DSPIC33EP64GP503-I/TL - 16-bit 70 MIPS DSC 64KB Flash | Microchip
MPN: DSPIC33EP64GP503-I/TL ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.87 | $48.70 |
| 100 | $4.35 | $435.00 |
| 500 | $3.92 | $1,960.00 |
| 1,000 | $3.51 | $3,510.00 |
DSPIC33EP64GP503-I/TL Overview
A digital signal controller combines the computational throughput of a DSP engine with the peripheral integration and control peripherals of a microcontroller. Within the semiconductor hierarchy, the dsPIC33EP sits under Microchip's 16-bit MCU/DSC portfolio, which in turn belongs to the broader class of embedded processors. DSCs are widely used wherever deterministic real-time control, fast interrupt response and math acceleration must coexist with rich analog peripherals on a single chip.
Key features include the 70 MIPS dsPIC33E core with DSP instruction extensions, up to 64KB self-programming Flash with ECC-class endurance, hi-speed PWM modules for motor control and power conversion, on-chip operational amplifiers that reduce external BOM count in current-sense loops, and a Charge Time Measurement Unit (CTMU) for capacitive touch and precise time measurement. The CAN 2.0B module makes the device directly suitable for automotive body and industrial fieldbus nodes.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with a 24-bit instruction word, single-cycle MAC and dual operand fetch, supported by the PTG, which can trigger ADC conversions and PWM updates in hardware without CPU intervention. This offloading yields deterministic sampling latencies critical for digital power loops and sensor fusion.
Typical applications include brushless DC and PMSM motor control, digital power supplies and LED drivers, automotive CAN gateways and body modules, industrial sensors, and capacitive touch interfaces.
Design consideration: at 70 MIPS the core draws significant dynamic current, so a solid VDD/VSS decoupling network and careful grounding of the on-chip op-amps are essential to preserve analog accuracy.
This page synthesizes distributor pricing context, drop-in alternatives from the same dsPIC33EP family, and practical design notes not found on a single datasheet page. Pricing shown is as of 2026-09-25.
Drop-in alternatives for DSPIC33EP64GP503-I/TL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GP503-I/TL (same form factor and footprint) — differing in Package, Operating Temperature, Core, RAM, Packaging.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GP503-E/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.48 / Unit
View Datasheet →DSPIC33EP32GP503-I/TL
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP32MC203T-I/TL
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →DSPIC33EP256MC504T-I/TL
✅ Drop-In✓ In Stock
$3.32 / Unit
View Datasheet →DSPIC33EP64GP503-I/TL Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 64 KB (22K x 24) |
| RAM | 8 KB |
| Package | 36-VTLA (5x5 mm) |
| Operating Voltage | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (I grade) |
| CAN | CAN 2.0B module |
| On-chip Op-Amps | 3 |
| Comparators | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| Peripheral Trigger Generator (PTG) | Yes |
| Hi-Speed PWM | Yes (motor control / digital power) |
| Mounting Type | Surface Mount |
| Lifecycle Status | In Production (per Microchip) |
| Packaging Suffix | /TL (Tape and Reel) |
DSPIC33EP64GP503-I/TL 36-vtla (5x5 mm) Pin Configuration Guide
Pin configuration for DSPIC33EP64GP503-I/TL (36-vtla (5x5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GP503-I/TL.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GP503-I/TL is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive CAN Body Modules, Digital Power Supplies and LED Drivers, Industrial Sensors and Instrumentation, Capacitive Touch Interfaces, Embedded Networking Gateways.
BLDC/PMSM Motor Control
The DSPIC33EP64GP503-I/TL fits motor-control applications through its 70 MIPS DSP core, hi-speed PWM with complementary outputs and dead-time insertion, and three on-chip op-amps that amplify shunt current signals before the ADC - removing external amplifier ICs from the drive board. In a typical sensorless FOC loop, the PTG triggers ADC sampling synchronized to the PWM center, achieving deterministic current sampling without CPU-triggered jitter. The four on-chip comparators support hardware overcurrent protection that trips PWM outputs faster than any software path. Firmware complexity, including Clarke/Park transforms and PI loops, fits comfortably in the 64KB (22K x 24) Flash with margin for communication stacks.
Recommended
Automotive CAN Body Modules
The integrated CAN 2.0B module with 8-frame buffers makes the DSPIC33EP64GP503-I/TL well suited for body-control nodes, sensor hubs and gateway sub-functions in vehicles. The -40C to +125C I-grade rating covers under-hood-adjacent and interior electronics environments, and the 5x5 mm 36-VTLA package conserves PCB area in compact modules. The CTMU supports capacitive touch interfaces for human-machine controls such as steering-wheel buttons, while comparators provide lamp-load diagnostics. With 64KB Flash, a full CAN stack plus application logic and diagnostic services (UDS-style) fit in a single chip, and its low-power sleep modes suit modules that must meet key-off quiescent current budgets.
