DSPIC33EP256MU810-I/PF - 16-bit DSC 60 MIPS 256KB Flash | Microchip
MPN: DSPIC33EP256MU810-I/PF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.62 | $76.20 |
| 100 | $6.58 | $658.00 |
| 500 | $5.95 | $2,975.00 |
| 1,000 | $5.4 | $5,400.00 |
DSPIC33EP256MU810-I/PF Overview
A digital signal controller combines the computational architecture of a microcontroller with the math throughput of a digital signal processor. In the power management hierarchy of embedded systems, a DSC such as the dsPIC33EP family sits between general-purpose MCUs and dedicated DSPs, offering deterministic single-cycle MAC/DSP instructions alongside standard control peripherals, which is why DSCs dominate precision motor control, digital power conversion, and embedded sensing applications.
Key features include the dsPIC33E 16-bit core operating up to 60 MIPS, 256 KB (85.5K x 24) of flash program memory with self-programming, 28 KB of SRAM, a high-speed USB 2.0 full-speed device module, two CAN 2.0B controllers, up to 15 DMA channels, and advanced analog peripherals. These resources let a single chip close high-speed current loops while servicing USB or CAN communications simultaneously.
Architecturally, the DSP engine supports single-cycle MAC and 40-bit accumulators, while the PWM modules with dedicated time bases generate complementary outputs with dead-time insertion, the foundation of field-oriented motor control and digitally controlled switching power supplies. The operating supply range is 3.0 V to 3.6 V, and the industrial grade I suffix supports -40C to +85C ambient operation.
Typical applications include brushless DC and PMSM motor drives, switch-mode power supplies and digital power factor correction, USB-connected industrial sensors, and CAN-networked automotive or building control nodes.
For design, confirm PGEC/PGED programming line routing carefully: this device is reported to be sensitive to cross-talk on its programming data lines, so keep ICSP traces short and away from high-dv/dt PWM nets.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256MU810-I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256MU810-I/PF (same form factor and footprint) — differing in Operating Temperature, Package, Program Memory Size, RAM Size, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256MU810-E/PF
✅ Drop-In✓ In Stock
$5.31 / Unit
View Datasheet →DSPIC33EP256GM710T-I/PF
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →DSPIC33EP512MU810-I/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$11.2 / Unit
View Datasheet →DSPIC33EP128MU810-I/PF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MU810-H/PF
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MU810-I/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC (RISC with DSP engine) |
| Maximum CPU Speed | 60 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| SRAM | 28 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| Clock Frequency | 60 MHz |
| DMA Channels | 15 |
| CAN Modules | 2 x CAN 2.0B |
| USB Module | USB 2.0 full-speed device |
| Package Type | 100-TQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial, I suffix) |
| Timers | Multiple 16-bit general purpose timers (up to 9 per family datasheet) |
| RoHS Status | Compliant |
| Lifecycle Status | Active |
DSPIC33EP256MU810-I/PF 100-tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP256MU810-I/PF (100-tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256MU810-I/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256MU810-I/PF is suitable for 6 applications: Brushless DC / PMSM Motor Control, Digital Power Conversion (SMPS / PFC), USB-Connected Industrial Sensing Nodes, CAN Networked Gateways and Controllers, Test and Measurement Instrumentation, Automotive and Embedded Control Prototyping.
Brushless DC / PMSM Motor Control
The DSPIC33EP256MU810-I/PF fits field-oriented control (FOC) drives because its 60 MIPS 16-bit core executes single-cycle MAC instructions for Park/Clarke transforms, while the High-Speed PWM module generates complementary outputs with hardware dead-time insertion. In a typical three-phase inverter, ADC samples of phase currents are moved by the 15 DMA channels into the 28 KB SRAM without CPU loading, allowing current loops at 20-50 kHz with concurrent supervisor tasks. Running from a 3.3 V rail in the industrial -40C to +85C range, the 100-pin TQFP exposes sufficient I/O for gate enable, encoder, and fault feedback lines, making it a single-chip controller for servo, pump, and fan drives.
Recommended
Digital Power Conversion (SMPS / PFC)
Digital switch-mode power supplies and power-factor-correction stages benefit from the DSPIC33EP256MU810's deterministic DSP throughput and High-Speed PWM with per-cycle duty updates. The 60 MIPS core closes voltage and current loops at switching frequencies commonly above 100 kHz, while the DMA-driven ADC sampling keeps loop latency predictable - a key advantage over interrupt-only MCU designs. With 256 KB flash, compensation networks, soft-start ramps, and multiple operating profiles can be stored on-chip, and the 3.0 V to 3.6 V single-rail supply simplifies bias design. USB and dual CAN connectivity enable in-system configuration and telemetry for digitally managed power shelves and telecom rectifiers.
