DSPIC33EP512GP504-H/ML - 16-bit DSC 512KB Flash 60MIPS | Microchip
MPN: DSPIC33EP512GP504-H/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.9 | $6.90 |
| 10 | $6.21 | $62.10 |
| 100 | $5.52 | $552.00 |
| 500 | $4.97 | $2,485.00 |
| 1,000 | $4.48 | $4,480.00 |
DSPIC33EP512GP504-H/ML Overview
A digital signal controller combines the computational core of a 16-bit microcontroller with DSP-grade instruction support (single-cycle MAC, DSP multiply, hardware divide), making the dsPIC33EP family a bridge between general-purpose MCUs and dedicated DSPs in the embedded power-management hierarchy. Members of this family integrate high-speed PWM, analog comparators, op amps, CAN, and the Peripheral Trigger Generator (PTG) for autonomous operation.
Key features of this part include the 16-bit dsPIC33EP CPU core running at up to 60 MIPS, 512KB self-programmable Flash, 48KB on-chip RAM, and an advanced analog subsystem with op amps and comparators as documented by Microchip and distributor listings. The GP504 variant is the general-purpose (GP) derivative of the dsPIC33EPxxxGP50x family, targeted at designs needing both control flow and signal-processing throughput in a compact 44-pin footprint.
Architecturally, the dsPIC33EP core supports a modified Harvard pipeline, hardware loop constructs (DO and REPEAT), and interrupts with deterministic latency, while the peripheral ecosystem includes multiple UART, SPI, and I2C serial ports, input capture/output compare channels, and high-speed PWM modules suited to digital power conversion.
Typical applications include digital power supplies and LED drivers that exploit the high-speed PWM, motor control (BLDC/PMSM) drives using DSP math, and industrial control or CAN-networked sensor nodes that benefit from integrated analog and CAN 2.0B.
Design consideration: run the core from the internal PLL and budget the watchdog and low-dropout regulator settings carefully; the ML QFN thermal pad should be soldered to a ground pour for best thermal and noise performance.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512GP504-H/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP504-H/ML (same form factor and footprint) — differing in Package, Core, Operating Temperature, Program Memory (Flash), Core Architecture.
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DSPIC33EP512GP504-E/ML
✅ Drop-In✓ In Stock
$4.19 / Unit
View Datasheet →DSPIC33EP512GM304-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →DSPIC33EP256GP504-H/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →DSPIC33EP128GP504-H/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP504-H/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP504-H/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP512GP504-H/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EP 16-bit DSC |
| Max CPU Speed | 60 MIPS |
| Max Clock Frequency | 60 MHz |
| Program Memory Size | 512KB (170K x 24) Flash |
| RAM Size | 48KB |
| Package | 44-QFN (8x8 mm) |
| Integrated Op Amps | Yes |
| Comparators | Yes |
| CAN | Yes (CAN 2.0B) |
| High-Speed PWM | Yes |
| Peripheral Trigger Generator | Yes (PTG) |
| Mounting Type | Surface Mount |
| Status | In Production (recommended for automotive design per Microchip) |
| Data Sheet Publication | 2013-08-15 (per FindIC) |
DSPIC33EP512GP504-H/ML 44-qfn (8x8 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP512GP504-H/ML (44-qfn (8x8 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP504-H/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP504-H/ML is suitable for 6 applications: Digital Power Supplies, Brushless Motor Control (BLDC/PMSM), CAN-Networked Industrial Nodes, Digital Audio Signal Processing, Automotive Auxiliary Systems, Portable Instrumentation and Data Loggers.
Digital Power Supplies
The DSPIC33EP512GP504-H/ML fits digitally controlled AC-DC and DC-DC power supplies because its high-speed PWM module, integrated op amps, and comparators form a complete control loop on one chip, while the 60 MIPS 16-bit core executes compensator math with single-cycle MAC instructions. Typical use places the DSC between the voltage/current feedback dividers and the MOSFET gate driver: the on-chip op amps condition shunt signals, comparators provide cycle-by-cycle overcurrent limiting independent of software, and the PWM peripheral generates phase-shifted or complementary outputs. The PTG offloads repetitive sampling sequences from the CPU. A quantified benefit is deterministic loop timing: hardware-comparator current limiting reacts without interrupt latency, improving transient response versus purely software-controlled loops.
Recommended
Brushless Motor Control (BLDC/PMSM)
For BLDC and PMSM drives, the DSPIC33EP512GP504-H/ML provides the high-speed PWM outputs, fast analog comparators, and DSP math throughput that field-oriented control demands. In a typical topology, the 60 MIPS core runs the FOC current loop while six PWM channels drive a three-phase inverter through a gate driver; integrated op amps amplify shunt-resistor phase currents and comparators implement hardware overcurrent trip without CPU intervention. The 44-QFN (8x8 mm) footprint allows the controller to sit close to gate drivers, reducing PWM routing inductance and ringing. With 512KB Flash, sensorless algorithms such as sliding-mode observers plus startup routines fit comfortably alongside the main control firmware.
