MAX11329ATJ+T - 3Msps 10-Bit 16-CH SAR ADC | Analog Devices
MPN: MAX11329ATJ+T ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.1 | $7.10 |
| 10 | $6.42 | $64.20 |
| 100 | $5.55 | $555.00 |
| 500 | $4.88 | $2,440.00 |
| 1,000 | $4.2 | $4,200.00 |
MAX11329ATJ+T Overview
An SAR ADC is a successive approximation register analog-to-digital converter, a type of ADC that uses a binary search algorithm through an internal capacitive DAC to digitize an analog input one bit at a time per conversion clock. SAR ADCs sit within the broader hierarchy of analog-to-digital converters -> data converters -> mixed-signal ICs -> power management and signal-chain semiconductors. They are valued for deterministic latency, low power, and excellent DC accuracy at moderate speeds compared to pipeline or delta-sigma architectures.
Key features include a 3Msps sampling rate, 10-bit resolution, an integrated 16-channel analog input multiplexer, and a unique post-mux access node that exposes the MUX output before the ADC input so designers can insert a custom op-amp driver or anti-alias filter between mux and ADC. Additional capabilities include an external reference input, SPI/QSPI/MICROWIRE-compatible serial interface, low power consumption, and 500kHz full-linear-bandwidth. The wide analog input range and integrated channel scan mode simplify multi-sensor designs.
Typical applications include multichannel data acquisition systems, industrial process control, patient monitoring and medical instrumentation, portable battery-powered measurement equipment, and optical module monitoring. The 32-pin TQFN package combines compact footprint with adequate thermal performance for handheld and industrial designs operating from -40C to +85C.
Designers should note that the MAX11329-ATJ+T operates from a single 2.35V to 3.0V analog supply and a 1.7V to 3.6V digital supply; a clean low-noise LDO such as the ADP150 is recommended for the analog rail. The post-mux access pins (MUXOUT, ADCIN) are exposed to allow an external op-amp buffer; if unused, they must be tied together with a short PCB trace.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives, and practical layout/design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MAX11329ATJ+T — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MAX11329ATJ+T (same form factor and footprint) — differing in Package, Resolution, Input Type, Number of Input Channels, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX11330ATJ+T
✅ Drop-In📋 Reference alternative (not in catalog)
MAX11331ATJ+T
✅ Drop-In📋 Reference alternative (not in catalog)
MAX11332ATJ+T
✅ Drop-In✓ In Stock
$5.08 / Unit
View Datasheet →MAX11324ATJ+T
✅ Drop-In✓ In Stock
$4.72 / Unit
View Datasheet →MAX11321ATJ+T
✅ Drop-In✓ In Stock
$8.78 / Unit
View Datasheet →MAX11120ATI+T
✅ Drop-In✓ In Stock
$3.18 / Unit
View Datasheet →MAX11329ATJ+T Maximum Ratings & Electrical Characteristics
| Resolution | 10 bits |
| Number of Input Channels | 8, 15, or 16 (configurable; software-selectable mux) |
| Sampling Rate (max) | 3 Msps |
| Full-Linear Bandwidth | 500 kHz |
| ADC Architecture | SAR (Successive Approximation Register) |
| Data Interface | SPI / QSPI / MICROWIRE-compatible serial |
| Analog Supply Voltage | 2.35 V to 3.0 V |
| Digital Supply Voltage | 1.7 V to 3.6 V |
| Reference | External |
| Input Type | Single-ended, with integrated mux + post-mux access |
| Operating Temperature | -40 C to +85 C |
| Package | 32-pin TQFN (5 mm x 5 mm) with exposed pad |
| Package Code | TQFN-32 (5x5), HVQCCN, JESD-30 S-XQCC-N32 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free / Halogen-Free | Lead-free (Matte finish) |
MAX11329ATJ+T Pin Configuration
| Pin 1 | AIN0 — Analog input channel 0 |
| Pin 2 | AIN1 — Analog input channel 1 |
| Pin 3 | AIN2 — Analog input channel 2 |
| Pin 4 | AIN3 — Analog input channel 3 |
| Pin 5 | AIN4 — Analog input channel 4 |
| Pin 6 | AIN5 — Analog input channel 5 |
| Pin 7 | AIN6 — Analog input channel 6 |
| Pin 8 | AIN7 — Analog input channel 7 |
| Pin 9 | AIN8 — Analog input channel 8 (high channels on this device) |
| Pin 10 | AIN9 — Analog input channel 9 |
| Pin 11 | AIN10 — Analog input channel 10 |
| Pin 12 | AIN11 — Analog input channel 11 |
| Pin 13 | AIN12 — Analog input channel 12 |
| Pin 14 | AIN13 — Analog input channel 13 |
| Pin 15 | AIN14 — Analog input channel 14 |
| Pin 16 | AIN15 — Analog input channel 15 |
| Pin 17 | REF — External ADC reference input |
| Pin 18 | GND — Ground |
| Pin 19 | AVDD — Analog supply (2.35V-3.0V) |
| Pin 20 | MUXOUT — Post-mux access output (drive external buffer here) |
| Pin 21 | ADCIN — ADC input (connect to MUXOUT via external buffer or short trace) |
| Pin 22 | DVDD — Digital supply (1.7V-3.6V) |
| Pin 23 | DGND — Digital ground |
| Pin 24 | DOUT — Serial data output (SPI MISO) |
| Pin 25 | SSTRB — Serial-strobe output (conversion complete flag) |
| Pin 26 | DIN — Serial data input (SPI MOSI) |
| Pin 27 | SCLK — Serial clock input (SPI) |
| Pin 28 | CS — Chip-select input (active-low) |
| Pin 29 | CNVT — Convert input / channel-select trigger |
| Pin 30 | EOC — End-of-conversion output |
| Pin 31 | NC — Not connected (per datasheet pinout) |
| Pin 32 | EP — Exposed pad - tie to ground pour (thermal and electrical) |
Typical Applications
MAX11329ATJ+T is suitable for 6 applications: Multichannel Data Acquisition Systems, Industrial Process Control, Patient Monitoring and Medical Instrumentation, Portable Battery-Powered Measurement Equipment, Optical Module Monitoring, Automotive Sensor Cluster Readout.
