DSPIC33EP64MC204-I/MV - 70 MIPS 16-Bit DSC 64KB | Microchip
MPN: DSPIC33EP64MC204-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.88 | $48.80 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.55 | $3,550.00 |
DSPIC33EP64MC204-I/MV Overview
A digital signal controller combines the deterministic control structure of a microcontroller with the mathematical throughput of a DSP engine. In the power-management hierarchy, the dsPIC33EP64MC204 sits in Microchip's dsPIC33E family of digital signal controllers, which occupies the space between general-purpose 16-bit MCUs and standalone DSPs. DSCs are the de-facto controllers for digitally controlled power conversion and precision motor control, where a fast multiply-accumulate (MAC) engine and high-resolution PWM must run in the same closed loop as the control firmware.
Key features include a 70 MIPS dsPIC DSC core with integrated DSP instruction support, dual role modules such as the MCPWM (motor control PWM) peripheral for complementary and independent PWM outputs, and QEI (Quadrature Encoder Interface) inputs for direct encoder feedback from servo motors. The device operates from a 3.0V to 3.6V supply using CMOS technology and is AEC-Q100 qualified, per distributor data, making it suitable for automotive-adjacent designs.
Architecturally, the dsPIC33EP core pairs a 16-bit RISC pipeline with a dedicated DSP multiply-accumulate unit and extensive on-chip peripherals, enabling single-cycle MAC operations that offload control-loop mathematics from the main program flow. The exposed-pad UQFN package improves heat extraction and signal integrity at high clock rates.
Typical applications include brushless DC (BLDC) and PMSM motor drives, digitally controlled switching power supplies and inverters, and servo/stepper positioning systems where QEI feedback closes the motion loop.
A key design consideration is power supply decoupling: each VDD/VSS pair should have a low-ESR 0.1uF capacitor, and the exposed pad must be soldered to a grounded PCB pour for both thermal and electrical performance.
This page synthesizes distributor inventory and pricing signals, drop-in family alternatives, and design guidance not consolidated on the manufacturer datasheet alone.
Drop-in alternatives for DSPIC33EP64MC204-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64MC204-I/MV (same form factor and footprint) — differing in Operating Temperature, Package, Core, Programming Interface, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64MC204-H/MV
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP128MC204-I/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP256MC204-I/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32MC204-I/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP64MC204-E/MV
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP64GP504-E/MV
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$2.85 / Unit
View Datasheet →DSPIC33EP64MC204-I/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC DSC (RISC + DSP engine) |
| Core Speed | 70 MIPS |
| Program Memory (FLASH) | 64KB (22K x 24) |
| RAM | 8KB (8192 words) |
| Supply Voltage | 3.0 V to 3.6 V |
| Motor Control PWM (MCPWM) | Yes |
| Quadrature Encoder Interface (QEI) | Yes |
| Package | 48-UQFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (I grade) |
| Qualification | AEC-Q100 (automotive) |
| Technology | CMOS |
| Product Family | dsPIC33EP (dsPIC 33EP series) |
| Packaging | Tube |
DSPIC33EP64MC204-I/MV 48-uqfn (6x6 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64MC204-I/MV (48-uqfn (6x6 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64MC204-I/MV.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64MC204-I/MV is suitable for 6 applications: BLDC / PMSM Motor Drives, Digitally Controlled Power Supplies, Servo and Stepper Motion Control, Industrial Automation and Embedded Control, Automotive-Adjacent Subsystems, Battery-Powered and Portable Digital Power.
BLDC / PMSM Motor Drives
The DSPIC33EP64MC204-I/MV is purpose-built for brushless DC and permanent-magnet synchronous motor control: its 70 MIPS dsPIC DSC core executes field-oriented control (FOC) loops with DSP multiply-accumulate throughput, while the MCPWM peripheral generates complementary PWM outputs with dead-time control for three-phase inverters. The QEI quadrature encoder interface closes the position/speed loop directly from encoder feedback. In a typical topology, the DSC reads phase currents via its ADC, computes the control algorithm, and updates PWM duty cycles every PWM period for responsive torque control. The AEC-Q100 qualification noted in distributor data also supports automotive-adjacent motor subsystems.
Recommended
Digitally Controlled Power Supplies
In digitally controlled switching power supplies, PFC stages, and DC-DC converters, the 70 MIPS core provides the loop bandwidth needed for voltage-mode and current-mode control executed in firmware. The MCPWM module can produce phase-shifted or complementary PWM signals for half-bridge, full-bridge, and LLC topologies, and the DSP engine performs fast multiply-accumulate operations for digital compensators (PID, 2p2z). Placed at the center of the control loop, the DSC replaces analog compensator networks with firmware, enabling programmable transient response and telemetry. The 3.0V-3.6V supply integrates cleanly into a 3.3V bias rail, and the exposed-pad UQFN package manages switching-environment thermal load.
Recommended
Servo and Stepper Motion Control
The DSPIC33EP64MC204-I/MV fits motion-control nodes where quadrature encoders provide feedback: the QEI module decodes encoder A/B channels in hardware, freeing CPU cycles for trajectory planning on the 70 MIPS core. Firmware generates stepping profiles or servo torque commands, with the MCPWM outputs driving H-bridges or servo amplifiers. The 64KB FLASH accommodates full motion profiles, communication stacks, and diagnostics without external memory. AEC-Q100 qualification per distributor data allows use in industrial-vehicle and factory automation positioning axes. The 48-pin UQFN 6x6 mm footprint keeps controller area compact within dense multi-axis drive PCBs.
