DSPIC33EV64GM104T-I/PT - 16-bit 70 MIPS 5V DSC 64KB | Microchip
MPN: DSPIC33EV64GM104T-I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.92 | $4.92 |
| 10 | $4.43 | $44.30 |
| 100 | $3.94 | $394.00 |
| 500 | $3.55 | $1,775.00 |
| 1,000 | $3.2 | $3,200.00 |
DSPIC33EV64GM104T-I/PT Overview
A digital signal controller combines the computational throughput of a digital signal processor (DSP) with the peripheral integration and deterministic control of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33EV family well suited to closed-loop control loops, motor control, and power conversion where both math throughput and rugged I/O are required.
Key features of this part include an operating voltage range of 4.5V to 5.5V (5V-class operation in harsh environments), a CAN 2.0B bus interface with up to 8 Mbit/s operation, six motor-control PWM channels with fault protection, three on-chip op amps, a charge time measurement unit (CTMU), and SENT peripheral support for automotive sensor interfaces. The ECC Flash provides functional safety (FuSa) capability by detecting and correcting single-bit memory errors.
Architecturally, the dsPIC33EV64GM104 integrates a 16-bit modified Harvard core with DSP engine, barrel shifter, four DMA channels, and multiple interrupt vectors, allowing deterministic real-time response. Peripheral Pin Select (PPS) lets engineers remap digital peripherals onto RPn pins, easing PCB layout and reducing board rework during development.
Typical applications include brushless DC and PMSM motor drives, industrial power supplies, automotive body and powertrain subsystems using CAN and SENT, appliances requiring robust 5V I/O, and digital lighting or HVAC control.
A key design consideration is thermal management: the 44-TQFP exposed-lead package on a standard 4-layer board typically supports the full industrial temperature range of -40C to +85C, but high-frequency operation with heavily loaded I/O banks should be verified with junction temperature estimation.
This page synthesizes distributor availability data, drop-in alternatives, pin-compatibility guidance, and practical design notes not found in a single manufacturer datasheet, giving engineers and buyers one consolidated reference.
Drop-in alternatives for DSPIC33EV64GM104T-I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EV64GM104T-I/PT (same form factor and footprint) — differing in Core.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EV64GM004T-I/PT
✅ Drop-In✓ In Stock
$2.8 / Unit
View Datasheet →DSPIC33EV64GM104T-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV64GM104T-I/PTVAO
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EV128GM104T-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.38 / Unit
View Datasheet →DSPIC33EV32GM104T-I/PT
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EV64GM104T-I/PT Maximum Ratings & Electrical Characteristics
| Core | dsPIC33EV 16-bit DSC |
| Core Speed | 70 MIPS |
| Program Memory | 64KB (22K x 24) ECC Flash |
| RAM | 8KB |
| Supply Voltage | 4.5 V to 5.5 V |
| I/O Pins | 44 |
| Package | 44-TQFP (10x10 mm) |
| Operating Temperature | -40C to +85C |
| CAN Interface | CAN 2.0B |
| PWM Channels | 6 motor-control PWM |
| Op Amps | 3 on-chip |
| CTMU | Charge Time Measurement Unit |
| SENT Interface | Yes |
| DMA Channels | 4 |
| Timers | 9 |
| Peripheral Pin Select | Yes (PPS) |
| Functional Safety | FuSa supported (ECC Flash) |
| Mounting Type | Surface Mount |
DSPIC33EV64GM104T-I/PT 44-tqfp (10x10 mm) Pin Configuration Guide
Pin configuration for DSPIC33EV64GM104T-I/PT (44-tqfp (10x10 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EV64GM104T-I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EV64GM104T-I/PT is suitable for 6 applications: BLDC / PMSM Motor Control, Automotive Body and Sensor Interfaces, Industrial Power Supplies and Digital Power Conversion, Appliances and Harsh-Environment Control, CAN-Connected Industrial Automation Nodes, Test, Measurement, and Instrumentation Front Ends.
BLDC / PMSM Motor Control
The DSPIC33EV64GM104T-I/PT is a strong fit for brushless DC and permanent-magnet synchronous motor drives because its six motor-control PWM channels provide complementary outputs with dead-time insertion and fault protection, while the 70 MIPS DSP core executes field-oriented control (FOC) loops deterministically. The three on-chip op amps condition current-shunt signals without external amplifiers, reducing BOM cost. Running from a robust 5V supply, the DSC tolerates the noisy ground environment of an inverter stage. Placed next to the gate-driver ICs with ADC triggered directly by the PWM module, it closes the current loop with sub-PWM-cycle latency; the trade-off is that 5V logic requires level translation if the gate driver expects 3.3V inputs.
Recommended
Automotive Body and Sensor Interfaces
For automotive subsystems, the DSPIC33EV64GM104T-I/PT combines CAN 2.0B networking with SENT peripheral support, the interface mandated for modern automotive sensor signal transmission. The CTMU adds time-domain measurement for capacitive touch or resistance sensing, and the ECC Flash supports functional-safety workflows required in safety-relevant body functions. Its 5V-tolerant I/O directly meets legacy 5V automotive signal levels without translation chips. In a typical use, the DSC reads SENT-encoded position or pressure sensors, applies digital filtering at 70 MIPS, and reports over CAN to the body controller; designers should verify the exact qualification documentation variant when PPAP deliverables are required.