Recommended
USB-Connected Industrial Sensing Nodes
Because the DSPIC33EP256MU810 integrates a USB 2.0 full-speed device module on the same die as its DSP engine and 12-bit ADC resources, it is a strong fit for smart sensors that stream measurement data to a host PC or gateway without an external USB interface chip. The 15 DMA channels move ADC results directly into the 28 KB SRAM USB endpoint buffers, minimizing CPU overhead, while the 256 KB flash accommodates protocol stacks plus calibration tables. The industrial -40C to +85C rating and 3.0 V to 3.6 V supply match standard industrial backplane conditions, allowing one chip to perform conditioning math and communications in data acquisition and test fixtures.
Recommended
CAN Networked Gateways and Controllers
With two independent CAN 2.0B controllers, the DSPIC33EP256MU810-I/PF can bridge two CAN buses while running local control logic, making it suitable for building automation nodes, agricultural equipment controllers, and vehicle gateway prototyping. Each CAN module supports up to 1 Mbps operation with hardware message filtering, and the 60 MIPS DSP core handles routing, encryption, and signal processing between the buses. Combined with USB, the same part can act as a CAN-to-USB diagnostic gateway for service tools. The 100-pin TQFP offers enough I/O to drive keypads, displays, and discrete outputs, consolidating what traditionally required a MCU plus a CAN transceiver pair.
Recommended
Test and Measurement Instrumentation
Handheld and bench instruments require simultaneous math throughput and human-interface connectivity - exactly the mix the DSPIC33EP256MU810 delivers. The 60 MIPS core with DSP engine performs FFTs, RMS computation, and digital filtering on sampled waveforms, while DMA-fed ADC sampling provides low-jitter acquisition. The USB device module exports data to a PC application, and the 256 KB flash stores multiple instrument personalities and calibration constants. The industrial -40C to +85C range covers unconditioned field environments, and the single 3.3 V rail simplifies battery operation. The 100-pin TQFP pin count supports analog front ends, display interfaces, and encoder inputs on one controller.
Recommended
Automotive and Embedded Control Prototyping
Although the standard I-grade part targets industrial environments, the DSPIC33EP256MU810's dual CAN 2.0B modules and 60 MIPS DSP core make it a common prototyping controller for automotive-adjacent systems - body control functions, e-bike powertrains, and CAN-based accessory modules - before migration to qualified parts. The 3.0 V to 3.6 V supply tolerates regulated automotive 5 V rails via a 3.3 V LDO, and the 100-pin TQFP footprint matches the E-suffix variant (DSPIC33EP256MU810-E/PF) for extended temperature deployment without PCB respin. DMA resources keep CAN message servicing deterministic alongside PWM and ADC tasks typical of vehicle subsystem control.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256MU810-I/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256MU810-E/PF | DSPIC33EP256GM710T-I/PF | DSPIC33EP512MU810-I/PF | DSPIC33EP128MU810-I/PF |
|---|---|---|---|---|---|
| Package | 100-TQFP (14x14 mm) | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same | 100-TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| CAN Modules | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B | 2 x CAN 2.0B |
| Operating Temperature | -40C to +85C | Extended temperature range (E grade) | -40C to +85C | -40C to +85C | -40C to +85C |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
Key Differentiators
- USB plus dual CAN on one chip (vs DSPIC33EP256MC504-I/PT)
- Drop-in flash scaling within the same footprint (vs DSPIC33EP512MU810-I/PF)
- Temperature grade flexibility without respin (vs DSPIC33EP256MU810-E/PF)
Design Notes
Independent developer documentation (northernsoftware.com) reports that the dsPIC33EP256MU810 is more sensitive to cross-talk between the PGEC and PGED programming lines than other PIC devices. This can cause inability to connect or various verification failures during ICSP programming. Route PGEC/PGED as short as possible, keep them away from PWM and switching nets, and when first programming a new board, start with a reduced ICSP clock speed before raising it.
The device runs from a single 3.0 V to 3.6 V rail. Decouple each VDD/VSS pair with 0.1 uF ceramic capacitors placed within 2 mm of the pins, and add bulk capacitance (4.7 uF to 10 uF) near the package. USB full-speed operation requires the rail to stay within the USB-specified window; an LDO with better than 3% load regulation is recommended when USB is enabled. Estimated: with core and I/O activity at 60 MIPS, supply current stays in the tens of milliamp range, so thermal design is rarely the constraint for this DSC.
For motor control or digital power use, group the PWM output pins toward the gate-driver side of the board and star-ground the analog section so ADC reference ground noise stays below 1 LSB. Use the peripheral pin select (PPS) capability to route UART/SPI away from high dv/dt nets. Keep the crystal or internal-FRC configuration consistent with your clock budget; a 60 MIPS profile via PLL requires attention to PLL jitter-sensitive analog routing on the board.
Compliance Information
RoHS-compliant lead-free packaging per standard Microchip industrial product offering; lifecycle listed as ACTIVE (digchip). No AEC-Q100 qualification claimed for the I suffix - verify with Microchip for automotive use.
