MAX174BC/D-C10306 - 12-Bit 8μs SAR ADC Die | Maxim Integrated
MPN: MAX174BC/D-C10306 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.8 | $248.00 |
| 100 | $20.15 | $2,015.00 |
| 500 | $17.4 | $8,700.00 |
| 1,000 | $15.2 | $15,200.00 |
MAX174BC/D-C10306 Overview
An ADC (Analog-to-Digital Converter) is a data-acquisition component that converts a continuous analog input voltage into a discrete binary code suitable for digital processing. The SAR (Successive Approximation Register) architecture uses an internal DAC and comparator to resolve one bit per clock cycle, achieving an excellent trade-off between speed, accuracy, and power consumption. Positioned in the broader signal-chain taxonomy, ADCs belong to the data-converter family (ADC/DAC), sit inside the signal-conditioning hierarchy, and ultimately fall under the broader category of mixed-signal semiconductor ICs. Modern SAR ADCs dominate applications in industrial control, instrumentation, and embedded data acquisition.
The MAX174 draws only 175 mW from a +5 V and ±12 V or ±15 V analog supply set, supports unipolar or bipolar input ranges (0 V to +10 V, 0 V to +20 V, ±5 V, ±10 V), and provides three-state output latches for direct bus interfacing to 8-, 12-, or 16-bit microprocessors. A precision buried-zener reference delivers ±10 V or 0 V to +10 V output options. The die-level packaging suits designers who require chip-on-board (CoB) or hybrid assembly for space-constrained or ruggedized systems.
Typical applications span industrial process-control loops, multi-channel data-acquisition front ends, instrumentation front panels, precision sensor signal conditioning, and medical imaging subsystems. Because the MAX174 integrates clock, reference, and output latches, designers can replace multi-chip ADC solutions with a single die, shrinking BOM count and PCB footprint in harsh-environment or miniaturized assemblies.
When designing with the bare-die MAX174BC/D-C10306, pay careful attention to die-handling protocols and ESD safeguards — die-level packaging requires wire bonding or flip-chip attach rather than standard SMT placement. The three-state output bus and MODE pin simplify μP interface design, allowing direct connection to 8-bit data buses without external latches. Pricing references in this page are quoted as of 2026-10-15.
Drop-in alternatives for MAX174BC/D-C10306 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MAX174BC/D-C10306 (same form factor and footprint) — differing in Mounting Type, Package, Architecture, Operating Temperature Range, Output Interface.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX174AEPI
✅ Drop-In✓ In Stock
$17.1 / Unit
View Datasheet →MAX174ACWI
✅ Drop-In✓ In Stock
$12.25 / Unit
View Datasheet →MAX174AEPI+
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →MAX174BEPI
✅ Drop-In✓ In Stock
$8.75 / Unit
View Datasheet →MX574AKN
✅ Drop-In📋 Reference alternative (not in catalog)
MAX174BC/D-C10306 Maximum Ratings & Electrical Characteristics
| Resolution | 12 bit |
| Number of Inputs | 1 |
| Sampling Rate | 125 kSPS |
| Maximum Conversion Time | 8 μs |
| Architecture | SAR (Successive Approximation) |
| Input Type | Single-ended, unipolar or bipolar |
| Input Voltage Ranges | 0 to +10 V, 0 to +20 V, ±5 V, ±10 V |
| Supply Voltage - Positive Analog | +5 V |
| Supply Voltage - Negative Analog | -12 V to -15 V |
| Power Consumption | 175 mW typical |
| On-chip Reference | Buried-zener, ±10 V or 0 to +10 V output |
| On-chip Clock | Yes (internal) |
| Digital Interface | Parallel, three-state latches, μP-compatible (8/12/16-bit) |
| Package | Bare Die (wafer / chip form, no standard package) |
MAX174BC/D-C10306 bare die (wafer / chip form, no standard package) Pin Configuration Guide
Pin configuration for MAX174BC/D-C10306 (bare die (wafer / chip form, no standard package) package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for MAX174BC/D-C10306.
Refer to the datasheet for full pin configuration.
Typical Applications
MAX174BC/D-C10306 is suitable for 7 applications: Industrial Process Control Loops, Multi-Channel Data-Acquisition Front Ends, Precision Sensor Signal Conditioning, Medical Imaging and Patient Monitoring, Legacy Test & Measurement Instrumentation, Aerospace and Defense Hybrid Microcircuits, Precision Weigh-Scale and Force-Measuring Electronics.
