DSPIC33EP128GM710-H/PF - 70 MIPS 16-bit DSC 128KB Flash | Microchip
MPN: DSPIC33EP128GM710-H/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.35 | $63.50 |
| 100 | $5.75 | $575.00 |
| 500 | $5.3 | $2,650.00 |
| 1,000 | $4.9 | $4,900.00 |
DSPIC33EP128GM710-H/PF Overview
A digital signal controller combines the computational throughput of a DSP engine with the peripheral integration and ease of use of a microcontroller, occupying the same slot in the system hierarchy as motor control MCU -> embedded controller -> semiconductor. The dsPIC33EP family integrates a DSP engine with single-cycle MAC, dual 40-bit accumulators, and hardware divide support, making it well suited to closed-loop control mathematics.
Key features include the 70 MIPS dsPIC DSC core, integrated operational amplifiers, two CAN 2.0B modules, four quadrature encoder interfaces, and multiple motor-control PWM channels. These peripherals directly address precision motor control, digital power conversion, and industrial connectivity requirements without external analog or communication ICs.
Technically, the device operates at 3.3V with Harvard architecture and Peripheral Pin Select (PPS), which allows remapping of most digital peripherals to any of the RPn/RPIn pins, dramatically increasing layout flexibility on dense 100-pin boards. The -H/PF suffix denotes the extended temperature variant (up to 150C ambient per Microchip ordering-code convention) in TQFP packaging, distinguishing it from the industrial -I/PF grade.
Typical applications include brushless DC (BLDC) and permanent-magnet synchronous motor (PMSM) drives, solar inverters and digital power supplies, automotive auxiliary systems, and industrial automation nodes using the dual CAN interfaces.
Design consideration: because the -H grade is targeted at high-temperature environments, junction-to-ambient thermal resistance and board copper area must be validated at the highest planned ambient temperature; also provision the VCAP stabilizing capacitor required by the 1.8V internal core regulator.
This page synthesizes distributor availability data, drop-in same-footprint alternatives, pricing tiers, and practical design notes not found in the manufacturer datasheet, providing a single engineering-ready reference for the DSPIC33EP128GM710-H/PF.
Drop-in alternatives for DSPIC33EP128GM710-H/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP128GM710-H/PF (same form factor and footprint) — differing in Package, Program Memory Size, Qualification, Quadrature Encoder Interfaces, RAM Size.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128GM710-I/PF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256GM710
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GM710
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM710-H/PF Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory Size | 128KB (43K x 24) Flash |
| RAM Size | 16KB |
| Supply Voltage | 3.3 V |
| Package | 100-TQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| CAN Modules | 2 (CAN 2.0B) |
| Quadrature Encoder Interfaces | 4 (QEI) |
| Input/Output Capture Channels | 8 IC / 8 OC |
| Integrated Op Amps | Yes (on-chip OpAmps) |
| Motor Control PWM | Yes (motor control PWM channels) |
| Peripheral Pin Select | Yes (PPS remappable pins) |
| Architecture | Harvard, 16-bit with DSP engine |
| Automotive Qualification | Automotive-grade variant family (per distributor listing) |
| Operating Temperature | -40C to +150C (H temperature grade, per Microchip suffix convention) |
| RoHS Status | Compliant (per distributor listing) |
DSPIC33EP128GM710-H/PF 100-tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP128GM710-H/PF (100-tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128GM710-H/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128GM710-H/PF is suitable for 6 applications: BLDC / PMSM Motor Control, Digital Power Conversion (Solar Inverter / PFC), Automotive Auxiliary Control Modules, Industrial Automation and Networked Sensing Nodes, Robotics and Servo Drives, General-Purpose Embedded Control Upgrade Path.
