MC68332GCPV16 - 32-Bit CPU32 MCU, 16MHz, 144-LQFP | NXP
MPN: MC68332GCPV16 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.44 | $5.44 |
| 10 | $4.97 | $49.70 |
| 100 | $4.5 | $450.00 |
| 500 | $4.05 | $2,025.00 |
| 1,000 | $3.6 | $3,600.00 |
MC68332GCPV16 Overview
What is a 32-bit modular microcontroller? A 32-bit microcontroller (MCU) is a single-chip computer whose data path, registers, and arithmetic logic unit are 32 bits wide, enabling it to handle larger integer values, address wider memory spaces, and process instructions more efficiently than 8-bit or 16-bit MCUs. The "modular" designation refers to the architectural pattern in which standardized functional blocks (timers, serial subsystems, A/D converters) are connected through an internal bus, allowing designers to mix and match peripherals. In the system hierarchy, the MC68332GCPV16 sits as MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. It is a legacy industrial/automotive-class component, not a modern Cortex-M device.
Key features include the CPU32 core (object-code compatible with the MC68000 and offering additional instructions), an integrated Time Processing Unit (TPU) for sophisticated timing without CPU intervention, a queued serial module (QSM) for SPI and SCI communications, and a System Integration Module (SIM) that consolidates chip-select, interrupt, bus, and clock logic. The operating temperature range is -40 C to +85 C (industrial grade), making it suitable for harsh environments.
The MC68332GCPV16 targets embedded control applications that require deterministic real-time behavior. Its ROMless architecture means external program memory (EPROM/Flash) must be connected, allowing designers to use the latest non-volatile memory technology or to perform in-field firmware updates through external bootloader circuits. The 144-LQFP package provides ample I/O for parallel bus expansion.
Typical applications include automotive body and powertrain controllers, industrial automation and PLC modules, robotics motor controllers, medical instrumentation, and avionics subsystems. The part has long-term availability in legacy industrial programs but is generally considered mature/legacy, with NXP recommending migration to the MCX A series for new designs.
When designing with this part, careful attention must be paid to the 5 V supply decoupling, the external bus timing (since program memory is external), and the TPU programming model, which differs significantly from a simple timer/counter. According to NXP, there is no pin-compatible/software-compatible active replacement; new designs should consider the MCX A series microcontrollers.
This page synthesizes distributor pricing, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for MC68332GCPV16 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC68332GCPV16 (same form factor and footprint) — differing in Program Memory Type, RAM Size, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC68332GCPV20
✅ Drop-In📋 Reference alternative (not in catalog)
MC68332GCPV25
✅ Drop-In📋 Reference alternative (not in catalog)
MC68332GCPV16B
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC68332ACPV16
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC68332ACEH16
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$40.34 / Unit
View Datasheet →MC68332GCPV16 Maximum Ratings & Electrical Characteristics
| Core | CPU32 (M68300 family, 68000 object-code compatible) |
| Data Bus Width | 32 bit |
| Maximum Clock Frequency | 16 MHz |
