MC7447AHX1420LB - 1.42GHz PowerPC G4 MPU | NXP | 360-FCCBGA
MPN: MC7447AHX1420LB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $352.2 | $352.20 |
| 10 | $332.5 | $3,325.00 |
| 50 | $312 | $15,600.00 |
| 100 | $295 | $29,500.00 |
| 250 | $280 | $70,000.00 |
MC7447AHX1420LB Overview
A PowerPC G4 microprocessor is a 32-bit RISC CPU that extends the Power Architecture instruction set with the AltiVec SIMD/vector engine, enabling high-throughput parallel arithmetic for DSP-style kernels such as multimedia codecs, encryption, and radar processing. Within the broader system hierarchy it sits as an application-class MPU above microcontrollers, below high-end server CPUs, and pairs with companion memory controllers, northbridges, and voltage regulators to form a complete compute node. The MPC7447A family was designed to deliver server-class integer performance at embedded power budgets.
Key features include a 1.42 GHz core frequency, 64-bit external data bus, dedicated L1 instruction and data caches plus 512 KB unified L2 with cache locking support, eight instruction and data BAT registers for lightweight embedded operating systems, and low-power modes. The AltiVec unit delivers up to 16 multiply-accumulate operations per cycle, making the part suitable for vectorized workloads.
Architecturally the device uses a seven-stage integer pipeline with out-of-order execution capability and a separate vector unit. The 64-bit MPX bus to the system controller provides high memory bandwidth, while the integrated L2 cache reduces external memory pressure for working-set-intensive workloads. The 0.13 um process delivers the frequency target at modest power relative to earlier PowerPC G4 generations.
Typical applications include leading-edge embedded computing platforms, network control and packet processing appliances, signal-processing boards, telecom base-station controller cards, and aerospace/defense single-board computers where pin-compatible PowerPC upgrades are required. According to NXP product information, the part is suited to legacy PowerPC designs needing a 1.4 GHz-class core in a known footprint.
When designing with this device, ensure the board supports both 1.8 V and 2.5 V rails and that the 360-ball FCCBGA land pattern matches the package outline. Adequate thermal management is required because the device dissipates significant power under sustained AltiVec loads; the recommended junction ceiling is 105 C per the device ordering code suffix. This page synthesizes distributor availability, lifecycle signals, and drop-in PowerPC G4 alternatives that share the same package family.
Drop-in alternatives for MC7447AHX1420LB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC7447AVU1420LB
✅ Drop-In📋 Reference alternative (not in catalog)
PC7447AVLH1420LC
✅ Drop-In📋 Reference alternative (not in catalog)
MC7447AHX1420LB Maximum Ratings & Electrical Characteristics
| Core | PowerPC G4 (MPC7447A) |
| Architecture | 32-bit RISC with 128-bit AltiVec SIMD |
| Core Frequency | 1.42 GHz |
| Number of Cores | 1 |
| Bus Width | 64-bit |
| L2 Cache | 512 KB on-chip, unified |
| Cache Locking | Yes (L1) |
| BAT Registers | 8 instruction + 8 data |
| SIMD Engine | AltiVec 128-bit |
| Process Technology | 0.13 um CMOS |
| Supply Voltage (Core) | 1.8 V |
| Supply Voltage (I/O) | 2.5 V |
| Operating Temperature | 0C to 105C |
| Package | 360-FCCBGA (25x25 mm) |
| Mounting Type | Surface Mount (BGA) |
MC7447AHX1420LB 360-fccbga (25x25 mm) Pin Configuration Guide
Pin configuration for MC7447AHX1420LB (360-fccbga (25x25 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC7447AHX1420LB.
Refer to the datasheet for full pin configuration.
Typical Applications
MC7447AHX1420LB is suitable for 6 applications: Embedded Network Control Appliances, Signal Processing Boards, Telecom Base-Station Controller Cards, Aerospace/Defense Single-Board Computers, Industrial Computing Platforms, Legacy PowerPC G4 Sustaining Designs.
Embedded Network Control Appliances
The MC7447AHX1420LB's 1.42 GHz PowerPC core with AltiVec acceleration fits router and switch control-plane workloads that perform per-packet header inspection and ACL matching. Its 64-bit MPX bus and 512 KB L2 cache sustain line-rate lookups against large routing tables. Embedded network control appliances benefit from the part's low-power modes, which reduce idle consumption when traffic is low. The 360-FCCBGA package integrates into compact line-card form factors where a high-performance MPU with on-chip cache is required. Companion parts include the MPC107 northbridge and DDR memory buffers. Designers should size heatsinking for sustained packet processing because AltiVec workloads can fully exercise the core.
Recommended
Signal Processing Boards
The AltiVec engine enables up to 16 single-precision MAC operations per cycle, making the MC7447AHX1420LB a strong fit for radar, sonar, and software-defined radio DSP front-ends. Its 1.42 GHz clock and 128-bit vector unit accelerate FFTs, FIR filters, and beamforming kernels that would otherwise require a dedicated DSP. Signal-processing boards in industrial and defense markets rely on the part's 0.13 um CMOS implementation to balance throughput and power. The 360-FCCBGA package supports high-density PCB layouts common in VPX and CompactPCI signal-processing cards. Designers should pair the MPU with a companion memory controller and external SDRAM to sustain streaming data rates.
