MAX9867ETJ+ - Ultra-Low Power Stereo Audio Codec | Analog Devices
MPN: MAX9867ETJ+ ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.95 | $5.95 |
| 10 | $5.42 | $54.20 |
| 100 | $4.78 | $478.00 |
| 500 | $4.21 | $2,105.00 |
| 1,000 | $3.65 | $3,650.00 |
MAX9867ETJ+ Overview
An audio codec (coder-decoder) is a mixed-signal integrated circuit that performs both ADC (analog-to-digital conversion) for the recording path and DAC (digital-to-analog conversion) for the playback path. Codecs sit at the boundary between the analog acoustic domain and the digital processing domain, and ultra-low-power codecs such as the MAX9867 are specifically engineered for battery-operated portable electronics where standby and active current budgets are critical system design constraints.
Key features include 1.8V single-supply operation, 6.7 mW playback power consumption, support for both analog and digital microphones, and comprehensive click-and-pop suppression circuitry. The integrated stereo headphone amplifiers support differential, single-ended, and capacitorless output configurations, delivering up to 10 mW into 32 ohm headphones in capacitorless mode. The device also includes configurable digital filtering, programmable gain, and an I2C-compatible control interface with a full register map for fine-grained audio path tuning.
Architecturally, the MAX9867 combines 18-bit ADC and DAC paths with a low-noise analog front end, on-chip microphone bias generation, and integrated PLL for flexible audio clocking. The 32-pin TQFN package with exposed thermal pad enables compact PCB layouts in space-constrained portable designs, while the I2C control interface simplifies integration with host application processors and Bluetooth audio SoCs.
Typical applications include mobile phone audio subsystems, portable gaming console audio, portable media player headphone outputs, Bluetooth audio dongles, and wearable audio devices. The 1.8V single-suprail capability makes the MAX9867 directly compatible with modern application-processor PMIC rails common in portable designs.
When designing with the MAX9867, ensure that the exposed thermal pad (EP) on the 32-pin TQFN is soldered to a properly sized copper pour for both thermal dissipation and ground reference integrity. The capacitorless headphone output mode eliminates large AC-coupling capacitors on the PCB but requires careful ground-layout practices to avoid channel crosstalk.
This page consolidates distributor pricing, drop-in alternatives, and design guidance beyond what is in the MAX9867 datasheet alone, including a curated selection guide and parametric comparison against same-package alternatives.
Drop-in alternatives for MAX9867ETJ+ — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MAX9867ETJ+T
✅ Drop-In📋 Reference alternative (not in catalog)
MAX9867ETJ+G3U
✅ Drop-In📋 Reference alternative (not in catalog)
MAX9867ETJ+ Specifications
| Product Type | Stereo Audio Codec (ADC + DAC) |
| Supply Voltage | 1.8 V single supply |
| Playback Power Consumption | 6.7 mW |
| Resolution | 18-bit |
| Digital Audio Interface | I2S, TDM, left-justified |
| Control Interface | I2C-compatible (2-wire serial) |
| Sample Rate | 48 kSPS (max) |
| Microphone Inputs | Stereo differential (analog or digital) |
| Line Inputs | Stereo single-ended, configurable |
| Headphone Output Power | 10 mW into 32 ohm (capacitorless mode) |
| Headphone Amplifier Modes | Differential, single-ended, capacitorless |
| Click-and-Pop Suppression | Yes (integrated) |
| Operating Temperature Range | -40 C to +85 C |
| Package | 32-pin TQFN (5x5 mm) with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Audio Path SNR | 85 dB (per distributor parametric data) |
MAX9867ETJ+ 32-pin tqfn (5x5 mm) with exposed pad Pin Configuration Guide
Pin configuration for MAX9867ETJ+ (32-pin tqfn (5x5 mm) with exposed pad package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for MAX9867ETJ+.
Refer to the datasheet for full pin configuration.
Typical Applications
MAX9867ETJ+ is suitable for 6 applications: Mobile Phone Audio Subsystem, Portable Gaming Console Audio, Portable Media Player Headphone Output, Bluetooth Audio Dongle / Receiver, Wearable Audio Devices, Tablet Audio Subsystem.
Mobile Phone Audio Subsystem
The MAX9867ETJ+ is purpose-built for mobile phone audio. Its 1.8V single supply aligns directly with the PMIC rail that powers the application processor, eliminating extra level shifters; the 6.7 mW playback power keeps headset-mode current draw inside the typical 5-10 mA budget for LTE/5G phones; stereo differential microphone inputs accept both analog ECM and digital PDM MEMS microphones used in modern phone form factors. The I2S/TDM digital interface is compatible with every major smartphone application processor (Qualcomm Snapdragon, MediaTek, Unisoc). Place the codec between the SoC's digital audio port and the headphone jack; unlike higher-power codecs it does not require an additional boost converter or LDO in the audio path.
Recommended
Portable Gaming Console Audio
Handheld gaming consoles need low-power audio that survives several hours of battery operation. The MAX9867ETJ+ delivers 10 mW into 32 ohm headphones with 85 dB SNR and integrated click-and-pop suppression - directly addressing the loud transient artifacts that occur at headphone insertion or power-up. The capacitorless headphone mode saves two large 220uF AC-coupling caps per channel, freeing PCB area for the gaming display driver or battery management IC. Stereo recording path with differential microphone preamps supports voice chat during multiplayer sessions. Compared with discrete codec-plus-headphone-amp designs, this single-chip solution reduces BOM by approximately 40% in portable gaming hardware.
