DSPIC33EP128MC504T-E/ML - 16-bit 60 MIPS DSC, 128KB Flash | Microchip
MPN: DSPIC33EP128MC504T-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.9 | $5.90 |
| 10 | $5.31 | $53.10 |
| 100 | $4.72 | $472.00 |
| 500 | $4.25 | $2,125.00 |
| 1,000 | $3.85 | $3,850.00 |
DSPIC33EP128MC504T-E/ML Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits above generic MCUs and below multi-core application processors, making it the standard choice for real-time closed-loop control. The dsPIC33EP family belongs to Microchip's 16-bit architecture lineage and targets precision motor control, digital power conversion, and sensing systems.
Key features include a 16-bit modified-Harvard dsPIC core with DSP instruction extensions (MAC, DSP multiply-accumulate), on-chip motor-control PWM (MCPWM) with complementary outputs and dead-time control, a quadrature encoder interface (QEI), CAN 2.0B for automotive and industrial networking, three integrated operational amplifiers and four analog comparators, plus 5 timers and 4 DMA channels per distributor documentation.
Technically, the device runs from a 3.3 V supply with an internal PLL multiplier that allows a low-cost crystal to generate the maximum 60 MIPS core clock. CMOS process technology keeps active power low, while multiple idle and doze modes support energy-sensitive designs. The integrated op amps offload external signal-conditioning stages in current-sense loops.
Typical applications include brushless DC and PMSM motor drives (sensorless and encoder-based), digital SMPS and power-factor-correction converters, and automotive auxiliary systems requiring AEC-Q100 qualification and a CAN interface.
Design consideration: dedicate the highest-speed PWM module to the main inverter stage and use the DMA channels to service ADC results so the control ISR runs deterministically at the switching frequency.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP128MC504T-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP128MC504-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256MC504T-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64MC504T-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128MC504-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.05 / Unit
View Datasheet →DSPIC33EP128MC506T-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128MC504T-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC |
| Maximum Core Speed | 60 MIPS (Mouser/DigiKey listing); family up to 70 MIPS |
| Program Memory (FLASH) | 128 KB (43K x 24) |
| RAM | 16 KB |
| Supply Voltage | 3.3 V |
| Package | 44-QFN (8x8 mm), exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E grade) |
| Qualification | AEC-Q100 qualified |
| Motor Control PWM | Yes (MCPWM) |
| Quadrature Encoder Interface | Yes (QEI) |
| CAN | Yes (CAN 2.0B) |
| Integrated Op Amps | 3 |
| Analog Comparators | 4 |
| Timers | 5 |
| DMA Channels | 4 |
| Packaging | Tape & Reel (T prefix) |
DSPIC33EP128MC504T-E/ML 44-qfn (8x8 mm), exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP128MC504T-E/ML (44-qfn (8x8 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP128MC504T-E/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP128MC504T-E/ML is suitable for 6 applications: Brushless DC / PMSM Motor Drives, Digital Power Conversion (SMPS / PFC), Automotive Auxiliary Systems, Industrial Sensing and Condition Monitoring, Robotics and Motion Control, Power Tool and E-mobility Controllers.
Brushless DC / PMSM Motor Drives
The DSPIC33EP128MC504T-E/ML is purpose-built for precision motor control: its 60 MIPS DSP core executes field-oriented control (FOC) loops at PWM frequencies of 20 kHz or higher, while the dedicated motor-control PWM (MCPWM) module provides complementary outputs with programmable dead-time and the quadrature encoder interface (QEI) handles position feedback. The three on-chip op amps buffer phase-current sense resistors directly, and the four comparators support hardware-based overcurrent shutdown with no CPU latency. In a typical 48 V BLDC servo drive, the ADC is serviced by DMA so the control ISR runs deterministically. The AEC-Q100 qualification and CAN interface extend its use into automotive auxiliary drives such as pumps and actuators.
Recommended
Digital Power Conversion (SMPS / PFC)
In digitally controlled switch-mode power supplies and power-factor-correction stages, the DSPIC33EP128MC504T-E/ML combines its high-speed MCPWM module with the 16-bit DSP core to close voltage and current loops at switching frequencies into the hundreds of kHz. The 60 MIPS throughput allows average-current-mode control with non-linear limiters to execute inside one PWM period, and the integrated comparators provide cycle-by-cycle current limiting in hardware. The 3.3 V core supply and low-power modes suit always-on standby rails. Because the same die is offered across 64/128/256 KB flash variants in the identical 44-QFN footprint, designers can scale firmware complexity - from basic boost PFC to full digital LLC control - without changing the PCB.
Recommended
Automotive Auxiliary Systems
The AEC-Q100 qualification and -40C to +125C E-grade temperature range make the DSPIC33EP128MC504T-E/ML suitable for under-hood and body-adjacent automotive subsystems: fuel pump controllers, cooling fan drives, throttle actuators, and window/seat motors. The integrated CAN 2.0B module connects the node to the vehicle network without an external CAN controller, and the device's DSP performance handles sensorless motor algorithms such as sliding-mode observers that a commodity automotive MCU cannot execute in the available loop time. Tape-and-reel (T) packaging supports automated high-volume production lines. Functional-safety requirements beyond AEC-Q100 must be evaluated at the system level by the OEM.