Recommended
Industrial Power Supplies and Digital Power Conversion
Digital power stages - LLC resonant converters, PFC stages, and DC-DC modules - benefit from the DSPIC33EV64GM104T-I/PT's high-resolution PWM and DSP math throughput. The 70 MIPS core sustains inner current loops at switching frequencies in the hundreds of kilohertz, while the six PWM channels support interleaved or phase-shifted topologies. Four DMA channels offload ADC sample streams from the CPU, keeping loop latency predictable. The 5V I/O rail interfaces cleanly with industrial gate drivers and optocouplers. Designers should budget careful PWM dead-time margin and use the fault inputs for hardware overcurrent shutdown independent of software; the CTMU can also aid timing calibration in resonant topologies.
Recommended
Appliances and Harsh-Environment Control
Home and commercial appliances expose electronics to voltage transients, temperature swings, and EMI from compressor and fan motors - exactly the harsh environment Microchip targets with the dsPIC33EV family's 5V robustness. The DSPIC33EV64GM104T-I/PT drives fan and pump motors with its PWM bank, measures temperatures via its ADC, and supports capacitive-touch user panels through the CTMU, all in one 5V-supplied device. Its industrial -40C to +85C rating covers unconditioned appliance enclosures. Using the on-chip op amps for current sensing of induction-heater or compressor loads eliminates external amplifier stages; board layout should still isolate the power ground from the DSC ground with a star connection.
Recommended
CAN-Connected Industrial Automation Nodes
As a field node in CANopen or J1939-style industrial networks, the DSPIC33EV64GM104T-I/PT offers an on-chip CAN 2.0B controller, freeing the 70 MIPS core for local control tasks such as actuator sequencing, encoder decoding, and PID regulation. Peripheral Pin Select lets engineers place the CAN TX/RX, UARTs, and SPI/I2C peripherals wherever board routing is cleanest, and nine timers handle multi-rate task scheduling. The 8KB RAM buffers CAN message queues comfortably. Partnering the DSC with a rugged CAN transceiver and a 5V LDO yields a compact, noise-tolerant node; designers should enable the CAN error-passive handling in firmware to recover gracefully from bus faults.
Recommended
Test, Measurement, and Instrumentation Front Ends
The CTMU (Charge Time Measurement Unit) of the DSPIC33EV64GM104T-I/PT enables precise time-interval and capacitance measurements, while the DSP core at 70 MIPS performs windowing, filtering, and FFT pre-processing close to the sensor. The three integrated op amps buffer high-impedance inputs, and ECC Flash protects calibration constants and program memory against single-bit upsets in electrically noisy test benches. Its 5V ADC domain accepts standard sensor outputs directly, avoiding extra level-shift stages. In a typical instrument, the DSC sequences measurements under timer control and streams results over UART or SPI; for highest precision, bias the CTMU current source externally and calibrate against a reference capacitor.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EV64GM104T-I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EV64GM004T-I/PT | DSPIC33EV64GM104T-E/PT | DSPIC33EV64GM104T-I/PTVAO | DSPIC33EV128GM104T-I/PT | DSPIC33EV32GM104T-I/PT |
|---|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same | 44-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Program Memory | 64KB ECC Flash | 64KB ECC Flash | 64KB ECC Flash | 64KB ECC Flash | 128KB ECC Flash | 32KB ECC Flash |
| RAM | 8KB | 8KB | 8KB | 8KB | 8KB | 8KB |
| CAN Interface | CAN 2.0B | None | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Full peripheral integration for automotive and motor control (vs DSPIC33EV64GM004T-I/PT)
- Extended temperature option in the same footprint (vs DSPIC33EV64GM104T-E/PT)
- Memory headroom upgrade without redesign (vs DSPIC33EV128GM104T-I/PT)
Design Notes
The DSPIC33EV64GM104T-I/PT requires a single 4.5V to 5.5V supply. Place a 0.1uF ceramic decoupling capacitor at each VDD pin pair within 5 mm of the pin, plus one bulk 4.7uF to 10uF capacitor per device. If the 5V rail comes from a switching pre-regulator, add a ferrite bead pi-filter to keep high-frequency ripple below the ADC noise floor. Estimated: at 70 MIPS with all peripherals active, typical core current is in the tens of milliamps range - verify against the family datasheet current-consumption tables for your exact operating frequency.
Keep the ICSP programming header (MCLR, PGD, PGC, VDD, VSS) on the PCB even in production; it enables firmware updates without board removal. Because Peripheral Pin Select (PPS) remaps digital peripherals, route RPn pins with generous spacing so late pin-function changes do not force a layout respin. Anchor the analog pins (ANx, VREF) over a quiet analog ground island separated from PWM/switching return currents. Configure MCLR with a 10k pull-up and expose it on the header for programming voltage entry.
Three pitfalls recur with this family. First, omitting the configuration-bit review: clock source, watchdog, and PPS settings are latched at programming - wrong oscillator config causes a silently dead board. Second, forgetting that the GM104's peripheral set differs from GM004/006 siblings: code compiled against the wrong device header may reference nonexistent peripherals. Third, mixing 5V dsPIC I/O with 3.3V sensors: the dsPIC33EV is a 5V device and its inputs may not be 3.3V-safe in all modes - check VIH thresholds and use level shifters where needed.
Estimated: in a 44-TQFP 10x10 mm package on a standard 4-layer board, junction-to-ambient thermal resistance is typically in the range of 40-60 C/W (verify the exact theta-JA in the family datasheet package section). At an estimated 50 mA core/peripheral current on 5V, device dissipation is roughly 0.25 W, producing an estimated 10-15 C junction rise - well within the -40C to +85C industrial rating, but account for ambient extremes near +70C in sealed enclosures or verify the -E extended-temperature grade.
Compliance Information
MicrochipDirect lists conflict minerals compliance; the dsPIC33EV family targets automotive and industrial applications per Microchip product page. Verify RoHS/REACH certificates of conformance with the distributor for your specific date code; halogen-free status not explicitly stated in retrieved data.
