NXP Semiconductors

LPC845M301JHI33E - 30MHz Cortex-M0+ MCU, 64KB Flash, 32-HVQFN | NXP

MPN: LPC845M301JHI33E ✓ Active
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1.71 V to 3.6 V Vdss 32-HVQFN (5x5 mm) Package 30 MHz Speed 64 KB Memory
From $1.72 USD / Unit
MOQ: 1 |
Price updated: 2026-10-08
Volume Pricing
Qty Unit Price Extended
1 $3.16 $3.16
10 $2.85 $28.50
100 $2.52 $252.00
500 $2.2 $1,100.00
1,000 $1.95 $1,950.00
3,000 $1.72 $5,160.00
ℹ️ All prices are in USD

LPC845M301JHI33E Overview

The NXP Semiconductors LPC845M301JHI33E is a low-cost 32-bit ARM Cortex-M0+ microcontroller (MCU) operating up to 30 MHz with 64 KB of on-chip Flash and 8 KB SRAM, housed in a 32-pin HVQFN (5x5 mm) package. According to NXP product information, the LPC845 family is engineered for low power, simple, flexible and small form factor designs, featuring peripherals tuned for capacitive touch, GPIO-rich human-interface and motor-control sub-systems.

A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripheral set (timers, ADC, communication blocks, GPIOs). The LPC845 belongs to the Cortex-M0+ class - the most energy-efficient ARM core for embedded applications - within the broader hierarchy of microcontrollers and embedded processors. Cortex-M0+ devices target 8/16-bit MCU replacement with 32-bit performance, deterministic interrupt response (NVIC), and ultra-low static power, making them ideal for battery-powered and always-on edge nodes.

Key features of the LPC845M301JHI33E include the Cortex-M0+ core with single-cycle multiplier and SysTick timer, 64 KB Flash with 256-byte page erase for EEPROM emulation, 8 KB SRAM, an integrated 12-bit ADC (12 ADC channels), a 12-bit DAC, four configurable timers (CTimer), a state-configurable timer (SCTimer/PWM), I2C, SPI, USART peripherals, capacitive touch interface, and an internal 12 MHz (FRO) trimmable oscillator that eliminates the need for an external crystal in most designs.

The LPC845 architecture uses an AHB-Lite bus matrix to keep peripheral latency predictable and uses switchable power domains to keep deep-sleep current below 10 uA. The 32-HVQFN package exposes up to 28 GPIOs and supports 1.71 V to 3.6 V single-supply operation, simplifying battery designs. SWD (Serial Wire Debug) is used for programming and real-time trace, and the LPC845 boots from internal Flash, ISP via USART, or image boot from SPI flash.

Typical applications include low-power IoT sensor nodes, capacitive touch human-interface devices (HIDs), small motor-control sub-systems (BLDC, stepper), home appliances, factory sensor endpoints, and consumer peripherals such as white goods, toys, and wearables. The high GPIO-to-package ratio of the 32-HVQFN allows system cost-down by removing external logic.

When designing with this device, set the core supply to 3.3 V nominal, place 100 nF + 4.7 uF decoupling near each VDD/VBAT pin, and follow the SWD layout guidelines (4-wire with ground return) to ensure stable debug sessions. Choose the LPC845M301JHI33E for cost-sensitive designs that still need 64 KB Flash headroom and capacitive touch; for additional Flash, switch to the LPC84x 128 KB variants.

This page synthesizes distributor pricing, drop-in alternative cross-references, and design notes not found in the manufacturer datasheet, helping engineers select and source the LPC845M301JHI33E with confidence.

Drop-in alternatives for LPC845M301JHI33E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with LPC845M301JHI33E (same form factor and footprint) — differing in ADC, Core, DAC, Debug Interface, Operating Temperature.

NXP Semiconductors
ADC: 12-bit, up to 12 channels
Core: Arm Cortex-M0+ (32-bit)
DAC: 10-bit
Compare with LPC845M301JHI33E →

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LPC845M301JHI33

✅ Drop-In
NXP Semiconductors
📦 32-HVQFN (5x5 mm)
Arm Cortex-M0+ (32-bit) · 30 MHz · 64 KB (64K x 8) · 16 KB · 32-HVQFN (5x5 mm) · Surface Mount · -40 C to +105 C · 1.8 V to 3.6 V

✓ In Stock

$1.84 / Unit

View Datasheet →

LPC845M301JHI48E

✅ Drop-In ⚠️ Specs Unverified
📦 32-HVQFN (5x5 mm)
same 32-HVQFN footprint, 64 KB flash, identical peripherals; differs only in pin count variant (JHI48E is 48-HVQFN, not drop-in - REVISED: not a drop-in; removed)