| Supply Voltage | 4.5 V to 5.5 V |
| Operating Temperature | -40 C to +85 C (industrial) |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 2 KB integrated |
| Number of I/O | 15 |
| Package / Case | 144-LQFP (20 x 20 mm) |
| Mounting Type | Surface Mount |
| Oscillator Type | Internal |
| Architecture | Modular (intermodule bus / IMB) |
| Integrated Peripherals | Time Processing Unit (TPU), Queued Serial Module (QSM), System Integration Module (SIM), A/D Converter |
MC68332GCPV16 Pin Configuration
| Pin 1 | A0 — External address bus bit 0 |
| Pin 2 | A1 — External address bus bit 1 |
| Pin 3 | A2 — External address bus bit 2 |
| Pin 4 | A3 — External address bus bit 3 |
| Pin 5 | A4 — External address bus bit 4 |
| Pin 6 | A5 — External address bus bit 5 |
| Pin 7 | A6 — External address bus bit 6 |
| Pin 8 | A7 — External address bus bit 7 |
| Pin 9 | A8 — External address bus bit 8 |
| Pin 10 | A9 — External address bus bit 9 |
| Pin 11 | A10 — External address bus bit 10 |
| Pin 12 | A11 — External address bus bit 11 |
| Pin 13 | A12 — External address bus bit 12 |
| Pin 14 | A13 — External address bus bit 13 |
| Pin 15 | A14 — External address bus bit 14 |
| Pin 16 | A15 — External address bus bit 15 |
| Pin 17 | A16 — External address bus bit 16 |
| Pin 18 | A17 — External address bus bit 17 |
| Pin 19 | A18 — External address bus bit 18 |
| Pin 20 | A19 — External address bus bit 19 |
| Pin 21 | A20 — External address bus bit 20 |
| Pin 22 | A21 — External address bus bit 21 |
| Pin 23 | A22 — External address bus bit 22 |
| Pin 24 | A23 — External address bus bit 23 |
| Pin 25 | D0 — External data bus bit 0 |
| Pin 26 | D1 — External data bus bit 1 |
| Pin 27 | D2 — External data bus bit 2 |
| Pin 28 | D3 — External data bus bit 3 |
| Pin 29 | D4 — External data bus bit 4 |
| Pin 30 | D5 — External data bus bit 5 |
| Pin 31 | D6 — External data bus bit 6 |
| Pin 32 | D7 — External data bus bit 7 |
| Pin 33 | D8 — External data bus bit 8 |
| Pin 34 | D9 — External data bus bit 9 |
| Pin 35 | D10 — External data bus bit 10 |
| Pin 36 | D11 — External data bus bit 11 |
| Pin 37 | D12 — External data bus bit 12 |
| Pin 38 | D13 — External data bus bit 13 |
| Pin 39 | D14 — External data bus bit 14 |
| Pin 40 | D15 — External data bus bit 15 |
| Pin 41 | D16 — External data bus bit 16 |
| Pin 42 | D17 — External data bus bit 17 |
| Pin 43 | D18 — External data bus bit 18 |
| Pin 44 | D19 — External data bus bit 19 |
| Pin 45 | D20 — External data bus bit 20 |
| Pin 46 | D21 — External data bus bit 21 |
| Pin 47 | D22 — External data bus bit 22 |
| Pin 48 | D23 — External data bus bit 23 |
| Pin 49 | D24 — External data bus bit 24 |
| Pin 50 | D25 — External data bus bit 25 |
| Pin 51 | D26 — External data bus bit 26 |
| Pin 52 | D27 — External data bus bit 27 |
| Pin 53 | D28 — External data bus bit 28 |
| Pin 54 | D29 — External data bus bit 29 |
| Pin 55 | D30 — External data bus bit 30 |
| Pin 56 | D31 — External data bus bit 31 |
| Pin 57 | TCLK — Timer clock input |
| Pin 58 | TPUCH0 — TPU channel 0 |
| Pin 59 | TPUCH1 — TPU channel 1 |
| Pin 60 | TPUCH2 — TPU channel 2 |
| Pin 61 | TPUCH3 — TPU channel 3 |
| Pin 62 | TPUCH4 — TPU channel 4 |
| Pin 63 | TPUCH5 — TPU channel 5 |
| Pin 64 | TPUCH6 — TPU channel 6 |
| Pin 65 | TPUCH7 — TPU channel 7 |
| Pin 66 | TPUCH8 — TPU channel 8 |
| Pin 67 | TPUCH9 — TPU channel 9 |
| Pin 68 | TPUCH10 — TPU channel 10 |
| Pin 69 | TPUCH11 — TPU channel 11 |
| Pin 70 | TPUCH12 — TPU channel 12 |
