DSPIC33EP512GP504-H/PT - 16-Bit 60 MIPS DSC, 512KB Flash | Microchip
MPN: DSPIC33EP512GP504-H/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.2 | $7.20 |
| 10 | $6.55 | $65.50 |
| 100 | $5.9 | $590.00 |
| 500 | $5.35 | $2,675.00 |
| 1,000 | $4.85 | $4,850.00 |
DSPIC33EP512GP504-H/PT Overview
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs: it executes multiply-accumulate (MAC) and DSP instructions at high clock rates while retaining an intuitive C-programmable peripheral ecosystem, making it the preferred choice for closed-loop control and precision signal processing in a single IC.
Key features of the dsPIC33EP512GP504 include the dsPIC33E core operating at up to 60 MIPS, 512KB of self-programmable Flash with ECC, 48KB of on-chip SRAM, multiple UART, SPI and I2C communication modules, a high-speed PWM module suited for power conversion, integrated operational amplifiers and comparators for embedded analog signal conditioning, and a CTMU (Charge Time Measurement Unit). The family also supports the Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, reducing CPU overhead in real-time control loops.
Architecturally, the device is based on the 16-bit modified Harvard dsPIC33E core with a 24-bit instruction word, a hardware DSP engine with dual 40-bit accumulators, and single-cycle MAC operation. The high Flash density (512KB) accommodates complex control algorithms, fieldbus stacks, and bootloader code without external memory. The '-H' suffix denotes a high-temperature grade variant in the TQFP-44 (PT) package, and the '/PT' suffix indicates tape-and-reel packaging.
Typical applications include digital power supplies and PFC stages, motor control (BLDC, PMSM, ACIM) drives, uninterruptible power supplies, solar inverters, lighting ballasts, and industrial sensing systems that benefit from the on-chip op amps and high-speed PWM.
When designing with this DSC, decouple all VDD/VSS pairs, connect PGECx/PGEDx pairs consistently for ICSP programming and debugging, and verify the operating temperature rating of the -H grade against your thermal environment before finalizing the PCB stackup.
This page synthesizes distributor pricing, drop-in same-family alternatives, design notes, and intent-targeted FAQs not consolidated in the manufacturer datasheet, giving engineers a single citation-ready reference for the DSPIC33EP512GP504-H/PT.
Drop-in alternatives for DSPIC33EP512GP504-H/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512GP504-H/PT (same form factor and footprint) — differing in Core Architecture, Operating Temperature, Package, Analog Peripherals, Communication Interfaces.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512GP504-I/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP256GP504-I/PT
✅ Drop-In✓ In Stock
$3.68 / Unit
View Datasheet →DSPIC33EP32GP504T-I/PT
✅ Drop-In✓ In Stock
$2.15 / Unit
View Datasheet →DSPIC33EP256MC504-I/PT
✅ Drop-In✓ In Stock
$4.6 / Unit
View Datasheet →DSPIC33EP512GP504-E/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$5.48 / Unit
View Datasheet →DSPIC33EP512GM304-H/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$7.1 / Unit
View Datasheet →DSPIC33EP512GP504-H/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 48 KB |
| Supply Voltage | 3.3 V |
| Package | 44-TQFP (10x10 mm) |
| Package Code | PT |
| Terminal Pitch | 0.8 mm |
| JESD-30 Code | S-PQFP-G44 |
| Mounting Type | Surface Mount |
| Communication Interfaces | UART, SPI, I2C |
| Analog Peripherals | Op Amps, Comparators, CTMU |
| PWM Module | High-Speed PWM |
| Programming Interface | ICSP via PGECx/PGEDx pairs |
| Status | In Production |
DSPIC33EP512GP504-H/PT pt Pin Configuration Guide
Pin configuration for DSPIC33EP512GP504-H/PT (pt package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512GP504-H/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512GP504-H/PT is suitable for 6 applications: Digital Power Supplies and PFC, BLDC and PMSM Motor Control, Solar Inverters and MPPT Controllers, Uninterruptible Power Supplies, Industrial Sensing and Instrumentation, Lighting Ballasts and LED Drivers.
