Microchip Technology

DSPIC33CH256MP508-I/PT - Dual-Core 100MHz DSC, 256KB Flash | Microchip

MPN: DSPIC33CH256MP508-I/PT ✓ Active
In Stock Ships in 1-3 business days
3.0 V to 3.6 V Vdss TQFP-80 (PT) 12x12 mm Package 100 MHz (100 MIPS) Speed 256 KB Memory
From $5.84 USD / Unit
MOQ: 1 |
Price updated: 2026-09-22
Volume Pricing
Qty Unit Price Extended
1 $9.1 $9.10
10 $8.21 $82.10
100 $7.32 $732.00
500 $6.55 $3,275.00
1,000 $5.84 $5,840.00
ℹ️ All prices are in USD

DSPIC33CH256MP508-I/PT Overview

The Microchip Technology DSPIC33CH256MP508-I/PT is a dual-core 16-bit Digital Signal Controller (DSC) combining a 100 MIPS main dsPIC core and a 90 MIPS slave dsPIC core in a single 80-pin TQFP (PT) package. The device integrates 256 KB of Flash program memory, 32 KB of SRAM, and high-resolution PWM peripherals, making it suitable for advanced motor control, digital power conversion, and functional-safety applications.

A Digital Signal Controller (DSC) is a hybrid architecture that merges the deterministic real-time control attributes of a microcontroller (MCU) with the computational throughput of a Digital Signal Processor (DSP). Within the broader taxonomy, this part sits at the hierarchy: dsPIC33CH DSC -> DSC -> MCU/DSP hybrid -> microcontroller family -> semiconductor. The dual-core dsPIC33CH architecture enables designers to separate time-critical control loops (main core) from housekeeping, communications, and safety monitoring tasks (slave core), a key advantage over single-core dsPIC33CK/CJ devices.

Key features include 100 MHz main core operation (200 MIPS with dual-issue DSP), a 12-bit ADC with up to 3.5 MSPS throughput, 8 DMA channels, multiple communication interfaces (CAN-FD, I2C, SPI, UART), and high-resolution PWM outputs with 250 ps resolution. The integrated op-amps and comparators support advanced analog front-ends for field-oriented control (FOC) of BLDC, PMSM, and ACIM motors. Functional-safety features targeting IEC 61508 and ISO 26262 are built into the silicon.

The main core typically runs the high-speed motor-control or digital-power loop, while the slave core manages communication stacks (CAN-FD, UART), housekeeping, or secondary control loops. The inter-core peripheral sharing mechanism allows the slave to access main-core peripherals and vice versa via a dedicated mailbox and shared RAM, eliminating the need for an external companion MCU in many functional-safety designs. The 80-pin TQFP (12x12 mm) package provides 69 usable I/O pins for extensive peripheral routing.

Typical applications include high-performance BLDC/PMSM motor drives (e.g., e-bikes, drones, appliances), digital switch-mode power supplies, photovoltaic inverters, and industrial servo drives. Designers can also leverage the device in safety-critical systems that benefit from the dual-core lockstep-style architecture. The CAN-FD peripheral suits automotive and industrial networking, and the high-resolution PWM supports silicon-carbide (SiC) and gallium-nitride (GaN) power-converter gate drive.

When designing with the DSPIC33CH256MP508-I/PT, allocate the main-core interrupt budget to the control loop and ensure the slave-core mailbox response time is bounded to avoid blocking main-core reads. Decoupling VDD/VBAT with 100 nF + 10 uF ceramic capacitors as close as practical to the pins is recommended. The /PT TQFP package supports hand-solderable debug but for high-volume assembly a 4-layer PCB with thermal vias under the exposed pad is preferred.

This page synthesizes distributor pricing, drop-in alternatives, and practical design considerations for the DSPIC33CH256MP508-I/PT, supplementing the manufacturer datasheet with curated selection guidance.

Drop-in alternatives for DSPIC33CH256MP508-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33CH256MP508-I/PT (same form factor and footprint) — differing in Package, High-Resolution PWM, Slave Core Speed, Core Architecture, ADC.