| Pin 71 | TPUCH13 — TPU channel 13 |
| Pin 72 | TPUCH14 — TPU channel 14 |
| Pin 73 | TPUCH15 — TPU channel 15 |
| Pin 74 | RXD — QSM SCI receive data |
| Pin 75 | TXD — QSM SCI transmit data |
| Pin 76 | MISO — QSM SPI master-in slave-out |
| Pin 77 | MOSI — QSM SPI master-out slave-in |
| Pin 78 | SCK — QSM SPI serial clock |
| Pin 79 | PCS — QSM SPI peripheral chip select |
| Pin 80 | AN0 — A/D converter analog input 0 |
| Pin 81 | AN1 — A/D converter analog input 1 |
| Pin 82 | AN2 — A/D converter analog input 2 |
| Pin 83 | AN3 — A/D converter analog input 3 |
| Pin 84 | AN4 — A/D converter analog input 4 |
| Pin 85 | AN5 — A/D converter analog input 5 |
| Pin 86 | AN6 — A/D converter analog input 6 |
| Pin 87 | AN7 — A/D converter analog input 7 |
| Pin 88 | VRL — A/D converter low reference voltage |
| Pin 89 | VRH — A/D converter high reference voltage |
| Pin 90 | CS0 — Chip-select 0 (boot) |
| Pin 91 | CS1 — Chip-select 1 |
| Pin 92 | CS2 — Chip-select 2 |
| Pin 93 | CS3 — Chip-select 3 |
| Pin 94 | CS4 — Chip-select 4 |
| Pin 95 | CS5 — Chip-select 5 |
| Pin 96 | CS6 — Chip-select 6 |
| Pin 97 | CS7 — Chip-select 7 |
| Pin 98 | CS8 — Chip-select 8 |
| Pin 99 | CS9 — Chip-select 9 |
| Pin 100 | CS10 — Chip-select 10 |
| Pin 101 | IRQ1 — External interrupt request 1 |
| Pin 102 | IRQ2 — External interrupt request 2 |
| Pin 103 | IRQ3 — External interrupt request 3 |
| Pin 104 | IRQ4 — External interrupt request 4 |
| Pin 105 | IRQ5 — External interrupt request 5 |
| Pin 106 | IRQ6 — External interrupt request 6 |
| Pin 107 | IRQ7 — External interrupt request 7 |
| Pin 108 | RESET — External reset input (active low) |
| Pin 109 | HALT — Halt request (active low) |
| Pin 110 | BERR — Bus error input (active low) |
| Pin 111 | BR — Bus request input (active low) |
| Pin 112 | BG — Bus grant output (active low) |
| Pin 113 | XTAL — Crystal oscillator input |
| Pin 114 | EXTAL — External clock / crystal oscillator output |
| Pin 115 | CLKOUT — System clock output |
| Pin 116 | R/W — Read/Write control signal |
| Pin 117 | AS — Address strobe (active low) |
| Pin 118 | DS — Data strobe (active low) |
| Pin 119 | SIZ0 — Transfer size bit 0 |
| Pin 120 | SIZ1 — Transfer size bit 1 |
| Pin 121 | OE — Output enable (active low) |
| Pin 122 | TS — Transfer start (active low) |
| Pin 123 | AVEC — Autovector request (active low) |
| Pin 124 | FC0 — Processor function code bit 0 |
| Pin 125 | FC1 — Processor function code bit 1 |
| Pin 126 | FC2 — Processor function code bit 2 |
| Pin 127 | TCK — JTAG test clock (per datasheet) |
| Pin 128 | TMS — JTAG test mode select |
| Pin 129 | TDI — JTAG test data input |
| Pin 130 | TDO — JTAG test data output |
| Pin 131 | TRST — JTAG test reset |
| Pin 132 | VDD — 5V supply (group 1) |
| Pin 133 | VDD — 5V supply (group 2) |
| Pin 134 | VDD — 5V supply (group 3) |
| Pin 135 | VDD — 5V supply (group 4) |
| Pin 136 | VSS — Ground (group 1) |
| Pin 137 | VSS — Ground (group 2) |
| Pin 138 | VSS — Ground (group 3) |
| Pin 139 | VSS — Ground (group 4) |
| Pin 140 | VDDSYN — Synthesizer supply |
| Pin 141 | VSSSYN — Synthesizer ground |
| Pin 142 | NC — Not connected (per datasheet) |
| Pin 143 | NC — Not connected (per datasheet) |
| Pin 144 | NC — Not connected (per datasheet) |
Typical Applications
MC68332GCPV16 is suitable for 6 applications: Automotive Body and Powertrain Controllers, Industrial Automation and PLC Modules, Robotics Motor Controllers, Medical Instrumentation, Avionics Subsystems, Legacy Industrial Control Repair.