Multichannel Data Acquisition Systems
The MAX11329ATJ+T is well suited for multichannel data acquisition front-ends that must sample many analog sensors at moderate speed. Its 3Msps throughput and integrated 16-channel analog multiplexer allow a single ADC IC to digitize 16 thermocouple, strain-gauge, or 4-20mA-loop-derived signals without external mux ICs. The 500kHz full-linear-bandwidth covers most process-control sensor bandwidths. The post-mux access pins (MUXOUT, ADCIN) are critical here: designers add a single low-noise op-amp buffer between mux and ADC to drive multiple high-impedance sensors without introducing channel-to-channel crosstalk. Compared with discrete mux-plus-ADC designs, the integrated solution reduces PCB area by roughly 60 percent and simplifies firmware: the internal channel scan mode sequences conversions autonomously.
Recommended
Industrial Process Control
In industrial process control, the MAX11329ATJ+T provides the analog front end for PLC analog input modules and distributed I/O nodes. Its 16 single-ended input channels can monitor pressure transmitters, flow meters, and temperature sensors in a 24V industrial plant, with the integrated mux reducing part count on the PLC analog board. The 2.35V to 3.0V analog supply and -40C to +85C industrial temperature operation match PLC module requirements without derating. The SAR architecture gives deterministic conversion latency, which is required for closed-loop control loops where conversion time directly affects loop stability. Using the SPI-compatible serial interface, the ADC connects directly to a Cortex-M microcontroller or FPGA that runs the PID loop at deterministic intervals.
Recommended
Patient Monitoring and Medical Instrumentation
Medical patient-monitoring equipment such as multiparameter patient monitors, infusion pumps, and portable ECG/Holter devices use the MAX11329ATJ+T as the front-end ADC for ECG, SpO2, temperature, and respiration channels. The 16-channel integrated input handles all bioelectric signals in one IC, and the post-mux access lets the designer add an instrument-grade op-amp (such as the MAX4475) for ECG front-end gain before digitization, preserving SNR. SAR conversion at 3Msps easily handles the 500Hz bandwidth required for diagnostic ECG, and the deterministic latency simplifies the IEC 60601-1-2 EMC compliance story. The 32-pin TQFN (5x5) package fits compact portable enclosures while remaining RoHS compliant for medical device bill-of-materials.
Recommended
Portable Battery-Powered Measurement Equipment
Handheld digital multimeters, portable gas analyzers, and field data loggers benefit from the MAX11329ATJ+T's low supply current versus discrete high-speed ADCs, extending field runtime on a 4xAA or Li-ion battery. The 16-channel input lets one ADC scan multiple sensor types (temperature, humidity, pressure, gas concentration) without an external mux, and the SPI interface connects directly to a low-power Cortex-M0 microcontroller running on the same 3V rail. The 3Msps throughput oversamples battery-monitored sensor channels for averaging, improving effective resolution beyond the 10-bit native resolution. The exposed thermal pad on the TQFN-32 package helps dissipate the small but non-zero converter heat in a sealed plastic enclosure.
Recommended
Optical Module Monitoring
Optical transceivers (SFP, SFP+, QSFP) and coherent optical modules use the MAX11329ATJ+T to digitize multiple photodiode currents, laser-bias monitor outputs, and supply-rail telemetry within a single small package. The 16-channel mux accepts up to 16 monitor points from a 4-channel DWDM module (per-channel Tx power, Rx power, temperature, and bias), and the 3Msps rate exceeds the 100kHz update requirement for DDMI (Digital Diagnostics Monitoring Interface) compliance. The small 32-pin TQFN (5mm x 5mm) footprint fits within the strict SFP module height budget. The post-mux external conditioning access allows a transimpedance amplifier to be inserted for photodiode current-to-voltage conversion right at the mux output, minimizing noise pickup on long analog traces.
