DSPIC33EP256MU810-E/PF - 16-bit 60 MIPS DSC 256KB Flash | Microchip
MPN: DSPIC33EP256MU810-E/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.92 | $7.92 |
| 10 | $7.15 | $71.50 |
| 100 | $6.42 | $642.00 |
| 500 | $5.86 | $2,930.00 |
| 1,000 | $5.31 | $5,310.00 |
DSPIC33EP256MU810-E/PF Overview
A digital signal controller combines the computational architecture of a microcontroller with the mathematical throughput of a DSP. In the power-management hierarchy of embedded systems, a DSC sits above general-purpose MCUs for control-loop-intensive tasks: the dsPIC33E family executes single-cycle MAC and DSP instructions, allowing FOC motor-control algorithms and digital power feedback loops to run at PWM switching rates that a standard 8-bit or mid-range 16-bit MCU cannot sustain.
Key features include 256 KB of self-programmable Flash, up to 28 KB of SRAM, a high-speed PWM module supporting complementary outputs with dead-time insertion, dual CAN 2.0B controllers, full-speed USB OTG, and multiple 12-bit ADCs supporting simultaneous sampling. The extended-temperature -E grade enables deployment in industrial enclosures and under-hood environments without external cooling measures.
Technically, the dsPIC33E core pairs a 16-bit pipeline datapath with a DSP engine (17-bit x 17-bit multiplier, 40-bit accumulator) so that filtering, transformation, and control algorithms execute alongside interrupt-driven supervisory code. Eight-channel DMA offloads the CPU for USB, ADC, and SPI data streaming, and the peripheral-pin-select feature maps digital peripherals to flexible I/O locations on the 85+ available I/O, simplifying PCB routing.
Typical applications include brushless DC and permanent-magnet motor drives for industrial automation, digital power supplies and solar inverters requiring fast control loops, and USB-connected sensing or instrumentation nodes that also need CAN bus connectivity.
When designing with this part, budget the 3.0 V to 3.6 V supply rail carefully and keep the VDDCORE regulator capacitor close to the package; the PGEC/PGED programming pins are sensitive to cross-talk, so keep ICSP traces short and isolated.
This page synthesizes distributor pricing, verified drop-in alternatives from the same TQFP-100 footprint, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256MU810-E/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256MU810-E/PF (same form factor and footprint) — differing in Operating Temperature, Package, Program Memory Size, RAM Size, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256MU810-I/PF
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →DSPIC33EP512MU810-I/PF
✅ Drop-In✓ In Stock
$11.2 / Unit
View Datasheet →DSPIC33EP256MU806-I/PT
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP256GM710T-I/PF
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →DSPIC33EP256GM710-H/PF
✅ Drop-In✓ In Stock
$5.25 / Unit
View Datasheet →DSPIC33EP256MU810-E/PF Maximum Ratings & Electrical Characteristics
| Core Size | 16-bit |
| Program Memory Type | Flash |
| Program Memory Size | 256 KB (85.5K x 24) |
| RAM Size | 28 KB |
| Maximum Clock / Performance | 60 MIPS (up to 60 MHz clock) |
| Supply Voltage Range | 3 V to 3.6 V |
| I/O Ports | 51 I/O (per package listing); up to 85 I/O on 100-pin device |
| Package Type | 100-TQFP (14x14 mm) |
| Operating Temperature Range | -40C to +125C (E grade) |
| USB | USB 2.0 full-speed OTG |
| CAN Controllers | Dual CAN 2.0B |
| Timers | Up to 9 x 16-bit timers; 27 total general-purpose timer resources |
| High-Speed PWM | Yes (motor-control PWM with dead-time insertion) |
| ADC | Integrated 12-bit advanced analog ADCs |
| Mounting Type | Surface Mount |
| Life Cycle Stage | Active |
| RoHS Status | Compliant |
DSPIC33EP256MU810-E/PF 100-tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256MU810-E/PF (100-tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MU810-E/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MU810-E/PF is suitable for 6 applications: Brushless DC Motor Control, Digital Power Supplies and Solar Inverters, Industrial CAN/USB Gateways, Portable and Bench Instrumentation, Automotive-Adjacent Sensing Nodes, Smart Building and IoT Controllers.
Brushless DC Motor Control
The DSPIC33EP256MU810-E/PF fits BLDC and PMSM drives because its 60 MIPS DSP core executes field-oriented control with single-cycle 17x17 MAC operations while the high-speed PWM generates complementary outputs with programmable dead-time at switching frequencies well above the audible range. The 12-bit ADC samples phase currents at PWM sync, and DMA moves results without CPU intervention. The -40C to +125C -E grade suits sealed industrial drives; the dual CAN interfaces link the drive to factory fieldbus networks.
Recommended
Digital Power Supplies and Solar Inverters
Digital power conversion needs deterministic control loops; the DSC's DSP engine computes PID and predictive loops at PWM rates while the high-speed PWM module provides phase-shifted and complementary outputs with cycle-level resolution. Multiple 12-bit ADC channels sample output voltage and inductor current simultaneously for fast inner loops. The 256 KB Flash stores compensation tables, fault logging, and communication stacks (dual CAN for system monitoring, USB for commissioning) without external memory, and the extended -E temperature rating covers power-enclosure ambient conditions.
