Microchip Technology

DSPIC33EP128GM604-E/ML - 16-bit DSC, 128KB, 70 MIPS | Microchip

MPN: DSPIC33EP128GM604-E/ML ✓ Active
In Stock Ships in 1-3 business days
3.3V Vdss 44-QFN (8x8 mm), exposed pad Package 70 MIPS Speed 128KB (43K x 24) Memory
From $4.11 USD / Unit
MOQ: 1 |
Price updated: 2026-09-23
Volume Pricing
Qty Unit Price Extended
1 $6.42 $6.42
10 $5.78 $57.80
100 $5.16 $516.00
500 $4.63 $2,315.00
1,000 $4.11 $4,110.00
ℹ️ All prices are in USD

DSPIC33EP128GM604-E/ML Overview

The Microchip Technology DSPIC33EP128GM604-E/ML is a 16-bit dsPIC33EP digital signal controller (DSC) with a dsPIC33E core running at up to 70 MIPS, 128KB (43K x 24) of Flash program memory, 16KB of RAM, and an extended-temperature operating range of -40C to +125C, housed in a 44-pin QFN with exposed pad (8x8 mm, ML suffix).

A digital signal controller combines the computational capability of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between general-purpose MCUs and dedicated DSPs, making the dsPIC33E family a standard choice for closed-loop control applications that require both fast math and rich on-chip peripherals.

Key features of the GM604 variant include up to 70 MIPS core performance, two independent on-chip operational amplifiers/comparators (up to four in the family) with direct ADC connection, a CAN 2.0B module, high-speed PWM with complementary outputs for motor control, four DMA channels, and 13 timers. The analog block offers two independent ADC modules configurable as 10-bit at 1.1 Msps with four sample-and-hold stages, or 12-bit at 500 ksps with one sample-and-hold.

Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, barrel shifter, and modulo/circular addressing, enabling real-time control loops such as field-oriented control (FOC) without external math coprocessors. The internal bus architecture and four DMA channels offload data movement from the CPU, sustaining deterministic interrupt latency for time-critical loops.

Typical applications include precision sensorless and encoder-based motor control (PMSM, BLDC, ACIM), automotive and industrial power conversion, digital power supplies, and battery management systems, where the combination of high-speed PWM, dual ADCs, and CAN communication directly maps to system requirements.

A key design consideration is that the -E temperature grade (-40C to +125C) makes this part AEC-Q100 suitable for automotive deployments, but Flash write-endurance and core operating frequency derating at high temperature should be checked in the manufacturer datasheet.

This page synthesizes verified distributor pricing, drop-in alternatives, pinout guidance, and practical design notes not consolidated in the manufacturer datasheet, providing a single reference for selection engineers.

Drop-in alternatives for DSPIC33EP128GM604-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with DSPIC33EP128GM604-E/ML (same form factor and footprint) — differing in Operating Temperature, Package, ADC Resolution, Supply Voltage, Core.

Microchip Technology
Operating Temperature: -40C to +85C
Package: 44-QFN (8x8 mm) Exposed Pad
Microchip Technology
Operating Temperature: -40C to +125C (H grade)
ADC Resolution: 10-bit / 12-bit (dual modules)
Supply Voltage: 3.0 V to 3.6 V (3.3 V nominal)
Microchip Technology
Operating Temperature: -40C to +125C (E grade, automotive)
Package: 44-QFN (8x8 mm) with exposed pad
ADC Resolution: 12-bit / 10-bit

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

DSPIC33EP128GM604-I/ML

✅ Drop-In ⚠️ Specs Unverified
📦 44-QFN (8x8 mm, ML)
temperature grade -40C to +85C vs -40C to +125C (-40C lower ceiling), identical die/peripherals/pinout

📋 Reference alternative (not in catalog)

DSPIC33EP256GM604-E/ML

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 44-QFN (8x8 mm, ML)
dsPIC33E 16-bit DSC · 60 MIPS · 256 KB (85.5K x 24) Flash · 16 KB · 3.3 V · 44-QFN (8x8 mm) with exposed pad · -40C to +125C (E grade, automotive) · 12-bit / 10-bit

✓ In Stock

$6.55 / Unit

View Datasheet →

DSPIC33EP64GM604-E/ML

✅ Drop-In ⚠️ Specs Unverified
📦 44-QFN (8x8 mm, ML)
Flash 64KB vs 128KB (-50% program memory), same peripherals and pinout

