideration: the device supports flash partitioning into two boot-capable panels; partition selection affects available program memory layout and must be decided early in the project, per Microchip programming documentation.
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes beyond what the manufacturer product page alone provides.
Drop-in alternatives for DSPIC33CK256MP606-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CK256MP606-I/PT (same form factor and footprint) — differing in Package, Operating Temperature, Core, ADC Resolution, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CK256MP606-E/PT
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View Datasheet →DSPIC33CH256MP508-I/PT
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View Datasheet →DSPIC33CH512MP506-I/PT
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View Datasheet →DSPIC33CH128MP506-I/PT
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View Datasheet →DSPIC33CK256MP606-I/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33CK 16-bit DSC core |
| Core Speed | 100 MHz (100 MIPS) |
| Program Memory Size | 256 KB (256K x 8) Flash, dual panel |
| RAM Size | 64 KB |
| CAN Interface | CAN FD |
| ADC Resolution | 12-bit |
| Integrated Op-Amps | Yes |
| PWM Peripheral | High-resolution PWM (MCPWM) |
| Operating Temperature | -40C to +85C (I grade) |
| Package | 64-TQFP (10x10 mm) |
| Mounting Type | Surface Mount |
| Data Bus Width | 16-bit |
| Product Type | Digital Signal Controller (DSC) / Functional Safety (FuSa) MCU |
| Programming | In-System Programmable (ISP) |
| Country of Origin | Thailand |
| Lifecycle | In Production |
DSPIC33CK256MP606-I/PT 64-tqfp (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33CK256MP606-I/PT (64-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33CK256MP606-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33CK256MP606-I/PT is suitable for 6 applications: Precision Motor Control (BLDC/PMSM FOC), Digital Power Conversion (Solar Inverters, UPS), Automotive-Adjacent and CAN FD Networking Nodes, Battery Chargers and Battery Management, Industrial Automation and Sensing Nodes, Digital Audio and Signal Processing Equipment.
Precision Motor Control (BLDC/PMSM FOC)
The DSPIC33CK256MP606-I/PT is purpose-built for precision motor control: its single 100 MHz dsPIC DSC core executes single-cycle MAC instructions needed for field-oriented control (FOC) of BLDC and PMSM motors, while multiple 12-bit ADCs sample phase currents and bus voltage with minimal deterministic latency into the high-resolution PWM peripheral. This short ADC-to-PWM path enables fast inner current-loop closure, reducing torque ripple and improving efficiency in servo drives, e-bikes, HVAC blowers, and industrial pumps. The three on-chip operational amplifiers can condition shunt-based phase-current signals internally, cutting external op-amp count and board area. Typical designs pair the DSC with a three-phase gate driver and MOSFET power stage; the 256KB flash leaves ample room for FOC libraries, parameter tuning tables, protection state machines, and a bootloader.
Recommended
Digital Power Conversion (Solar Inverters, UPS)
In solar inverters, UPS systems, and totem-pole PFC stages, the DSPIC33CK256MP606-I/PT provides the deterministic control fabric that digital power demands. Its high-resolution PWM generators produce finely adjustable duty cycles and phase-shifted or complementary outputs with dead-time insertion, while the 12-bit ADCs capture current and voltage feedback synchronously with the PWM carrier to eliminate switching-noise artifacts in samples. The 100 MIPS core runs proportional-integral resonant controllers and MPPT algorithms concurrently with protection logic. Integrated op-amps handle inverter output current sensing, and 256KB flash accommodates grid codes, anti-islanding routines, and communication stacks. CAN FD enables inverter-to-BMS or site-controller networking. Designers should budget PWM resolution against core clock and verify ADC sampling windows in simulation before layout freeze.
Recommended
Automotive-Adjacent and CAN FD Networking Nodes
The integrated CAN FD controller makes the DSPIC33CK256MP606-I/PT a strong fit for industrial and off-highway vehicle nodes that need both deterministic control and high-bandwidth networking. CAN FD increases payload to 64 bytes per frame and supports faster arbitration/data phases than classic CAN, useful for firmware-over-CAN updates and dense sensor streaming. The 100 MHz core processes incoming frames, runs local control loops, and services diagnostic protocols simultaneously; 256KB dual-panel flash supports flash-over-CAN live updates without bricking the node. Combined with the DSC's ADCs and PWM channels, one device can serve as a pump controller, valve driver, or sensor-fusion hub on the CAN FD bus. Use a certified CAN FD transceiver at the physical layer and follow Microchip's CAN FD bit-timing guidelines in the datasheet family reference manual.
Recommended
Battery Chargers and Battery Management
Battery chargers and BMS master controllers benefit from the DSPIC33CK256MP606-I/PT's combination of synchronized analog acquisition, PWM power conversion, and CAN FD communications. The 12-bit ADCs monitor pack voltage, charge current, and per-block temperatures with PWM-synchronized sampling for accurate coulomb counting and CC/CV transition control, while the PWM module drives buck or LLC charger power stages with precise dead-time. On-chip op-amps condition shunt signals without extra components, and the 100 MIPS core runs charging state machines, cell-balancing logic, and safety interlocks. The 64KB RAM supports logging of charge history for predictive maintenance. Dual-panel flash enables field firmware updates to adapt charging profiles to new cell chemistries without a service visit - a tangible lifecycle benefit for fleet and energy-storage operators.
