DSPIC33FJ128GP706A-H/MR - 16-bit DSC, 128KB Flash, 64-VQFN | Microchip
MPN: DSPIC33FJ128GP706A-H/MR ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
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DSPIC33FJ128GP706A-H/MR Overview
A digital signal controller combines the deterministic execution and peripherals of a microcontroller (MCU) with the math acceleration of a digital signal processor (DSP). Within the power management hierarchy of embedded systems, the dsPIC33F family sits between general-purpose PIC24 microcontrollers and dedicated DSPs, offering single-cycle MAC instructions, hardware division, and advanced analog peripherals in a single chip. This makes DSCs the workhorse of motor control, digital power conversion, and precision sensing systems.
Key features of the DSPIC33FJ128GP706A-H/MR include a 16-bit pipelined core executing up to 40 MIPS, 128KB of self-programmable Flash with an ECC-free legacy architecture, integrated DSP engine for FIR/IIR filtering, multiple UART, SPI and I2C communication ports, and a rich analog subsystem with a high-speed 12-bit ADC suited to motor-control current sensing. The A-suffix die revision incorporates errata corrections over the original dsPIC33FJ128GP706 silicon.
The device operates from a 3.0V to 3.6V supply and supports internal PLL clock multiplication from an external crystal, allowing a 40 MIPS core clock from lower-frequency resonators. Programming and debugging use the two-wire ICSP interface through any available PGECx/PGEDx pin pair, supported by MPLAB X IDE and the PICkit, ICD, and REAL ICE tool families. According to Microchip product data, this H-temperature variant is qualified across the full -40C to +125C automotive range and is part of the AEC-Q100-qualified dsPIC33F automotive offering.
Typical applications include brushless and PMSM motor control, digital power supplies and LED drivers, automotive body and convenience modules, industrial sensing nodes, and audio signal processing where 16-bit fixed-point DSP math is required.
Design consideration: the 64-VQFN exposed pad should be soldered to a grounded thermal pad on the PCB for both thermal dissipation and signal integrity; connect all VDD/VSS pairs and use decoupling capacitors at each supply pin.
This page synthesizes distributor sourcing data, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33FJ128GP706A-H/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33FJ128GP706A-H/MR (same form factor and footprint) — differing in Core Architecture, Flash Program Memory, Operating Temperature, Package, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33FJ128GP706A-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33FJ128GP706A-E/MR
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →DSPIC33FJ128GP706-H/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ64GP706A-H/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128GP306A-H/MR
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33FJ128GP706A-H/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33F DSC |
| Maximum CPU Speed | 40 MIPS |
| Flash Program Memory | 128KB (128K x 8) |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (H grade) |
| Package | 64-VQFN (9x9 mm) Exposed Pad |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100, Automotive |
| Series | dsPIC33FJ128GP706A (dsPIC 33F) |
| Programming Interface | ICSP (PGECx/PGEDx pairs) |
| Die Revision | A (errata-corrected dsPIC33FJ128GP706 die) |
DSPIC33FJ128GP706A-H/MR 64-vqfn (9x9 mm) exposed pad Pin Configuration Guide
Pin configuration for DSPIC33FJ128GP706A-H/MR (64-vqfn (9x9 mm) exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33FJ128GP706A-H/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33FJ128GP706A-H/MR is suitable for 6 applications: BLDC/PMSM Motor Control, Automotive Body and Convenience Modules, Digital Power Conversion, Industrial Sensing and Instrumentation, Audio and Speech Signal Processing, Embedded Development and Prototyping.
BLDC/PMSM Motor Control
The DSPIC33FJ128GP706A-H/MR is well suited to brushless DC and PMSM field-oriented control because its 16-bit dsPIC33F core executes single-cycle MAC instructions at up to 40 MIPS, sustaining FOC current loops at typical 10-20 kHz PWM frequencies with deterministic latency. The integrated high-speed ADC samples phase currents synchronized to PWM triggers, eliminating external sampling circuits. Firmware runs from the on-chip 128KB Flash with no external memory. The -H temperature grade and AEC-Q100 qualification also allow use in automotive pumps, fans, and actuators where consumer-grade controllers would exceed their ratings near hot motor housings.
Recommended
Automotive Body and Convenience Modules
With AEC-Q100 qualification and a -40C to +125C operating range, the DSPIC33FJ128GP706A-H/MR fits automotive body electronics such as lighting modules, window-lift and seat controllers, and sensor hubs. The 64-VQFN 9x9 mm exposed-pad package conserves PCB area in space-limited modules, while the 128KB Flash accommodates LIN/CAN-stacked protocol stacks and diagnostics. The A-suffix die incorporates errata corrections that automotive programs typically require. Designs should connect every VDD/VSS pair and implement full decoupling per Microchip's hardware guidelines to meet EMC requirements such as conducted emissions in vehicle environments.
