DSPIC33EP256GM710-E/PF - 16-bit DSC 256KB Flash TQFP-100 | Microchip
MPN: DSPIC33EP256GM710-E/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.45 | $8.45 |
| 10 | $7.68 | $76.80 |
| 100 | $6.92 | $692.00 |
| 500 | $6.3 | $3,150.00 |
| 1,000 | $5.75 | $5,750.00 |
DSPIC33EP256GM710-E/PF Overview
A digital signal controller combines the computational strengths of a microcontroller (MCU) with the math acceleration of a digital signal processor (DSP). The dsPIC33EP family from Microchip sits within the broader 16-bit embedded controller hierarchy: DSC -> digital signal controller -> microcontroller unit -> semiconductor. These devices pair a Harvard-architecture dsPIC core with integrated DSP engine features such as single-cycle MAC, modulo and bit-reversed addressing, plus 32-bit multiply support.
Key differentiating features of the GM710 variant include dual CAN 2.0B modules, up to 12-channel PWM suitable for motor control, quadrature encoder interface (QEI) inputs, integrated operational amplifiers for current-sense signal chains, and 32KB of on-chip SRAM. The rich peripheral mix lets a single chip close a complete field-oriented motor-control loop: op-amps condition shunt currents, ADC samples them, the DSP core executes control algorithms, and the PWM module drives the inverter gate stage.
Technically, the dsPIC33EP core runs at up to 60 MIPS from a 3.3V supply, with the family marketing figure of 70 MIPS referenced at the maximum family rating. Program memory is 256KB of Flash, organized as 85.5K x 24-bit instructions. Interrupt latency is deterministic, and the DMA architecture offloads peripheral data movement from the CPU.
Typical applications include precision motor control for industrial drives, digital power supplies and inverters, automotive auxiliary systems (the -E temperature grade suits underhood-adjacent environments), and general embedded control requiring DSP math such as power conversion and sensor fusion.
When designing in this part, budget the 3.3V rail and decouple all VDD/VDDCORE pins per the family datasheet (70000689d); also verify the CAN transceiver selection matches the 3.3V I/O levels.
This page synthesizes verified distributor data, family datasheet references, drop-in alternatives within the same TQFP-100 footprint, and practical design notes not found in the standard manufacturer product page.
Drop-in alternatives for DSPIC33EP256GM710-E/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GM710-E/PF (same form factor and footprint) — differing in Package, Operating Temperature, Supply Voltage, Core Architecture, Quadrature Encoder Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GM710-I/PF
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512GM710-E/PF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP128GM710-E/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$6.4 / Unit
View Datasheet →DSPIC33EP256GM710-E/BG
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GM710-E/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC Harvard |
| Core Speed | 60 MIPS (family up to 70 MIPS) |
| Program Memory | 256KB (85.5K x 24) Flash |
| RAM | 32KB SRAM |
| Supply Voltage | 3.3 V |
| Package | TQFP-100 (14x14 mm) |
| Pin Count | 100 |
| Operating Temperature | -40C to +125C (E grade) |
| CAN Modules | 2 x CAN 2.0B |
| PWM Channels | 12 motor-control PWM |
| QEI Interfaces | 2 |
| Integrated Op-Amps | Yes (peripheral op-amps) |
| Input Capture / Output Compare | 8 / 8 |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Automotive Qualification | Marketed for automotive environments (per distributor data) |
DSPIC33EP256GM710-E/PF tqfp-100 (14x14 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256GM710-E/PF (tqfp-100 (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GM710-E/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GM710-E/PF is suitable for 6 applications: Industrial Motor Control Drives, Automotive Auxiliary Control Units, Digital Power Supplies and Inverters, Sensor Fusion and Embedded DSP, Building Automation and HVAC Control, Test, Measurement and Instrumentation.