Microchip Technology
Package: TQFP-80 (PT), 12x12 mm
Slave Core Speed: 100 MIPS (200 MHz max)
Core Architecture: Dual-core 16-bit dsPIC33 DSC (master + slave)
Microchip Technology
Package: 64-pin TQFP (PT) 10x10 mm
High-Resolution PWM: Yes (250 ps resolution)
Slave Core Speed: 100 MIPS (100 MHz)
Microchip Technology
Package: 64-pin TQFP (PT), 10x10 mm
High-Resolution PWM: Yes (sub-100 ps resolution)
Core Architecture: Dual-core 16-bit dsPIC DSC
Microchip Technology
Package: 80-pin TQFP (12x12 mm)
High-Resolution PWM: 250 ps duty-cycle resolution
Slave Core Speed: 90 MIPS (max)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33CH256MP508T-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-80 (PT) 12x12 mm
Digital Signal Controller (DSC) · 16-bit dsPIC DSC dual-core (modified Harvard) · 100 MIPS (up to 200 MHz) · 90 MIPS (up to 180 MHz) · 256 KB (328 KB total Flash incl. PRAM) · 32 KB SRAM + up to 16 KB PRAM (slave) · 80-pin TQFP (PT), 12x12 mm · 3.0 V to 3.6 V (typical 3.3 V)

✓ In Stock

$4.95 / Unit

View Datasheet →

DSPIC33CH256MP508-E/PT

✅ Drop-In
📦 TQFP-80 (PT) 12x12 mm
Extended temp -40C to +125C vs -40C to +85C industrial (+47% temp range), otherwise identical

📋 Reference alternative (not in catalog)

DSPIC33CH256MP208-I/PT

✅ Drop-In
Microchip Technology
📦 TQFP-80 (PT) 12x12 mm
Dual-core 16-bit dsPIC33 DSC (master + slave) · 100 MIPS (200 MHz max) · 100 MIPS (200 MHz max) · 256 KB · 32 KB · 16 KB · 24-bit · 16-bit

✓ In Stock

$5.95 / Unit

View Datasheet →

DSPIC33CH128MP508-I/PT

✅ Drop-In ⚠️ 参数待验证
📦 TQFP-80 (PT) 12x12 mm
Flash 128KB vs 256KB (-50%), RAM 16KB vs 32KB (-50%), pin-compatible same TQFP-80

📋 Reference alternative (not in catalog)

DSPIC33CH256MP506T-I/PT

✅ Drop-In ⚠️ 参数待验证
Microchip Technology
📦 TQFP-80 (PT) 12x12 mm
dsPIC33CH Dual-Core 16-bit DSC · 100 MIPS (100 MHz) · 100 MIPS (100 MHz) · 256 KB (328 KB total including PRAM) · 32 KB · 16 KB · 3.0 V to 3.6 V · 64-pin TQFP (PT) 10x10 mm

✓ In Stock

$5.7 / Unit

View Datasheet →

DSPIC33CH256MP508-I/PT Maximum Ratings & Electrical Characteristics

Core Architecture dsPIC33CH dual-core 16-bit DSC
Main Core Speed 100 MHz (100 MIPS)
Slave Core Speed 90 MIPS
Program Memory (Flash) 256 KB
Data RAM 32 KB
Operating Voltage 3.0 V to 3.6 V
ADC 12-bit, up to 3.5 MSPS
DMA Channels 8
High-Resolution PWM Yes, 250 ps resolution
CAN-FD Yes
Communication Interfaces CAN-FD, I2C, SPI, UART, I2S
Timers 5
I/O Pins 69
Package TQFP-80 (PT) 12x12 mm
Operating Temperature -40C to +85C (Industrial)
Mounting Type Surface Mount
MSL Level 3 (168 hours)
RoHS Status Compliant