Recommended
Digital Power Conversion
Digital power supplies, PFC stages, and LED drivers benefit from the controller's deterministic 40 MIPS pipeline and DSP multiply-accumulate engine, which execute compensator calculations within one PWM period. The on-chip ADC with simultaneous sampling supports voltage and current feedback loops at switching frequencies from 50 kHz to several hundred kHz in push-pull, LLC, or totem-pole topologies. The 128KB Flash holds multiple operating profiles and firmware-updatable control laws. The exposed-pad QFN provides low-inductance grounding that reduces switching-noise coupling into the analog front end, which is critical for control-loop stability and accuracy.
Recommended
Industrial Sensing and Instrumentation
In industrial transmitters, data loggers, and portable instruments, the dsPIC33F's advanced analog subsystem digitizes sensor signals while the DSP engine applies filtering and calibration math, replacing a separate MCU-plus-DSP chip pair. The 3.0V to 3.6V single-supply operation simplifies power design, and multiple UART/SPI/I2C ports interface displays, memory, and field buses. The 128KB Flash supports OTA or service-tool firmware updates. According to Microchip's family documentation, the GP-series analog features target exactly this class of precision measurement applications, and the -H grade tolerates hot electrical cabinets reaching +125C ambient extremes.
Recommended
Audio and Speech Signal Processing
The GP (General Purpose) family, which includes the DSPIC33FJ128GP706A, targets audio applications with peripherals and DSP throughput for speech codecs, active noise cancellation, and audio effects. The single-cycle MAC and hardware divide accelerate FIR/IIR filters and FFTs at 40 MIPS, comfortably handling multiple concurrent 16-bit fixed-point audio channels. The 128KB Flash stores codecs and tables without external memory. DCI (data converter interface) style serial ports in the family connect audio codecs directly, and the 64-VQFN package with exposed pad grounds the analog and digital domains cleanly to minimize crosstalk in mixed-signal audio layouts.
Recommended
Embedded Development and Prototyping
The dsPIC33FJ128GP706A is supported by Microchip's Explorer 16/32 Development Board through a Processor Plug-In Module (PIM), giving engineers a low-cost modular platform compatible with PIC24F, dsPIC, and PIC32 families. MPLAB X IDE with the XC16 compiler, plus PICkit, ICD, and REAL ICE debuggers, program the device over any PGECx/PGEDx pair. Third-party tool chains also list full programming and debugging support for this exact part. The 128KB Flash leaves generous headroom for middleware stacks during prototyping, and code migrates directly to the production 64-VQFN footprint when the design is frozen.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33FJ128GP706A-H/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33FJ128GP706A-I/MR | DSPIC33FJ128GP706A-E/MR | DSPIC33FJ128GP706-H/MR | DSPIC33FJ64GP706A-H/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) Exposed Pad | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 128KB (128K x 8) | 128KB | 128KB | 128KB | 64KB |
| CPU Speed | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS | 40 MIPS |
| Operating Temperature | -40C to +125C | -40C to +85C | Extended (beyond +125C) | -40C to +125C | -40C to +125C |
| Die Revision | A (errata-corrected) | A (errata-corrected) | A (errata-corrected) | Original die (errata apply) | A (errata-corrected) |
| Key Trade-off | High-temp automotive grade, 128KB | Lower cost, industrial temp only | Widest temperature, higher cost | Legacy die, documented errata | Half the Flash, lower cost |
Key Differentiators
- Automotive high-temperature grade in the same footprint (vs DSPIC33FJ128GP706A-I/MR)
- Errata-corrected A die revision (vs DSPIC33FJ128GP706-H/MR)
- Double the program memory of the low-cost sibling (vs DSPIC33FJ64GP706A-H/MR)
- Trade-off: premium over industrial variant (vs DSPIC33FJ128GP706A-I/MR)
Design Notes
The 64-VQFN exposed pad must be soldered to a PCB thermal pad connected to a solid ground plane. Recommended pattern: an array of ~5x5 thermal vias (0.3 mm drill) under the pad to transfer heat to inner layers. Solder-paste stencil openings should be reduced ~50% on the center pad to avoid voiding. All VDD/VSS and AVDD/AVSS pin pairs must be connected even if the analog section is unused, per Microchip's dsPIC33FJ hardware design guidelines.
Decouple every VDD pin with a 0.1 uF ceramic capacitor placed within 2-3 mm of the pin, plus one bulk 4.7-10 uF capacitor per supply domain. Keep AVDD on its own filtered supply or an RC/LC filter from VDD to preserve ADC accuracy in motor-control and sensing designs. The 3.0-3.6V supply must tolerate inrush from internal regulator startup; verify the supply can source the peak operating current at 40 MIPS with all peripherals enabled.
ICSP programming requires matched PGECx/PGEDx pairs: if PGEC2 is used for ICSPCLK, ICSPDAT must be PGED2 on the same pair. Mixing pairs is a frequent bring-up failure. Keep MCLR pulled up (typically 10 kOhm) with a 100 nF-10 uF capacitor sized to your programming tool. When substituting the non-A DSPIC33FJ128GP706 die, review the A-die errata list first - the corrections address documented silicon issues that may affect your firmware assumptions.
Compliance Information
Automotive AEC-Q100 qualification confirmed by DigiKey and Hotenda listings. RoHS/REACH/lead-free status not stated in verified data - verify on Microchip's product page.
