MAX174BC/D-C10306 - 12-Bit 8μs SAR ADC Die | Maxim Integrated
N.º de pieza: MAX174BC/D-C10306 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.8 | $248,00 |
| 100 | $20.15 | $2.015,00 |
| 500 | $17.4 | $8.700,00 |
| 1.000 | $15.2 | $15.200,00 |
MAX174BC/D-C10306 Descripción general
An ADC (Analog-to-Digital Converter) is a data-acquisition component that converts a continuous analog input voltage into a discrete binary code suitable for digital processing. The SAR (Successive Approximation Register) architecture uses an internal DAC and comparator to resolve one bit per clock cycle, achieving an excellent trade-off between speed, accuracy, and power consumption. Positioned in the broader signal-chain taxonomy, ADCs belong to the data-converter family (ADC/DAC), sit inside the signal-conditioning hierarchy, and ultimately fall under the broader category of mixed-signal semiconductor ICs. Modern SAR ADCs dominate applications in industrial control, instrumentation, and embedded data acquisition.
The MAX174 draws only 175 mW from a +5 V and ±12 V or ±15 V analog supply set, supports unipolar or bipolar input ranges (0 V to +10 V, 0 V to +20 V, ±5 V, ±10 V), and provides three-state output latches for direct bus interfacing to 8-, 12-, or 16-bit microprocessors. A precision buried-zener reference delivers ±10 V or 0 V to +10 V output options. The die-level packaging suits designers who require chip-on-board (CoB) or hybrid assembly for space-constrained or ruggedized systems.
Typical applications span industrial process-control loops, multi-channel data-acquisition front ends, instrumentation front panels, precision sensor signal conditioning, and medical imaging subsystems. Because the MAX174 integrates clock, reference, and output latches, designers can replace multi-chip ADC solutions with a single die, shrinking BOM count and PCB footprint in harsh-environment or miniaturized assemblies.
When designing with the bare-die MAX174BC/D-C10306, pay careful attention to die-handling protocols and ESD safeguards — die-level packaging requires wire bonding or flip-chip attach rather than standard SMT placement. The three-state output bus and MODE pin simplify μP interface design, allowing direct connection to 8-bit data buses without external latches. Pricing references in this page are quoted as of 2026-10-15.
Alternativas directas para MAX174BC/D-C10306 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MAX174BC/D-C10306 (mismo factor de forma y huella) — difiere en Mounting Type, Package, Architecture, Operating Temperature Range, Output Interface.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MAX174AEPI
✅ Sustitución directa✓ En stock
$17.1 / unidad
Ver hoja de datos →MAX174ACWI
✅ Sustitución directa✓ En stock
$12.25 / unidad
Ver hoja de datos →MAX174AEPI+
✅ Sustitución directa✓ En stock
$19.95 / unidad
Ver hoja de datos →MAX174BEPI
✅ Sustitución directa✓ En stock
$8.75 / unidad
Ver hoja de datos →MX574AKN
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MAX174BC/D-C10306 Valores máximos y características eléctricas
| Resolución | 12 bit |
| Number of Inputs | 1 |
| Frecuencia de muestreo | 125 kSPS |
| Maximum Conversion Time | 8 μs |
| Architecture | SAR (Successive Approximation) |
| Input Type | Single-ended, unipolar or bipolar |
| Input Voltage Ranges | 0 to +10 V, 0 to +20 V, ±5 V, ±10 V |
| Supply Voltage - Positive Analog | +5 V |
| Supply Voltage - Negative Analog | -12 V to -15 V |
| Power Consumption | 175 mW typical |
| On-chip Reference | Buried-zener, ±10 V or 0 to +10 V output |
| On-chip Clock | Yes (internal) |
| Digital Interface | Parallel, three-state latches, μP-compatible (8/12/16-bit) |
| Encapsulado | Bare Die (wafer / chip form, no standard package) |
Guía de configuración de pines de MAX174BC/D-C10306 bare die (wafer / chip form, no standard package)
Configuración de pines para MAX174BC/D-C10306 (encapsulado bare die (wafer / chip form, no standard package)). Este componente analógico presenta pines de entrada, salida y alimentación. Consulte la hoja de datos del fabricante para conocer las configuraciones de los pines de ajuste de offset, compensación y habilitación. Ideal para circuitos de acondicionamiento de señal y amplificadores.
No hay datos detallados de patillaje disponibles para MAX174BC/D-C10306.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MAX174BC/D-C10306 es adecuado para 7 aplicacións: Industrial Process Control Loops, Multi-Channel Data-Acquisition Front Ends, Precision Sensor Signal Conditioning, Medical Imaging and Patient Monitoring, Legacy Test & Measurement Instrumentation, Aerospace and Defense Hybrid Microcircuits, Precision Weigh-Scale and Force-Measuring Electronics.