📋 Reference alternative (not in catalog)

DSPIC33EP128GP604-E/ML

✅ Drop-In ⚠️ Specs Unverified
📦 44-QFN (8x8 mm, ML)
GP variant removes on-chip op amps and CAN-focused analog features; same core/Flash/pinout

📋 Reference alternative (not in catalog)

DSPIC33EP128GM304T-I/ML

✅ Drop-In
Microchip Technology
📦 44-QFN (8x8 mm, ML)
16-bit dsPIC33E DSC core · 70 MIPS · 60 MHz · 128KB (43K x 24) FLASH · 16 KB · 3.0 V to 3.6 V · -40C to +85C · 44-QFN (8x8 mm) Exposed Pad

✓ In Stock

$3.62 / Unit

View Datasheet →

DSPIC33EP128GM604-E/ML Maximum Ratings & Electrical Characteristics

Core dsPIC33E, 16-bit
Max CPU Speed 70 MIPS
Program Memory (Flash) 128KB (43K x 24)
SRAM 16KB
Supply Voltage 3.3V
ADC Resolution 10-bit (1.1 Msps) / 12-bit (500 ksps)
ADC Channels Up to 49 analog inputs (family)
Op Amps / Comparators Up to 4 on-chip op amps (family)
CAN Module CAN 2.0B
DMA Channels 4
Timers 13
Operating Temperature -40C to +125C
Package 44-QFN (8x8 mm), exposed pad
Mounting Type Surface Mount
Application Qualification Automotive, AEC-Q100 environment (per distributor data)
Programming Interface ICSP (PGECx/PGEDx pairs)

DSPIC33EP128GM604-E/ML 44-qfn (8x8 mm), exposed pad Pin Configuration Guide

Pin configuration for DSPIC33EP128GM604-E/ML (44-qfn (8x8 mm), exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

44-qfn (8x8 mm), exposed pad package pinout diagram for DSPIC33EP128GM604-E/ML

No detailed pinout data available for DSPIC33EP128GM604-E/ML.

Refer to the datasheet for full pin configuration.

Typical Applications

DSPIC33EP128GM604-E/ML is suitable for 6 applications: Precision Motor Control (FOC for PMSM/BLDC), Digital Power Supplies and Inverters, Automotive Body and Auxiliary Motor Systems, Industrial Sensor Conditioning and Data Acquisition, Battery Management and DC-DC Conversion in Energy Storage, Robotics and Factory Automation Drives.

🏭

Precision Motor Control (FOC for PMSM/BLDC)

The DSPIC33EP128GM604-E/ML is purpose-built for field-oriented control of PMSM and BLDC motors: the 70 MIPS DSP core executes current-loop mathematics with single-cycle MAC instructions, while up to four on-chip op amps amplify shunt current signals directly into the ADC. The two independent ADC modules - 10-bit at 1.1 Msps or 12-bit at 500 ksps - sample phase currents with flexible, PWM-synchronized trigger sources for deterministic loop timing. High-speed PWM with complementary outputs and programmable dead time drives the inverter stage. Place the DSC between the gate-driver inputs and current-sense shunts, with op-amp outputs routed on short traces to the dedicated ADC pins; the integrated analog path removes external amplifiers, reducing BOM cost and offset error. The 4 DMA channels stream sampled data without CPU intervention, keeping interrupt latency low during commutation interrupts.

⚡

Digital Power Supplies and Inverters

In digitally controlled power converters - LLC, totem-pole PFC, and solar micro-inverters - the DSPIC33EP128GM604-E/ML provides the control bandwidth and analog precision the loop requires. The dual ADCs permit simultaneous sampling of output voltage and input current, and configurable trigger sources let each converter stage fire conversions on PWM boundaries, eliminating jitter-induced output ripple. The 12-bit, 500 ksps mode delivers the resolution needed for voltage-mode compensation, while the 10-bit, 1.1 Msps mode supports fast peak-current-mode loops. The high-speed PWM module's complementary outputs with programmable blanking protect against switching-edge noise in current sensing. Firmware-implemented compensators (Type II/Type III) run comfortably at 70 MIPS with headroom for housekeeping tasks. The CAN 2.0B module enables PMBus-like supervision messaging in telecom rectifiers, and the -40C to +125C grade survives outdoor and power-stage-adjacent ambient temperatures.