Digital Power Supplies and PFC
The DSPIC33EP512GP504-H/PT fits digitally controlled AC-DC power supplies and power factor correction stages because its high-speed PWM module provides the fine duty-cycle resolution and complementary outputs needed for interleaved boost and LLC topologies, while the 60 MIPS dsPIC33E core closes voltage and current loops at switching frequency. On-chip comparators enable fast cycle-by-cycle overcurrent protection without CPU latency, and the integrated op amps condition current-shunt signals externally, reducing BOM cost. Placed as the supervisory controller between the sensing front end and gate drivers, it executes MPPT or constant-voltage loops in software; the trade-off versus a dedicated analog controller is firmware development effort in exchange for programmable compensation and field-updatable control law.
Recommended
BLDC and PMSM Motor Control
The DSPIC33EP512GP504-H/PT is well suited to brushless DC and permanent-magnet synchronous motor drives: the dsPIC33E core executes field-oriented control math with single-cycle MAC and dual 40-bit accumulators at up to 60 MIPS, while the high-speed PWM generates the three-phase complementary drive with dead-time control. Integrated comparators support hardware-based overcurrent trip, and the on-chip op amps amplify shunt-resistor phase currents. In a typical drive, the DSC samples phase currents via its ADC, runs the FOC loop, and drives gate drivers at the PWM output pins; the 512KB Flash leaves room for communication stacks and fieldbus protocols. The trade-off is higher cost than a smaller MC-series part if the algorithm footprint is small.
Recommended
Solar Inverters and MPPT Controllers
Grid-tie solar micro-inverters and MPPT controllers benefit from the DSPIC33EP512GP504-H/PT's combination of high-resolution PWM, fast analog comparators, and 60 MIPS DSP throughput. The controller tracks the PV panel maximum power point while simultaneously regulating the grid-current waveform, tasks the dual-accumulator DSP engine handles in real time. The 512KB Flash accommodates grid-compliance firmware, anti-islanding logic, and powerline or UART communication stacks without external memory, and the CTMU supports precision panel-voltage sensing. As the central controller between the DC-DC boost stage and the grid-bridge inverter, it replaces multiple analog control ICs; the design consideration is ensuring firmware coverage of all grid-code scenarios before certification.
Recommended
Uninterruptible Power Supplies
Online double-conversion UPS systems use the DSPIC33EP512GP504-H/PT to control the rectifier, battery converter, and inverter stages from one 60 MIPS controller. Its high-speed PWM outputs drive the phase legs, comparators provide hardware overcurrent protection during transfer events, and the on-chip op amps condition battery-current and bus-voltage feedback. The 512KB Flash holds the full state machine including transfer logic, battery-charging profiles, and communication interfaces (UART/SPI/I2C) to front panels and network cards, while 48KB RAM buffers event logs. The key benefit versus analog control is software-defined transfer timing and diagnostic reporting; the consideration is that all three converter loops share one CPU, so interrupt budgeting must be verified early.
Recommended
Industrial Sensing and Instrumentation
The DSPIC33EP512GP504-H/PT integrates op amps, comparators, and the CTMU charge-time measurement unit, making it a compact front-end controller for industrial sensors and instrumentation. The on-chip op amps buffer and amplify low-level signals from pressure, flow, or current sensors, the CTMU measures capacitive or time-of-flight quantities, and the 12-bit-class ADC family design digitizes results for DSP filtering at 60 MIPS. UART, SPI, and I2C ports stream data to HMI displays or industrial networks, while 512KB Flash supports calibration tables and multi-protocol firmware. In a typical build the DSC replaces a discrete amplifier-plus-MCU chain, cutting component count; the design consideration is characterizing the integrated analog performance against precision external amplifiers for highest-accuracy channels.
