MC68332GCPV16 - 32-Bit CPU32 MCU, 16MHz, 144-LQFP | NXP
N.º da peça: MC68332GCPV16 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.44 | $5,44 |
| 10 | $4.97 | $49,70 |
| 100 | $4.5 | $450,00 |
| 500 | $4.05 | $2.025,00 |
| 1.000 | $3.6 | $3.600,00 |
MC68332GCPV16 Visão geral
What is a 32-bit modular microcontroller? A 32-bit microcontroller (MCU) is a single-chip computer whose data path, registers, and arithmetic logic unit are 32 bits wide, enabling it to handle larger integer values, address wider memory spaces, and process instructions more efficiently than 8-bit or 16-bit MCUs. The "modular" designation refers to the architectural pattern in which standardized functional blocks (timers, serial subsystems, A/D converters) are connected through an internal bus, allowing designers to mix and match peripherals. In the system hierarchy, the MC68332GCPV16 sits as MCU -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. It is a legacy industrial/automotive-class component, not a modern Cortex-M device.
Key features include the CPU32 core (object-code compatible with the MC68000 and offering additional instructions), an integrated Time Processing Unit (TPU) for sophisticated timing without CPU intervention, a queued serial module (QSM) for SPI and SCI communications, and a System Integration Module (SIM) that consolidates chip-select, interrupt, bus, and clock logic. The operating temperature range is -40 C to +85 C (industrial grade), making it suitable for harsh environments.
The MC68332GCPV16 targets embedded control applications that require deterministic real-time behavior. Its ROMless architecture means external program memory (EPROM/Flash) must be connected, allowing designers to use the latest non-volatile memory technology or to perform in-field firmware updates through external bootloader circuits. The 144-LQFP package provides ample I/O for parallel bus expansion.
Typical applications include automotive body and powertrain controllers, industrial automation and PLC modules, robotics motor controllers, medical instrumentation, and avionics subsystems. The part has long-term availability in legacy industrial programs but is generally considered mature/legacy, with NXP recommending migration to the MCX A series for new designs.
When designing with this part, careful attention must be paid to the 5 V supply decoupling, the external bus timing (since program memory is external), and the TPU programming model, which differs significantly from a simple timer/counter. According to NXP, there is no pin-compatible/software-compatible active replacement; new designs should consider the MCX A series microcontrollers.
This page synthesizes distributor pricing, drop-in alternative analysis, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para MC68332GCPV16 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC68332GCPV16 (mesmo formato e footprint) — diferindo em Program Memory Type, RAM Size, Supply Voltage.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68332GCPV20
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68332GCPV25
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68332GCPV16B
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68332ACPV16
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
MC68332ACEH16
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$40.34 / unidade
Ver ficha técnica →MC68332GCPV16 Classificações máximas e características elétricas
| Core | CPU32 (M68300 family, 68000 object-code compatible) |
| Largura do barramento de dados | 32 bit |
| Frequência máxima de clock | 16 MHz |