🚗

Automotive Body and Auxiliary Motor Systems

For automotive auxiliary drives - HVAC blowers, pumps, electronic throttle, and wiper systems - the DSPIC33EP128GM604-E/ML combines the -E extended temperature grade (-40C to +125C) with AEC-Q100 environment qualification cited in distributor data, plus the CAN 2.0B interface required for in-vehicle networks. The dual ADCs handle position sensor inputs (hall, resolver-adjacent quadrature via QEI support in the encoder interface) while the op amps condition phase-current shunts for the control loop. The 128KB Flash accommodates the control application, CAN stack, and diagnostic/UDS firmware with margin for field updates. Four DMA channels and 13 timers offload housekeeping from the CPU, sustaining real-time behavior under bus load. Designers should apply Microchip's functional-safety guidance and derate maximum clock frequency at the upper temperature extreme per the family datasheet electrical tables.

🔧

Industrial Sensor Conditioning and Data Acquisition

The on-chip analog subsystem makes the DSPIC33EP128GM604-E/ML a compact front end for industrial sensor nodes. Up to four operational amplifiers buffer and amplify signals from pressure bridges, thermocouple-adjacent circuitry, and current transducers directly into the ADC input multiplexer - 11 to 49 analog input channels across the family - removing discrete amplifier stages. The two independent ADC modules can run different resolutions and sample rates simultaneously, for example 12-bit, 500 ksps on a precision pressure channel while a 10-bit, 1.1 Msps channel monitors a fast vibration signal. Programmable references with 32 voltage points and programmable blanking improve measurement integrity near switching events. DMA streams conversion results to the 16KB SRAM without CPU cycles. The -40C to +125C rating and 3.3V supply fit both cabinet-mounted and field-deployed industrial environments with wide thermal profiles.

🔋

Battery Management and DC-DC Conversion in Energy Storage

In battery management systems and bidirectional DC-DC converters for energy storage, the DSPIC33EP128GM604-E/ML supplies the measurement and control backbone. Dual ADCs simultaneously digitize cell-stack voltage and inductor current, while the on-chip op amps condition shunt signals without external amplifiers. The high-speed PWM generates the phase-shifted or complementary drive signals required by synchronous buck/boost and CLLC stages, with programmable dead-time control protecting the power bridge. The CAN 2.0B module communicates state-of-charge and fault data to a vehicle or site controller, and the 13 timers plus 4 DMA channels maintain watchdogs and housekeeping without disturbing the fast control loop. The -E grade sustains -40C to +125C operation needed near power stages. Firmware-based coulomb counting and balancing algorithms fit comfortably in the 128KB Flash with 16KB SRAM supporting filtering state.

🤖

Robotics and Factory Automation Drives

Industrial motion nodes - servo drives, stepper controllers, and joint actuators - benefit from the DSPIC33EP128GM604-E/ML's deterministic control pipeline. The quadrature encoder interface support and QEI-capable inputs decode motor position feedback, while 70 MIPS core performance executes cascade position/velocity/current loops with single-cycle DSP math. The high-speed PWM drives both servo bridges and microstepping stages, and the dual ADCs sample bus voltage and phase current with PWM-synchronized triggers for consistent loop timing. On-chip op amps minimize the analog front-end footprint on dense multi-axis PCBs. The CAN 2.0B module integrates the controller into factory fieldbus architectures, and four serial I/O ports support peripheral expansion. The -40C to +125C range tolerates cabinet and motor-adjacent temperatures, and 128KB Flash holds the motion profile engine plus communication stack with headroom for field upgrades.

