DSPIC33EP16GS504-I/PT - 16-Bit 70 MIPS Digital Power DSC | Microchip
MPN: DSPIC33EP16GS504-I/PT β Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
DSPIC33EP16GS504-I/PT Overview
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, the DSC sits above general-purpose MCUs and below dedicated DSPs: it executes control-loop mathematics fast enough to close current and voltage feedback loops inside a single switching period of a switch-mode power converter.
The GS504 variant belongs to Microchip's dsPIC33EP16GS504 family purpose-built for digital power. Its interconnected high-speed PWM peripheral, on-chip analog comparators, and ADC with programmable gain amplifier (PGA) allow PWM duty-cycle updates to be triggered directly by analog events with minimal CPU latency - a key enabler for peak-current-mode and multi-phase topologies.
The device executes a modified Harvard architecture with DSP instructions (MAC, barrel shifter), 2048 words of RAM, and a 24-bit program memory word. Communication includes I2C, SPI, and UART, with 35 general-purpose I/O. ICSP programming/debugging is supported through any paired PGECx/PGEDx pin pair, and the family carries Functional Safety (FuSa) support documentation per DigiKey listings.
Typical applications include interleaved power factor correction (Microchip's 350W Interleaved PFC reference design uses this family), digitally controlled AC-DC and DC-DC converters, solar micro-inverters, battery chargers, and LED drivers.
Design consideration: all VDD/VSS pairs must be connected and decoupled, and the PGEC/PGED pair used for ICSP must be kept matched - mixing PGEC2 with PGED1 is a common bring-up failure.
This page adds value beyond the datasheet by consolidating distributor inventory signals, same-footprint family alternatives, and practical design notes in one citation-ready reference.
Drop-in alternatives for DSPIC33EP16GS504-I/PT β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
DSPIC33EP16GS504-E/PT
β Drop-Inπ Reference alternative (not in catalog)
DSPIC33EP32GS504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP64GS504-I/PT
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
DSPIC33EP16GS504-I/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP modified Harvard, CMOS |
| Maximum Instruction Speed | 70 MIPS |
| Flash Program Memory | 16 KB (16K x 8) |
| Program Memory Width | 24-bit |
| SRAM | 2048 words |
| Supply Voltage (Max) | 3.6 V |
| Supply Voltage (Nominal) | 3.3 V |
| Package | 44-TQFP (10x10 mm) |
| Operating Temperature | -40C to +85C |
| GPIO Count | 35 I/O |
| Communication Interfaces | I2C, SPI, UART |
| PWM | Interconnected high-speed PWM (digital power optimized) |
| Analog Peripherals | ADC with PGA, high-speed comparators |
| DSP Features | MAC instruction, barrel shifter, boundary scan |
| Debug/Programming | ICSP via paired PGECx/PGEDx pins |
| Functional Safety Support | Yes (FuSa per DigiKey classification) |
| Mounting Type | Surface Mount |
| Low Power Modes | Supported |
DSPIC33EP16GS504-I/PT 44-tqfp (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP16GS504-I/PT (44-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP16GS504-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP16GS504-I/PT is suitable for 6 applications: Interleaved Power Factor Correction (PFC), Digitally Controlled DC-DC Converters, Solar Micro-Inverters, Battery Chargers and Battery Management, LED Drivers and Lighting Power, Industrial Motor Control and Power Subsystems.
Interleaved Power Factor Correction (PFC)
Microchip's own 350W Interleaved PFC reference design demonstrates the dsPIC33EP16GS504 family controlling a two-phase boost PFC from a universal AC input to a single high-voltage DC output. The DSPIC33EP16GS504-I/PT fits this role because its interconnected high-speed PWM generates phase-shifted PWM streams for interleaved legs, while the ADC with PGA samples inductor current and bus voltage each switching cycle at 70 MIPS core throughput. The on-chip comparators provide cycle-by-cycle overcurrent protection without CPU intervention, a requirement for PFC reliability. Placed in the control stage between the sensing dividers and gate drivers, the DSC executes average-current-mode compensation digitally, eliminating analog error-amp drift and enabling adaptive gain over the universal input range. The trade-off versus an analog PFC controller is firmware development effort, repaid by field-upgradable control tuning.