| Tensão de alimentação | 4.5 V to 5.5 V |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Program Memory Type | ROMless (external memory required) |
| RAM Size | 2 KB integrated |
| Number of I/O | 15 |
| Encapsulamento / Caixa | 144-LQFP (20 x 20 mm) |
| Tipo de montagem | Surface Mount |
| Oscillator Type | Internal |
| Architecture | Modular (intermodule bus / IMB) |
| Integrated Peripherals | Time Processing Unit (TPU), Queued Serial Module (QSM), System Integration Module (SIM), A/D Converter |
Configuração de pinos do MC68332GCPV16
| Pino 1 | A0 — External address bus bit 0 |
| Pino 2 | A1 — External address bus bit 1 |
| Pino 3 | A2 — External address bus bit 2 |
| Pino 4 | A3 — External address bus bit 3 |
| Pino 5 | A4 — External address bus bit 4 |
| Pino 6 | A5 — External address bus bit 5 |
| Pino 7 | A6 — External address bus bit 6 |
| Pino 8 | A7 — External address bus bit 7 |
| Pino 9 | A8 — External address bus bit 8 |
| Pino 10 | A9 — External address bus bit 9 |
| Pino 11 | A10 — External address bus bit 10 |
| Pino 12 | A11 — External address bus bit 11 |
| Pino 13 | A12 — External address bus bit 12 |
| Pino 14 | A13 — External address bus bit 13 |
| Pino 15 | A14 — External address bus bit 14 |
| Pino 16 | A15 — External address bus bit 15 |
| Pino 17 | A16 — External address bus bit 16 |
| Pino 18 | A17 — External address bus bit 17 |
| Pino 19 | A18 — External address bus bit 18 |
| Pino 20 | A19 — External address bus bit 19 |
| Pino 21 | A20 — External address bus bit 20 |
| Pino 22 | A21 — External address bus bit 21 |
| Pino 23 | A22 — External address bus bit 22 |
| Pino 24 | A23 — External address bus bit 23 |
| Pino 25 | D0 — External data bus bit 0 |
| Pino 26 | D1 — External data bus bit 1 |
| Pino 27 | D2 — External data bus bit 2 |
| Pino 28 | D3 — External data bus bit 3 |
| Pino 29 | D4 — External data bus bit 4 |
| Pino 30 | D5 — External data bus bit 5 |
| Pino 31 | D6 — External data bus bit 6 |
| Pino 32 | D7 — External data bus bit 7 |
| Pino 33 | D8 — External data bus bit 8 |
| Pino 34 | D9 — External data bus bit 9 |
| Pino 35 | D10 — External data bus bit 10 |
| Pino 36 | D11 — External data bus bit 11 |
| Pino 37 | D12 — External data bus bit 12 |
| Pino 38 | D13 — External data bus bit 13 |
| Pino 39 | D14 — External data bus bit 14 |
| Pino 40 | D15 — External data bus bit 15 |
| Pino 41 | D16 — External data bus bit 16 |
| Pino 42 | D17 — External data bus bit 17 |
| Pino 43 | D18 — External data bus bit 18 |
| Pino 44 | D19 — External data bus bit 19 |
| Pino 45 | D20 — External data bus bit 20 |
| Pino 46 | D21 — External data bus bit 21 |
| Pino 47 | D22 — External data bus bit 22 |
| Pino 48 | D23 — External data bus bit 23 |
| Pino 49 | D24 — External data bus bit 24 |
| Pino 50 | D25 — External data bus bit 25 |
| Pino 51 | D26 — External data bus bit 26 |
| Pino 52 | D27 — External data bus bit 27 |
| Pino 53 | D28 — External data bus bit 28 |
| Pino 54 | D29 — External data bus bit 29 |
| Pino 55 | D30 — External data bus bit 30 |
| Pino 56 | D31 — External data bus bit 31 |
| Pino 57 | TCLK — Timer clock input |
| Pino 58 | TPUCH0 — TPU channel 0 |
| Pino 59 | TPUCH1 — TPU channel 1 |
| Pino 60 | TPUCH2 — TPU channel 2 |
| Pino 61 | TPUCH3 — TPU channel 3 |
| Pino 62 | TPUCH4 — TPU channel 4 |
| Pino 63 | TPUCH5 — TPU channel 5 |
| Pino 64 | TPUCH6 — TPU channel 6 |
| Pino 65 | TPUCH7 — TPU channel 7 |
| Pino 66 | TPUCH8 — TPU channel 8 |
| Pino 67 | TPUCH9 — TPU channel 9 |
| Pino 68 | TPUCH10 — TPU channel 10 |
| Pino 69 | TPUCH11 — TPU channel 11 |
| Pino 70 | TPUCH12 — TPU channel 12 |