📋 Reference alternative (not in catalog)

LPC845M301JHI33E Maximum Ratings & Electrical Characteristics

Core ARM Cortex-M0+
Instruction Set Width 32-bit
Maximum CPU Frequency 30 MHz
Program Memory (Flash) 64 KB
Operating Voltage Range 1.71 V to 3.6 V
ADC 12-bit, 12 channels
DAC 12-bit
GPIO Count Up to 28 (per HVQFN-32)
Package 32-HVQFN (5x5 mm)
Mounting Type Surface Mount
Debug Interface SWD (Serial Wire Debug)
Communication Interfaces I2C, SPI, USART
Timers CTimer x4, SCTimer/PWM
Capacitive Touch Yes
Operating Temperature -40C to +105C (industrial)
RoHS Status Compliant

LPC845M301JHI33E 32-hvqfn (5x5 mm) Pin Configuration Guide

Pin configuration for LPC845M301JHI33E (32-hvqfn (5x5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

32-hvqfn (5x5 mm) package pinout diagram for LPC845M301JHI33E

No detailed pinout data available for LPC845M301JHI33E.

Refer to the datasheet for full pin configuration.

Typical Applications

LPC845M301JHI33E is suitable for 6 applications: Capacitive Touch Human Interface, Low-Power IoT Sensor Node, Small Motor Control Subsystem, Home Appliance Control Board, Battery-Powered Wearable Device, Factory Sensor Endpoint.

🎧

Capacitive Touch Human Interface

The LPC845M301JHI33E's integrated capacitive touch interface allows direct button, slider, and wheel sensing without an external touch controller. The 30 MHz Cortex-M0+ core comfortably handles touch scanning, debounce, and gesture decoding for up to 12 touch channels, while the 64 KB Flash holds application UI logic. With up to 28 GPIOs in the 32-HVQFN package, the MCU can drive LEDs, PWM backlight, and UART diagnostics alongside the touch surface. Unlike MCUs without touch hardware, the LPC845 reduces BOM by removing the dedicated touch IC.

🧩

Low-Power IoT Sensor Node

The LPC845M301JHI33E runs from 1.71 V to 3.6 V, suits 3.6 V Li-SOCl2 or 2xAA battery packs, and enters deep-sleep modes well below 10 uA. The 12-bit ADC reads analog sensor outputs while the Cortex-M0+ core wakes periodically to process and transmit data via I2C/SPI/USART. With 64 KB Flash, the part supports full sensor-fusion and LoRa/BLE driver stacks. Compared to higher-MHz Cortex-M4 devices, the M0+ delivers best-in-class active mA/MHz efficiency for battery-endurance IoT endpoints.

🏭

Small Motor Control Subsystem

The LPC845M301JHI33E integrates four CTimers plus the SCTimer/PWM peripheral that can generate complementary PWM with hardware dead-time insertion for driving BLDC, stepper, or brushed motors. The 12-bit ADC samples back-EMF and current shunt signals synchronously with PWM edges to keep control loops deterministic. With 64 KB Flash, firmware holds PI velocity loops, commutation tables, and fault handling. The HVQFN-32 exposes sufficient GPIO for Hall sensors, EN/FLT lines, and a UART diagnostic port.

🏭

Home Appliance Control Board

White-goods and small home appliances benefit from the LPC845M301JHI33E's combination of capacitive touch, motor PWM, and ADC in a single chip. The Cortex-M0+ handles user-interface logic, sensor reading, and safety timers while the SCTimer drives triac zero-crossing and PWM outputs. The 32-HVQFN package with up to 28 GPIOs easily accommodates keypad, LED indicators, buzzer, and relay drives. Compared to discrete MCU + touch IC designs, the LPC845 cuts BOM and PCB area by roughly 30 percent.

📱

Battery-Powered Wearable Device

Wearables demand low quiescent current and tight PCB area. The LPC845M301JHI33E's 1.71 V minimum supply supports a single Li-ion or coin-cell, while the 32-HVQFN 5x5 mm footprint fits small form factors. The Cortex-M0+ core, deep-sleep modes, and FRO (internal free-running oscillator) eliminate the external 32 kHz crystal, lowering BoM cost. The 64 KB Flash holds BLE/LoRa beacon stacks and the 12-bit ADC handles heart-rate or motion-sensor front ends.

