MC7447AHX1333LB - 1.333GHz PowerPC G4 MPU | NXP | 360-FCCBGA
MPN: MC7447AHX1333LB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $75 | $75.00 |
| 10 | $68 | $680.00 |
| 25 | $62 | $1,550.00 |
| 50 | $58 | $2,900.00 |
| 100 | $54 | $5,400.00 |
MC7447AHX1333LB Overview
A microprocessor (MPU) is an integrated circuit that fetches, decodes, and executes instructions of a program stored in external memory. The MC7447AHX1333LB belongs to the PowerPC G4 family, which extends the PowerPC 7xx ISA with AltiVec (a 128-bit SIMD vector unit). Within the broader taxonomy, this MPU sits as: microprocessor -> RISC microprocessor -> PowerPC -> PowerPC G4 -> embedded MPU. It targets compute-dense workloads in networking, telecom, defense, and high-performance embedded applications where integer and vector throughput matter more than power efficiency.
Key features of the MC7447AHX1333LB include a 1.333 GHz core clock, 133 MHz (effective 533 MHz quad-pumped) bus interface, 512 KB unified L2 cache, full 128-bit AltiVec SIMD engine, 64-bit data bus, and a 1.3V core voltage with I/O voltages of 1.8V and 2.5V. The device operates across an industrial temperature range up to 105C, making it suitable for thermally demanding enclosures.
The MC7447AHX1333LB uses a superscalar out-of-order execution pipeline paired with a 7-stage integer pipeline. Its AltiVec unit adds a dedicated vector pipeline executing 16-way SIMD on 128-bit registers, enabling parallel processing of DSP-like workloads in networking and media codecs. The 64-bit MPX bus connects to external SDRAM/SRAM controllers, and the on-die L2 cache reduces external memory pressure for working-set-bound code.
Typical applications include high-end embedded networking routers and switches, telecom baseband equipment, signal processing systems, single-board computers used in aerospace and defense, and industrial control platforms requiring deterministic compute. Designers typically pair this MPU with NXP (Motorola/Freescale) system controllers from the MPC107/MPC106 families and PC133 SDRAM memories.
When designing with this part, ensure the PCB uses a 25x25 mm FCCBGA land pattern with proper via-in-pad or microvia construction, and validate thermal dissipation under worst-case workload because the die is rated only to 105C. The MC7447AHX1333LB is also pin-for-pin compatible with the MPC7445 and MPC7447, simplifying reuse across platforms that share the same processor footprint.
This page consolidates distributor pricing, drop-in compatible MPC74xx alternatives, and practical thermal/BGA layout guidance that the manufacturer product brief does not present in a single place.
Drop-in alternatives for MC7447AHX1333LB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC7447AHX1333LB (same form factor and footprint) — differing in Mounting Type, Operating Temperature, Package, Process Technology, Bus Width.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC7447AVU1000NB
✅ Drop-In✓ In Stock
$99.5 / Unit
View Datasheet →MPC7447AHX1333LB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC7447AVU1000NB
✅ Drop-In📋 Reference alternative (not in catalog)
MPC7445HX667ND
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC7447HX1000NB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MPC7447AHX1267LB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC7447AHX1333LB Maximum Ratings & Electrical Characteristics
| Core Processor | PowerPC G4 |
| Number of Cores / Bus Width | 1 Core, 32-Bit |
| Core Clock Speed | 1.333 GHz |
| L2 Cache | 512 KB on-chip |
| Bus Interface Width | 64-bit |
| Bus Speed | 133 MHz (533 MHz quad-pumped) |
| SIMD Co-Processor | AltiVec 128-bit |
| Core Voltage | 1.3 V |
| I/O Voltage | 1.8 V / 2.5 V |
| Operating Temperature | 0C to +105C |
| Package | 360-FCCBGA (25x25 mm) |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 0.13 micrometer CMOS |
| Graphics Acceleration | No |
| Display & Interface Controllers | None integrated |
| RoHS Status | unknown |
| Pin-for-Pin Compatible With | MPC7445, MPC7447 |
MC7447AHX1333LB 360-fccbga (25x25 mm) Pin Configuration Guide
Pin configuration for MC7447AHX1333LB (360-fccbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7447AHX1333LB.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7447AHX1333LB is suitable for 6 applications: Embedded Networking Routers, Telecom Baseband Signal Processing, Single-Board Computers (Aerospace and Defense), Industrial Control and Automation Platforms, High-Performance Embedded Computing (HPEC), Legacy Computing Appliance Refresh.
Embedded Networking Routers
The MC7447AHX1333LB's 1.333 GHz core and AltiVec SIMD engine make it a strong fit for embedded networking routers that perform packet classification and deep packet inspection on the data plane. Designers pair it with NXP MPC107/MPC106 system controllers and PC133 SDRAM memories. The 64-bit MPX bus at 533 MT/s (quad-pumped) sustains line-rate throughput across multiple Gigabit Ethernet ports. Compared with a microcontroller-class solution, the G4's superscalar pipeline and 512 KB on-die L2 cache cut average packet processing latency by 30-50%. Thermal design must hold junction at or below 105C under worst-case traffic load. The legacy PowerPC software ecosystem (Linux 2.6, VxWorks, LynxOS) is mature for this part, accelerating deployment.
Recommended
Telecom Baseband Signal Processing
The MC7447AHX1333LB's AltiVec 128-bit SIMD unit accelerates DSP-like signal processing tasks common in telecom baseband equipment, including FFTs, channel equalization, and vocoder pipelines. The 1.3 V core keeps active power manageable for 24/7 base-station operation, while the 105C thermal ceiling supports outdoor enclosures. The part is typically paired with external DSP accelerators or ASIC front-ends via its 64-bit MPX bus. Designers should reserve headroom for AltiVec programming (typical 4-8x speedup over scalar on vectorizable kernels). Software stacks port cleanly from existing PowerPC G4 telecom platforms. The MPC7447A silicon revision (Apollo 7 PM, rev 1.1) is the most mature for telecom volumes.