BLDC / PMSM Motor Control
The DSPIC33EP128GM710-H/PF fits precision motor control because its 70 MIPS DSP core executes field-oriented control (FOC) loops at switching frequencies of 20 kHz or higher, while the motor-control PWM modules, four QEI encoder interfaces, and on-chip op-amps handle phase generation and current-sense amplification with minimal external components. In a typical PMSM drive, the MC PWM channels generate complementary center-aligned PWM with dead-time insertion, the integrated op-amps amplify low-side shunt currents, and the ADC samples them for the FOC current loop, all inside one 3.3V device. The dual CAN 2.0B interfaces connect the drive to a factory automation or vehicle network. The extended -H temperature grade tolerates hot drive enclosures where the +85C industrial ceiling is marginal, a quantified reliability advantage for sealed motor-drive enclosures with derated airflow.
Recommended
Digital Power Conversion (Solar Inverter / PFC)
Digital power converters benefit directly from the DSPIC33EP128GM710-H/PF's single-cycle MAC DSP engine, which computes the control law of PFC, LLC, or grid-tie inverter stages within one PWM period at 70 MIPS. The high-resolution PWM with dead-time control drives half-bridge and full-bridge topologies, while the on-chip comparators and op-amps implement fast cycle-by-cycle overcurrent protection without external analog circuitry. Two CAN modules support multi-converter daisy-chaining in solar string architectures, and Peripheral Pin Select lets designers route capture/compare resources optimally on the dense 100-pin board. Operating at 3.3V with 128KB Flash, the device stores soft-start ramps, protection lookup tables, and grid-code firmware. The extended temperature rating helps in inverter enclosures where ambient temperatures regularly exceed standard industrial limits.
Recommended
Automotive Auxiliary Control Modules
The DSPIC33EP128GM710-H/PF is listed by distributors as part of Microchip's automotive-oriented offering, and the -H extended temperature grade aligns with under-hood and near-engine ambient requirements. Typical uses include electronic throttle, transmission actuation, cooling fan, and pump control, where the 70 MIPS core runs position and current loops, the QEI modules decode dual redundant position sensors, and dual CAN 2.0B modules interface to vehicle body and powertrain buses. The 128KB Flash accommodates diagnostic firmware with UDS-style service handlers, and Peripheral Pin Select simplifies routing on dense boards. Designers should verify AEC-Q100 qualification requirements against the specific ordering code and use the Microchip automotive-grade variants where certification is mandatory, since the -H suffix denotes temperature grade rather than guaranteed automotive qualification.
Recommended
Industrial Automation and Networked Sensing Nodes
For factory automation nodes, the DSPIC33EP128GM710-H/PF offers abundant I/O on the 100-pin TQFP: dozens of remappable RPn pins via Peripheral Pin Select allow UART, SPI, I2C, and capture peripherals to be placed wherever board layout demands. The 70 MIPS core handles protocol stacks plus local control math concurrently, 128KB Flash stores comm stacks and web-style diagnostics, and 16KB RAM buffers network frames. Dual CAN 2.0B modules make the device a natural CAN gateway or bridge between device-level and cell-level buses, and the op-amps condition analog sensor channels such as pressure or load cells before the internal ADC. Extended -H temperature rating supports hot-panel and high-dielectric-heating installations where standard industrial parts approach their +85C limit.
Recommended
Robotics and Servo Drives
Robotic joint and servo drive controllers exploit four independent quadrature encoder interfaces on the DSPIC33EP128GM710-H/PF, enabling simultaneous multi-axis position feedback from a single controller - a capability few 16-bit DSCs match. The 70 MIPS DSP core executes cascaded position/velocity/current loops per axis, the MC PWM outputs drive H-bridges for each joint motor, and the on-chip op-amps and comparators implement fast current limiting. The 100-pin package provides enough I/O for limit switches, brake outputs, and safety interlocks without port expanders. 128KB Flash stores trajectory profiles and CANopen-style firmware served over either CAN module. The extended -H grade is valuable in sealed robot arms where motor and controller heat accumulates above +85C ambient.