Recommended
Portable Media Player Headphone Output
Dedicated portable media players benefit from the MAX9867ETJ+'s ultra-low 6.7 mW playback power consumption, which directly extends battery runtime during music playback. The on-chip headphone amplifier supports differential, single-ended, and capacitorless output topologies; the capacitorless mode eliminates four large bulk capacitors from the BOM and PCB. Comprehensive click-and-pop suppression prevents audible transients during track skip, volume change, and power-up/power-down events - a key quality perception metric in consumer audio. The integrated digital audio interface (I2S/TDM/left-justified) supports sample rates up to 48 kSPS, covering all standard compressed and lossless audio formats.
Recommended
Bluetooth Audio Dongle / Receiver
Wireless Bluetooth audio dongles and receive-only headsets need a compact, low-power codec to convert the digital audio stream from the BT SoC into analog headphone signals. The MAX9867ETJ+ integrates the entire DAC-plus-headphone-amp chain on a single 5x5 mm die, with I2S-compatible input matching standard Bluetooth SoC digital outputs (Qualcomm QCC, Airoha, Realtek RTL series). The 1.8V supply matches the typical Li-ion battery plus LDO output of a small dongle form factor. Click-and-pop suppression is critical for the frequently-connected/disconnected nature of BT audio accessories.
Recommended
Wearable Audio Devices
Smartwatches, fitness bands, and hearables require audio playback and capture in tiny PCB footprints. The MAX9867ETJ+ integrates codec plus headphone amplifier plus microphone preamps on a single 32-pin TQFN-EP chip, eliminating the need for a separate audio DAC or ADC. The 6.7 mW playback power and 1.8V single-supply operation are essential for wearables that operate from small Li-ion coin cells with limited peak current capability. The exposed-pad TQFN package has a low profile suitable for stacked-die wearable designs, and the stereo differential microphone input accepts either analog or digital PDM MEMS microphones commonly used in hearable form factors.
Recommended
Tablet Audio Subsystem
Tablet computers need stereo playback and recording for video conferencing applications. The MAX9867ETJ+ supports stereo headphone output at 10 mW into 32 ohm with click-and-pop suppression across all volume transitions, and the integrated stereo microphone preamp with digital microphone support allows direct connection to MEMS microphone arrays used for noise-cancelling conferencing. The I2C control interface works with standard tablet embedded controllers and the digital audio interface (I2S/TDM) interfaces directly to tablet application processors. The 1.8V supply is the standard rail for tablet codec peripherals, allowing direct PMIC connection.
Recommended
Recommended Products Summary
Engineering reference data for MAX9867ETJ+ — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MAX9867ETJ+T | MAX9867ETJ+G3U |
|---|---|---|---|
| Package | 32-pin TQFN (5x5 mm) with EP | 32-pin TQFN (5x5 mm) with EP - same | 32-pin TQFN (5x5 mm) with EP - same |
| Brand | Analog Devices (formerly Maxim Integrated) | Analog Devices - same brand | Analog Devices - same brand |
| Supply Voltage | 1.8 V single supply | 1.8 V single supply | 1.8 V single supply |
| Playback Power | 6.7 mW | 6.7 mW (identical silicon) | 6.7 mW (identical silicon) |
| Resolution | 18-bit | 18-bit | 18-bit |
| Audio Path SNR | 85 dB | 85 dB | 85 dB |
| Headphone Output Power | 10 mW into 32 ohm | 10 mW into 32 ohm | 10 mW into 32 ohm |
| Sample Rate | up to 48 kSPS | up to 48 kSPS | up to 48 kSPS |
| Control Interface | I2C-compatible | I2C-compatible | I2C-compatible |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Key Differentiators
- Single-rail 1.8V supply for direct mobile SoC connection (vs MAX9860ETG+T)
- Capacitorless headphone output saves 4 large bulk caps (vs MAX9860ETG+T)
- Integrated digital microphone interface with PDM (vs Discreet codec + external digital mic preamp)
Design Notes
Estimated: at 1.8V supply and 6.7 mW playback power, the MAX9867ETJ+ generates very little on-die heat in normal operation. However, the exposed thermal pad (EP) of the 32-pin TQFN should still be soldered to a ground copper pour of at least 25 mm^2 for thermal dissipation and ground-reference integrity. Without the EP land, ground-bounce noise from the headphone amplifier output stage can couple into the ADC microphone path. Reference design follows the Analog Devices MAX9867 evaluation kit layout.
Place the input and output decoupling capacitors (typically 1 uF and 0.1 uF ceramic in parallel) as close to the AVDD and DVDD pins as possible to minimize supply-noise coupling into the audio path. Route the I2S data and clock traces as a matched-length group to maintain timing margin at 48 kSPS. Keep the headphone output traces short and symmetric to preserve channel-balance and reduce crosstalk; the Analog Devices evaluation kit layout is the recommended starting point.
Do not omit the exposed-pad solder connection - it is the primary ground return and thermal path for the headphone amplifier output stage. Do not operate the MAX9867 above 85 C junction - derate by 10 C for enclosed portable housings. When using digital microphones, ensure the PDM clock polarity and timing match the codec's digital microphone interface configuration bits in the register map; mismatched timing causes silent recording or distorted capture. Reference: Analog Devices MAX9867 datasheet, Register and Bit Descriptions section.
Compliance Information
RoHS compliance per Maxim Integrated / Analog Devices product page. The MAX9867 is not AEC-Q100 qualified - for automotive designs a different codec is required.