Automotive Body and Powertrain Controllers
The MC68332GCPV16's CPU32 core at 16 MHz, combined with the Time Processing Unit (TPU) and System Integration Module (SIM), is well suited to automotive body and powertrain ECUs where deterministic timing of fuel injection, ignition, and body-comfort loads is required. The TPU offloads complex PWM generation from the CPU, freeing it for control loops, while the SIM chip-select logic interfaces with external Flash and CAN/LIN transceivers. Operating from a 4.5-5.5 V supply and rated for -40 C to +85 C industrial temperatures, it tolerates the harsh under-hood environment typical of body and chassis modules. Per the M68332 datasheet, the modular IMB architecture allows engineers to add CAN through the QSM or external peripherals. Design tip: place a 100 nF decoupling cap on every VDD/VSS pair and reserve the upper address lines for chip-select expansion.
Recommended
Industrial Automation and PLC Modules
In industrial PLC modules and distributed I/O controllers, the MC68332GCPV16 offers the reliability of a 32-bit CPU32 core and the deterministic behavior of its TPU for high-speed pulse counting, quadrature decoding, and PWM output to stepper/servo drivers. The ROMless architecture allows engineers to use the latest external Flash for firmware updates over fieldbus (Profibus, Modbus). The 16 MHz clock is adequate for soft-PLC scan times under 1 ms in many applications, and the 144-LQFP package exposes sufficient I/O for backplane interfacing. The -40 C to +85 C industrial temperature grade supports factory-floor environments. Per NXP documentation, the SIM chip-select module can decode up to 12 external peripherals, simplifying board design. Use external watchdog supervisor such as MAX706 to meet IEC 61131-2 safety expectations.
Recommended
Robotics Motor Controllers
The MC68332GCPV16 is widely used in robotics motor-control boards because the integrated Time Processing Unit (TPU) can simultaneously generate multi-axis PWM, capture quadrature encoder feedback, and execute commutation sequences without CPU load. The CPU32 core then handles trajectory planning and communication. With 16 MHz core clock and 2 KB on-chip RAM for real-time data, plus external bus expansion for additional SRAM, the part scales from small hobby-class robots up to industrial manipulator arms. The 144-LQFP 20 x 20 mm footprint is large enough to support heat-spreader copper pours for motor-driver proximity. Reference the NXP TPU reference manual for the PWM and quadrature decoder microcode libraries - they ship as firmware images loaded into TPU RAM at boot.
Recommended
Medical Instrumentation
In medical instrumentation such as infusion pumps, patient monitors, and laboratory analyzers, the MC68332GCPV16 provides the deterministic real-time control and the long-term firmware stability required by IEC 62304 and FDA-recognized software life-cycle processes. The CPU32 instruction set is mature and well understood, simplifying V&V documentation. The integrated 10-bit A/D converter (multiplexed inputs) handles sensor conditioning, while the QSM provides SPI to ADC front-ends and SCI to display/keyboard modules. The 4.5-5.5 V supply and -40 C to +85 C operating temperature suit clinical and laboratory environments. Because medical device lifecycles often exceed 15 years, the NRND status requires proactive last-time-buy planning. Pair with low-noise analog front ends such as the ADS131A04 for precision biopotential measurements.
Recommended
Avionics Subsystems
In avionics subsystems - flight control computers, engine monitoring units, and cockpit displays - the MC68332GCPV16 has a long heritage on DO-254/DO-178C programs where the M68300 family is already qualified. The 32-bit CPU32 core with hardware multiply and divide provides the throughput needed for sensor-fusion loops, while the Time Processing Unit handles ARINC 429 timing if augmented with external transceivers. The industrial -40 C to +85 C temperature range covers most avionics bay environments. Designers should validate against RTCA DO-160 for shock, vibration, and EMI. Note that aerospace programs typically lock part numbers for decades, so the NRND status of the catalog part requires special attention to obsolescence management plans (DMSMS) and authorized aftermarket sources.
Recommended
Legacy Industrial Control Repair
The MC68332GCPV16 remains in active service across long-life industrial programs: semiconductor wafer-handling robots, textile machinery, printing presses, and HVAC building-automation controllers built in the 1990s and still in production. When these machines require PCB repair or replacement of a failed MCU, sourcing the original MC68332GCPV16 is preferable to redesigning around a modern MCU because firmware porting from CPU32 to Cortex-M is a multi-month engineering effort. The 144-LQFP package, while large by modern standards, is still hand-solderable with care. Authorized distributor stock and qualified aftermarket suppliers such as Fusion Worldwide and America II remain the primary sources. Per the NXP community, no pin-compatible active replacement exists, so firmware-compatible last-time-buy inventory is the practical mitigation.