Recommended
Digital Power Supplies and LED Drivers
For digital AC/DC and DC/DC converters and high-power LED drivers, the DSPIC33EP64GP503-I/TL offers the deterministic control granularity that switching converters demand: hi-speed PWM with nanosecond-class resolution adjustments, hardware-triggered ADC sampling aligned to switching instants via the PTG, and fast comparator-based cycle-by-cycle current limiting. The 70 MIPS core executes compensator math (2P2Z or PID) within each switching period even at hundreds of kilohertz. On-chip op-amps condition current-shunt feedback, cutting component count in compact power stages, while the 64KB Flash accommodates multi-mode control firmware including soft-start, burst mode and fault management state machines without external memory.
Recommended
Industrial Sensors and Instrumentation
Industrial sensing nodes benefit from the DSPIC33EP64GP503-I/TL combination of DSP math capability and integrated analog. The CTMU provides precise time-interval and charge measurement for capacitive and resistive sensing, while the three op-amps and four comparators condition signals from bridges and current sensors on-chip. The 70 MIPS core applies digital filtering (IIR/FIR) and FFT-based diagnostics locally, enabling condition-monitoring endpoints that send processed results over CAN or UART rather than raw data. Operating from 3.0V to 3.6V with sleep currents suited to battery-backed nodes, the device supports retrofit sensor deployments where 5x5 mm board space and 64KB of calibration plus protocol code are sufficient.
Recommended
Capacitive Touch Interfaces
The CTMU (Charge Time Measurement Unit) on the DSPIC33EP64GP503-I/TL implements robust capacitive touch sensing with hardware-based charge measurement, freeing CPU cycles for debounce, filtering and application logic. In appliances, control panels and white goods, the four on-chip comparators and configurable scan sequencing allow multi-key touch arrays to be sampled deterministically, and the 64KB Flash supports gesture processing and firmware-update bootloaders in the same image. The 5x5 mm 36-VTLA package suits compact glass-over-panel designs. Noise robustness is enhanced by firmware-controlled frequency hopping of the touch scan, an approach documented in Microchip's CTMU touch-sensing application notes.
Recommended
Embedded Networking Gateways
The DSPIC33EP64GP503-I/TL serves as a protocol-conversion node between CAN fieldbuses and serial links (UART, SPI, I2C) in industrial equipment. The 70 MIPS core runs dual protocol stacks concurrently with headroom for data transformation, while the 64KB Flash holds both stacks plus configuration storage. Multiple UARTs and the PPS (Peripheral Pin Select) system let firmware route communication peripherals to the pins routed on a given PCB, simplifying hardware reuse across product variants. Deterministic interrupt latency and hardware DMA-class data movement via the PTG keep message turnaround times bounded, which matters in synchronized distributed-control systems such as conveyors, pumps and building automation networks.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GP503-I/TL — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GP503-E/TL | DSPIC33EP32GP503-I/TL | DSPIC33EP32MC203T-I/TL | DSPIC33EP256MC504T-I/TL |
|---|---|---|---|---|---|
| Package | 36-VTLA (5x5 mm) | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same | 36-VTLA (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 64 KB (22K x 24) | 64 KB | 32 KB | 32 KB | 256 KB |
| Temperature Grade | -40C to +125C (I) | -40C to +150C class (E, verify datasheet) | -40C to +125C (I) | -40C to +125C (I) | -40C to +125C (I) |
| Family / Peripheral Focus | GP: CAN, op-amps, CTMU, PTG | GP: identical peripheral set | GP: identical peripheral set | MC: motor-control focus | MC: motor-control focus |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
Key Differentiators
- Three on-chip op-amps reduce external BOM (vs DSPIC33EP32MC203T-I/TL)
- Extended-temperature sibling available in same footprint (vs DSPIC33EP64GP503-E/TL)
- 64KB Flash headroom for stacks and bootloaders (vs DSPIC33EP32GP503-I/TL)
Design Notes
At 70 MIPS the dsPIC33EP core draws significant dynamic current; place 0.1uF ceramic decoupling capacitors at every VDD/VSS pin pair plus one bulk 4.7-10uF capacitor per supply domain. Estimated: dynamic supply current scales roughly linearly with Fcy, so reducing core frequency in idle phases (doze mode) directly reduces rail noise on mixed-signal grounds shared with the on-chip op-amps.
The 36-VTLA (5x5 mm) QFN package requires an exposed thermal/electrical pad; connect it to a solid ground plane with an array of thermal vias (typically 3x3). Because pin functions are assignable via PPS, route UART/SPI/PWM to the pins that minimize crossovers with analog traces - define the PPS mapping to match your PCB, not the reverse.
Verify the RAM budget against the current Microchip data sheet revision before freezing linker scripts, since distributor summaries disagree (8KB vs 4KB) for this MPN. Also, the CTMU and on-chip op-amps share pins with general-purpose I/O; confirm alternate-pin assignments in the datasheet pin diagram before layout sign-off to avoid a respin.
Keep the PWM outputs and gate-driver traces physically separated from the op-amp input traces used for current sensing. The on-chip op-amps have finite PSRR; switching-edge coupling into the current-sense loop causes ADC readings offset by switching noise. Route sense lines as short differential pairs and filter at the ADC input as recommended in Microchip's digital-power reference designs.
Compliance Information
In Production per Microchip product page; standard -I/TL production parts are lead-free/RoHS per Microchip policy. Not AEC-Q100 qualified as a standard part - verify with Microchip for automotive qualification options.
