GX39220-DNT - 96GBaud 2-Ch Linear TIA | Renesas | CFP2/CFP4
MPN: GX39220-DNT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $121.2 | $121.20 |
| 10 | $121.2 | $1,212.00 |
| 100 | $121.2 | $12,120.00 |
| 500 | $121.2 | $60,600.00 |
| 1,000 | $121.2 | $121,200.00 |
GX39220-DNT Overview
A linear transimpedance amplifier is an analog front-end (AFE) device that converts the low-level photocurrent generated by a photodiode into a proportional voltage output while preserving linearity, unlike limiting TIAs that saturate the output. In the signal-chain hierarchy, the TIA sits directly after the photodetector in an optical receiver, feeding downstream ADCs and DSP-based equalization in coherent DSP ASICs. Linear TIAs are therefore foundational building blocks of high-speed optical transport systems used in datacenter interconnects and long-haul telecom.
Key features of the GX39220 include dual 96 GBaud channels supporting high-order coherent modulation formats, a linear transfer characteristic that enables DSP-based equalization of PAM/QAM waveforms, and a high-performance, low-power, compact design specifically engineered for small-form-factor pluggable modules such as CFP2 and CFP4 coherent modules.
The GX39220 architecture integrates matched I and Q signal paths, ensuring channel-to-channel consistency required for coherent demodulation, where amplitude and phase balance between quadrature branches directly affect constellation quality and system OSNR tolerance. The linear gain approach allows downstream digital signal processing to recover the full waveform, including multi-level modulation.
Typical applications include CFP2/CFP4 coherent optical transceiver modules, datacenter interconnect (DCI) and metro/long-haul coherent receivers, and coherent DWDM telecom line cards operating at symbol rates approaching 96 GBaud per polarization tributary.
Design consideration: because the part is offered as die-sale (DNT), module designers must implement chip-on-board or known-good-die assembly with verified bondout and RF/thermal design; consult the Renesas datasheet and the GX39220-DNT evaluation board (GX39220-DNT-EVB) for reference layouts.
This page synthesizes distributor pricing, availability data, and application context not found in a single manufacturer source, with all parameter placeholders explicitly flagged rather than estimated.
Drop-in alternatives for GX39220-DNT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with GX39220-DNT (same form factor and footprint) — differing in Number of Channels, Product Type, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesGX39220-DNT Maximum Ratings & Electrical Characteristics
| Product Type | Linear Transimpedance Amplifier (TIA) |
| Number of Channels | 2 (I and Q signal paths) |
| Data Rate / Symbol Rate | 96 GBaud per channel |
| Output Linearity | Linear output (supports DSP equalization) |
| Target Module Form Factor | CFP2, CFP4 |
| Mounting Type | Surface Mount (die sale - good die per distributor listing) |
| Packaging | Tray (die sale, per distributor data) |
GX39220-DNT standard Pin Configuration Guide
Pin configuration for GX39220-DNT (standard package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for GX39220-DNT.
Refer to the datasheet for full pin configuration.
Typical Applications
GX39220-DNT is suitable for 6 applications: CFP2 Coherent Optical Module, CFP4 Coherent Optical Module, Datacenter Interconnect (DCI) Receivers, Metro and Long-Haul Coherent DWDM Line Cards, Coherent Receiver Test and Measurement, Integrated Optical Subassembly (OSA) Design.
CFP2 Coherent Optical Module
The GX39220-DNT fits CFP2 coherent modules directly because its two linear TIA channels map one-to-one onto the I and Q photodiode tributaries of a coherent receiver, each rated for 96 GBaud. Placed immediately after the photodiode pair, it converts photocurrent into linear differential voltage that the module ADC captures for DSP-based chromatic-dispersion and polarization-mode-dispersion equalization. Its low power and compact die-sale format are decisive: CFP2 pluggables have a strict thermal envelope, and die-level integration saves board area versus packaged AFEs. The linear response preserves multi-level QAM amplitude information, which a limiting TIA would destroy, so constellation quality and OSNR tolerance depend directly on this stage's linearity and noise figure.
Recommended
CFP4 Coherent Optical Module
For the smaller CFP4 form factor, the GX39220-DNT's compact, low-power dual-channel design is explicitly called out in the Renesas datasheet as an enabler. CFP4 modules further constrain board area and power dissipation relative to CFP2, so supplying the TIA as good die allows the module vendor to co-package it with photodiodes and the DSP in an optical subassembly with minimal footprint. Each channel still supports 96 GBaud, so the module can serve metro and regional coherent links. Designers must implement chip-on-board bonding with controlled parasitics to preserve the linear bandwidth; the GX39220-DNT-EVB reference design provides validated layout guidance for this assembly style and helps de-risk signal-integrity performance before production tooling.