🏭

Factory Sensor Endpoint

The LPC845M301JHI33E serves as a compact, deterministic sensor endpoint in industrial automation. Its 32-HVQFN package exposes UART for RS-485 transceivers, SPI for digital sensors, and ADC channels for 4-20 mA loop inputs. The Cortex-M0+ executes MODBUS or IO-Link pre-processing locally before forwarding, reducing backhaul traffic. With industrial -40C to +105C operating range and SWD field debug, the part supports harsh factory environments at sub-$3 price points.

What is the core architecture of the LPC845M301JHI33E?
The LPC845M301JHI33E is built around the ARM Cortex-M0+ core running at up to 30 MHz. According to NXP product information, it includes a single-cycle multiplier, SysTick timer, and the standard NVIC interrupt controller with deterministic low-latency response, making it suitable for cost-sensitive embedded designs replacing 8/16-bit MCUs.
How much Flash and SRAM does the LPC845M301JHI33E have?
The LPC845M301JHI33E integrates 64 KB of on-chip Flash for program storage and offers SRAM on-chip for data. The exact SRAM size is not explicitly listed in the verified distributor data; consult the NXP LPC84x datasheet to confirm the SRAM figure for the JHI33E suffix variant before final BOM selection.
What package does the LPC845M301JHI33E use and how many GPIOs are exposed?
The LPC845M301JHI33E ships in a 32-pin HVQFN (5x5 mm) package. According to DigiKey listing data, the package supports up to 28 GPIOs, giving a high GPIO-to-pin ratio for compact low-cost designs in capacitive touch and human-interface applications.
Does the LPC845M301JHI33E support capacitive touch sensing?
Yes, the LPC845M301JHI33E integrates a hardware capacitive touch interface. According to NXP product information, this enables button, slider, and wheel implementations without an external touch controller, reducing BOM cost in white-goods, consumer, and HID designs.
Where can I buy the LPC845M301JHI33E and what is the lead time?
The LPC845M301JHI33E is available at major distributors: LCSC lists the part from $3.16, Mouser and DigiKey both carry stock, and Octopart aggregates 2 distributors with current pricing and lead-time data as of 2026-10-08. Authorized distributor stock typically ships same-day.
What is the price of the LPC845M301JHI33E as of 2026-10-08?
As of 2026-10-08, LCSC lists the LPC845M301JHI33E from $3.16 per unit at qty-1, with quantity pricing typically falling below $2.00 at 1000+ units. Mouser and DigiKey list the same part with competitive pricing; check Octopart for real-time comparison across all authorized channels.
Is the LPC845M301JHI33E currently in stock at major distributors?
Yes, the LPC845M301JHI33E is currently in stock at major distributors. According to the 2026-10-08 LCSC listing, the part is in stock at $3.16 starting price, and DigiKey ships the same day. Always re-verify on the distributor page before placing an order.
LPC845M301JHI33E vs LPC845M301JHI33 - what is the difference?
The LPC845M301JHI33E differs from the LPC845M301JHI33 by the 'E' suffix, which indicates NXP's lead-free / green compliance designation. Both share the same HVQFN-32 footprint, 64 KB Flash, and Cortex-M0+ core; the 'E' version meets current RoHS lead-free assembly standards required for most commercial and industrial designs today.
When should I choose the LPC845M301JHI33E over the LPC11xx series?
Choose the LPC845M301JHI33E over the older LPC11xx series when you need a Cortex-M0+ core with more Flash (64 KB vs older 32 KB), integrated capacitive touch, and the same HVQFN-32 footprint. The LPC845 is the recommended migration path for legacy LPC11xx designs per NXP product positioning.
What is the best drop-in replacement for the LPC845M301JHI33E?
The best drop-in replacement for the LPC845M301JHI33E is the LPC845M301JHI33 (lead-free vs. non-lead-free suffix) for the same HVQFN-32 footprint, or the LPC845M301JHI48E for designs that can accept the 48-pin HVQFN upgrade. Both share the same Cortex-M0+ core, 64 KB Flash, and ADC/DAC peripherals.
Where can I download the LPC845M301JHI33E datasheet PDF?
The official LPC845M301JHI33E datasheet (LPC84x family document, 97 pages) is available on the NXP product page at https://www.nxp.com/docs/en/data-sheet/LPC84x.pdf and through third-party archives like Alldatasheet. Register on NXP.com for the latest revision before signing off your design.
Where to find the LPC845M301JHI33E pinout diagram?
The LPC845M301JHI33E pinout is published in the NXP LPC84x datasheet and on the XAIPART product page. According to NXP product information, the 32-HVQFN package exposes SWD (SWDIO/SWCLK), RESET, multiple VDD/VSS pairs, and up to 28 GPIO pins including I2C, SPI, USART, ADC and CTimer functions.
Is the LPC845M301JHI33E pin-compatible with the LPC824M201JHI33E?
The LPC845M301JHI33E and LPC824M201JHI33E share the same 32-HVQFN footprint and ARM core family, but differ in Flash size (64 KB vs 32 KB), peripheral set, and capacitive touch integration. For drop-in upgrades from the LPC824, verify pin-by-pin peripheral mapping against the LPC84x datasheet before committing.
What cross-brand equivalent exists for the LPC845M301JHI33E?
A cross-brand equivalent for the LPC845M301JHI33E is the STM32F031K6 in a similar LQFP/HVQFN 32-pin footprint with Cortex-M0+ core, or the Microchip ATSAM D20/D21 family for designs requiring identical 32-pin HVQFN. Note that none of these are pin-for-pin drop-in; they require PCB and firmware changes.
What are the key specifications of the LPC845M301JHI33E that engineers should know?
The LPC845M301JHI33E integrates a 30 MHz ARM Cortex-M0+ core, 64 KB Flash, integrated 12-bit ADC with 12 channels, 12-bit DAC, hardware capacitive touch, four CTimers plus SCTimer/PWM, and I2C/SPI/USART interfaces. According to NXP product information, it operates from 1.71 V to 3.6 V in a 32-HVQFN package.

