GX36220 - 2x64Gb/s Dual Linear TIA for 400G Coherent ROSA | Renesas
MPN: GX36220 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $495.79 | $495.79 |
| 10 | $460.5 | $4,605.00 |
| 100 | $420 | $42,000.00 |
| 500 | $385.45 | $192,725.00 |
| 1,000 | $360.2 | $360,200.00 |
GX36220 Overview
An LDO (Low-Dropout) linear regulator is a class of voltage regulator that maintains a stable output voltage even when the supply rail is only marginally above the desired output. In this product family of high-speed analog amplifiers, linearity and low input-referred noise are paramount: the TIA converts small photodiode currents into usable voltage swings while preserving the modulation fidelity required for soft-decision FEC at 400G and beyond. The GX36220 sits within the linear amplifier hierarchy, which bridges photodetectors and the host CDR/DSP in the optical receive chain.
Key differentiating specifications include a per-channel bandwidth of approximately 28 GHz to support 32Gbaud Nyquist operation, very low input-referred noise current on the order of sub-pA/sqrt(Hz), and a differential trans-impedance in the multi-kΩ range typical for coherent I-channel amplifiers. The device integrates two matched TIA cores on a single die, removing the need for a second IC in dual-polarization receivers. The die form factor is required for sub-pF parasitic bonding directly to the photodiodes and to the limiting-stage or CDR ASIC, minimizing stub lengths.
Architecture-wise, the GX36220 is built on a high-fT SiGe BiCMOS process that delivers the fT/ft necessary for 32Gbaud I/Q paths. Auto-zero feedback and on-die bias networks hold the operating points stable across temperature. The dual-channel layout is symmetrical so that I and Q skew is minimized, which is critical for coherent demodulation where timing mismatch translates directly into phase-error penalties.
Typical applications include 400G CFP2-DCO and QSFP-DD coherent transceivers, line-card ROSAs for DWDM transport platforms, and OEM 600G/800G next-generation coherent reference designs. The bare-die format means the part is wire-bonded inside a hermetic ROSA package alongside InP photodiodes or integrated coherent receivers.
When designing with this device, follow Renesas evaluation board layout guidelines to keep bond-wire inductance below 0.5 nH per tap. Use matched differential routing on host side and provide a quiet low-noise analog supply. Thermal management is handled at the ROSA package level since the GX36220 ships as a bare die.
This page synthesizes distributor pricing snapshots, cross-reference data, and engineering design notes that go beyond the manufacturer datasheet to assist BOM and qualification engineers.
Drop-in alternatives for GX36220 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with GX36220 (same form factor and footprint) — differing in Number of Channels, Mounting Type, Package, Product Type, Aggregate Data Rate.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
GX36220-DNT
✅ Drop-In✓ In Stock
$355.55 / Unit
View Datasheet →GX36220-F-DNT
✅ Drop-In✓ In Stock
$308.36 / Unit
View Datasheet →GX36420-DNT
✅ Drop-In✓ In Stock
$135.92 / Unit
View Datasheet →GX39220-DNT
✅ Drop-In✓ In Stock
$121.2 / Unit
View Datasheet →GX36220 Maximum Ratings & Electrical Characteristics
| Product Type | Dual linear Trans-Impedance Amplifier (TIA) |
| Number of Channels | 2 (I and Q) |
| Per-Channel Data Rate | 32 Gb/s (32 GBaud) |
| Aggregate Data Rate | 2x64 Gb/s |
| Target Application | 400G coherent Receiver Optical Sub-Assembly (ROSA) |
| Modulation Support | DP-16QAM and higher-order coherent formats |
| Package | Bare die (DIE SALE - WAFER) |
GX36220 bare die (die sale - wafer) Pin Configuration Guide
Pin configuration for GX36220 (bare die (die sale - wafer) package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for GX36220.
Refer to the datasheet for full pin configuration.
Typical Applications
GX36220 is suitable for 6 applications: 400G Coherent CFP2-DCO Transceivers, QSFP-DD Coherent Modules, DWDM Line-Card ROSA Receivers, Next-Generation 800G Reference Designs, Coherent Test & Measurement Equipment, Data Center Interconnect (DCI) Coherent Links.
400G Coherent CFP2-DCO Transceivers
The GX36220's 2x64 Gb/s aggregate bandwidth and dual-channel I/Q TIA architecture make it a strong fit for 400G CFP2-DCO coherent transceivers. Its 32 GBaud per-channel capability directly enables DP-16QAM modulation at the 400G line rate. Inside the ROSA, the TIA is wire-bonded to an integrated coherent receiver (ICR) photodiode pair and feeds the host CDR/DSP ASIC. Unlike lower-bandwidth non-coherent TIAs, the GX36220 maintains sub-pA/sqrt(Hz) noise and matched I/Q gain across the entire 28 GHz class bandwidth, minimizing phase-error penalties in coherent demodulation.
Recommended
QSFP-DD Coherent Modules
Compact QSFP-DD coherent modules require dual-channel coherent TIAs that fit inside a hermetic ROSA sub-package. The GX36220's dual-channel die footprint minimizes the bill of materials by replacing two single-channel TIA ICs with one matched-die solution. Its 32 GBaud per-channel rate aligns with QSFP-DD 400ZR/400ZR+ optical specifications. Bond-wire inductance budget is tight inside QSFP-DD ROSAs, so the bare-die form factor of the GX36220 enables sub-0.5 nH bonds directly from the photodiode outputs to the TIA pads, preserving eye-margins over the full temperature range.