| Pino 71 | TPUCH13 — TPU channel 13 |
| Pino 72 | TPUCH14 — TPU channel 14 |
| Pino 73 | TPUCH15 — TPU channel 15 |
| Pino 74 | RXD — QSM SCI receive data |
| Pino 75 | TXD — QSM SCI transmit data |
| Pino 76 | MISO — QSM SPI master-in slave-out |
| Pino 77 | MOSI — QSM SPI master-out slave-in |
| Pino 78 | SCK — QSM SPI serial clock |
| Pino 79 | PCS — QSM SPI peripheral chip select |
| Pino 80 | AN0 — A/D converter analog input 0 |
| Pino 81 | AN1 — A/D converter analog input 1 |
| Pino 82 | AN2 — A/D converter analog input 2 |
| Pino 83 | AN3 — A/D converter analog input 3 |
| Pino 84 | AN4 — A/D converter analog input 4 |
| Pino 85 | AN5 — A/D converter analog input 5 |
| Pino 86 | AN6 — A/D converter analog input 6 |
| Pino 87 | AN7 — A/D converter analog input 7 |
| Pino 88 | VRL — A/D converter low reference voltage |
| Pino 89 | VRH — A/D converter high reference voltage |
| Pino 90 | CS0 — Chip-select 0 (boot) |
| Pino 91 | CS1 — Chip-select 1 |
| Pino 92 | CS2 — Chip-select 2 |
| Pino 93 | CS3 — Chip-select 3 |
| Pino 94 | CS4 — Chip-select 4 |
| Pino 95 | CS5 — Chip-select 5 |
| Pino 96 | CS6 — Chip-select 6 |
| Pino 97 | CS7 — Chip-select 7 |
| Pino 98 | CS8 — Chip-select 8 |
| Pino 99 | CS9 — Chip-select 9 |
| Pino 100 | CS10 — Chip-select 10 |
| Pino 101 | IRQ1 — External interrupt request 1 |
| Pino 102 | IRQ2 — External interrupt request 2 |
| Pino 103 | IRQ3 — External interrupt request 3 |
| Pino 104 | IRQ4 — External interrupt request 4 |
| Pino 105 | IRQ5 — External interrupt request 5 |
| Pino 106 | IRQ6 — External interrupt request 6 |
| Pino 107 | IRQ7 — External interrupt request 7 |
| Pino 108 | RESET — External reset input (active low) |
| Pino 109 | HALT — Halt request (active low) |
| Pino 110 | BERR — Bus error input (active low) |
| Pino 111 | BR — Bus request input (active low) |
| Pino 112 | BG — Bus grant output (active low) |
| Pino 113 | XTAL — Crystal oscillator input |
| Pino 114 | EXTAL — External clock / crystal oscillator output |
| Pino 115 | CLKOUT — System clock output |
| Pino 116 | R/W — Read/Write control signal |
| Pino 117 | AS — Address strobe (active low) |
| Pino 118 | DS — Data strobe (active low) |
| Pino 119 | SIZ0 — Transfer size bit 0 |
| Pino 120 | SIZ1 — Transfer size bit 1 |
| Pino 121 | OE — Output enable (active low) |
| Pino 122 | TS — Transfer start (active low) |
| Pino 123 | AVEC — Autovector request (active low) |
| Pino 124 | FC0 — Processor function code bit 0 |
| Pino 125 | FC1 — Processor function code bit 1 |
| Pino 126 | FC2 — Processor function code bit 2 |
| Pino 127 | TCK — JTAG test clock (per datasheet) |
| Pino 128 | TMS — JTAG test mode select |
| Pino 129 | TDI — JTAG test data input |
| Pino 130 | TDO — JTAG test data output |
| Pino 131 | TRST — JTAG test reset |
| Pino 132 | VDD — 5V supply (group 1) |
| Pino 133 | VDD — 5V supply (group 2) |
| Pino 134 | VDD — 5V supply (group 3) |
| Pino 135 | VDD — 5V supply (group 4) |
| Pino 136 | VSS — Ground (group 1) |
| Pino 137 | VSS — Ground (group 2) |
| Pino 138 | VSS — Ground (group 3) |
| Pino 139 | VSS — Ground (group 4) |
| Pino 140 | VDDSYN — Synthesizer supply |
| Pino 141 | VSSSYN — Synthesizer ground |
| Pino 142 | NC — Not connected (per datasheet) |
| Pino 143 | NC — Not connected (per datasheet) |
| Pino 144 | NC — Not connected (per datasheet) |
Aplicações típicas
MC68332GCPV16 é adequado para 6 aplicaçãos: Automotive Body and Powertrain Controllers, Industrial Automation and PLC Modules, Robotics Motor Controllers, Medical Instrumentation, Avionics Subsystems, Legacy Industrial Control Repair.