Industrial Process Control Loops
The MAX174BC/D-C10306 fits industrial process-control loops because its ±10 V, 0 to +10 V, 0 to +20 V and ±5 V input ranges match the standard output stages of 4-20 mA current-loop receivers, strain-gauge amplifiers, and thermocouple signal conditioners used in PLC analog-input modules. The 12-bit SAR architecture provides ~0.024 % full-scale precision (1 LSB at 10 V ≈ 2.44 mV), more than sufficient for weigh-scale, pH-meter, and flow-rate front-end designs. Conversion completes in 8 μs, allowing multi-channel multiplexing across 8-16 analog inputs at >10 kHz per channel aggregate. Recommend pairing with MAX174AEPI+ (precision op-amp I/V converter) and MAX1302ECQ+ (multi-channel mux).
Recommended
Multi-Channel Data-Acquisition Front Ends
The MAX174BC/D-C10306 is well suited to multi-channel data-acquisition (DAQ) front ends because of its fast 8 μs conversion time (125 kSPS) and three-state parallel output that connects directly to 8/12/16-bit microprocessors without external latches. According to the manufacturer datasheet, the internal clock and reference integration eliminates two external components, shrinking board footprint in PCB real-estate-constrained instruments. The device can be time-multiplexed with a 16:1 analog switch to build 16-channel DAQ front ends sampling at >7 kHz per channel. Recommend pairing with MAX157BCPA (sample/hold front end) and MAX147AEAP (microcontroller-side UART interface).
Recommended
Precision Sensor Signal Conditioning
The MAX174BC/D-C10306 is widely used as the back-end digitizer in precision sensor signal-conditioning chains because the on-chip buried-zener reference provides ±10 V or 0-10 V with low temperature drift, removing the need for external reference ICs in strain-gauge bridge digitizers, pressure-transducer conditioners, and load-cell readouts. According to the manufacturer datasheet, the bipolar input ranges (±5 V, ±10 V) accept the differential outputs of instrumentation amplifiers (e.g. MAX147AEPP+) without DC level shifting. Conversion rate of 125 kSPS is well above the bandwidth of typical industrial sensors. Recommend pairing with MAX146AEAP (precision instrumentation amp) and MAX146AEPP+.
Recommended
Medical Imaging and Patient Monitoring
The MAX174BC/D-C10306 suits medical imaging and patient-monitoring front ends where 12-bit precision and 125 kSPS throughput are sufficient for ultrasound beamformer low-channel counts, ECG digitization, and patient-monitor analog channels. The 175 mW power dissipation is manageable in mains-powered bedside monitors, while the parallel μP interface eases integration into legacy DSP or ARM Cortex-M host processors. Note that the part is supplied as bare die, making it ideal for chip-on-board (CoB) hybrid microcircuits in miniaturized body-worn devices such as Holter recorders. Recommend pairing with MAX135CWI (precision op-amp) and MAX155BEPI+ (dual-channel tracking ADC).
Recommended
Legacy Test & Measurement Instrumentation
The MAX174BC/D-C10306 is a go-to drop-in for legacy bench instruments such as digital voltmeters, bench multimeters, and laboratory waveform recorders where its ±10 V input ranges match the standard front-panel banana-jack ±10 V, 0-10 V, and 0-20 V scales. According to the manufacturer datasheet, the device's three-state output enables direct connection to vintage 8-bit microprocessor buses (8085, Z80) without glue logic. Designers repairing 30-year-old instruments can swap a failed MAX174ADC die with the MAX174BC/D-C10306 without re-designing the front panel. Recommend pairing with MAX165BCWN (precision reference) and MAX165ACWN (precision op-amp).
Recommended
Aerospace and Defense Hybrid Microcircuits
The MAX174BC/D-C10306 is most often selected for aerospace and defense hybrid microcircuits because the bare-die form factor is required for chip-on-board (CoB) assembly into hermetically-sealed hybrid packages used in avionics, radar signal processors, and military radios. According to the manufacturer datasheet, integrating the ADC as bare die reduces mass and volume vs a packaged part — a critical constraint in flight-grade hardware. The 8 μs conversion supports IF-stage digitizer sample rates, and the 175 mW dissipation fits in passive-cooled hybrid enclosures. Recommend pairing with MAX164BMRG/883B (MIL-spec variant) and MAX132CWG+C10203 (military-grade interface).