Recommended
Telecom Base-Station Controller Cards
The MC7447AHX1420LB provides the control-plane horsepower for legacy 3G/4G base-station controller cards where PowerPC software stacks are already deployed. Its 32-bit Power Architecture with AltiVec can manage Layer 2/3 protocols, encryption accelerators, and timing-critical maintenance tasks. Telecom-grade controller cards benefit from the part's industrial temperature grade (0C to 105C) and on-chip L2 cache that reduces external memory traffic during bursts. The 360-FCCBGA footprint integrates into ATCA and MicroTCA backplanes. Operators should ensure power-sequencing circuits match the 1.8 V core and 2.5 V I/O rail requirements specified in the NXP datasheet.
Recommended
Aerospace/Defense Single-Board Computers
The MC7447AHX1420LB's industrial temperature grade and Pin-compatible footprint support aerospace/defense single-board computers (SBCs) that must operate reliably in extended thermal envelopes. Its AltiVec engine accelerates video processing, encryption, and telemetry analysis in avionics and unmanned-vehicle payloads. The second-source PC7447AVLH1420LC from e2v is widely qualified for aerospace programs requiring long-term continuity of supply. Defense SBCs typically use the part in VPX, VXS, or custom conduction-cooled layouts. Designers should review radiation and reliability data from the supplier before deployment in radiation-exposed environments.
Recommended
Industrial Computing Platforms
Industrial computing platforms such as factory automation controllers and machine-vision inspection systems leverage the MC7447AHX1420LB's AltiVec vector engine for high-throughput image-processing pipelines. The 64-bit MPX bus supports bandwidth-hungry frame-grabber interfaces common in machine vision. The part's BAT registers enable efficient access to large memory-mapped I/O spaces, simplifying driver code for industrial peripherals. The 360-FCCBGA package is appropriate for high-density SBCs deployed in factory-floor enclosures. System integrators should design for adequate airflow and ensure the thermal envelope matches the 105 C junction ceiling.
Recommended
Legacy PowerPC G4 Sustaining Designs
Sustaining designs for legacy PowerPC G4 systems - including older Apple Power Mac G4-derived industrial controllers and scientific instrumentation - rely on the MC7447AHX1420LB as a drop-in performance upgrade. The 1.42 GHz speed grade replaces older 1.0 GHz or 1.3 GHz MPC7447A parts without firmware changes, extending the service life of fielded equipment. The 512 KB on-chip L2 cache and AltiVec engine allow sustaining older software without performance penalties. Designers should validate BIOS/firmware against the specific speed-grade stepping before production rollout. Because NXP has discontinued the part, planning for last-time-buy inventory is essential.
Recommended
Recommended Products Summary
Engineering reference data for MC7447AHX1420LB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC7447AVU1420LB | PC7447AVLH1420LC |
|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | e2v technologies |
| Core Frequency | 1.42 GHz | 1.42 GHz | 1.42 GHz |
| L2 Cache | 512 KB | 512 KB | 512 KB |
| Supply Voltage (Core) | 1.8 V | 1.8 V | 1.8 V |
| Supply Voltage (I/O) | 2.5 V | 2.5 V | 2.5 V |
| AltiVec SIMD | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| Process Technology | 0.13 um CMOS | 0.13 um CMOS | 0.13 um CMOS |
| Lifecycle Status | Obsolete (NXP EOL) | Obsolete (NXP EOL) | Aerospace long-term supply |
Key Differentiators
- 1.42 GHz highest speed grade in MPC7447A family (vs MC7447AVS1167NB)
- Industrial/extended temperature grade per HX suffix (vs PC7447AVLH1420LC (e2v aerospace variant))
- 512 KB on-chip L2 cache (vs MC7447AVU1420LB)
Design Notes
The MC7447AHX1420LB requires two independent supply rails: 1.8 V for the core and 2.5 V for the I/O/MPX bus. Power sequencing must follow the NXP MPC7447A hardware specifications to avoid latch-up; the I/O rail should ramp before or simultaneously with the core rail. Estimated: under sustained AltiVec load the core can draw in the multi-amp range; size the 1.8 V regulator for at least 1.5x the typical draw and use low-ESR bulk decoupling close to the BGA balls.
The 360-FCCBGA package dissipates significant heat under sustained AltiVec workloads. A thermal management strategy (heat spreader, heatsink, or airflow) is required to keep the junction temperature below the 105 C ceiling. Estimated: with the part running flat-out at 1.42 GHz, board designers should budget at least 10-15 W of dissipation in worst-case vector workloads and provide a thermal pad or copper pour under the BGA.
The 360-FCCBGA package requires a precise BGA land pattern per the NXP package drawing. Use microvia or via-in-pad PCB technology for reliable assembly, and follow IPC-7095 design rules for BGA. Because the part is obsolete and lead-free, reflow profiles must comply with the JEDEC J-STD-020 moisture sensitivity level of the specific device variant; many 360-FCCBGA lots are MSL3 or higher and require bake-out before assembly.
Do not assume all MC7447A variants are drop-in interchangeable: speed grade (1420 vs 1167 vs 1000), package suffix (HX vs VU vs VS), and temperature grade differ across order codes. Confirm the BGA ball map and AC timing against the NXP datasheet before substituting one suffix for another in production. Also note that the obsolete status means last-time-buy windows are short; plan for safety stock of 12-24 months of demand.
Compliance Information
Compliance data not present in verified sources; confirm from lot-specific manufacturer documentation or certificate of conformance.