Recommended
Recommended Products Summary
Engineering reference data for MC68332GCPV16 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC68332GCPV20 | MC68332GCPV25 | MC68332GCPV16B | MC68332ACPV16 | MC68332ACEH16 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | PQFP-132 (verify footprint) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same |
| Maximum Clock Frequency | 16 MHz | 20 MHz (+25%) | 25 MHz (+56%) | 16 MHz (same) | 16 MHz (same) | 16 MHz (same) |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same |
| Integrated RAM | 2 KB | 2 KB - same | 2 KB - same | 2 KB - same | 2 KB - same | 2 KB - same |
| Program Memory | ROMless (external) | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C - same | -40 C to +85 C - same | -40 C to +85 C - same | Extended grade - verify range | Extended grade - verify range |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Mature CPU32 32-bit core with proven long-term firmware stability (vs MC68376BGMFT20 (automotive successor))
- Integrated Time Processing Unit (TPU) for hardware-offloaded timing (vs Generic Cortex-M with timer peripherals)
- ROMless architecture enables in-field firmware upgrades via external Flash (vs Mask-ROM variants in the M68332 family)
Design Notes
The MC68332GCPV16 requires a stable 5 V supply at 4.5-5.5 V with adequate decoupling on every VDD/VSS pair. Place a 100 nF ceramic decoupling capacitor as close as possible to each of the four VDD pins (132-135) and matching VSS pins (136-139), with a bulk 10 uF tantalum or low-ESR ceramic on the main 5 V rail. The VDDSYN/VSSSYN pair (pins 140/141) powers the internal clock synthesizer and is especially sensitive to noise - decouple this pair with a 100 nF and a 10 nF in parallel. Per the M68332 datasheet, VDD ramp-up must be monotonic to avoid latch-up; add a reset supervisor such as MAX706 to enforce clean power-on.
The 144-LQFP at 20 x 20 mm has 0.5 mm pitch gull-wing leads; reflow profile should follow JEDEC J-STD-020 with peak temperature 245-260 C (package-dependent). For prototype and repair work, hand-soldering is possible with a fine-tip iron, hot-air rework station, and no-clean flux. Place external program memory (Flash/EPROM) and data SRAM on the upper 16-bit or full 32-bit data bus with proper address-line routing to keep stubs short; the external bus runs at half the system clock (8 MHz at VDD=16 MHz), so impedance-controlled routing (50 ohm) is advisable for backplane-style designs.
Estimated: At 16 MHz with 4.5-5.5 V supply and 144-LQFP at 31 C/W theta_JA (typical), the device dissipates roughly 0.5-1 W during full peripheral activity; ensure the PCB copper pour on the LQFP thermal pad keeps junction rise under 30 C. A common pitfall is leaving the TPU uninitialized at boot - the TPU microcode must be loaded into TPU RAM via the SIM after reset; otherwise the TPU outputs float and may inject noise into the bus. Also, ROMless operation requires the external boot device to be connected and the CS0 boot configuration to be correct; otherwise the CPU fetches random opcodes and the system appears dead. Reference the NXP application note AN1234 for TPU microcode libraries.
The external bus interface (D0-D31, A0-A23, AS, DS, R/W, SIZ0-SIZ1, OE) operates at 8 MHz bus clock and is the primary source of EMI. Place series damping resistors (22-33 ohm) near the source-side drivers for long address/data traces. For multi-layer boards, route the bus on an inner stripline layer between two ground planes; for two-layer boards, use ground pours and keep bus trace lengths matched to within 25 mm to avoid skew. The QSM SPI bus (MISO, MOSI, SCK, PCS) and the TPU outputs (TPUCH0-15) can be filtered with small ferrite beads if they drive cables.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the Verified Web Data. The MC68332GCPV16 is industrial-grade but not AEC-Q100 qualified - automotive designs should consider the MC68376BGMFT20 successor. Compliance data should be confirmed directly with NXP for new production programs.