ESD8004 - 4-Channel Low-Capacitance ESD Diode | onsemi
MPN: ESD8004 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
ESD8004 Overview
An ESD protection diode is a discrete semiconductor device that diverts transient electrostatic-discharge energy away from a sensitive circuit. A low-capacitance TVS diode array belongs to the hierarchy of discrete semiconductor, surge protector, TVS diode, and ESD protection component. Unlike a fuse or surge suppressor intended primarily for slower power transients, this array is optimized for high-frequency data conductors where parasitic capacitance and clamping behavior directly affect signal integrity.
The verified manufacturer information identifies ultra-low capacitance, a low ESD clamping voltage, and flow-through package construction as the principal benefits. The 10-UDFN layout supports easy placement across data lines and helps maintain consistent impedance between paired conductors. An eight-volt typical clamp and 16 A Ipp value provide concrete transient-protection parameters, while the four-channel arrangement allows one compact device to protect multiple adjacent signal paths.
Because capacitance, breakdown behavior, insertion loss, and differential impedance determine whether a protection device is transparent to the data link, engineers should evaluate the complete interface against the applicable channel rate and system requirements. The available verified snippets do not provide exact capacitance, working-voltage, response-time, or differential-impedance figures, so those specifications require confirmation from the manufacturer datasheet before release. The package footprint should likewise be checked against the complete ordering code, ESD8004MUTAG, and the PCB land pattern.
Typical uses include USB 3.0 high-speed pairs, external-facing data connectors, and other low-voltage interfaces where electrostatic discharge is a concern. The flow-through construction is especially useful where traces must continue through the protection location with minimal asymmetry. Placement close to the connector can shorten the unprotected path, while ground-return design and controlled differential routing remain essential for repeatable ESD performance.
When laying out the device, preserve the intended high-speed trace geometry and match both conductors of each differential pair. Avoid adding unnecessary copper or test pads that disturb impedance. Confirm connector-side versus logic-side orientation, inspect the manufacturer pin and land-pattern information, and validate the assembled channel with the system ESD test procedure. This page consolidates verified manufacturer information, sourcing details, interface guidance, and design cautions that are not consolidated in a distributor search result.
Drop-in alternatives for ESD8004 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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| Product Type | Four-channel low-capacitance ESD protection diode array |
| Number of Protected Channels | 4 channels |
| Typical Clamping Voltage | 8 V |
| Peak Pulse Current | 16 A Ipp |
| Package | 10-UDFN (2.5 mm x 1.0 mm) |
| Package Construction | Flow-through style |
| Mounting Type | Surface mount |
| Supported High-Speed Use | High-speed differential data lines such as USB 3.0 |
| ESD Protection Function | Electrostatic-discharge transient clamping |
| Ordering Code Shown By Distributor | ESD8004MUTAG |
ESD8004 flow-through style Pin Configuration Guide
Pin configuration for ESD8004 (flow-through style package). This power device features gate, drain, and source terminals. For non-polarized packages, refer to the manufacturer datasheet for exact pin 1 orientation and footprint details. Common applications include power supply design, motor driving, and load switching.
No detailed pinout data available for ESD8004.
Refer to the datasheet for full pin configuration.
Typical Applications
ESD8004 is suitable for 6 applications: USB 3.0 High-Speed Ports, External High-Speed Data Connectors, Low-Voltage Differential Data Links, Mobile and Portable Peripherals, Industrial Communication Interfaces, Network and Communications Equipment.
USB 3.0 High-Speed Ports
The ESD8004 is a direct fit for USB 3.0 routing because onsemi identifies its flow-through package as supporting matched high-speed differential lines and its four channels can protect multiple adjacent conductors. The verified 8 V typical clamp and 16 A Ipp provide defined transient-handling targets without relying on a generic protector. Place the array at the connector entry, preserve symmetric pair geometry, and confirm insertion loss and capacitance from the manufacturer datasheet before compliance testing.