Industrial Motor Control Drives
The DSPIC33EP256GM710-E/PF is purpose-built for precision motor control: its 12 motor-control PWM channels drive three-phase inverters with complementary outputs and dead-time control, while two QEI inputs accept incremental encoder feedback for position-accurate commutation. The integrated op-amps condition current-shunt signals directly, shortening the analog front end before the 10/12-bit ADC sampling chain. The 60 MIPS DSP core with single-cycle MAC executes field-oriented control (FOC) algorithms in well under one PWM period, closing current loops at 20 kHz or higher. Placed as the sole controller between the position sensor and gate drivers, it removes external analog amplifiers and reduces BOM cost. The main trade-off is thermal: at full core speed the 3.3V supply draws tens of milliamps, so the TQFP-100 exposed copper pours should be sized for continuous industrial ambient temperatures.
Recommended
Automotive Auxiliary Control Units
The extended -40C to +125C operating rating of the -E grade makes this DSC appropriate for automotive auxiliary modules such as pump controllers, cooling-fan drives, throttle actuation, and body power-management nodes, where underhood-adjient ambient temperatures routinely reach +105C to +125C. According to distributor data (Jotrin, findics), the part is explicitly categorized for automotive environments. The dual CAN 2.0B controllers connect the module to vehicle networks with hardware message filtering, reducing CPU interrupt load. The 12-channel PWM and QEI peripherals cover both brushless actuation and encoder-feedback positioning in a single chip. Designers must supply AEC-qualified support components and confirm full AEC-Q100 qualification status with Microchip before releasing to production, since catalog automotive marketing does not substitute for formal qualification documentation on a per-MPN basis.
Recommended
Digital Power Supplies and Inverters
Switching power conversion benefits directly from this DSC's architecture: the DSP core computes voltage- and current-loop compensators with deterministic sub-microsecond latency, while the 12 PWM channels provide phase-shifted, complementary, or interleaved outputs with hardware dead-time insertion. The on-chip op-amps buffer current-sense shunt signals, and the ADC can be triggered synchronously to the PWM ramp for noise-free mid-rail sampling - a technique Microchip documents in its digital power reference designs. Dual CAN enables system-level telemetry in telecom rectifiers and solar micro-inverters. The 256KB Flash accommodates adaptive control firmware plus a bootloader for field firmware updates over CAN. The key performance consideration is ADC-to-PWM synchronization setup; incorrect trigger placement injects switching noise into sampled currents, degrading loop stability.
Recommended
Sensor Fusion and Embedded DSP
With 32KB SRAM, single-cycle MAC, and bit-reversed addressing for FFT support, the DSPIC33EP256GM710 handles moderate sensor-fusion workloads: IMU filtering, vibration analysis, power metering, and acoustic signal conditioning. The 60 MIPS core executes 1024-point real FFTs and cascaded biquad IIR filters in real time while the DMA moves ADC samples to RAM without CPU intervention, keeping interrupt latency deterministic. The peripheral op-amps can pre-condition microphone or accelerometer signals before digitization. Unlike a general-purpose MCU-plus-DSP two-chip solution, this single TQFP-100 device consolidates control and signal processing, cutting board area and firmware complexity. Firmware developers should budget the DSP library (DSP Fixed-Point library from Microchip) against the 256KB Flash, which remains ample for typical fusion pipelines with communication stacks included.
Recommended
Building Automation and HVAC Control
Fan, pump, and compressor subsystems in HVAC and building automation need both motor-control peripherals and network connectivity - exactly this part's strengths. The 12 PWM channels drive EC-motor inverters, the QEI inputs accept airflow or position feedback, and dual CAN 2.0B plus UART/SPI/I2C connect to BMS gateways and sensors. The -40C to +125C E-grade tolerates rooftop and mechanical-room ambient extremes that fail commercial-grade silicon. The 256KB Flash holds control firmware plus Modbus or proprietary protocol stacks with room for OTA bootloader logic. Running the DSP-based sensorless observer algorithms (back-EMF estimation) leverages the single-cycle MAC, eliminating position sensors in cost-sensitive fan applications. The principal design trade-off is supply decoupling: motor switching noise on the 3.3V rail must be isolated from the ADC reference for stable sensorless control.