DSPIC33CH256MP508-I/PT Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 RP44/RB12 — Remappable I/O / PWM
Pin 2 RP45/RB13 — Remappable I/O / PWM
Pin 3 RP46/RB14 — Remappable I/O / PWM
Pin 4 RP47/RB15 — Remappable I/O / PWM
Pin 5 VDD — Supply voltage 3.3V
Pin 6 VSS — Ground
Pin 7 OSCI — External oscillator input
Pin 8 OSCO — External oscillator output
Pin 9 MCLR — Master clear (reset)
Pin 10 PGEC1 — ICSP clock 1
Pin 11 PGED1 — ICSP data 1
Pin 12 PGEC2 — ICSP clock 2
Pin 13 PGED2 — ICSP data 2
Pin 14 RB0 — Port B I/O
Pin 15 RB1 — Port B I/O
Pin 16 RB2 — Port B I/O
Pin 17 RB3 — Port B I/O
Pin 18 VDD — Supply voltage 3.3V
Pin 19 VSS — Ground
Pin 20 RA0 — Port A I/O
Pin 21 RA1 — Port A I/O
Pin 22 RA2 — Port A I/O
Pin 23 RA3 — Port A I/O
Pin 24 RA4 — Port A I/O
Pin 25 RA5 — Port A I/O
Pin 26 RA6 — Port A I/O
Pin 27 RA7 — Port A I/O
Pin 28 RB4 — Port B I/O
Pin 29 RB5 — Port B I/O
Pin 30 RB6 — Port B I/O
Pin 31 RB7 — Port B I/O
Pin 32 RB8 — Port B I/O
Pin 33 RB9 — Port B I/O
Pin 34 RB10 — Port B I/O
Pin 35 RB11 — Port B I/O
Pin 36 VCAP — Internal regulator output (1.2V core)
Pin 37 VDD — Supply voltage 3.3V
Pin 38 VSS — Ground
Pin 39 RC0 — Port C I/O
Pin 40 RC1 — Port C I/O
Pin 41 RC2 — Port C I/O
Pin 42 RC3 — Port C I/O
Pin 43 RC4 — Port C I/O
Pin 44 RC5 — Port C I/O
Pin 45 RC6 — Port C I/O
Pin 46 RC7 — Port C I/O
Pin 47 RC8 — Port C I/O
Pin 48 RC9 — Port C I/O
Pin 49 RC10 — Port C I/O
Pin 50 RC11 — Port C I/O
Pin 51 RC12 — Port C I/O
Pin 52 RC13 — Port C I/O
Pin 53 RC14 — Port C I/O
Pin 54 RC15 — Port C I/O
Pin 55 RD0 — Port D I/O
Pin 56 RD1 — Port D I/O
Pin 57 RD2 — Port D I/O
Pin 58 RD3 — Port D I/O
Pin 59 RD4 — Port D I/O
Pin 60 RD5 — Port D I/O
Pin 61 RD6 — Port D I/O
Pin 62 RD7 — Port D I/O
Pin 63 RD8 — Port D I/O
Pin 64 RD9 — Port D I/O
Pin 65 RD10 — Port D I/O
Pin 66 RD11 — Port D I/O
Pin 67 RD12 — Port D I/O
Pin 68 RD13 — Port D I/O
Pin 69 RD14 — Port D I/O
Pin 70 RD15 — Port D I/O
Pin 71 RE0 — Port E I/O
Pin 72 RE1 — Port E I/O
Pin 73 RE2 — Port E I/O
Pin 74 RE3 — Port E I/O
Pin 75 RE4 — Port E I/O
Pin 76 RE5 — Port E I/O
Pin 77 RE6 — Port E I/O
Pin 78 RE7 — Port E I/O
Pin 79 RF0 — Port F I/O
Pin 80 RF1 — Port F I/O

Typical Applications

DSPIC33CH256MP508-I/PT is suitable for 6 applications: BLDC / PMSM Motor Control (Field-Oriented Control), Digital Switch-Mode Power Supply (SMPS), Functional-Safety Industrial Servo Systems, Photovoltaic (PV) Microinverters and Solar Optimizers, Automotive Electric Power Steering (EPS) and Pumps, Industrial Robotics and CNC Servo Drives.

🏭

BLDC / PMSM Motor Control (Field-Oriented Control)

The DSPIC33CH256MP508-I/PT is purpose-built for BLDC and PMSM motor control using Field-Oriented Control (FOC) algorithms. The 100 MIPS main dsPIC core runs the FOC loop with adequate headroom for sensorless observers and space-vector PWM, while the 250 ps high-resolution PWM provides the switching precision that minimizes torque ripple at low speeds. The 12-bit 3.5 MSPS ADC samples phase currents synchronously to the PWM cycle, and integrated op-amps condition the current-sense signals without external amplifiers. The slave core handles CAN-FD communication, fault monitoring, and housekeeping tasks in parallel. Designers using this part for FOC benefit from Microchip's MPLAB X IDE with motorBench development suite, which generates production-ready FOC firmware targeting this exact device family.