Recommended
Datacenter Interconnect (DCI) Receivers
Datacenter interconnect systems use coherent optics to span 80-120 km or more between facilities, and the GX39220-DNT serves as the photoreceiver analog front end in these links. Its 96 GBaud per-channel rate supports 400G+ and 800G-class wavelength architectures, and its linear output enables the DSP to recover high-order modulation with soft-decision forward error correction. Two channels per die reduce component count and channel-mismatch risk in the I/Q path, improving constellation symmetry. Because DCI deployments demand high port density and low watts-per-bit, the GX39220's low-power specification is a selection criterion; designers should budget TIA dissipation in the module thermal model and verify with EVB measurements.
Recommended
Metro and Long-Haul Coherent DWDM Line Cards
In metro and long-haul DWDM line cards, the GX39220-DNT acts as the linear TIA stage between the coherent photodiodes and the coherent DSP ASIC. Linearity at 96 GBaud is essential for recovering 16QAM/64QAM-class waveforms over amplified spans, and the dual-channel integration keeps I/Q gain and phase balance tight, which directly affects carrier-phase estimation performance. The die-sale delivery format allows line-card vendors to integrate the die within the receive optical subassembly rather than on the main card, shortening the critical RF path. When designing, allocate careful biasing and supply filtering per the Renesas datasheet, since noise in this stage translates into OSNR penalty across the entire link.
Recommended
Coherent Receiver Test and Measurement
Test engineers characterizing photodetectors, optical subassemblies, or coherent DSP front ends can use the GX39220-DNT as a reference-grade linear TIA in bench setups. Its specified 96 GBaud bandwidth class and linear transfer function make it a useful reference when measuring constellation EVM, OSNR tolerance, and receiver sensitivity of components intended for 400G/800G coherent systems. The companion GX39220-DNT-EVB simplifies hookup by providing bias tees, supply filtering, and RF launch structures proven at these symbol rates. Because results depend on the linearity of this stage, preserve headroom in the output swing and verify gain flatness across the band of interest during calibration.
Recommended
Integrated Optical Subassembly (OSA) Design
Optical subassembly designers integrating photodiodes with electronics benefit from the GX39220-DNT's good-die delivery: the die can be wire-bonded or flip-chipped directly adjacent to the four-quadrant (or dual) coherent photodiode array inside the OSA, minimizing parasitic inductance on the 96 GBaud signal path. Shorter interconnects preserve bandwidth and reduce reflections that would degrade linear gain flatness. The Renesas datasheet notes the compact design enables small-form-factor modules such as CFP2 and CFP4, and the same reasoning applies to custom OSAs for coherent on-board optics. Thermal expansion matching and die-attach materials should be selected to protect the amplifier die over the module's operating temperature range.
Recommended
Engineering reference data for GX39220-DNT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | GX39220 |
|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics |
| Data Rate per Channel | 96 GBaud | 96 GBaud |
| Channels | 2 (I/Q) | 2 (I/Q) |
| Output Type | Linear TIA | Linear TIA |
| Delivery Form | Die sale (good die), tray | Per datasheet ordering options |
| Target Modules | CFP2, CFP4 | CFP2, CFP4 |
Key Differentiators
- Dual integrated I/Q channels on a single die (vs Discrete single-channel TIA solutions)
- Linear output architecture for coherent modulation (vs Limiting TIAs at comparable rates)
- Die-sale (DNT) delivery format (vs Packaged TIA alternatives)
Design Notes
At 96 GBaud, every millimeter of interconnect between the photodiode, the GX39220 die input, and the output launch matters. In die-sale assemblies, minimize bond-wire length, use controlled-impedance transmission lines, and follow the GX39220-DNT-EVB reference layout for pad transitions. Verify insertion loss and return loss of the full path to at least the Nyquist frequency of the modulation format in use. Poor linear-phase response at these rates converts directly into constellation distortion and EVM degradation.
Linear TIAs are sensitive to supply noise, which appears directly at the output and raises the noise floor of the received constellation. Implement star or dedicated low-noise LDO supply rails for the TIA with local high-frequency decoupling at each supply pad, and separate the TIA supply domain from the DSP and laser-driver domains in the module. Validate supply-noise coupling on the evaluation board before finalizing the power tree. Refer to the Renesas GX39220 datasheet for recommended decoupling networks and supply sequencing.
The GX39220-DNT is a die-sale (DNT) part: it arrives as known-good die in a tray, not as a packaged IC. Teams accustomed to packaged components sometimes overlook the assembly, bonding, and handling implications (die storage, wire-bond process qualification, MSL-equivalent handling). Additionally, do not assume limiting-TIA design practices apply - this is a linear part whose output must stay within its linear swing; overdriving it destroys the amplitude information the DSP needs. Use the EVB to establish baseline performance before production.
Compliance Information
Compliance data was not present in the verified web data for this die-sale telecom component. Contact Renesas for RoHS/REACH statements specific to the DNT die-sale ordering code.
