LPC845M301JHI33E - 30MHz Cortex-M0+ MCU, 64KB Flash, 32-HVQFN | NXP
MPN： LPC845M301JHI33E ✓ 啟用中LPC845M301JHI33E 概覽
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripheral set (timers, ADC, communication blocks, GPIOs). The LPC845 belongs to the Cortex-M0+ class - the most energy-efficient ARM core for embedded applications - within the broader hierarchy of microcontrollers and embedded processors. Cortex-M0+ devices target 8/16-bit MCU replacement with 32-bit performance, deterministic interrupt response (NVIC), and ultra-low static power, making them ideal for battery-powered and always-on edge nodes.
Key features of the LPC845M301JHI33E include the Cortex-M0+ core with single-cycle multiplier and SysTick timer, 64 KB Flash with 256-byte page erase for EEPROM emulation, 8 KB SRAM, an integrated 12-bit ADC (12 ADC channels), a 12-bit DAC, four configurable timers (CTimer), a state-configurable timer (SCTimer/PWM), I2C, SPI, USART peripherals, capacitive touch interface, and an internal 12 MHz (FRO) trimmable oscillator that eliminates the need for an external crystal in most designs.
The LPC845 architecture uses an AHB-Lite bus matrix to keep peripheral latency predictable and uses switchable power domains to keep deep-sleep current below 10 uA. The 32-HVQFN package exposes up to 28 GPIOs and supports 1.71 V to 3.6 V single-supply operation, simplifying battery designs. SWD (Serial Wire Debug) is used for programming and real-time trace, and the LPC845 boots from internal Flash, ISP via USART, or image boot from SPI flash.
Typical applications include low-power IoT sensor nodes, capacitive touch human-interface devices (HIDs), small motor-control sub-systems (BLDC, stepper), home appliances, factory sensor endpoints, and consumer peripherals such as white goods, toys, and wearables. The high GPIO-to-package ratio of the 32-HVQFN allows system cost-down by removing external logic.
When designing with this device, set the core supply to 3.3 V nominal, place 100 nF + 4.7 uF decoupling near each VDD/VBAT pin, and follow the SWD layout guidelines (4-wire with ground return) to ensure stable debug sessions. Choose the LPC845M301JHI33E for cost-sensitive designs that still need 64 KB Flash headroom and capacitive touch; for additional Flash, switch to the LPC84x 128 KB variants.
This page synthesizes distributor pricing, drop-in alternative cross-references, and design notes not found in the manufacturer datasheet, helping engineers select and source the LPC845M301JHI33E with confidence.
直接替換替代品，適用於 LPC845M301JHI33E — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
此系列的變體
與下列產品可直接替換的同系列型號： LPC845M301JHI33E （相同外形與佔位） — 差異在於 ADC, Core, DAC, Debug Interface, Operating Temperature.
LPC845M301JHI33
✅ 直接替換聯絡詢價
查看資料表 →LPC845M301JHI48E
✅ 直接替換 ⚠️ 規格未經驗證📋 參考替代品（不在目錄中）
LPC845M301JHI33E 最大額定值與電氣特性
| Core | ARM Cortex-M0+ |
| Instruction Set Width | 32-bit |
| Maximum CPU Frequency | 30 MHz |
| Program Memory (Flash) | 64 KB |
| Operating Voltage Range | 1.71 V to 3.6 V |
| ADC | 12-bit, 12 channels |
| DAC | 12-bit |
| GPIO Count | Up to 28 (per HVQFN-32) |
| 封裝 | 32-HVQFN (5x5 mm) |
| 安裝類型 | Surface Mount |
| Debug Interface | SWD (Serial Wire Debug) |
| Communication Interfaces | I2C, SPI, USART |
| Timers | CTimer x4, SCTimer/PWM |
| Capacitive Touch | Yes |
| 工作溫度 | -40C to +105C (industrial) |
| RoHS 狀態 | Compliant |
LPC845M301JHI33E 32-hvqfn (5x5 mm) 腳位配置指南
LPC845M301JHI33E（32-hvqfn (5x5 mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： LPC845M301JHI33E.
請參閱 資料表 以查看完整腳位配置。
典型應用
LPC845M301JHI33E 適用於 6 應用s: Capacitive Touch Human Interface, Low-Power IoT Sensor Node, Small Motor Control Subsystem, Home Appliance Control Board, Battery-Powered Wearable Device, Factory Sensor Endpoint.
Capacitive Touch Human Interface
The LPC845M301JHI33E's integrated capacitive touch interface allows direct button, slider, and wheel sensing without an external touch controller. The 30 MHz Cortex-M0+ core comfortably handles touch scanning, debounce, and gesture decoding for up to 12 touch channels, while the 64 KB Flash holds application UI logic. With up to 28 GPIOs in the 32-HVQFN package, the MCU can drive LEDs, PWM backlight, and UART diagnostics alongside the touch surface. Unlike MCUs without touch hardware, the LPC845 reduces BOM by removing the dedicated touch IC.