Recommended
DWDM Line-Card ROSA Receivers
DWDM transport line cards operating in the C-band rely on coherent ROSAs that combine a polarization-diversity InP photodiode with a dual-channel linear TIA. The Renesas GX36220 is engineered precisely for this application, pairing I/Q gain symmetry with low noise to support 400G and 600G super-channels. Its SiGe BiCMOS process handles high symbol-rate clocks without excessive jitter, and the on-die bias network keeps the operating point stable across line-card chassis temperature gradients. Compared with discrete TIA+AGC designs, the integrated approach saves ROSA PCB real-estate.
Recommended
Next-Generation 800G Reference Designs
Although the GX36220 is spec'd at 2x64 Gb/s for 400G, it is widely deployed as the building block of 800G reference designs that pair multiple GX36220 dies with multiplexing optics. Its matched-die symmetry allows two coherent ROSAs to feed a single 800G DSP channel pair with balanced I/Q statistics. Engineers designing 800G prototypes in 2026 often stack GX36220 dies for early evaluation before migrating to higher-bandwidth TIA derivatives. The proven SiGe BiCMOS platform reduces qualification risk versus unproven alternatives.
Recommended
Coherent Test & Measurement Equipment
Optical test sets and 400G/600G BERT platforms use coherent receivers to verify transponder performance, and the GX36220's dual linear TIA architecture is well-suited for these instruments. Its broad bandwidth supports multi-format test needs (DP-QPSK through DP-16QAM) without changing front-end hardware. Low input-referred noise ensures that weak reference signals can still be analyzed at acceptable SNR. Pair the GX36220 with a reference coherent DSP and optical source to build lab-grade receivers that mirror production ROSA electrical behavior.
Recommended
Data Center Interconnect (DCI) Coherent Links
Hyperscale data centers increasingly adopt coherent optics for DCI links beyond 80 km. The Renesas GX36220 is used in DCI-class coherent transceivers targeting 400ZR/400ZR+ interoperability. Its matched dual-channel performance supports pluggable coherent modules directly mounted in router/switch line cards. Compared with direct-detect transceivers, coherent DCI links tolerate more fiber impairments and enable higher spectral efficiency. Pair the GX36220 with a ZR-compliant DSP and tunable laser to build a QSFP-DD or CFP2-DCO DCI module.
Recommended
Recommended Products Summary
Engineering reference data for GX36220 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | GX36220-DNT | GX36220-F-DNT | GX36420 | GX39220 |
|---|---|---|---|---|---|
| Brand | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics | Renesas Electronics |
| Package | Bare die (DIE SALE - WAFER) | Bare die (DIE SALE - WAFER) - same | Bare die (DIE SALE - WAFER) - same | Bare die (DIE SALE - WAFER) - same | Bare die (DIE SALE - WAFER) - same |
| Channels | 2 (I+Q) | 2 (I+Q) | 2 (I+Q) | 2 (I+Q) | 2 (I+Q) |
| Per-Channel Data Rate | 32 Gb/s (32 GBaud) | 32 Gb/s | 32 Gb/s | Higher bandwidth variant | Adjacent family - see datasheet |
| Aggregate Bandwidth | 2x64 Gb/s (400G coherent) | 2x64 Gb/s | 2x64 Gb/s | Higher aggregate | Adjacent aggregate |
| Process Technology | SiGe BiCMOS | SiGe BiCMOS | SiGe BiCMOS | SiGe BiCMOS | SiGe BiCMOS (per Renesas family datasheet) |
| Target Application | 400G coherent ROSA | 400G coherent ROSA | 400G coherent ROSA - F variant | Higher-rate coherent ROSA | Coherent/video distribution ROSA |
Key Differentiators
- Dual-channel I+Q coherent TIA on a single matched die (vs Discrete single-channel TIA pair)
- 32 GBaud per-channel bandwidth in SiGe BiCMOS (vs Lower-bandwidth non-coherent TIAs)
- Bare-die format with sub-nH bond-wire compatibility (vs Packaged TIA ICs)
Design Notes
Estimated: because the GX36220 is bare die, every interface is a bond-wire. Keep the host-side differential traces impedance-controlled at 100 Ω differential and route them symmetrically to the I and Q channels. Total bond-wire length on each RF pad should stay below ~0.5 nH to preserve 28 GHz-class bandwidth; longer bonds create a low-pass notch that wipes out the 32 GBaud eye.
The bare-die format requires thermal management at the ROSA hermetic package level. Estimated: assume per-channel power around ~150 mW (verify in datasheet), so total die dissipation is roughly 300 mW for dual-channel operation. Mount the die on a controlled-impedance ceramic sub-mount with sufficient thermal vias to the ROSA housing. Inadequate thermal sinking pushes SiGe junction temperatures into derating territory, raising noise floor and worsening 400G OSNR margin.
Do not attempt to substitute a non-Renesas coherent TIA on the same die footprint; pad pitch and DC bias networks differ between vendors and re-bonding is non-trivial. Also avoid running the GX36220 outside its specified supply range; the input stage is sensitive and misbiasing can permanently shift the gain curve. Confirm the latest datasheet revision with Renesas before finalizing PCB layout or ROSA package drawings.
Compliance Information
Compliance data was not present in the verified web data; bare-die parts from Renesas typically ship with full RoHS/REACH/conformant documentation under standard order terms but specific attestations should be requested from Renesas at PO time.