Recommended
Single-Board Computers (Aerospace and Defense)
The MC7447AHX1333LB powers long-lifecycle single-board computers in aerospace and defense platforms, where the 360-FCCBGA's rugged ceramic packaging and 105C operating temperature exceed commercial SBC requirements. With 512 KB on-chip L2 cache and 1.333 GHz compute, the G4 outperforms many modern low-power ARM SBCs on integer and vector workloads while maintaining pin compatibility with the MPC7445/MPC7447 installed base. Aerospace integrators value this family for legacy VxWorks and LynxOS certifications, and for field-proven reliability under shock and vibration. Pairing with Conduction-Cooled VME (VME64x) SBC chassis simplifies upgrades from older 7445 deployments.
Recommended
Industrial Control and Automation Platforms
The MC7447AHX1333LB fits industrial control platforms that demand deterministic compute, real-time operating system support, and long-life parts availability through last-time-buy programs. Its 1.333 GHz single-thread throughput and AltiVec engine handle servo loop computation, PLC ladder execution, and machine vision preprocessing in factory automation. The 105C operating range supports cabinet-internal deployment without active cooling. Industrial designers integrate it with PCI-based I/O cards, and migrate easily between speed grades (e.g., 1.0 GHz vs 1.333 GHz) because all MPC7447A parts share the same 360-FCCBGA footprint and pinout per NXP family documentation.
Recommended
High-Performance Embedded Computing (HPEC)
The MC7447AHX1333LB delivers HPEC-grade throughput in ruggedized embedded chassis for radar, sonar, and electronic warfare subsystems where compute density per liter matters more than power efficiency. The G4's out-of-order pipeline plus 128-bit AltiVec accelerates beamforming and matched-filter kernels, while the 512 KB L2 keeps working sets on-die to avoid external memory bandwidth bottlenecks on the 64-bit MPX bus. Defense integrators can pair multiple G4 nodes via the 64-bit bus for symmetric multiprocessing. The 105C ceiling and ceramic FCCBGA package suit conduction-cooled VPX deployments in military vehicles.
Recommended
Legacy Computing Appliance Refresh
The MC7447AHX1333LB is widely deployed as a 1U/2U rack appliance compute engine for legacy data-center workloads such as print servers, mail routers, and security appliances running legacy PowerPC Linux or BSD. Its 1.333 GHz throughput and 512 KB L2 cache sustain modest transaction rates for these workloads. The 360-FCCBGA package is typically socketed via a PGA/BGA adapter for field replacement. IT refresh teams use last-time-buy stock from authorized distributors to extend the operating life of installed appliances by 3-5 years. Designers must plan a forward migration to QorIQ or Layerscape once stock is depleted.
Recommended
Recommended Products Summary
Engineering reference data for MC7447AHX1333LB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7447AVU1000NB | MPC7447AHX1333LB | MPC7447AVU1000NB | MPC7445HX667ND | MPC7447HX1000NB | MPC7447AHX1267LB |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (formerly Freescale) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Core Clock | 1.333 GHz | 1.0 GHz | 1.333 GHz | 1.0 GHz | 667 MHz | 1.0 GHz | 1.267 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB | 512 KB |
| Core Voltage | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V | 1.3 V |
| Bus Width | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit | 64-bit |
| AltiVec SIMD | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest speed grade of the MPC7447A family (vs MC7447AVU1000NB)
- Pin-for-pin compatible with MPC7445/MPC7447 (vs MPC7448HX1267ND)
- Mature AltiVec SIMD software ecosystem (vs Lower-clocked MPC7447A variants)
Design Notes
Estimated: at 1.333 GHz core clock with 1.3 V core supply, the MC7447AHX1333LB typical core power is ~10-12 W under workload. Designers must use at least a 2 oz copper layer plus thermal vias under the 360-FCCBGA and ensure junction temperature stays below 105C. Add a heat spreader or heat sink for sustained full-load operation. Monitor Tj with the on-die thermal diode.
The 360-FCCBGA (25x25 mm) requires via-in-pad or microvia PCB construction to route signals out of the inner rows. Use 1.27 mm ball pitch with appropriate non-solder-mask-defined (NSMD) pads. Match trace impedance to 50 ohm single-ended for the MPX bus; keep bus signals length-matched within 25 ps to preserve the 533 MT/s quad-pumped timing window.
The MC7447AHX1333LB shares the 360-FCCBGA footprint with MPC7445 and MPC7447 siblings per NXP, but NOT with the MPC7448 family - the MPC7448 dual-core adds pins for the second core and changes the bus interface. Confirming pinout against the 360-ball map before PCB re-spin prevents costly rework. Use NXP's MPC7447A hardware specification document for the authoritative ball map.
Decouple the 1.3 V core rail with at least six 10 uF X5R ceramic capacitors placed close to the BGA balls, plus a 100 uF bulk polymer capacitor. Decouple the 1.8 V and 2.5 V I/O rails with 1 uF + 100 nF pairs at each island. Keep noisy switching converters away from the MPX bus region; a dedicated ground split under the BGA improves signal integrity.
Compliance Information
Compliance status not explicitly stated in the Verified Web Data; original Freescale/NXP product page confirms only the part is Discontinued. AEC-Q100 is not applicable for legacy non-automotive MPU. RoHS/REACH/lead-free status to be confirmed with distributor documentation before modern environmental compliance review.