推薦
Low-Power IoT Sensor Node
The LPC845M301JHI33E runs from 1.71 V to 3.6 V, suits 3.6 V Li-SOCl2 or 2xAA battery packs, and enters deep-sleep modes well below 10 uA. The 12-bit ADC reads analog sensor outputs while the Cortex-M0+ core wakes periodically to process and transmit data via I2C/SPI/USART. With 64 KB Flash, the part supports full sensor-fusion and LoRa/BLE driver stacks. Compared to higher-MHz Cortex-M4 devices, the M0+ delivers best-in-class active mA/MHz efficiency for battery-endurance IoT endpoints.
推薦
Small Motor Control Subsystem
The LPC845M301JHI33E integrates four CTimers plus the SCTimer/PWM peripheral that can generate complementary PWM with hardware dead-time insertion for driving BLDC, stepper, or brushed motors. The 12-bit ADC samples back-EMF and current shunt signals synchronously with PWM edges to keep control loops deterministic. With 64 KB Flash, firmware holds PI velocity loops, commutation tables, and fault handling. The HVQFN-32 exposes sufficient GPIO for Hall sensors, EN/FLT lines, and a UART diagnostic port.
推薦
Home Appliance Control Board
White-goods and small home appliances benefit from the LPC845M301JHI33E's combination of capacitive touch, motor PWM, and ADC in a single chip. The Cortex-M0+ handles user-interface logic, sensor reading, and safety timers while the SCTimer drives triac zero-crossing and PWM outputs. The 32-HVQFN package with up to 28 GPIOs easily accommodates keypad, LED indicators, buzzer, and relay drives. Compared to discrete MCU + touch IC designs, the LPC845 cuts BOM and PCB area by roughly 30 percent.
推薦
Battery-Powered Wearable Device
Wearables demand low quiescent current and tight PCB area. The LPC845M301JHI33E's 1.71 V minimum supply supports a single Li-ion or coin-cell, while the 32-HVQFN 5x5 mm footprint fits small form factors. The Cortex-M0+ core, deep-sleep modes, and FRO (internal free-running oscillator) eliminate the external 32 kHz crystal, lowering BoM cost. The 64 KB Flash holds BLE/LoRa beacon stacks and the 12-bit ADC handles heart-rate or motion-sensor front ends.
推薦
Factory Sensor Endpoint
The LPC845M301JHI33E serves as a compact, deterministic sensor endpoint in industrial automation. Its 32-HVQFN package exposes UART for RS-485 transceivers, SPI for digital sensors, and ADC channels for 4-20 mA loop inputs. The Cortex-M0+ executes MODBUS or IO-Link pre-processing locally before forwarding, reducing backhaul traffic. With industrial -40C to +105C operating range and SWD field debug, the part supports harsh factory environments at sub-$3 price points.
推薦
推薦產品摘要
工程參考資料，適用於 LPC845M301JHI33E — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | LPC845M301JHI33 | LPC845M301JHI48E |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-HVQFN (5x5 mm) | 32-HVQFN (5x5 mm) - same | 48-HVQFN (upgrade only) |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Max CPU Frequency | 30 MHz | 30 MHz | 30 MHz |
| Flash Size | 64 KB | 64 KB | 64 KB |
| Lead-Free / RoHS | Yes (E suffix) | Non-E (verify RoHS) | Yes (E suffix) |
| Capacitive Touch | Yes | Yes | Yes |
主要差異化特點
- Same die, lead-free compliant variant (對比LPC845M301JHI33)
- More Flash than LPC824 predecessor (對比LPC824M201JHI33E)
設計說明
Place a 100 nF X7R ceramic bypass capacitor within 2 mm of each VDD pin and a bulk 4.7 uF capacitor on the 3V3 rail. The LPC845M301JHI33E draws only a few mA in active mode and below 10 uA in deep-sleep, so a small LDO or even direct battery regulation is sufficient. Add a 10 uF reservoir cap if using a switching converter. Tie all unused VSS pins to ground for HVQFN thermal dissipation.
The 32-HVQFN package requires a 5x5 mm land pattern with a center thermal pad that MUST be soldered to a 3.3 V copper plane (or ground plane, per schematic) for mechanical reliability and thermal dissipation. Follow NXP's HVQFN soldering reflow profile with peak temperature under 260 C. Maintain a continuous ground plane under the MCU to keep the ADC and capacitive touch noise low.
Do not exceed 3.6 V on any VDD pin - the LPC845M301JHI33E is a 1.71-3.6 V part and will latch-up above absolute maximum ratings. Ensure the SWDIO/SWDCLK lines are not pulled high during reset, otherwise the MCU may enter boundary-scan mode and fail to boot. The internal FRO is trimmed at 12 MHz; add external load capacitors only if switching to a crystal oscillator via the ISP command.
合規資訊
RoHS compliant per NXP product page (E suffix indicates lead-free). AEC-Q100 not applicable - the LPC845M301JHI33E is a commercial/industrial-grade MCU, not automotive-qualified.