Recommended
Digitally Controlled DC-DC Converters
For buck, boost, and half-bridge DC-DC stages, the DSPIC33EP16GS504-I/PT closes voltage and current loops digitally inside each switching period. Its 70 MIPS 16-bit DSP core with MAC instructions computes PID or 2p2z compensators in a few microseconds, while the high-speed PWM supports duty-cycle updates with sub-nanosecond-resolution trigger timing relative to ADC sampling. The PGA front-end scales low-level shunt signals on-chip, removing external instrumentation amplifiers and their offset errors. Typical deployment places the DSC between a resistor/current-shunt sense network and MOSFET gate drivers, with the comparators handling fast overcurrent shutdown. Compared with fixed-frequency analog PWM controllers, the digital approach enables soft-start profiling, phase management, and PMBus-style telemetry in firmware; the cost is attention to ADC noise and PWM update jitter in layout, which the datasheet's digital-power layout guidance addresses.
Recommended
Solar Micro-Inverters
Micro-inverters combine an MPPT-controlled DC-DC input stage with a grid-synchronized DC-AC output stage - exactly the dual-loop control workload the DSPIC33EP16GS504-I/PT was architected for. At 70 MIPS with hardware MAC, one device can execute MPPT sampling plus grid current shaping at typical 20-100 kHz switching frequencies, while the interconnected PWM drives multiple gate-driver channels for interleaved and full-bridge stages. The ADC with PGA conditions panel current/voltage sense signals, and comparators implement hardware overcurrent protection required by grid-tie safety practice. Firmware-implemented anti-islanding and per-panel MPPT tuning are updateable in the field, an advantage over hardwired analog solutions. Design attention should go to isolation barriers and to ensuring the 3.3V controller supply is generated cleanly from the high-voltage DC bus through an isolated auxiliary supply.
Recommended
Battery Chargers and Battery Management
Multi-chemistry chargers demand sequenced constant-current/constant-voltage profiling, accurate current sensing, and safety cutoffs - all naturally mapped onto the DSPIC33EP16GS504-I/PT. The 16KB Flash accommodates full CC/CV state machines with temperature-derating tables; the PGA-equipped ADC reads current shunts and pack voltage with on-chip gain; and the high-speed PWM drives the charging power stage at 100 kHz-class frequencies with deterministic loop timing. The 35 GPIO and I2C/SPI/UART ports support fuel-gauge communication, display interfaces, and charger-to-host messaging. Hardware comparators provide independent overcurrent and overvoltage trip points that remain active regardless of firmware state, supporting safe-failure design practice. Relative to an application MCU plus analog charger IC, this single-DSC approach reduces BOM count; the trade-off is that firmware must carry the safety certification burden, which the family's Functional Safety (FuSa) support package helps address.
Recommended
LED Drivers and Lighting Power
High-brightness and tunable LED systems need precisely dimmed, flicker-free constant-current drive, which the DSPIC33EP16GS504-I/PT delivers through its high-speed PWM and DSP-rate control loops. The DSC regulates LED current by adjusting buck or boost stage duty cycle each cycle using ADC-with-PGA current feedback, while secondary PWM channels implement independent dimming (PWM or analog dimming via averaged current references). At 70 MIPS, one controller can manage multi-channel RGBW fixtures with color mixing algorithms alongside power conversion. The 35 GPIO support presence detection, DALI/UART communication, and thermal-derating sensors. Hardware comparators protect against open-LED and short-circuit faults cycle-by-cycle. Against dedicated analog LED driver ICs, the digital approach adds programmable dimming curves and communication-based control; designers must ensure PWM dimming resolution is adequate at low brightness to avoid visible quantization.