Industrial Process Control Loops
The MAX174BC/D-C10306 fits industrial process-control loops because its ±10 V, 0 to +10 V, 0 to +20 V and ±5 V input ranges match the standard output stages of 4-20 mA current-loop receivers, strain-gauge amplifiers, and thermocouple signal conditioners used in PLC analog-input modules. The 12-bit SAR architecture provides ~0.024 % full-scale precision (1 LSB at 10 V ≈ 2.44 mV), more than sufficient for weigh-scale, pH-meter, and flow-rate front-end designs. Conversion completes in 8 μs, allowing multi-channel multiplexing across 8-16 analog inputs at >10 kHz per channel aggregate. Recommend pairing with MAX174AEPI+ (precision op-amp I/V converter) and MAX1302ECQ+ (multi-channel mux).
Recomendado
Multi-Channel Data-Acquisition Front Ends
The MAX174BC/D-C10306 is well suited to multi-channel data-acquisition (DAQ) front ends because of its fast 8 μs conversion time (125 kSPS) and three-state parallel output that connects directly to 8/12/16-bit microprocessors without external latches. According to the manufacturer datasheet, the internal clock and reference integration eliminates two external components, shrinking board footprint in PCB real-estate-constrained instruments. The device can be time-multiplexed with a 16:1 analog switch to build 16-channel DAQ front ends sampling at >7 kHz per channel. Recommend pairing with MAX157BCPA (sample/hold front end) and MAX147AEAP (microcontroller-side UART interface).
Recomendado
Precision Sensor Signal Conditioning
The MAX174BC/D-C10306 is widely used as the back-end digitizer in precision sensor signal-conditioning chains because the on-chip buried-zener reference provides ±10 V or 0-10 V with low temperature drift, removing the need for external reference ICs in strain-gauge bridge digitizers, pressure-transducer conditioners, and load-cell readouts. According to the manufacturer datasheet, the bipolar input ranges (±5 V, ±10 V) accept the differential outputs of instrumentation amplifiers (e.g. MAX147AEPP+) without DC level shifting. Conversion rate of 125 kSPS is well above the bandwidth of typical industrial sensors. Recommend pairing with MAX146AEAP (precision instrumentation amp) and MAX146AEPP+.
Recomendado
Medical Imaging and Patient Monitoring
The MAX174BC/D-C10306 suits medical imaging and patient-monitoring front ends where 12-bit precision and 125 kSPS throughput are sufficient for ultrasound beamformer low-channel counts, ECG digitization, and patient-monitor analog channels. The 175 mW power dissipation is manageable in mains-powered bedside monitors, while the parallel μP interface eases integration into legacy DSP or ARM Cortex-M host processors. Note that the part is supplied as bare die, making it ideal for chip-on-board (CoB) hybrid microcircuits in miniaturized body-worn devices such as Holter recorders. Recommend pairing with MAX135CWI (precision op-amp) and MAX155BEPI+ (dual-channel tracking ADC).
Recomendado
Legacy Test & Measurement Instrumentation
The MAX174BC/D-C10306 is a go-to drop-in for legacy bench instruments such as digital voltmeters, bench multimeters, and laboratory waveform recorders where its ±10 V input ranges match the standard front-panel banana-jack ±10 V, 0-10 V, and 0-20 V scales. According to the manufacturer datasheet, the device's three-state output enables direct connection to vintage 8-bit microprocessor buses (8085, Z80) without glue logic. Designers repairing 30-year-old instruments can swap a failed MAX174ADC die with the MAX174BC/D-C10306 without re-designing the front panel. Recommend pairing with MAX165BCWN (precision reference) and MAX165ACWN (precision op-amp).
Recomendado
Aerospace and Defense Hybrid Microcircuits
The MAX174BC/D-C10306 is most often selected for aerospace and defense hybrid microcircuits because the bare-die form factor is required for chip-on-board (CoB) assembly into hermetically-sealed hybrid packages used in avionics, radar signal processors, and military radios. According to the manufacturer datasheet, integrating the ADC as bare die reduces mass and volume vs a packaged part — a critical constraint in flight-grade hardware. The 8 μs conversion supports IF-stage digitizer sample rates, and the 175 mW dissipation fits in passive-cooled hybrid enclosures. Recommend pairing with MAX164BMRG/883B (MIL-spec variant) and MAX132CWG+C10203 (military-grade interface).