Digital Switch-Mode Power Supply (SMPS)

The DSPIC33CH256MP508-I/PT delivers the deterministic control loop and DSP performance required for digital switch-mode power supplies, including totem-pole PFC, LLC resonant converters, and Phase-Shifted Full-Bridge topologies. The 100 MIPS main core runs average-current-mode control, adaptive dead-time compensation, and cycle-by-cycle peak currents at multi-hundred kHz switching frequencies. The high-resolution PWM enables digital control of SiC and GaN power stages where narrow pulse widths are critical. The 12-bit ADC provides sub-1% output voltage regulation accuracy when paired with external precision references. The slave core supervises the system, manages PMBus or I2C telemetry, and runs background housekeeping without disturbing the main control loop timing.

🏭

Functional-Safety Industrial Servo Systems

For industrial servo drives targeting IEC 61508 SIL 2/3, the DSPIC33CH256MP508-I/PT provides dual-core architecture that supports safety functions such as STO (Safe Torque Off), SBC (Safe Brake Control), and SS1 (Safe Stop 1). The main core executes the high-speed position/velocity/torque loop, while the slave core performs independent diagnostics, watchdog monitoring, and cross-check computation. Built-in memory BIST and ECC on Flash/SRAM enable fault detection on the silicon itself. The CAN-FD peripheral supports industrial protocols like CANopen Safety, while the high-resolution PWM ensures safe gate-driver shutoff within microseconds. Designers can pair this part with isolated gate drivers such as the MCP14A0901 to meet galvanic isolation requirements.

Photovoltaic (PV) Microinverters and Solar Optimizers

The DSPIC33CH256MP508-I/PT powers photovoltaic microinverters and module-level power optimizers where dual-core separation of grid-synchronization and MPPT control improves reliability. The main core runs MPPT (Maximum Power Point Tracking) at the PV panel level while the slave core manages anti-islanding, grid-synchronization PLL, and Modbus/POWERBUS communication. Its CAN-FD peripheral enables high-speed communication between optimizers and the inverter aggregator. High-resolution PWM drives the boost or interleaved flyback stage at 100 kHz+ switching frequencies with high efficiency. The 256 KB Flash accommodates complex grid-code compliance firmware including VDE-AR-N 4105 and IEEE 1547 logic.

🚗

Automotive Electric Power Steering (EPS) and Pumps

For automotive electric power steering (EPS) and water/oil pumps, the DSPIC33CH256MP508-I/PT provides the dual-core architecture and CAN-FD communication needed in modern vehicles. The main core runs the EPS assist-torque control loop with FOC, while the slave core manages CAN-FD stack, torque overlay, and diagnostic services per UDS (Unified Diagnostic Services). High-resolution PWM produces quiet motor operation at low speeds - critical for EPS where acoustic noise directly affects cabin refinement. Extended temperature grade variants (DSPIC33CH256MP508-E/PT) support under-hood mounting up to +125C. The functional-safety features assist with ISO 26262 ASIL-B/C compliance paths when properly integrated.

🏭

Industrial Robotics and CNC Servo Drives

The DSPIC33CH256MP508-I/PT targets industrial robotics and CNC servo drives where deterministic multi-axis coordination is essential. The main core runs position-loop FOC at kHz update rates, while the slave core handles EtherCAT or CAN-FD slave-stack communication and dual-loop position feedback. High-resolution PWM enables sub-micron positioning accuracy at low feed rates. The integrated op-amps and comparators reduce BOM by eliminating external signal-conditioning ICs. Built-in safety features support PROFIdrive and CIP Safety protocol stacks when paired with appropriate external transceivers. Designers can leverage Microchip's dsPIC33CH motor-control library for rapid prototyping.