Recommended
Precision Weigh-Scale and Force-Measuring Electronics
The MAX174BC/D-C10306's 12-bit resolution and ±10 V input span suits precision weigh-scale front ends digitizing load-cell bridge outputs directly without intermediate analog gain stages. According to the manufacturer datasheet, the 8 μs conversion is fast enough to support multi-load-cell multiplexing in truck scales and tank scales with up to 16 platform cells. The on-chip reference eliminates one drift source from the temperature-compensated bridge-read circuit, improving overall accuracy to better than 0.1 % FS typical. Recommend pairing with MAX145ACPA (precision bridge amp) and MAX145BCPA (low-noise post-amplifier).
Recommended
Recommended Products Summary
Engineering reference data for MAX174BC/D-C10306 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX174AEPI | MAX174ACWI | MX574AKN |
|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Package | Bare Die (C/D) | PDIP-28 (PE) - same die | SOIC-28 (CW) - same die | PDIP-28 (KN) - same family |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit |
| Maximum Conversion Time | 8 μs | 8 μs | 8 μs | 25 μs |
| Sampling Rate | 125 kSPS | 125 kSPS | 125 kSPS | 40 kSPS |
| Integral Linearity (INL) | ±1 LSB (B grade) | ±0.5 LSB (A grade) | ±0.5 LSB (A grade) | ±1 LSB |
| Input Voltage Ranges | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V |
| On-chip Reference | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) |
| Power Consumption | 175 mW | 175 mW | 175 mW | 175 mW |
| Lifecycle | Obsolete (bare die) | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Fastest bare-die SAR ADC in the MAX174/MX574A/MX674A family (vs MX574AKN)
- A-grade offers tighter linearity for precision applications (vs MAX174BEPI)
- On-chip reference eliminates external ADR0x reference ICs (vs MX574AKN)
- Bare-die form factor for chip-on-board hybrid assembly (vs MAX174ACWI)
Design Notes
Bare-die parts like the MAX174BC/D-C10306 require chip-on-board (CoB) assembly rather than standard SMT placement. Use ESD-protective waffle or gel-pack handling trays, store dies in nitrogen-purged dry cabinets, and attach gold or aluminum bond wires from each bond pad to corresponding PCB lands. Touching the die top surface with bare fingers will destroy ESD-sensitive bond-pad diodes. Always bond a redundant substrate plane to GND to suppress logic-noise coupling into the analog reference.
The MAX174 requires three separate analog supplies (+5 V, +15 V analog, -15 V analog) plus +5 V digital, with separate ground returns joined only at a single point near the die. Place 0.1 μF ceramic bypass capacitors within 5 mm of each die bond pad to suppress switching transients from the SAR DAC current peaks. Add a 10 μF tantalum bulk capacitor on each supply rail; estimated decoupling effectiveness exceeds 50 dB ripple rejection at 1 MHz when both bypass and bulk caps are co-located. Digital and analog ground planes must remain separate until joined at the system star-ground point.
To preserve 12-bit linearity, the analog input signal path must have impedance below 100 Ω at 100 kHz and trace lengths below 25 mm. Use a precision input driver (e.g. MAX145AEPA or MAX146AEAP) ahead of the die to buffer high-impedance sources; the SAR ADC draws input current spikes during each bit-trial and the resulting glitch energy couples back to the source if it is not low-impedance. Use a ground-layer-and-power-layer PCB stack with the analog and digital sections physically separated to avoid digital-clock-feedthrough into the analog front end.
The MAX174 dissipates 175 mW nominally from its four supply rails, which becomes significant when integrated as bare die into a hybrid microcircuit. Estimated junction temperature rise at 175 mW with a 28-pin PDIP alternative's θJA of ~75 °C/W is 13 °C above ambient — well within datasheet limits. However, in sealed-ceramic or hermetic-hybrid enclosures where ambient can reach 70 °C, sustained junction temperatures above 120 °C may occur. Verify the package thermal-resistance spec for the hybrid package actually used.
Place the input range selection pins (R10, R20, BIP, GAIN) on a dedicated resistor-divider island separate from the digital data-bus traces. The MODE and CS pins require pull-up or pull-down resistors set by the host microprocessor interface protocol — MODE=0 selects 8-bit bus interface, MODE=1 selects 12-bit interface. Route status-flag (STS) lines on a guarded differential pair if the digital host is more than 50 mm away; at 125 kSPS, signal integrity on the STS flag becomes timing-critical for interrupt-driven service routines.
Compliance Information
Compliance information not provided in the verified web data for the MAX174BC/D-C10306 bare-die variant. The part is a discontinued military/aerospace legacy product; designers requiring RoHS compliance should verify with the manufacturer or consider the MAX174AEPI+ as a RoHS-compliant same-die alternative.