Recommended
General-Purpose Embedded Control Upgrade Path
The DSPIC33EP128GM710-H/PF serves as a future-proof general-purpose embedded controller where DSP-grade math may be needed later. Designs can start with simple state-machine firmware and later add FFT-based diagnostics, digital filtering, or control-law upgrades without hardware changes, thanks to the 70 MIPS DSP engine and 128KB in-system-programmable Flash. The 100-pin footprint with PPS remapping accommodates evolving interface needs - adding a second UART or repositioning SPI lines is a firmware change, not a PCB respin. Code written for the GM710 family ports directly to pin-compatible DSPIC33EP256GM710 or DSPIC33EP512GM710 parts when memory grows, making the same 100-pin TQFP footprint scalable across 128KB to 512KB product tiers on one PCB.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128GM710-H/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128GM710-I/PF | DSPIC33EP256GM710 | DSPIC33EP512GM710 |
|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 128KB (43K x 24) | 128KB (43K x 24) | 256KB (86K x 24) | 512KB (173K x 24) |
| CAN Modules | 2 (CAN 2.0B) | 2 (CAN 2.0B) | 2 (CAN 2.0B) | 2 (CAN 2.0B) |
| RAM | 16KB | 16KB | 32KB | 52KB |
| Pin Compatibility | Baseline (100-pin TQFP GM710) | Pin-to-pin compatible | Pin-to-pin compatible | Pin-to-pin compatible |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Extended temperature range (vs DSPIC33EP128GM710-I/PF)
- Lowest cost within the GM710 100-pin pin-compatible family (vs DSPIC33EP256GM710)
- Four quadrature encoder interfaces on one controller (vs DSPIC33EP128GM306 (64-pin sibling))
- Trade-off: standard-grade availability (vs DSPIC33EP128GM710-I/PF)
Design Notes
The dsPIC33EP uses an internal 1.8V core regulator that requires a low-ESR stabilizing capacitor (typically around 10 uF, value per the dsPIC33EP datasheet DS70000689) on the VCAP pin; omitting or undersizing this capacitor is a leading cause of erratic resets. All VDD/VSS pairs on the 100-pin TQFP must be connected, each decoupled with 0.1 uF ceramic capacitors placed within 2-3 mm of the pins. Estimated: with dozens of I/O switching at 70 MIPS, transient supply current peaks require a bulk 10-47 uF capacitor near the device in addition to per-pin decoupling.
The -H extended temperature grade targets high-ambient environments, so thermal validation is essential. Estimated calculation: at 70 MIPS with many active peripherals, core current can reach the 100-200 mA range, giving roughly 0.3-0.7 W dissipation at 3.3V. With a typical TQFP-100 theta_JA on a standard 4-layer board, junction temperature rise is approximately 30-50C above ambient - verify against the datasheet theta_JA for your PCB copper area and keep Tj within the datasheet maximum at your worst-case ambient. Increase ground-plane copper or reduce MIPS duty cycle if marginal.
Use Peripheral Pin Select (PPS) deliberately at schematic capture time: assign time-critical peripherals (MC PWM outputs, QEI inputs) to pins closest to their drivers/receivers to minimize stub length and crosstalk. Keep the four QEI input pairs routed as tightly coupled pairs, separate from PWM high-current traces. Route CAN_TX/CAN_RX to the transceiver with series resistors (recommended 10-33 ohm) to control ringing. Per the dsPIC33EP Family Reference Manual Section 11.4, some remappable peripherals have PPS limitations - confirm each mapping against the datasheet before locking the layout.
Three recurring mistakes with the GM710 family: (1) confusing the -H temperature suffix with automotive qualification - always verify the exact ordering code against your quality requirements; (2) forgetting that CONFIG/JTAG/ICSP pins (MCLR, PGC/PGD) must remain accessible on test points for in-circuit programming with ICD/REAL ICE; (3) relying on default pin assignments that PPS later remaps - document the final PPS map in source control. Additionally, ADC reference and analog ground routing must be star-connected to AVDD/AVSS to preserve the on-chip op-amp and ADC accuracy for current-sense channels.
Compliance Information
RoHS compliance indicated by distributor listings (DigiKey/Jotrin). Jotrin describes the family as 'Automotive' in marketing classification; AEC-Q100 qualification status for this exact ordering code is not stated in the provided data and must be confirmed with Microchip. REACH, halogen-free, and conflict-minerals status not stated in provided data.