Recommended
Industrial Motor Control and Power Subsystems
The DSPIC33EP16GS504-I/PT also serves auxiliary digital-power roles in industrial drives: auxiliary switched-mode supplies, PFC front-ends, and power-factor monitoring within larger motor-drive cabinets. The 70 MIPS DSP core runs both power-conversion loops and housekeeping tasks (current and voltage metering, temperature supervision via its analog peripherals, and UART/SPI reporting to the main drive controller). Its -40C to +85C industrial rating and Functional Safety support documentation suit factory automation environments. The high-speed PWM can drive small auxiliary converters or blower supplies, while the comparators protect against rail faults without firmware latency. In this role it typically pairs with a dedicated motor-control DSC handling the inverter stage; the split keeps control firmware simple and certified separately. Watch connector wiring of all VDD/VSS pairs on the 44-TQFP during panel assembly, as unconnected supply pins are a common field failure cause.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP16GS504-I/PT β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP16GS504-E/PT | DSPIC33EP32GS504-I/PT | DSPIC33EP64GS504-I/PT |
|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 16 KB | 16 KB | 32 KB | 64 KB |
| Core Speed | 70 MIPS (16-bit) | 70 MIPS (16-bit) | 70 MIPS (16-bit) | 70 MIPS (16-bit) |
| Operating Temperature | -40C to +85C | -40C to +125C (extended) | -40C to +85C | -40C to +85C |
| High-Speed PWM / Digital Power Peripherals | Yes (interconnected PWM, ADC+PGA, comparators) | Yes - identical peripheral set | Yes - identical peripheral set | Yes - identical peripheral set |
| Key Selection Factor | Lowest-cost 16KB option, industrial temp | Same memory, extended +125C temp | Headroom for larger firmware, same footprint | Maximum Flash in same footprint |
| Pin Compatibility | 44-pin, pin-to-pin across GS504 family | Pin-to-pin identical | Pin-to-pin identical | Pin-to-pin identical |
Key Differentiators
- Purpose-built digital power peripheral set (vs DSPIC33EP32GS504-I/PT)
- Extended temperature option without respin (vs DSPIC33EP16GS504-E/PT)
- Functional Safety (FuSa) support classification (vs Generic MCUs of similar speed)
Design Notes
Connect every VDD and VSS pair on the 44-TQFP - leaving a power pair unconnected is a documented bring-up failure mode for the dsPIC33EP GS family. Place a 100 nF ceramic decoupling capacitor at each VDD/VSS pair within 2-3 mm of the pins, plus one bulk 4.7-10 uF capacitor per supply domain. Microchip's ICSP guidance (northernsoftware.com support summary) confirms multiple PGECx/PGEDx pairs exist; route the programmer connector to one complete pair and keep it matched - ICSPCLK on PGEC2 with ICSPDAT on PGED1 will not program.
The DSPIC33EP16GS504-I/PT operates from a nominal 3.3V rail with a 3.6V absolute maximum. In power-conversion systems deriving control power from 5V, 12V, or high-voltage DC buses, regulate down with an LDO or small buck and verify the 3.3V rail stays within tolerance during converter transients - supply excursions above 3.6V can permanently damage the DSC. For digital power layouts, keep the analog supply clean: sense-divider and PGA input routing should stay away from gate-driver switching loops to preserve ADC accuracy.
Two frequent pitfalls when migrating within the GS504 family: first, recompile/retarget the device selection when swapping the 16KB part for 32KB/64KB variants - linker memory maps differ even though the pinout is identical. Second, do not assume the -I grade part survives +125C ambient; the -E suffix (DSPIC33EP16GS504-E/PT) is required for extended temperature, so confirm thermal estimates before finalizing the BOM. Boundary-scan and barrel-shifter features are shared across the family, so debug tooling carries over unchanged.
Compliance Information
Compliance data was not present in the retrieved web data; confirm RoHS/REACH status on the official Microchip product page or distributor compliance sheets before procurement.