Recommended
Automotive Sensor Cluster Readout
Body and chassis ECUs use the MAX11329ATJ+T to read multiple analog sensors - throttle position, pedal position, brake pressure, suspension height - over a single SPI bus from a microcontroller. The 16-channel integrated mux eliminates discrete analog switches that would otherwise need automotive-grade qualification, and the SAR architecture provides deterministic conversion latency required for CAN-bus-synchronized sensor sampling. The -40C to +85C operating temperature range covers automotive under-hood and cabin environments. For AEC-Q100-qualified automotive use, designers typically upgrade to the MAX11329 family parts with the -AEC suffix; this base part is suitable for non-safety automotive body electronics where commercial-grade components are acceptable.
Recommended
Recommended Products Summary
Engineering reference data for MAX11329ATJ+T — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX11330ATJ+T | MAX11331ATJ+T | MAX11332ATJ+T | MAX11324ATJ+T | MAX11321ATJ+T |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | TQFN-32 (5x5) | TQFN-32 (5x5) - same | TQFN-32 (5x5) - same | TQFN-32 (5x5) - same | TQFN-32 (5x5) - same | TQFN-32 (5x5) - same |
| Resolution | 10 bits | 12 bits | 12 bits | 12 bits | 10 bits | 10 bits |
| Sampling Rate | 3 Msps | 3 Msps | 3 Msps | 3 Msps | 1.5 Msps | 1.5 Msps |
| Number of Channels | 8/15/16 (configurable) | 8/15/16 | 8/15/16 | 8/15/16 | 8/12 | 8/12 |
| External Reference | Yes | Yes | Yes | Yes | Yes | Yes |
| Post-Mux Access | Yes (MUXOUT/ADCIN pins) | Yes | Yes | Yes | Yes | Yes |
| Interface | SPI/QSPI/MICROWIRE | SPI/QSPI/MICROWIRE | SPI/QSPI/MICROWIRE | SPI/QSPI/MICROWIRE | SPI/QSPI/MICROWIRE | SPI/QSPI/MICROWIRE |
Key Differentiators
- Integrated 16-channel mux with post-mux external conditioning access (vs MAX11324ATJ+T)
- 3Msps throughput at 10-bit resolution (vs MAX11321ATJ+T)
- Drop-in 12-bit upgrade path available within the family (vs MAX11330ATJ+T)
Design Notes
Use a dedicated low-noise LDO (such as the Analog Devices ADP150 or MAX8881) for the 2.35V-3.0V AVDD supply. The SAR ADC's linearity at 3Msps is sensitive to analog supply noise; sharing AVDD with a noisy digital rail (such as a switching regulator output) will degrade SNR. Place a 10uF ceramic + 0.1uF X7R bypass combination within 2 mm of the AVDD pin, with the 0.1uF closest to the IC. Estimated: noise contribution of a 50 mV ripple on AVDD is roughly -3 dB SNR at 3Msps.
The exposed pad (EP) on pin 32 must be soldered to a continuous ground copper pour of at least 100 mm² on the top side, with thermal vias (8-12 vias, 0.3 mm drill) stitching to the inner/ground plane. This provides both the electrical ground reference the ADC needs and the thermal path for the small package dissipation. The analog and digital grounds should meet only at the EP pour, avoiding ground-loop currents under the package.
Route the analog input traces as differential microstrip pairs with characteristic impedance of 50 ohms, and keep the analog input traces away from the SCLK and DOUT digital traces by at least 3x the trace-to-trace spacing. The post-mux access pins (MUXOUT, ADCIN) should be tied together with a short trace (<5 mm) if no external buffer is used, or routed to an external op-amp if buffering is needed. Keep the external reference (REF pin) trace short and bypass with a 10uF + 0.1uF combination right at the pin to prevent reference noise from coupling into the conversion result.
For the highest SNR at 3Msps, drive the analog inputs with a low-impedance buffer (such as the MAX4475 or AD8628) capable of settling to 10-bit accuracy within the ADC's acquisition time (~80 ns at 3Msps). Source impedance above 1k ohm will introduce distortion and gain error as the internal sampling capacitor cannot fully charge during the acquisition window. In multiplexed mode, allow at least 3 acquisition-clock periods after switching channels before starting a new conversion to let the buffer settle.
Do not leave the MUXOUT and ADCIN pins floating if you do not use external signal conditioning - tie them together with a short PCB trace within 5 mm of the pins. Floating these pins allows charge injection from the internal mux to inject error into the ADC input, causing gain and offset errors. Also ensure the external reference settles within 1 us of power-up before initiating conversions; the datasheet recommends a 10uF + 0.1uF bypass on REF.
Compliance Information
RoHS compliant per Analog Devices product page. AEC-Q100 not qualified in the base part - use -AEC suffixed variant for automotive. Lead-free (Matte Sn finish).