Recommended
CAN-Networked Industrial Nodes
Industrial automation nodes benefit from the DSPIC33EP512GP504-H/ML's integrated CAN 2.0B controller, which links the node to a CANopen or J1939 network without an external CAN controller. According to the FindIC specification summary, the part combines CAN, op amps, comparators, and PTG on a single 44-pin die, so a sensor front end (via the on-chip analog), local control logic, and network interface occupy one chip. The 512KB Flash accommodates protocol stacks plus application code, and 48KB RAM buffers message queues. Typical deployment: an I/O module sampling sensors at fixed rate via PTG-triggered ADC sequences, packaging data into CAN frames, and reacting to remote commands, all within deterministic interrupt budgets.
Recommended
Digital Audio Signal Processing
The DSP heritage of the dsPIC33EP core makes the DSPIC33EP512GP504-H/ML suitable for embedded audio processing such as equalization, mixing, and active crossover filters. Its 16-bit core executes single-cycle DSP multiply-accumulate operations, and the 60 MIPS clock provides roughly 30,000 MACs per instruction cycle budget per millisecond, ample for multi-band biquad filters at 48 kHz sampling. The 48KB RAM supports delay lines and filter coefficient tables, while 512KB Flash stores multiple preset configurations. In a typical design the DSC receives I2S-adjacent control data via SPI or UART, applies filtering, and manages volume/relay control, while the on-chip comparators supervise fault conditions such as clip detection.
Recommended
Automotive Auxiliary Systems
Microchip explicitly lists the dsPIC33EP512GP504 as 'Recommended for Automotive Design' on its product page, and the 44-QFN package with thermal pad suits under-hood and body-control module environments where board space is constrained. The on-chip CAN controller integrates with vehicle networks, the advanced analog subsystem (op amps, comparators) handles sensor conditioning for position, current, and temperature inputs, and the high-speed PWM drives actuators such as throttle bodies, lamp ballasts, and pump motors. Engineers should note that automotive qualification details must be confirmed with Microchip, and for the most demanding temperature profiles the pin-compatible DSPIC33EP512GP504-E/ML extended-temperature variant may be the safer ordering choice within the same footprint.
Recommended
Portable Instrumentation and Data Loggers
Battery-powered instruments use the DSPIC33EP512GP504-H/ML for its balance of processing throughput and manageable power: the 60 MIPS core finishes acquisition-and-compute tasks quickly so the device can spend more time in low-power idle modes. The PTG automates sensor scanning sequences without CPU wake-ups, the on-chip op amps buffer bridge or electrode signals reducing external component count, and 512KB Flash retains multiple calibration tables and logging firmware. A typical logger topology connects analog front ends to the op-amp inputs, uses PTG-triggered conversions, stores data to SPI flash or SD card, and reports over UART/USB bridge. The compact 44-QFN (8x8 mm) footprint suits handheld enclosure constraints.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP504-H/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP504-E/ML | DSPIC33EP512GM304-I/ML | DSPIC33EP256GP504-H/ML | DSPIC33EP128GP504-H/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512KB (170K x 24) | 512KB | 512KB | 256KB | 128KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Grade | -H suffix grade | -E extended grade | -I industrial grade | -H suffix grade | -H suffix grade |
| Analog Integration | Op amps + comparators + PTG | Op amps + comparators + PTG | GM family extended analog set | Op amps + comparators + PTG | Op amps + comparators + PTG |
Key Differentiators
- Full 512KB Flash at the GP504 memory tier (vs DSPIC33EP256GP504-H/ML)
- Extended-temperature drop-in availability (vs DSPIC33EP512GP504-E/ML)
- GM-family peripheral upgrade path on same footprint (vs DSPIC33EP512GM304-I/ML)
Design Notes
The 44-QFN (8x8 mm) package has an exposed thermal pad that is the primary ground connection. Design the PCB with a solid ground pour under the QFN and an array of thermal vias (typically 4x4 at 1 mm pitch) connecting to internal ground planes. Solder the pad fully - an unfilled pad void raises ground impedance and degrades analog performance of the on-chip op amps and ADC. Place 100 nF ceramic decoupling capacitors within 2 mm of every VDD pin pair, plus one bulk 4.7-10 uF capacitor near the supply entry.
Power the DSPIC33EP512GP504-H/ML from a clean 3.3V rail per Microchip's dsPIC33EP family power guidelines (Microchip Application Note on dsPIC33E power and clock design). The on-chip voltage regulator requires its external capacitor per the family datasheet; do not omit it or the core regulator may oscillate. Estimated: with core current on the order of tens of mA at 60 MIPS plus I/O loads, budget the 3.3V regulator for at least 150-200 mA headroom including CAN transceiver and gate-driver supply shares. Sequence MCLR with power-good signaling for deterministic boot.
dsPIC33EP peripherals use remappable RPn pins: a wrong PPS (Peripheral Pin Select) mapping silently disconnects UART/SPI/PWM pins, the most common bring-up failure. Verify PPS assignments in MPLAB X Code Configurator before routing. Second pitfall: configure unused I/O as outputs driving low or inputs with pull-downs to avoid floating-pin EMI. Third: the -H temperature suffix is not the -E extended grade - if your product enclosure exceeds the -H rating, switch to the pin-identical DSPIC33EP512GP504-E/ML rather than re-qualifying the board.
Compliance Information
Microchip product page states the dsPIC33EP512GP504 is 'Recommended for Automotive Design'; formal AEC-Q100 qualification not stated in provided data. Verify RoHS/REACH status on the Microchip ordering-information page.