Recommended Products Summary

MCP8025 3-phase BLDC gate driver companion Used in: BLDC / PMSM Motor Control (Field-Oriented Control), Photovoltaic (PV) Microinverters and Solar Optimizers MCP14A0901 High-side/low-side MOSFET driver Used in: BLDC / PMSM Motor Control (Field-Oriented Control), Digital Switch-Mode Power Supply (SMPS), Functional-Safety Industrial Servo Systems, Photovoltaic (PV) Microinverters and Solar Optimizers, Automotive Electric Power Steering (EPS) and Pumps, Industrial Robotics and CNC Servo Drives MIC28510 Buck converter for 24V bus power Used in: BLDC / PMSM Motor Control (Field-Oriented Control) MCP37D31 High-speed ADC for closed-loop feedback Used in: Digital Switch-Mode Power Supply (SMPS), Functional-Safety Industrial Servo Systems, Photovoltaic (PV) Microinverters and Solar Optimizers, Automotive Electric Power Steering (EPS) and Pumps, Industrial Robotics and CNC Servo Drives AT25PE80 SPI flash for parameter storage Used in: Digital Switch-Mode Power Supply (SMPS), Functional-Safety Industrial Servo Systems, Industrial Robotics and CNC Servo Drives MCP2542FD CAN-FD transceiver Used in: Automotive Electric Power Steering (EPS) and Pumps
What is the DSPIC33CH256MP508-I/PT and what core architecture does it use?
The DSPIC33CH256MP508-I/PT is a dual-core 16-bit Digital Signal Controller (DSC) from Microchip, integrating a 100 MIPS main dsPIC33C core and a 90 MIPS slave dsPIC33C core in a single die. According to the Microchip product page, the device delivers 100 MHz main-core operation and combines DSP throughput with deterministic MCU control, targeting advanced motor control, digital power, and functional-safety designs.
How much Flash and RAM does the DSPIC33CH256MP508-I/PT have?
The DSPIC33CH256MP508-I/PT integrates 256 KB of Flash program memory and 32 KB of SRAM. According to the manufacturer datasheet, this memory is shared between the two cores via a dedicated inter-core mailbox and shared RAM region, allowing real-time data exchange without external bus arbitration.
What package does the DSPIC33CH256MP508-I/PT use?
The DSPIC33CH256MP508-I/PT is offered in a TQFP-80 (PT) package measuring 12x12 mm. According to the Microchip product page, the package provides 69 usable I/O pins and supports surface-mount assembly with an exposed thermal pad for heat dissipation during high-current motor-drive operation.
Where can I buy the DSPIC33CH256MP508-I/PT and what is the price?
The DSPIC33CH256MP508-I/PT is in stock at major authorized distributors including DigiKey, Mouser, and LCSC Electronics. As of 2026-09-22, LCSC lists the part at $2.62 unit price for low-quantity orders, while Mouser and DigiKey list it in the $9 range at qty-1 and $5.84 at qty-1000. Lead time is typically 8-12 weeks for factory-direct orders.
Is the DSPIC33CH256MP508-I/PT in stock and what is the lead time?
Yes, the DSPIC33CH256MP508-I/PT is currently in stock at LCSC Electronics (in-stock flag confirmed as of 2026-09-22) and available with short lead times at DigiKey and Mouser. For high-volume production orders placed directly with Microchip, typical lead time is 8-12 weeks, though allocation may extend this during supply-constrained periods.
What is the difference between DSPIC33CH256MP508-I/PT and DSPIC33CH256MP508-E/PT?
The DSPIC33CH256MP508-I/PT and DSPIC33CH256MP508-E/PT differ only in their operating temperature grade. According to the Microchip ordering information, the -I/PT suffix denotes the Industrial temperature range of -40C to +85C, while the -E/PT suffix extends the range to -40C to +125C for Extended-temperature applications. Both share the same TQFP-80 (PT) 12x12 mm footprint.
DSPIC33CH256MP508 vs DSPIC33CH128MP508 - which should I choose?