Recommended
External High-Speed Data Connectors
External connectors expose high-speed data conductors to direct-contact and airborne electrostatic discharge, making the ESD8004 useful near the connector shell and signal entry. Its four-channel flow-through architecture protects several lines while maintaining continued routing toward the host controller. Position it as close as practical to the connector, provide a short return path to chassis or protection ground as defined by the system design, and avoid long unprotected copper segments.
Recommended
Low-Voltage Differential Data Links
The ESD8004 suits low-voltage differential links where capacitance and trace symmetry are critical. Its ultra-low-capacitance description indicates that the protection network is intended to minimize signal disturbance, and the flow-through construction supports matched routing through the protection position. The four-channel format can consolidate protection for two pairs. Final acceptance should use the exact edge rate, differential impedance, loss budget, and ESD test waveform rather than the 8 V clamp value alone.
Recommended
Mobile and Portable Peripherals
Portable equipment connected through an exposed data port benefits from compact transient protection, and the ESD8004's 10-UDFN package measures only 2.5 mm by 1.0 mm according to the verified distributor result. Its four channels allow one placement to serve a multi-line high-speed interface while conserving board area. Designers should still budget connector mechanics, enclosure discharge paths, and grounding, because a low-capacitance diode alone does not complete an ESD-compliant enclosure system.
Recommended
Industrial Communication Interfaces
Industrial data equipment can combine long external cables with sensitive, high-speed interface electronics, increasing the value of localized ESD protection. ESD8004 can be installed at an accessible connector before traces enter the main board, with its four channels protecting paired conductors through the flow-through layout. The 16 A Ipp listing describes a transient capability, but enclosure grounding, cable geometry, and the applicable equipment-level test standard remain essential to achieving system immunity.
Recommended
Network and Communications Equipment
The ESD8004 can protect high-speed communications lines routed between an external connector and sensitive circuitry. Its compact four-channel format reduces the number of discrete protection placements, while ultra-low capacitance helps avoid unnecessary loading of fast edges. For a complete design, maintain continuous reference planes, use a deliberate protection-ground strategy, and verify channel-to-channel skew and insertion loss against the communications specification before production release.
Recommended
Recommended Products Summary
Engineering reference data for ESD8004 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 10-UDFN (2.5 mm x 1.0 mm) |
| Brand | onsemi |
| Protection Channels | 4 channels |
| Typical Clamping Voltage | 8 V |
| Peak Pulse Current | 16 A Ipp |
| Package Construction | Flow-through style |
| Target Interface | High-speed differential data lines including USB 3.0 |
Design Notes
Place the ESD8004 at the connector entry and minimize unprotected trace length. The flow-through package is intended to preserve routing through the protection position, but the PCB must follow onsemi's land pattern and maintain a continuous return plane. Confirm pin orientation, exposed-pad connectivity, and the complete ESD8004MUTAG footprint from the manufacturer datasheet before release.
Preserve differential-pair symmetry through and around the device. Match conductor widths, spacing, via transitions, and reference-plane geometry to the interface impedance; do not add large pads, copper pours, or test points beside the high-speed lines. Because exact capacitance and insertion-loss values are absent from the supplied snippets, validate them against the target edge rate and channel budget using the full datasheet.
Do not select a substitute from channel count and package name alone. A drop-in candidate must match the 10-UDFN footprint, pin mapping, flow-through routing, capacitance, clamp behavior, and peak-pulse capability. The verified 8 V typical clamp and 16 A Ipp are useful figures but are insufficient without pulse conditions; obtain those test details before calculating margin or claiming equivalent protection.
Connect the protection return to the enclosure or protection-ground structure specified by the complete EMC design, and keep transient current out of sensitive analog or digital return paths. The device clamps ESD events, but cable entry, shell bonding, ground-plane continuity, and chassis geometry determine whether energy reaches the PCB. Validate the assembled product with the applicable system-level ESD procedure.
Compliance Information
The supplied verified snippets do not provide explicit environmental or automotive compliance statements. No compliance claim is inferred from the manufacturer name, package, or ESD function.