Recommended
Test, Measurement and Instrumentation
Handheld meters, data loggers, and industrial instrumentation benefit from this DSC's deterministic interrupt latency, 32KB SRAM for waveform buffers, and rich serial connectivity (two UARTs, SPI, I2C, plus CAN). The DMA engine streams ADC samples to memory at full rate while the CPU runs display and communication tasks, enabling continuous acquisition without gaps. The peripheral op-amps front-end small sensor signals, and the 256KB Flash stores calibration tables and multi-protocol firmware. For FFT-based measurement features (harmonic analysis, THD), the DSP instruction set with bit-reversed addressing accelerates in-place transforms. Designers should schedule ADC conversions from a timer rather than software loops to guarantee uniform sample spacing, and reserve the I-grade variant for bench instruments that never see +125C, reducing component cost without functional loss.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GM710-E/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GM710-I/PF | DSPIC33EP512GM710-E/PF | DSPIC33EP128GM710-E/PF |
|---|---|---|---|---|
| Package | TQFP-100 (14x14 mm) | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same | TQFP-100 (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256KB (85.5K x 24) | 256KB (85.5K x 24) | 512KB | 128KB |
| RAM | 32KB SRAM | 32KB SRAM | 32KB SRAM | 32KB SRAM |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| CAN Modules | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B |
| PWM / QEI / Op-Amps | 12 PWM, 2 QEI, Yes | 12 PWM, 2 QEI, Yes | 12 PWM, 2 QEI, Yes | 12 PWM, 2 QEI, Yes |
Key Differentiators
- Extended temperature for automotive-adjacent zones (vs DSPIC33EP256GM710-I/PF)
- Balanced 256KB Flash capacity (vs DSPIC33EP512GM710-E/PF)
- Integrated peripheral op-amps and dual CAN (vs DSPIC33EP128GM710-E/PF)
Design Notes
The dsPIC33EP family requires a separate VDDCORE pin supplied by an on-chip regulator - follow the datasheet's mandatory external capacitor value on VDDCORE exactly (per datasheet 70000689d minimum connection list). Decouple every VDD pin with 100nF ceramic placed within 3mm, plus bulk 10uF near the supply entry. AVDD must be filtered separately (ferrite plus 1uF plus 100nF) because the ADC reference noise directly limits current-sense accuracy in motor-control loops.
Estimated: at 60 MIPS the device draws on the order of 40-60 mA typical from 3.3V (0.13-0.2 W) plus I/O load; with the TQFP-100 theta_JA on a standard 4-layer board, junction rise is modest (roughly 10-15C), which is why the -40C to +125C E grade is achievable without heatsinking. The dominant thermal risk is hot ambient plus hot I/O drivers (12 PWM pins driving large gate-charge loads); budget I/O dissipation separately and verify junction temperature against the datasheet maximum of +125C.
Do not migrate freely between E and I grades without re-checking worst-case ambient: the -I/PF drops the maximum rating to +85C. When substituting 128KB or 512KB Flash variants, update the linker script and check configuration-word compatibility (per family datasheet 70000689d the devices are code-compatible but memory maps differ). For CAN nodes, place a common-mode choke and match the transceiver (e.g., MCP2562) standby behavior to firmware CAN wake-up settings to avoid missed bus-off recovery.
Compliance Information
Verified web data does not state explicit RoHS/REACH strings for this exact MPN; the device is marketed (Jotrin, findics) as suitable for automotive environments. AEC-Q100 qualification not confirmed in provided data - treat as not qualified until verified with Microchip. Microchip current production is typically RoHS-compliant, but confirm via the manufacturer product page material declaration.