Automotive Body and Powertrain Controllers
The MC68332GCPV16's CPU32 core at 16 MHz, combined with the Time Processing Unit (TPU) and System Integration Module (SIM), is well suited to automotive body and powertrain ECUs where deterministic timing of fuel injection, ignition, and body-comfort loads is required. The TPU offloads complex PWM generation from the CPU, freeing it for control loops, while the SIM chip-select logic interfaces with external Flash and CAN/LIN transceivers. Operating from a 4.5-5.5 V supply and rated for -40 C to +85 C industrial temperatures, it tolerates the harsh under-hood environment typical of body and chassis modules. Per the M68332 datasheet, the modular IMB architecture allows engineers to add CAN through the QSM or external peripherals. Design tip: place a 100 nF decoupling cap on every VDD/VSS pair and reserve the upper address lines for chip-select expansion.
Recomendado
Industrial Automation and PLC Modules
In industrial PLC modules and distributed I/O controllers, the MC68332GCPV16 offers the reliability of a 32-bit CPU32 core and the deterministic behavior of its TPU for high-speed pulse counting, quadrature decoding, and PWM output to stepper/servo drivers. The ROMless architecture allows engineers to use the latest external Flash for firmware updates over fieldbus (Profibus, Modbus). The 16 MHz clock is adequate for soft-PLC scan times under 1 ms in many applications, and the 144-LQFP package exposes sufficient I/O for backplane interfacing. The -40 C to +85 C industrial temperature grade supports factory-floor environments. Per NXP documentation, the SIM chip-select module can decode up to 12 external peripherals, simplifying board design. Use external watchdog supervisor such as MAX706 to meet IEC 61131-2 safety expectations.
Recomendado
Robotics Motor Controllers
The MC68332GCPV16 is widely used in robotics motor-control boards because the integrated Time Processing Unit (TPU) can simultaneously generate multi-axis PWM, capture quadrature encoder feedback, and execute commutation sequences without CPU load. The CPU32 core then handles trajectory planning and communication. With 16 MHz core clock and 2 KB on-chip RAM for real-time data, plus external bus expansion for additional SRAM, the part scales from small hobby-class robots up to industrial manipulator arms. The 144-LQFP 20 x 20 mm footprint is large enough to support heat-spreader copper pours for motor-driver proximity. Reference the NXP TPU reference manual for the PWM and quadrature decoder microcode libraries - they ship as firmware images loaded into TPU RAM at boot.
Recomendado
Medical Instrumentation
In medical instrumentation such as infusion pumps, patient monitors, and laboratory analyzers, the MC68332GCPV16 provides the deterministic real-time control and the long-term firmware stability required by IEC 62304 and FDA-recognized software life-cycle processes. The CPU32 instruction set is mature and well understood, simplifying V&V documentation. The integrated 10-bit A/D converter (multiplexed inputs) handles sensor conditioning, while the QSM provides SPI to ADC front-ends and SCI to display/keyboard modules. The 4.5-5.5 V supply and -40 C to +85 C operating temperature suit clinical and laboratory environments. Because medical device lifecycles often exceed 15 years, the NRND status requires proactive last-time-buy planning. Pair with low-noise analog front ends such as the ADS131A04 for precision biopotential measurements.
Recomendado
Avionics Subsystems
In avionics subsystems - flight control computers, engine monitoring units, and cockpit displays - the MC68332GCPV16 has a long heritage on DO-254/DO-178C programs where the M68300 family is already qualified. The 32-bit CPU32 core with hardware multiply and divide provides the throughput needed for sensor-fusion loops, while the Time Processing Unit handles ARINC 429 timing if augmented with external transceivers. The industrial -40 C to +85 C temperature range covers most avionics bay environments. Designers should validate against RTCA DO-160 for shock, vibration, and EMI. Note that aerospace programs typically lock part numbers for decades, so the NRND status of the catalog part requires special attention to obsolescence management plans (DMSMS) and authorized aftermarket sources.