Recommended Products Summary

MCP2515 CAN transceiver-adjacent controller option for drive network Used in: Precision Motor Control (FOC for PMSM/BLDC) DSPIC33CK64MC105T-I/M4 Microchip Technology Used in: Precision Motor Control (FOC for PMSM/BLDC) DSPIC33CK512MP606T-I/PT Microchip Technology Used in: Digital Power Supplies and Inverters MCP1630 Analog PWM companion for hybrid power control Used in: Digital Power Supplies and Inverters DSPIC33EP128GM304T-I/ML Microchip Technology Used in: Automotive Body and Auxiliary Motor Systems MCP2562 CAN FD-capable transceiver for in-vehicle bus Used in: Automotive Body and Auxiliary Motor Systems MCP3208 External SPI ADC for channel expansion Used in: Industrial Sensor Conditioning and Data Acquisition MCP6V01 Auto-zero op amp for precision sensor front end Used in: Industrial Sensor Conditioning and Data Acquisition MCP25050 CAN I/O expander for cell-tap monitoring support Used in: Battery Management and DC-DC Conversion in Energy Storage DSPIC33CK32MC102T-I/SS Microchip Technology Used in: Battery Management and DC-DC Conversion in Energy Storage DSPIC33CK128MP205-E/PT Microchip Technology Used in: Robotics and Factory Automation Drives MCP2542 CAN transceiver for automation fieldbus Used in: Robotics and Factory Automation Drives
What are the key specifications of DSPIC33EP128GM604-E/ML that engineers should know?
The DSPIC33EP128GM604-E/ML is a 16-bit dsPIC33E digital signal controller from Microchip with 128KB (43K x 24) Flash, 16KB RAM, and up to 70 MIPS core performance. It integrates dual ADC modules (10-bit 1.1 Msps or 12-bit 500 ksps), up to four on-chip op amps, a CAN 2.0B module, 4 DMA channels, and 13 timers in a 44-QFN (8x8) exposed-pad package rated from -40C to +125C.
What is the operating temperature range of DSPIC33EP128GM604-E/ML?
The DSPIC33EP128GM604-E/ML operates from -40C to +125C, indicated by the -E extended temperature suffix. According to Microchip product data, this extended grade suits automotive and industrial deployments, and the part is listed by distributors as automotive/AEC-Q100 environment qualified. The industrial -I grade (also -40C to +85C) is available as DSPIC33EP128GM604-I/ML for cost-sensitive non-automotive designs.
What is the difference between DSPIC33EP128GM604-E/ML and DSPIC33EP128GM604-I/ML?
The only functional difference is the temperature grade: the -E version operates from -40C to +125C while the -I version operates from -40C to +85C. Both use the identical 128KB Flash die, the same 44-QFN (8x8 mm, ML) package, and the same peripheral set including CAN, dual ADCs, and on-chip op amps, making the -I a direct drop-in on the same PCB footprint. The -E carries the automotive extended-range qualification, so choose -E for under-hood or high-temperature industrial environments.
DSPIC33EP128GM604 vs DSPIC33EP256GM604 - which is better for motor control?
For motor control algorithms, both parts deliver identical core performance (70 MIPS), identical peripherals (dual ADC, high-speed PWM, op amps, CAN), and the same 44-QFN footprint. The only difference is Flash: 128KB on the GM604 versus 256KB on the GM606-series 256KB variants. If your control code, FOC library, bootloader, and field firmware updates fit within 128KB (43K x 24 instructions), the GM604 is the lower-cost choice; otherwise select the 256KB drop-in to preserve the same PCB.
What is the best drop-in replacement for DSPIC33EP128GM604-E/ML?
The best drop-in replacement is DSPIC33EP128GM604-I/ML, which is pin-to-pin compatible in the same 44-QFN (8x8) package with identical Flash and peripherals, differing only in the temperature grade (-40C to +85C vs -40C to +125C). Other pin-compatible family options in the same ML footprint include DSPIC33EP256GM604-E/ML (2x Flash) and DSPIC33EP64GM604-E/ML (half Flash), which keep the same pinout and memory map while changing program capacity.
Can DSPIC33EP128GM304 replace DSPIC33EP128GM604?
DSPIC33EP128GM304T-I/ML is electrically pin-compatible in the same 44-QFN package and matches the 128KB Flash and 16-bit core, but it is not a full-equivalent replacement: the GM304 variant omits some GM60x analog features such as the on-chip op amps targeted at motor-control sensing. Firmware must be recompiled and analog front-end circuitry reviewed. Treat it as a pin-compatible cost-down option only when your design does not rely on the integrated op amps or the full ADC channel count.
When should I choose DSPIC33EP128GM604-E/ML over the GP604 variant?
