DSPIC33EP256GP504-H/ML - 70 MIPS 16-bit DSC 44-QFN | Microchip
MPN: DSPIC33EP256GP504-H/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP256GP504-H/ML Overview
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral integration and control-oriented instruction set of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits above general-purpose MCUs for real-time control loops, and the dsPIC33E family is Microchip's flagship 16-bit DSC platform for precision motor control, digital power conversion, and embedded sensing.
Key features include the highest-speed 70 MIPS dsPIC33E core with DSP engine and excellent code density, high-speed PWM peripherals, integrated operational amplifiers (Op Amps), advanced analog modules including the Charge Time Measurement Unit (CTMU), and a Peripheral Trigger Generator (PTG) for autonomous peripheral coordination. The -H suffix denotes the automotive-qualified high-temperature grade within the AEC-Q100 qualified dsPIC33EP256GP504 variant family.
Architecturally, the device pairs a modified Harvard 16-bit core with an integrated DSP engine providing single-cycle MAC and 40-bit accumulators, plus extensive DMA support. On-chip peripherals reduce external component count in digital power and motor-control topologies where deterministic, cycle-accurate PWM timing is essential.
Typical applications include brushless DC and PMSM motor drives, digitally controlled switch-mode power supplies and lighting, automotive auxiliary control modules, and industrial sensing systems leveraging the CTMU and integrated op amps.
When designing, verify the exact operating temperature range of the -H grade against the manufacturer datasheet before finalizing thermal budget, and confirm the flash/RAM partitioning fits the control algorithm plus communication stacks.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP256GP504-H/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP256GP504-H/ML (same form factor and footprint) — differing in Package, Program Memory (Flash), Comparators, CTMU, Core Architecture.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP256GP504-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP504-E/ML
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →DSPIC33EP512GP504-E/ML
✅ Drop-In✓ In Stock
$4.19 / Unit
View Datasheet →DSPIC33EP128GP504-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP128GP504-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.28 / Unit
View Datasheet →DSPIC33EP256GP504-H/ML Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC core |
| Performance | 70 MIPS |
| Program Memory (Flash) | 256 KB |
| SRAM | 32 KB |
| Supply Voltage | 3.3 V |
| Package | 44-VQFN (8x8 mm) Exposed Pad |
| Pin Count | 44 |
| Mounting Type | Surface Mount |
| High-Speed PWM | Yes |
| Integrated Op Amps | Yes |
| Advanced Analog | Yes (incl. CTMU) |
| Peripheral Trigger Generator (PTG) | Yes |
| Qualification | Automotive, AEC-Q100 |
| Family | dsPIC 33EP Series |
| Lifecycle Status | In Production (per Microchip product page) |
DSPIC33EP256GP504-H/ML 44-vqfn (8x8 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP256GP504-H/ML (44-vqfn (8x8 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP256GP504-H/ML.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP256GP504-H/ML is suitable for 6 applications: Brushless DC / PMSM Motor Control, Digitally Controlled Power Supplies, Automotive Auxiliary Control Modules, Industrial Sensing and Condition Monitoring, Embedded DSP Signal Processing, High-Intensity LED and Lighting Control.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GP504-H/ML fits sensorless and sensored BLDC/PMSM drives because its 70 MIPS core sustains field-oriented control (FOC) loop rates while the high-speed PWM module produces complementary outputs with hardware dead time. The integrated op amps condition current-shunt signals directly, and the Peripheral Trigger Generator (PTG) chains ADC sampling to PWM events autonomously, cutting CPU interrupt load. In a typical 48 V servo drive, the DSC runs the current loop at 20-50 kHz entirely in hardware-coordinated stages, leaving headroom for the position observer and CAN communication. The 256 KB flash accommodates the FOC engine plus communication and safety stacks without external memory, and the automotive AEC-Q100 -H grade suits vehicle auxiliary motor modules.
Recommended
Digitally Controlled Power Supplies
For digital SMPS, LLC, and PFC stages, the DSPIC33EP256GP504-H/ML provides the cycle-accurate high-speed PWM and fast 70 MIPS control loop needed for voltage-mode or current-mode regulation at switching frequencies above 100 kHz. The advanced analog block and DMA let the ADC stream output-voltage and current samples without CPU intervention, while the PTG triggers conversions synchronized to PWM edges for clean averaged sampling. The 3.3 V core with 32 KB SRAM handles compensator state plus PMBus-style communication. Using the -H grade adds automotive qualification for onboard charger and DC-DC auxiliary modules, and the 44-QFN exposed-pad package conducts heat into the power-stage ground plane.
Recommended
Automotive Auxiliary Control Modules
The -H grade of the dsPIC33EP256GP504 is automotive AEC-Q100 qualified, targeting modules such as pump controllers, actuators, lighting ballasts, and blower drives. The high-speed PWM drives half-bridge stages, integrated op amps amplify shunt currents for over-current protection, and the CTMU supports capacitive touch or time-based sensing for human-machine interfaces on the same die. The 70 MIPS core leaves margin for diagnostic routines required in automotive software architectures, and 256 KB flash holds the application plus boot loader for field reprogramming over CAN or LIN. The 44-QFN (8x8 mm) exposed pad aids thermal management in sealed modules with limited airflow.