Recommended
Lighting Ballasts and LED Drivers
Digital HID ballasts and high-power LED drivers leverage the DSPIC33EP512GP504-H/PT's high-speed PWM for resonant half-bridge and buck-boost stage control, with fine frequency and duty resolution supporting lamp ignition sequences and dimming curves. The comparators implement fast lamp-overcurrent and open-circuit protection in hardware, and the DSP core runs adaptive control that extends lamp life or enables flicker-free dimming from 0 to 100 percent. Communication interfaces accept DALI or 0-10V interface firmware in the 512KB Flash alongside control code. As the single controller behind the gate-drive stage, it consolidates ignition, regulation, and fault handling; the trade-off against smaller dsPIC parts is unused memory headroom in simple fixed-output fixtures.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512GP504-H/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512GP504-I/PT | DSPIC33EP256GP504-I/PT | DSPIC33EP32GP504T-I/PT | DSPIC33EP256MC504-I/PT |
|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) PT | 44-TQFP (10x10 mm) PT - same | 44-TQFP (10x10 mm) PT - same | 44-TQFP (10x10 mm) PT - same | 44-TQFP (10x10 mm) PT - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB (170K x 24) | 512 KB | 256 KB | 32 KB | 256 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Peripheral Family | GP (general purpose, op amps + high-speed PWM) | GP - identical | GP - identical peripheral set | GP - identical peripheral set | MC - motor-control-oriented PWM |
| Drop-in Compatibility | Reference part | Pin-to-pin, different temp grade | Pin-to-pin, reduced Flash | Pin-to-pin, reduced Flash | Pin-to-pin, MC peripherals |
Key Differentiators
- Maximum memory in the same footprint (vs DSPIC33EP256GP504-I/PT)
- High-temperature grade availability (vs DSPIC33EP512GP504-I/PT)
- Integrated analog reduces BOM (vs DSPIC33EP32GP504T-I/PT)
Design Notes
ICSP programming and debugging use PGECx/PGEDx pin pairs, and per Microchip's dsPIC33EP512GP504 support documentation any pair works only if used as a matched pair - for example PGEC2 must be paired with PGED2 for ICSPCLK/ICSPDAT. Route at least one PGEC/PGED pair to a standard programming header, and keep that pair free of heavy capacitive loading. Additionally, all VDD and VSS pins must be connected during programming and debugging, not just the pairs near the header.
The dsPIC33EP512GP504 operates from a 3.3V supply with multiple VDD/VSS pairs in the 44-TQFP package. Decouple each VDD pin with a 100 nF ceramic capacitor placed within a few millimeters of the pin, and add one bulk 10 uF capacitor per power domain. On integrated-op-amp and ADC supply rails, ferrite-bead isolation from the digital rail measurably reduces switching-noise coupling into analog readings. Estimated: at 60 MIPS, core current is on the order of tens of milliamps - size the 3.3V regulator accordingly with margin for I/O loads.
The 10x10 mm 44-TQFP with 0.8 mm terminal pitch is hand-solderable, but for reflow assembly specify a standard QFP land pattern per the package outline drawing in the Microchip family datasheet. Keep the high-speed PWM traces to gate drivers short and, for multi-phase converters, length-match phase outputs. Place analog sensing traces (op-amp inputs, CTMU pins) away from PWM and clock lines, and use a solid ground plane under the DSC to control return paths. The 10x10 body has a thermal pad-less design, so heat exits through the pins - pour copper on all VSS leads.
Before committing to the -H suffix variant, verify the operating temperature range requirement of your end product: -H is the high-temperature grade while -I covers extended industrial range and -E the widest range; all share the same 44-TQFP PT footprint, so the grade can be selected late in design. Estimated: a DSC dissipating on the order of 100-200 mV-scale tens of milliamps at 3.3 V (well under 1 W) needs no heatsink, but confirm the exact thermal resistance figure from the family datasheet before use in sealed enclosures.
Compliance Information
Recommended for automotive design per Microchip product page (device-level). RoHS/lead-free status reflects Microchip standard commercial TQFP production; explicit REACH and halogen-free declarations were not present in the retrieved data.