Recommended
Industrial CAN/USB Gateways
With two independent CAN 2.0B controllers plus full-speed USB OTG in one 3.3 V device, the DSPIC33EP256MU810-E/PF bridges industrial fieldbus segments to USB-connected PCs and service tools. Eight-channel DMA keeps USB and CAN traffic off the CPU, preserving 60 MIPS headroom for protocol translation, filtering, and logging into the ~28 KB SRAM. The 100-pin TQFP exposes the flexible I/O and peripheral-pin-select needed to route multiple UART/SPI sides of a gateway, and the -E grade supports unventilated control cabinets.
Recommended
Portable and Bench Instrumentation
Instrument front-ends benefit from the simultaneous-sampling 12-bit ADCs and DSP filtering (FIR/IIR in hardware MACs) running at 60 MIPS, while USB OTG provides a plug-and-play data path to host software with no external bridge chip. The 256 KB Flash stores calibration constants, waveform libraries, and host protocol stacks. The 100-TQFP 14x14 mm 0.5 mm pitch package suits two-layer-to-four-layer bench designs, and surface-mount construction with RoHS compliance simplifies global manufacturing.
Recommended
Automotive-Adjacent Sensing Nodes
Although not AEC-Q100 qualified, the -40C to +125C extended grade lets the DSPIC33EP256MU810-E/PF serve under-hood-adjacent and high-ambient industrial sensing nodes that demand the robustness of automotive-style thermal margins. Dual CAN provides vehicle/industrial bus connectivity, the 12-bit ADCs digitize sensor channels, and the 60 MIPS DSP core performs filtering and feature extraction locally, transmitting only processed results and reducing bus load in multi-node networks.
Recommended
Smart Building and IoT Controllers
Building controllers combine sensor acquisition, local control logic, and upstream connectivity - exactly the dsPIC33EP256MU810-E/PF profile. The 60 MIPS core with DSP instructions runs FFT-based vibration or current-signature analysis for predictive maintenance, the ADCs sample up to many sensor channels, and dual CAN plus USB OTG provide both BMS fieldbus and service interfaces. Peripheral-pin-select lets one firmware image adapt to different PCB routings, and the extended temperature range suits rooftop and plant-room enclosures.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MU810-E/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MU810-I/PF | DSPIC33EP512MU810-I/PF | DSPIC33EP256MU806-I/PT | DSPIC33EP256GM710T-I/PF |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) /PF | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same | 100-TQFP (14x14) - same footprint | 100-TQFP (14x14) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256 KB (85.5K x 24) | 256 KB | 512 KB | 256 KB | 256 KB |
| Performance | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| USB OTG | Yes (full-speed) | Yes | Yes | Yes | No (GM family) |
| High-Speed PWM | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Extended -40C to +125C temperature grade (vs DSPIC33EP256MU810-I/PF)
- Full MU-family peripheral set with dual CAN and USB (vs DSPIC33EP256MU806-I/PT)
- Memory-size scalability in the same footprint (vs DSPIC33EP512MU810-I/PF)
Design Notes
The VDDCORE pin connects to the internal 1.8 V core regulator output and requires its specified low-ESR capacitor placed within a few millimeters of the pin, with a solid ground return. Poor VDDCORE decoupling is the most common cause of erratic operation and programming failures on dsPIC33EP parts. Follow the datasheet power-up sequencing requirements - allow VDD to ramp per spec before releasing MCLR, and hold MCLR low via an RC circuit or external supervisor during brown-out conditions.
The dsPIC33EP256MU810 is more sensitive to cross-talk on the PGEC1/PGED1 programming lines than many other PIC devices, which can cause ICSP connection or verification failures (documented by third-party development-tool vendors). Route PGEC/PGED traces short, away from PWM and switching nodes, and consider a dedicated 6-pin ICSP header with series resistors. Do not share PGED/PGEC nets with high-current or high-dv/dt signals on the 100-pin TQFP layout.
With 51+ fast-switching I/O on a 0.5 mm pitch 14x14 mm package, use a minimum 4-layer board (solid ground plane under the DSC) when driving motor gate drivers or USB simultaneously. Provide 0.1 uF decoupling at each VDD/VSS pair plus bulk 10 uF at the supply entry. For USB, match the 90 ohm differential pair impedance on D+/D- and keep the pair under 50 mm; for CAN, use proper split termination (2 x 60 ohm with a ground-splitting capacitor) at the transceiver.
Estimated: at 60 MIPS with USB and CAN active, typical core current is on the order of tens of mA at 3.3 V, giving dissipation well under 0.5 W - the 100-TQFP theta_JA on a standard 4-layer board keeps junction rise modest even at +125C ambient. However, the -E grade only guarantees operation to +125C ambient: calculate Tj = Ta + (P x theta_JA) with your exact board conditions, and if ambient exceeds ~105C, verify the full electrical spec margin or move to forced airflow.
Compliance Information
RoHS compliant and lead-free per DigiKey listing for the -E/PF suffix. Not AEC-Q100 qualified; the -E extended temperature grade is not automotive qualification. REACH and halogen-free status not stated in provided data.