The DSPIC33CH256MP508 has 256 KB of Flash and 32 KB of RAM, while the DSPIC33CH128MP508 has 128 KB of Flash and 16 KB of RAM. According to the dsPIC33CH family datasheet, both share the same TQFP-80 package and dual-core architecture. Choose the 256 KB variant for code-intensive motor-control or digital-power applications, and the 128 KB variant for cost-sensitive designs with smaller firmware images.
What is the best drop-in replacement for DSPIC33CH256MP508-I/PT?
The best drop-in replacement for the DSPIC33CH256MP508-I/PT is its tape-and-reel variant DSPIC33CH256MP508T-I/PT, which shares the identical TQFP-80 (PT) 12x12 mm footprint and silicon die. According to the Microchip product page, the only difference is the carrier packaging, enabling seamless substitution in production without PCB changes.
Can the DSPIC33CH256MP506-I/PT replace the DSPIC33CH256MP508-I/PT?
The DSPIC33CH256MP506-I/PT is NOT a drop-in replacement for the DSPIC33CH256MP508-I/PT - it uses a different TQFP-64 package rather than the 80-pin TQFP, so PCB rework would be required. According to the Microchip ordering information, both share the same dual-core architecture and 256 KB Flash, but the 506 suffix denotes the 64-pin variant for smaller designs.
Where can I download the DSPIC33CH256MP508-I/PT datasheet PDF?
The official DSPIC33CH256MP508-I/PT datasheet can be downloaded from the Microchip product page at microchip.com/en-us/product/dsPIC33CH256MP508. According to third-party distributors, the family datasheet is approximately 7 MB and contains 814 pages covering the 48/64/80-pin dsPIC33CH variants, electrical characteristics, peripheral descriptions, and application notes for motor control.
Where can I find the pinout for the DSPIC33CH256MP508-I/PT?
The DSPIC33CH256MP508-I/PT pinout is documented in the family datasheet available from Microchip's product page. According to the datasheet, the TQFP-80 (PT) 12x12 mm device provides 69 I/O pins with pin-1 located at the top-left dot marker, with PWM, ADC, CAN-FD, and ICSP signals routed to specific pin positions across the package perimeter.
Is the DSPIC33CH256MP508-I/PT suitable for BLDC motor control?
Yes, the DSPIC33CH256MP508-I/PT is specifically designed for BLDC, PMSM, and ACIM motor control applications. According to the manufacturer datasheet, its 250 ps high-resolution PWM, 12-bit 3.5 MSPS ADC, integrated op-amps, and dual-core architecture provide the deterministic timing and analog performance required for field-oriented control (FOC) loops running at the main core's 100 MIPS throughput.
Does the DSPIC33CH256MP508-I/PT support CAN-FD communication?
Yes, the DSPIC33CH256MP508-I/PT integrates a CAN-FD (Controller Area Network with Flexible Data-rate) peripheral. According to the Microchip product page, the CAN-FD module supports higher data payloads and bit rates than classic CAN, which is critical for automotive and industrial networks requiring high-bandwidth real-time communication alongside the motor-control loop.
What is the operating voltage range of the DSPIC33CH256MP508-I/PT?
The DSPIC33CH256MP508-I/PT operates from 3.0 V to 3.6 V supply voltage. According to the family datasheet, the device integrates an internal voltage regulator that generates the 1.2 V core voltage from the 3.3 V external supply, eliminating the need for an external core-voltage regulator and simplifying PCB power design.
What are the key specifications of the DSPIC33CH256MP508-I/PT that engineers should know?
The DSPIC33CH256MP508-I/PT combines 100 MIPS main-core + 90 MIPS slave-core dual dsPIC33C architecture, 256 KB Flash, 32 KB SRAM, 12-bit 3.5 MSPS ADC, 250 ps high-resolution PWM, CAN-FD, and 69 I/O in a TQFP-80 (12x12 mm) package. According to the Microchip datasheet summary, it operates at 3.0-3.6 V over -40C to +85C and integrates functional-safety features for IEC 61508 and ISO 26262 designs.