Recommended
Industrial Automation and Sensing Nodes
As an industrial automation node, the DSPIC33CK256MP606-I/PT bridges real-time actuation and networked monitoring in a single 64-TQFP device. Its rich peripheral multiplexing - multiple UART, SPI, I2C ports, and extensive 12-bit ADC channels - interfaces with encoders, pressure and flow sensors, and HMI elements, while PWM outputs drive actuators, heaters, or small motors under closed-loop control. The 100 MIPS DSP engine can run digital filtering and FFT-based condition-monitoring algorithms on vibration or acoustic data locally, sending only condensed results over CAN FD to a supervisory PLC or gateway. The industrial -40C to +85C temperature grade suits factory-floor and outdoor cabinet environments. Plan Peripheral Pin Select assignments early to avoid multiplexing conflicts, and use the integrated op-amps for analog front-end gain stages to reduce BOM cost.
Recommended
Digital Audio and Signal Processing Equipment
The DSP instruction set of the DSPIC33CK256MP606-I/PT - single-cycle multiply-accumulate, dual fetch, and bit-reversed addressing - makes it viable for embedded digital signal processing tasks such as active noise cancellation, audio effect processing, and sensor waveform analysis. The 12-bit ADCs digitize microphone or sensor inputs at rates sufficient for control-band audio work, and PWM or communication peripherals generate outputs or stream data to external codec devices. The 64KB RAM buffers multiple frame windows for FIR/IIR filtering and spectral analysis, while the 256KB flash stores coefficient tables and multiple processing profiles. The 64-pin TQFP provides enough I/O to interface encoders, switches, and display interfaces for user control. For hi-fi sample rates beyond the ADC capability, pair the DSC with an external audio codec over its I2S-style serial interface where supported.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CK256MP606-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CK256MP606-E/PT | DSPIC33CK128MP506-E/MR | DSPIC33CH512MP506-I/PT | DSPIC33CH256MP508-I/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Single dsPIC33CK core, 100 MHz | Single dsPIC33CK core, 100 MHz | Single dsPIC33CK core, 100 MHz | Dual-core dsPIC33CH (master + slave) | Dual-core dsPIC33CH (master + slave) |
| Program Memory (Flash) | 256 KB | 256 KB | 128 KB | 512 KB | 256 KB |
| Operating Temperature | -40C to +85C (I grade) | Extended grade (E) | Extended grade (E) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Dual-Panel Flash (Live Update) | Yes (partitionable) | Yes (partitionable) | Yes (partitionable) | Yes (dual-core supports flash update on slave core) | Yes (dual-core supports flash update on slave core) |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
Key Differentiators
- Maximum flash in the 64-pin dsPIC33CK family (vs DSPIC33CK128MP506-E/MR)
- Single-core simplicity at equal clock rate (vs DSPIC33CH512MP506-I/PT)
- Extended-temperature drop-in sibling exists (vs DSPIC33CK256MP606-E/PT)
Design Notes
For the 64-TQFP (10x10 mm), create a land pattern per the Microchip family datasheet mechanical drawing and provide a solid ground plane on layer 2. Place 100 nF ceramic decoupling capacitors at all VDD pins with via-in-pad to the ground plane, plus bulk 4.7-10 uF near the supply entry. Keep the analog supply path (AVDD) filtered with an RC or ferrite bead from the digital VDD rail to preserve ADC accuracy - the 12-bit ADC resolution is only as good as the reference and AVDD cleanliness.
Decide flash partitioning early. Per Microchip documentation, the DSPIC33CK256MP606 can run unpartitioned (single 256KB block, 0x000000-0x02C000) or split into two boot-capable panels; changing this later invalidates linker scripts, bootloaders, and update tooling. Also verify Peripheral Pin Select (PPS) assignments in software before schematic sign-off - heavily multiplexed 64-pin packages can silently conflict PWM, UART, and analog channel mappings that were valid on a larger package.
When the high-resolution PWM drives a switching power stage, route PWM outputs away from ADC input traces and keep sense lines paired with their returns. Use PWM-synchronized ADC sampling (triggered by the PWM module rather than free-running) to sample currents away from switching edges; this alone often improves current-measurement noise by several LSBs. Maintain differential routing for shunt sense signals into the on-chip op-amp inputs.
Estimated: thermal margin at 100 MHz is comfortable for most designs - Microchip dsPIC33CK devices of this class dissipate on the order of a few hundred milliwatts at full speed, and the 64-TQFP theta_JA on a standard 4-layer board keeps junction rise well within the -40C to +85C industrial rating. Still, verify actual ICC from the datasheet electrical characteristics table against your specific clock configuration and peripheral loading, and derate for enclosed, non-ventilated enclosures.
Compliance Information
Compliance status not stated in provided web data; consult the Microchip product page environmental data sheet for DSPIC33CK256MP606-I/PT for RoHS/REACH confirmation.