Choose the GM604 over the DSPIC33EP128GP604-E/ML when your application uses the on-chip operational amplifiers and CAN 2.0B module that define the GM series, such as current-sense amplification in FOC motor drives or inverter communication. The GP604 shares the same 44-QFN footprint and 128KB Flash but drops these motor-control-oriented peripherals. If your design uses external op amps and has no CAN bus, the GP604 offers the same core performance at a lower cost on the identical PCB.
Where to download the DSPIC33EP128GM604 datasheet PDF?
The authoritative datasheet is Microchip document 70000689, titled 16-Bit Digital Signal Controllers with High-Speed PWM, Op Amps and Advanced Analog, available from ww1.microchip.com; a product summary page is also maintained at microchip.com/en-us/product/dsPIC33EP128GM604. This single family datasheet covers the GM604, including pinout diagrams, ADC and PWM specifications, electrical characteristics by temperature grade, and the programming (ICSP) connection requirements via PGECx/PGEDx pin pairs.
Where can I find the pinout of DSPIC33EP128GM604-E/ML?
The complete 44-pin QFN pinout is provided in the Microchip family datasheet (document 70000689) in the pin diagrams section. Note that dsPIC33EP128GM604 has more than one pair of PGECx and PGEDx programming pins: you must use any pair as a matched pair for ICSP - for example, if PGEC2 carries ICSPCLK, the corresponding PGED2 must carry ICSPDAT. All VDD and VSS pins must be connected during programming and debugging.
What is the price of DSPIC33EP128GM604-E/ML?
As of 2026-09-23, XAIPART lists DSPIC33EP128GM604-E/ML at USD 6.42 for quantity 1, tapering to USD 4.11 at 1000 units. Distributor pricing at DigiKey and Mouser historically sits in a similar single-digit USD range for the 44-QFN extended-temperature package. Because extended-grade automotive-suitable DSCs can see longer factory lead times (distributor data has cited up to 23 weeks), confirm current stock and lead time before committing a bill of materials.
Is DSPIC33EP128GM604-E/ML in stock and where can I buy it online?
Yes, the part is an active, orderable product: DigiKey lists DSPIC33EP128GM604-E/ML as 'Order today, ships today', and Mouser and MicrochipDirect (as DSPIC33EP128GM604-I/ML for the industrial grade) carry inventory. On XAIPART you can request a quote with tier pricing from USD 6.42 at qty 1. Because extended-temperature grades occasionally revert to long factory lead times, verify real-time availability at your distributor of choice before scheduling production.
What is the lead time for DSPIC33EP128GM604-E/ML?
Distributor data for this part has cited a factory lead time of up to 23 weeks during constrained supply periods, while in-stock distribution channels (DigiKey, Mouser, MicrochipDirect) can ship within days when inventory is available. As of 2026-09-23 the part is listed as shipping today from major distributors. For volume production, place a buffered order or schedule with Microchip Direct due to the extended -E temperature grade's higher allocation risk compared with industrial -I variants.
Is DSPIC33EP128GM604-E/ML the same as DSPIC33EP128GM604-E/MR?
No - they share the same die and electrical specifications but use different physical packages: the /ML suffix is a 44-QFN with exposed pad measuring 8x8 mm, while the /MR suffix is a smaller 44-QFN body (6x6 mm family option). Because the land patterns and body sizes differ, the MR is NOT a mechanical drop-in on an ML footprint even though pin functions correspond. Choose /ML to keep an existing 8x8 mm PCB layout unchanged; select /MR only for new space-constrained layouts.
Is DSPIC33EP128GM604-E/ML suitable for automotive applications?
Yes. Distributor data (Hotenda) explicitly lists the part as automotive with AEC-Q100 environment qualification, and the -E suffix guarantees -40C to +125C operation required for many under-hood and body-control zones. The integrated CAN 2.0B module provides the in-vehicle network interface, while dual high-speed ADCs and on-chip op amps support current sensing in electric power steering, pumps, and traction-adjacent motor drives. Confirm specific qualification documentation with Microchip for safety-critical ASIL deployments.
What tools support programming and debugging the DSPIC33EP128GM604?
The dsPIC33EP128GM604 is supported by the MPLAB X IDE with XC16 compiler, and hardware tools including PICkit, ICD, and Real ICE programmers/debuggers. Per Northern Software compatibility notes, the part programs via ICSP using any PGECx/PGEDx pin pair (used strictly as a pair), and it is compatible with third-party NSDSP programmers as well. Debugging provisions are fully supported, and all VDD/VSS pins must be connected during any programming or debug session.