Recommended
Industrial Sensing and Condition Monitoring
The CTMU (Charge Time Measurement Unit) plus integrated op amps make the DSPIC33EP256GP504-H/ML effective for capacitive, resistive, and time-of-flight sensing in industrial condition-monitoring nodes. The 70 MIPS DSP engine executes FFT-based vibration analysis locally, so the node can transmit alarm states instead of raw waveforms, reducing bus traffic. The PTG automates repetitive sensor-scan sequences with microsecond determinism, and 32 KB SRAM buffers multiple acquisition channels. Operating from a single 3.3 V rail simplifies isolated sensor power design, and the automotive-qualified -H grade extends deployment reliability to high-temperature enclosures near motors and drives.
Recommended
Embedded DSP Signal Processing
As a true digital signal controller, the DSPIC33EP256GP504-H/ML executes single-cycle MAC and DSP instructions with 40-bit accumulators at 70 MIPS, delivering roughly 70 million MACs per second for filtering, transform, and demodulation workloads. Applications include acoustic analysis, power-line communication modems, and ultrasonic processing, where the 256 KB flash holds coefficient tables and the 32 KB SRAM sustains double-buffered sample streams via DMA. Compared with a separate DSP-plus-MCU two-chip solution, the single-die integration reduces BOM count, board area, and inter-chip latency, which tightens control-loop phase margin in feedback applications such as active noise cancellation.
Recommended
High-Intensity LED and Lighting Control
Digital LED drivers benefit from the high-speed PWM resolution of the DSPIC33EP256GP504-H/ML: the PWM module generates phase-shifted or interleaved channels for multi-string drivers, while the fast ADC loop regulates current per string and the op amps sense shunt voltages without external amplifiers. The 70 MIPS core implements dimming curves, DALI/DMX protocol stacks, and thermal fold-back protection in the same controller. For street-lighting and horticultural fixtures where ambient temperatures approach +125C, the automotive -H grade provides qualification headroom, and the 44-QFN exposed-pad package simplifies thermal coupling to the driver PCB copper pour.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP256GP504-H/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP256GP504-I/ML | DSPIC33EP256GP504-E/ML | DSPIC33EP512GP504-E/ML | DSPIC33EP128GP504-I/ML |
|---|---|---|---|---|---|
| Package | 44-VQFN (8x8 mm) Exposed Pad | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same | 44-QFN (8x8) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Program Memory | 256 KB | 256 KB | 256 KB | 512 KB | 128 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Automotive AEC-Q100 Qualification | Yes (-H grade) | No (industrial grade) | No (extended industrial) | No (extended industrial) | No (industrial grade) |
| High-Speed PWM / Op Amps / CTMU | Yes / Yes / Yes | Yes / Yes / Yes | Yes / Yes / Yes | Yes / Yes / Yes | Yes / Yes / Yes |
Key Differentiators
- Automotive AEC-Q100 high-temperature grade (vs DSPIC33EP256GP504-I/ML)
- Double the program memory of the 128GP504 sibling (vs DSPIC33EP128GP504-I/ML)
- Cost-optimized within the family (vs DSPIC33EP512GP504-E/ML)
Design Notes
The 44-QFN (8x8 mm) exposed pad is the primary thermal and ground path. Connect the exposed pad to a solid ground plane with an array of thermal vias (typically 5x5, 0.3 mm drill, filled or tented per assembly house capability). Insufficient exposed-pad solder coverage raises junction temperature in motor-control loads; verify via X-ray or cross-section sampling on first builds. Decouple each VDD pin with 0.1 uF ceramic placed within 2 mm of the pin, plus one bulk 10 uF per power domain.
The device operates from a single 3.3 V supply; in automotive and digital-power systems, feed it from a wide-input buck (for example from 12 V or 24 V rails) with local LC filtering. Sequencing requirements are relaxed for dsPIC33E, but keep the AVDD pin on its own filtered supply (ferrite bead plus 1 uF plus 0.1 uF) to preserve ADC and op amp accuracy. Estimated: at 70 MIPS the core draws tens of mA; verify exact current from the family datasheet electrical characteristics rather than estimating for the thermal budget.
Confirm the temperature-grade suffix before placement: -H, -I, and -E parts share the same 44-QFN footprint but differ in qualified ambient range and qualification level; mixing grades on one panel or substituting -I for -H in an automotive program violates qualification intent. Also note the dsPIC33E 24-bit instruction word organization: flash capacity expressed in KB refers to program memory bytes, while some listings show instruction-word counts, which can cause apparent memory-size confusion in BOM reviews.
Compliance Information
Automotive AEC-Q100 qualification per distributor listings (Hotenda) for the DSPIC33EP256GP504 family -H grade. RoHS/REACH/lead-free status not stated in the provided data; confirm on the Microchip product page.