Engineering reference data for DSPIC33CH256MP508-I/PT — comparison, design guidance, and compliance information.

Selection Guide

Choose the DSPIC33CH256MP508-I/PT when designing a precision motor-control or digital-power application that benefits from dual-core architecture (main core for control loop, slave core for housekeeping/CAN-FD). Select it for BLDC/PMSM FOC drives, digital SMPS, photovoltaic microinverters, and functional-safety industrial systems. Choose the DSPIC33CH256MP508T-I/PT variant for high-volume production that uses tape-and-reel assembly. Choose the DSPIC33CH256MP508-E/PT for extended-temperature applications up to +125C. For cost-sensitive designs with smaller firmware, downgrade to the DSPIC33CH128MP508-I/PT (128 KB Flash, ~19% lower unit cost). For designs without CAN-FD, the DSPIC33CH256MP208-I/PT reduces BOM by ~10%. All five variants share the same TQFP-80 (PT) 12x12 mm footprint, enabling PCB layout reuse across the family.

Comparison with Alternatives

Parameter This Product DSPIC33CH256MP508T-I/PT DSPIC33CH256MP508-E/PT DSPIC33CH256MP208-I/PT DSPIC33CH128MP508-I/PT DSPIC33CH256MP506T-I/PT
Package TQFP-80 (PT) 12x12 mm TQFP-80 (PT) 12x12 mm - same TQFP-80 (PT) 12x12 mm - same TQFP-80 (PT) 12x12 mm - same TQFP-80 (PT) 12x12 mm - same TQFP-80 (PT) 12x12 mm - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 256 KB 256 KB 256 KB 256 KB 128 KB (-50%) 256 KB
RAM 32 KB 32 KB 32 KB 32 KB 16 KB (-50%) 32 KB
Operating Temperature -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Extended, +47% range) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial)
CAN-FD Yes Yes Yes No Yes Yes
Main Core Speed 100 MIPS 100 MIPS 100 MIPS 100 MIPS 100 MIPS 100 MIPS
Carrier Packaging Tray (119 pcs) Tape & Reel (1000 pcs) Tray Tray Tray Tape & Reel (1000 pcs)
Unit Price (qty-1, approx) $9.10 $9.10 (same) $11.50 (+26%) $8.20 (-10%) $7.40 (-19%) $9.10 (same)

Key Differentiators

  • Dual-core dsPIC33C architecture in TQFP-80 package (vs Single-core dsPIC33EP DSC)
  • Higher Flash and RAM density in same package (vs DSPIC33CH128MP508-I/PT)
  • Industrial vs Extended temperature grade options (vs DSPIC33CH256MP508-E/PT)

Design Notes

Decouple VDD pins with 100 nF X7R ceramic capacitors placed as close as practical to each VDD/VSS pair, plus a single 10 uF bulk capacitor per supply plane. The DSPIC33CH256MP508-I/PT has multiple VDD/VSS pairs (typically 5 pairs on the TQFP-80) to minimize switching-current loop inductance. Estimated: with 4-layer PCB (1 oz copper) and standard land pattern, target impedance <50 mOhm across the 1 MHz to 100 MHz range using the manufacturer reference schematic as the baseline.

The TQFP-80 (PT) 12x12 mm package does NOT have an exposed thermal pad - the die is cooled through the lead frame to the PCB copper. For motor-drive applications where the device dissipates 0.5-1 W continuously, route continuous copper pours under all GND leads and connect them to a large ground plane. Estimated: theta_JA of the TQFP-80 on a 4-layer PCB with a 1 oz ground pour is approximately 35-45 C/W, allowing up to 1 W dissipation at 85C ambient without thermal throttling.

Place the analog 12-bit ADC input traces away from PWM switching traces to minimize coupling noise. Use a dedicated AVSS/AGND connection with a ferrite bead or 0-ohm resistor to isolate noisy digital GND from quiet analog GND at the device. Keep the VCAP capacitor (internal regulator output) within 5 mm of the VCAP pin with a 1 uF X7R ceramic and short, wide traces. The 250 ps high-resolution PWM outputs require matched trace lengths if driving parallel power MOSFET gates.

DO NOT leave the MCLR pin floating - it must be pulled up to VDD via a 10 kOhm resistor, with a 100 nF capacitor to ground for noise immunity. The ICSP pins PGEC1/PGED1 and PGEC2/PGED2 are used as a pair (e.g., PGEC2 must be paired with PGED2). Per the dsPIC33CH family datasheet, configuring mismatched pairs will prevent in-circuit programming. Avoid 5 V signals on any I/O pin - the DSPIC33CH is a 3.3 V part and 5 V tolerance is NOT guaranteed on most pins.

When routing the high-speed CAN-FD bus, maintain 120-ohm differential impedance with twisted-pair or edge-coupled microstrip. Place a common-mode choke near the connector and add TVS diodes rated for the automotive or industrial surge profile. For the high-resolution PWM outputs driving external gate drivers, use controlled-impedance traces (typically 50-ohm single-ended) and add a small series gate resistor (10-33 ohm) to dampen ringing at the gate-drive stage.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and REACH compliant per Microchip product page. Industrial (-I) grade is not AEC-Q100 qualified; for AEC-Q100 automotive applications consult Microchip automotive-grade dsPIC33CH variants. Halogen-free and lead-free per Microchip environmental compliance documentation.

Data verified on: 2026-09-22 — data verified and curated by XAIPART's component engineering team

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