Engineering reference data for DSPIC33EP128GM604-E/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose DSPIC33EP128GM604-E/ML when you need a 16-bit 70 MIPS DSC with integrated op amps, CAN 2.0B, dual high-speed ADCs, and -40C to +125C operation in a compact 44-QFN - the classic fit is FOC motor control, digital power, or automotive auxiliary drives. Choose DSPIC33EP128GM604-I/ML for identical function up to +85C at lower cost. Choose DSPIC33EP256GM604-E/ML when code size (bootloader + algorithm + field updates) exceeds 128KB, or DSPIC33EP64GM604-E/ML to cut cost on lean firmware. Choose DSPIC33EP128GM304T-I/ML only as a pin-compatible cost-down when the on-chip op amps are unused. All alternatives keep the same 8x8 mm ML PCB footprint, so platform reuse is preserved; the smaller /MR package is not footprint-compatible and requires new layout work.

Comparison with Alternatives

Parameter This Product DSPIC33EP128GM604-I/ML DSPIC33EP256GM604-E/ML DSPIC33EP64GM604-E/ML DSPIC33EP128GM304T-I/ML
Package 44-QFN (8x8 mm, ML) 44-QFN (8x8 mm, ML) - same 44-QFN (8x8 mm, ML) - same 44-QFN (8x8 mm, ML) - same 44-QFN (8x8 mm, ML) - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Program Memory 128KB (43K x 24) 128KB (43K x 24) 256KB 64KB 128KB
Max CPU Speed 70 MIPS 70 MIPS 70 MIPS 70 MIPS 70 MIPS
Operating Temperature -40C to +125C (-E) -40C to +85C (-I) -40C to +125C (-E) -40C to +125C (-E) -40C to +85C (-I)
On-chip Op Amps Up to 4 (GM6xx analog feature set) Up to 4 (identical die) Up to 4 Up to 4 Reduced (GM3xx feature set) - review required
CAN Module CAN 2.0B CAN 2.0B CAN 2.0B CAN 2.0B CAN (per family) - verify variant

Key Differentiators

  • Extended temperature with full analog feature set (vs DSPIC33EP128GM604-I/ML)
  • Motor-control analog integration (vs DSPIC33EP128GM304T-I/ML)
  • Scalable Flash on the same footprint (vs DSPIC33EP256GM604-E/ML)

Design Notes

Connect ALL VDD and VSS pins of the 44-QFN (8x8, ML) package; per Microchip programming documentation, leaving any supply pair floating will prevent ICSP programming. Provide at least one matched PGECx/PGEDx pair to a programming header - if PGEC2 carries ICSPCLK, the paired PGED2 must carry ICSPDAT. Place 100 nF ceramic decoupling capacitors at each supply pin pair, and solder the exposed pad to a grounded thermal array (4x4 via stitching) both for heat spreading at 125C ambient and for return-path integrity on the high-speed PWM and ADC analog grounds.

Do not assume the GM604's analog feature set transfers when substituting family variants: the GM3xx series (e.g., DSPIC33EP128GM304) removes on-chip op amps, breaking shunt-amplifier front ends designed around the internal amplifiers. Also, the /MR package (smaller body) is not footprint-compatible with the /ML 8x8 mm QFN despite matching pin functions - never swap without PCB rework. Finally, verify Flash endurance and maximum clock derating at +125C in the family datasheet electrical tables before locking the control-loop frequency.

Estimated: at 70 MIPS with typical DSC core current on the order of tens of milliamps, power dissipation in the 44-QFN ML package is well under 0.5W, giving a junction rise of roughly 20-30C above ambient depending on copper area - safe within the -40C to +125C window for most designs. However, in motor-drive boards the DSC often shares the PCB with hot power stages; keep the controller at least 10-15 mm from inverter hotspots and route the exposed-pad ground plane to large copper pours so ambient at the die stays well below the +125C ceiling.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

Distributor listings (Hotenda, DigiKey) identify the part as automotive with AEC-Q100 environment qualification. RoHS/lead-free status inferred from active distributor catalog status; REACH, halogen-free, and conflict-minerals details not stated in provided data.

Data verified on: 2026-09-23 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Microchip Technology DSPIC33EP128GM604-E/ML dsPIC33EP128GM604 dsPIC33E family DSPIC33EP128GM604-I/ML DSPIC33EP256GM604-E/ML DSPIC33EP64GM604-E/ML DSPIC33EP128GP604-E/ML DSPIC33EP128GM304T-I/ML digital signal controller (DSC) digital signal processor (DSP) microcontroller (MCU) 16-bit core 70 MIPS CAN 2.0B 44-QFN exposed pad (8x8 mm) AEC-Q100 RoHS ICSP / PGEC-PGED programming field-oriented control (FOC) high-speed PWM dual ADC modules (10-bit 1.1 Msps / 12-bit 500 ksps) on-chip op amps motor control digital power
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