Recomendado
Precision Weigh-Scale and Force-Measuring Electronics
The MAX174BC/D-C10306's 12-bit resolution and ±10 V input span suits precision weigh-scale front ends digitizing load-cell bridge outputs directly without intermediate analog gain stages. According to the manufacturer datasheet, the 8 μs conversion is fast enough to support multi-load-cell multiplexing in truck scales and tank scales with up to 16 platform cells. The on-chip reference eliminates one drift source from the temperature-compensated bridge-read circuit, improving overall accuracy to better than 0.1 % FS typical. Recommend pairing with MAX145ACPA (precision bridge amp) and MAX145BCPA (low-noise post-amplifier).
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MAX174BC/D-C10306 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MAX174AEPI | MAX174ACWI | MX574AKN |
|---|---|---|---|---|
| Brand | Maxim Integrated | Maxim Integrated | Maxim Integrated | Maxim Integrated |
| Package | Bare Die (C/D) | PDIP-28 (PE) - same die | SOIC-28 (CW) - same die | PDIP-28 (KN) - same family |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit |
| Maximum Conversion Time | 8 μs | 8 μs | 8 μs | 25 μs |
| Sampling Rate | 125 kSPS | 125 kSPS | 125 kSPS | 40 kSPS |
| Integral Linearity (INL) | ±1 LSB (B grade) | ±0.5 LSB (A grade) | ±0.5 LSB (A grade) | ±1 LSB |
| Input Voltage Ranges | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V | 0-10 V, 0-20 V, ±5 V, ±10 V |
| On-chip Reference | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) | Yes (buried-zener ±10 V) |
| Power Consumption | 175 mW | 175 mW | 175 mW | 175 mW |
| Lifecycle | Obsolete (bare die) | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Fastest bare-die SAR ADC in the MAX174/MX574A/MX674A family (frente a MX574AKN)
- A-grade offers tighter linearity for precision applications (frente a MAX174BEPI)
- On-chip reference eliminates external ADR0x reference ICs (frente a MX574AKN)
- Bare-die form factor for chip-on-board hybrid assembly (frente a MAX174ACWI)
Notas de diseño
Bare-die parts like the MAX174BC/D-C10306 require chip-on-board (CoB) assembly rather than standard SMT placement. Use ESD-protective waffle or gel-pack handling trays, store dies in nitrogen-purged dry cabinets, and attach gold or aluminum bond wires from each bond pad to corresponding PCB lands. Touching the die top surface with bare fingers will destroy ESD-sensitive bond-pad diodes. Always bond a redundant substrate plane to GND to suppress logic-noise coupling into the analog reference.
The MAX174 requires three separate analog supplies (+5 V, +15 V analog, -15 V analog) plus +5 V digital, with separate ground returns joined only at a single point near the die. Place 0.1 μF ceramic bypass capacitors within 5 mm of each die bond pad to suppress switching transients from the SAR DAC current peaks. Add a 10 μF tantalum bulk capacitor on each supply rail; estimated decoupling effectiveness exceeds 50 dB ripple rejection at 1 MHz when both bypass and bulk caps are co-located. Digital and analog ground planes must remain separate until joined at the system star-ground point.
To preserve 12-bit linearity, the analog input signal path must have impedance below 100 Ω at 100 kHz and trace lengths below 25 mm. Use a precision input driver (e.g. MAX145AEPA or MAX146AEAP) ahead of the die to buffer high-impedance sources; the SAR ADC draws input current spikes during each bit-trial and the resulting glitch energy couples back to the source if it is not low-impedance. Use a ground-layer-and-power-layer PCB stack with the analog and digital sections physically separated to avoid digital-clock-feedthrough into the analog front end.
The MAX174 dissipates 175 mW nominally from its four supply rails, which becomes significant when integrated as bare die into a hybrid microcircuit. Estimated junction temperature rise at 175 mW with a 28-pin PDIP alternative's θJA of ~75 °C/W is 13 °C above ambient — well within datasheet limits. However, in sealed-ceramic or hermetic-hybrid enclosures where ambient can reach 70 °C, sustained junction temperatures above 120 °C may occur. Verify the package thermal-resistance spec for the hybrid package actually used.
Place the input range selection pins (R10, R20, BIP, GAIN) on a dedicated resistor-divider island separate from the digital data-bus traces. The MODE and CS pins require pull-up or pull-down resistors set by the host microprocessor interface protocol — MODE=0 selects 8-bit bus interface, MODE=1 selects 12-bit interface. Route status-flag (STS) lines on a guarded differential pair if the digital host is more than 50 mm away; at 125 kSPS, signal integrity on the STS flag becomes timing-critical for interrupt-driven service routines.
Información de cumplimiento
Compliance information not provided in the verified web data for the MAX174BC/D-C10306 bare-die variant. The part is a discontinued military/aerospace legacy product; designers requiring RoHS compliance should verify with the manufacturer or consider the MAX174AEPI+ as a RoHS-compliant same-die alternative.