Recommended
Industrial Automation and Embedded Control
As a 16-bit DSC running at 70 MIPS with 64KB FLASH and 8KB RAM, this device serves as the main controller in industrial nodes requiring both real-time control and communication: sensors acquisition, protocol handling, and local actuation in one chip. The -40C to +85C industrial temperature rating covers factory-floor environments, and the 3.0V-3.6V CMOS design supports standard 3.3V industrial logic levels. Typical roles include pump and fan controllers, conveyor subsystems, and smart sensor transmitters, where DSP capability handles filtering (FIR/IIR) of noisy analog inputs that a plain MCU would struggle with in the same loop timing budget.
Recommended
Automotive-Adjacent Subsystems
Distributor data (datasheets.com, updated 23-APR-2024) lists the DSPIC33EP64MC204-I/MV as an AEC-Q100 automotive-qualified 16-bit DSC, enabling design-in for automotive-adjacent subsystems such as electric pumps, blower and fan controllers, actuators, and auxiliary motor modules. The 3.0V to 3.6V supply range and -40C to +85C rating align with typical automotive 3.3V rails and cabin/under-hood module environments (verify grade level with Microchip for your exact location). The MCPWM and QEI peripherals directly support the motorized functions common in these modules, while the 64KB FLASH supports firmware with diagnostic and reporting features.
Recommended
Battery-Powered and Portable Digital Power
For portable digitally controlled power products - fast chargers, battery-management controllers, and compact inverter modules - the 48-UQFN 6x6 mm exposed-pad package minimizes board area while the 70 MIPS DSC core runs charging state machines plus power-conversion control loops concurrently. The 3.0V to 3.6V CMOS operation maps directly to common 3.3V LDO or buck-derived rails, and the DSP engine implements coulomb counting, impedance tracking, and ripple-filtering algorithms efficiently. Compared with an analog-control approach, firmware control allows adaptive charging profiles updated in the field using the 64KB self-programmable FLASH.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64MC204-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64MC204-H/MV | DSPIC33EP128MC204-I/MV | DSPIC33EP32MC204-I/MV | DSPIC33EP64GP504-E/MV |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) exposed pad | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program FLASH | 64KB (22K x 24) | 64KB | 128KB | 32KB | 64KB |
| RAM | 8KB | 8KB | 8KB | 8KB | 8KB |
| Motor Control PWM (MCPWM) | Yes | Yes | Yes | Yes | No (GP peripheral set) |
| Operating Temperature | -40C to +85C (I grade) | Higher grade (H suffix) | -40C to +85C | -40C to +85C | -40C to +125C (E grade) |
Key Differentiators
- Integrated MCPWM motor-control PWM peripheral (vs DSPIC33EP64GP504-E/MV)
- AEC-Q100 automotive qualification (vs DSPIC33EP64MC202-I/SP (28-pin sibling))
- Exposed-pad UQFN thermal/electrical performance (vs DSPIC33EP64MC204-I/ML (44-QFN))
- Honest trade-off: FLASH capacity vs cost (vs DSPIC33EP128MC204-I/MV)
Design Notes
The /MV package is a 48-UQFN 6x6 mm with exposed pad. Solder the exposed pad to a grounded PCB copper pour with an array of thermal vias - this is essential for both heat dissipation at 70 MIPS operation and for reducing ground bounce in switching motor-drive environments. Follow Microchip's UQFN footprint guidelines for stencil design; partial exposed-pad soldering is a common cause of intermittent ground faults and thermal issues in production.
Supply the device from a clean 3.0V-3.6V rail (nominal 3.3V). Decouple every VDD/VSS pair with a 0.1uF low-ESR ceramic capacitor placed within 2-3 mm of the pin, plus one bulk 4.7-10uF capacitor near the device. In motor-control designs where the same board drives inverter gates, isolate the DSC ground from high-current PWM switching returns to prevent noise coupling into ADC readings and the MCPWM outputs.
The 48-UQFN package shares pin functions between analog and digital roles (PWM, QEI, communications) via peripheral pin select-style configuration; verify the final pin map against the datasheet 48-pin table before routing, because the /ML (44-pin QFN) and /SP (28-pin) variants of the same die have different pin maps and are NOT interchangeable footprints. Also confirm the H vs I temperature grade matches your thermal environment before a production BOM swap.
At 70 MIPS, keep high-speed clock traces (OSC/CLKI) short and away from PWM output lines driving inverter gates. Route encoder QEI inputs as a shielded, length-matched pair with filtering if the encoder cable is long, and use the device's input filtering features to reject motor commutation noise. Estimated: keeping PWM rise-time edge rates controlled via series gate resistors also reduces radiated emissions from the DSC-side traces.
Compliance Information
Distributor data (datasheets.com, updated 23-APR-2024) identifies the part as AEC-Q100 automotive qualified. RoHS/REACH/lead-free status not explicitly stated in provided web data; verify on Microchip's product page.