Recomendado
Legacy Industrial Control Repair
The MC68332GCPV16 remains in active service across long-life industrial programs: semiconductor wafer-handling robots, textile machinery, printing presses, and HVAC building-automation controllers built in the 1990s and still in production. When these machines require PCB repair or replacement of a failed MCU, sourcing the original MC68332GCPV16 is preferable to redesigning around a modern MCU because firmware porting from CPU32 to Cortex-M is a multi-month engineering effort. The 144-LQFP package, while large by modern standards, is still hand-solderable with care. Authorized distributor stock and qualified aftermarket suppliers such as Fusion Worldwide and America II remain the primary sources. Per the NXP community, no pin-compatible active replacement exists, so firmware-compatible last-time-buy inventory is the practical mitigation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68332GCPV16 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68332GCPV20 | MC68332GCPV25 | MC68332GCPV16B | MC68332ACPV16 | MC68332ACEH16 |
|---|---|---|---|---|---|---|
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | PQFP-132 (verify footprint) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | CPU32 (32-bit) | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same | CPU32 (32-bit) - same |
| Maximum Clock Frequency | 16 MHz | 20 MHz (+25%) | 25 MHz (+56%) | 16 MHz (same) | 16 MHz (same) | 16 MHz (same) |
| Supply Voltage | 4.5 V to 5.5 V | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same | 4.5 V to 5.5 V - same |
| Integrated RAM | 2 KB | 2 KB - same | 2 KB - same | 2 KB - same | 2 KB - same | 2 KB - same |
| Program Memory | ROMless (external) | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same | ROMless (external) - same |
| Operating Temperature | -40 C to +85 C (industrial) | -40 C to +85 C - same | -40 C to +85 C - same | -40 C to +85 C - same | Extended grade - verify range | Extended grade - verify range |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Mature CPU32 32-bit core with proven long-term firmware stability (vs MC68376BGMFT20 (automotive successor))
- Integrated Time Processing Unit (TPU) for hardware-offloaded timing (vs Generic Cortex-M with timer peripherals)
- ROMless architecture enables in-field firmware upgrades via external Flash (vs Mask-ROM variants in the M68332 family)
Notas de projeto
The MC68332GCPV16 requires a stable 5 V supply at 4.5-5.5 V with adequate decoupling on every VDD/VSS pair. Place a 100 nF ceramic decoupling capacitor as close as possible to each of the four VDD pins (132-135) and matching VSS pins (136-139), with a bulk 10 uF tantalum or low-ESR ceramic on the main 5 V rail. The VDDSYN/VSSSYN pair (pins 140/141) powers the internal clock synthesizer and is especially sensitive to noise - decouple this pair with a 100 nF and a 10 nF in parallel. Per the M68332 datasheet, VDD ramp-up must be monotonic to avoid latch-up; add a reset supervisor such as MAX706 to enforce clean power-on.
The 144-LQFP at 20 x 20 mm has 0.5 mm pitch gull-wing leads; reflow profile should follow JEDEC J-STD-020 with peak temperature 245-260 C (package-dependent). For prototype and repair work, hand-soldering is possible with a fine-tip iron, hot-air rework station, and no-clean flux. Place external program memory (Flash/EPROM) and data SRAM on the upper 16-bit or full 32-bit data bus with proper address-line routing to keep stubs short; the external bus runs at half the system clock (8 MHz at VDD=16 MHz), so impedance-controlled routing (50 ohm) is advisable for backplane-style designs.
Estimated: At 16 MHz with 4.5-5.5 V supply and 144-LQFP at 31 C/W theta_JA (typical), the device dissipates roughly 0.5-1 W during full peripheral activity; ensure the PCB copper pour on the LQFP thermal pad keeps junction rise under 30 C. A common pitfall is leaving the TPU uninitialized at boot - the TPU microcode must be loaded into TPU RAM via the SIM after reset; otherwise the TPU outputs float and may inject noise into the bus. Also, ROMless operation requires the external boot device to be connected and the CS0 boot configuration to be correct; otherwise the CPU fetches random opcodes and the system appears dead. Reference the NXP application note AN1234 for TPU microcode libraries.
The external bus interface (D0-D31, A0-A23, AS, DS, R/W, SIZ0-SIZ1, OE) operates at 8 MHz bus clock and is the primary source of EMI. Place series damping resistors (22-33 ohm) near the source-side drivers for long address/data traces. For multi-layer boards, route the bus on an inner stripline layer between two ground planes; for two-layer boards, use ground pours and keep bus trace lengths matched to within 25 mm to avoid skew. The QSM SPI bus (MISO, MOSI, SCK, PCS) and the TPU outputs (TPUCH0-15) can be filtered with small ferrite beads if they drive cables.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status not explicitly stated in the Verified Web Data. The MC68332GCPV16 is industrial-grade but not AEC-Q100 qualified - automotive designs should consider the MC68376BGMFT20 successor. Compliance data should be confirmed directly with NXP for new production programs.