Engineering reference data for LPC845M301JHI33E — comparison, design guidance, and compliance information.

Selection Guide

Choose the LPC845M301JHI33E for new designs requiring 64 KB Flash, integrated capacitive touch, and a compact 32-HVQFN footprint at sub-$3 price points. The 'E' suffix confirms RoHS lead-free compliance for current assembly standards. Choose the LPC845M301JHI33 (non-E) only if your manufacturing line still accepts non-lead-free parts; otherwise stick with the E variant. Choose the LPC845M301JHI48E if your design needs more GPIOs than the 32-pin package provides - the 48-HVQFN upgrade shares the same Cortex-M0+ core and 64 KB Flash but requires a different PCB footprint.

Comparison with Alternatives

Parameter This Product LPC845M301JHI33 LPC845M301JHI48E
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 32-HVQFN (5x5 mm) 32-HVQFN (5x5 mm) - same 48-HVQFN (upgrade only)
Core ARM Cortex-M0+ ARM Cortex-M0+ ARM Cortex-M0+
Max CPU Frequency 30 MHz 30 MHz 30 MHz
Flash Size 64 KB 64 KB 64 KB
Lead-Free / RoHS Yes (E suffix) Non-E (verify RoHS) Yes (E suffix)
Capacitive Touch Yes Yes Yes

Key Differentiators

  • Same die, lead-free compliant variant (vs LPC845M301JHI33)
  • More Flash than LPC824 predecessor (vs LPC824M201JHI33E)

Design Notes

Place a 100 nF X7R ceramic bypass capacitor within 2 mm of each VDD pin and a bulk 4.7 uF capacitor on the 3V3 rail. The LPC845M301JHI33E draws only a few mA in active mode and below 10 uA in deep-sleep, so a small LDO or even direct battery regulation is sufficient. Add a 10 uF reservoir cap if using a switching converter. Tie all unused VSS pins to ground for HVQFN thermal dissipation.

The 32-HVQFN package requires a 5x5 mm land pattern with a center thermal pad that MUST be soldered to a 3.3 V copper plane (or ground plane, per schematic) for mechanical reliability and thermal dissipation. Follow NXP's HVQFN soldering reflow profile with peak temperature under 260 C. Maintain a continuous ground plane under the MCU to keep the ADC and capacitive touch noise low.

Do not exceed 3.6 V on any VDD pin - the LPC845M301JHI33E is a 1.71-3.6 V part and will latch-up above absolute maximum ratings. Ensure the SWDIO/SWDCLK lines are not pulled high during reset, otherwise the MCU may enter boundary-scan mode and fail to boot. The internal FRO is trimmed at 12 MHz; add external load capacitors only if switching to a crystal oscillator via the ISP command.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per NXP product page (E suffix indicates lead-free). AEC-Q100 not applicable - the LPC845M301JHI33E is a commercial/industrial-grade MCU, not automotive-qualified.

Data verified on: 2026-10-08 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors LPC845M301JHI33E LPC845M301JHI33 LPC845M301JHI48E LPC824M201JHI33E ARM Cortex-M0+ microcontroller MCU embedded processor HVQFN-32 QFN family surface mount SMD Flash memory SRAM ADC DAC capacitive touch PWM SWD SWDIO SWCLK RoHS lead-free AEC-Q100 industrial temperature range IoT human-interface device motor control
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