Recommended
Industrial Sensing and Condition Monitoring
With three operational amplifiers, four comparators, and a 16-bit DSP core on one die, the DSPIC33EP128MC504T-E/ML condenses a complete analog signal chain for industrial sensing nodes: the op amps amplify bridge or current-loop signals, the ADC digitizes them, and the DSP instruction set applies digital filtering (FIR/IIR) at rates unattainable on generic MCUs. The CAN bus integrates the node into factory networks, while 4 DMA channels stream acquisition data without CPU overhead. Vibration-monitoring and motor-current-signature-analysis endpoints benefit directly from the 60 MIPS throughput. The 44-QFN 8x8 mm footprint fits compact sensor housings, and the extended temperature range tolerates panel-mounted environments.
Recommended
Robotics and Motion Control
Multi-axis robotics controllers use the DSPIC33EP128MC504T-E/ML as a per-axis drive processor: the QEI decodes incremental encoder feedback from each joint motor, the MCPWM drives the inverter stage, and the 60 MIPS core runs cascaded position/velocity/current loops at several kHz. Deterministic interrupt latency and single-cycle MAC operations ensure consistent loop timing, which is critical for smooth coordinated motion. CAN 2.0B links each axis controller to the main robot CPU over a robust differential bus. The 128 KB FLASH accommodates trajectory interpolation tables and commutation firmware with headroom, and the 44-QFN package keeps the drive electronics compact enough for integration inside joint housings.
Recommended
Power Tool and E-mobility Controllers
Cordless power tools, e-bikes, and light e-mobility devices require compact, rugged BLDC controllers with field-weakening and regenerative-braking capability. The DSPIC33EP128MC504T-E/ML delivers sensorless FOC at 60 MIPS with hardware dead-time control and comparator-based overcurrent protection that reacts within microseconds - essential when battery packs supply hundreds of amps. The -40C to +125C rating survives enclosed motor-controller cavities, and the 3.3 V supply simplifies power tree design from battery-backed regulators. Firmware storage of 128 KB is sufficient for adaptive control, fault logging, and anti-theft features, while the exposed-pad 44-QFN package dissipates controller heat into the PCB copper directly.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP128MC504T-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP128MC504-I/ML | DSPIC33EP256MC504T-E/ML | DSPIC33EP64MC504T-E/ML | DSPIC33EP128MC504-E/ML |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| FLASH | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| RAM | 16 KB | 16 KB | 16 KB | 16 KB | 16 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Packaging | Tape & Reel | Tube/Tray | Tape & Reel | Tape & Reel | Tray |
| Relative Cost Tier | Mid | Mid (slightly lower) | Higher | Lower | Mid |
Key Differentiators
- Integrated analog front end (vs DSPIC33EP256MC504T-E/ML)
- Automotive temperature and qualification (vs DSPIC33EP128MC504-I/ML)
- Firmware headroom versus cost floor (vs DSPIC33EP64MC504T-E/ML)
Design Notes
The 44-QFN (8x8 mm) exposed pad is the primary ground return and thermal path. Connect the exposed pad to a solid ground plane via an array of at least 4x4 via-in-pad stitches (0.3 mm vias) to minimize ground bounce between the analog and digital domains. dsPIC33EP parts in QFN require the full land pattern per Microchip application note AN1207 QFN layout guidelines; insufficient pad wetting from undersized stencils is the most common cause of rework on this package.
Supply the VDDCORE/VDD rail per the datasheet sequencing requirements and fit the recommended low-ESR core capacitors close to pins. Use separate ferrite-isolated 3.3 V feeds for VDD and AVDD (3 op amps and ADC share the analog rail) with 10 uF bulk plus 0.1 uF ceramic at each pin group. Estimated: a typical FOC design drawing ~60-80 mA core+I/O at 3.3 V dissipates roughly 0.26 W - negligible thermally, so copper sizing is dominated by driver stages, not the DSC.
Do not rely on Peripheral Pin Select defaults: PPS mappings reset to unassigned and motor PWM outputs will not appear until RPINR/RPOR registers are configured and unlocked with the correct key sequence. Also verify MCLR/PGD/PGC are reserved for ICSP during layout - encasing them in dense analog routing without test points makes field programming and debug impossible. Finally, the E-grade part is required wherever ambient exceeds +85C; the -I variant is not a legitimate substitution in automotive cavities.
Route PWM outputs differentially-matched to the gate drivers and keep the current-sense op amp input traces short and guarded by ground. The integrated op amps are adequate for shunt buffering at motor-control bandwidths, but for very low shunt values (<5 mohm) check the datasheet offset and CMRR numbers before skipping an external precision amplifier.
Compliance Information
Distributor listings (Hotenda, Microchip USA) identify the part as AEC-Q100 qualified and RoHS/lead-free surface-mount. REACH and halogen-free status not stated in the provided data.