MC9S08AC32CFJE - 40MHz 32KB 8-Bit MCU | NXP | LQFP-32
MPN: MC9S08AC32CFJE ✗ End of Life| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MC9S08AC32CFJE Overview
A microcontroller is a semiconductor device that integrates a CPU core, program memory, data memory, I/O, timers, and communication interfaces on one package. The MC9S08AC32CFJE belongs to the S08AC family and the broader 8-bit embedded-controller hierarchy, combining real-time control with more peripheral capability than a basic logic device. The supplied distributor information identifies 32 KB Flash, 8 KB RAM, a 40 MHz clock, a 2.7 V to 5.5 V supply range, and SCI/SPI connectivity.
Key features include a 40 MHz HCS08 CPU, 32 KB Flash for firmware storage, and 8 KB RAM for working data. The 16-bit timer capability supports periodic and timing-sensitive control functions, while SCI and SPI interfaces allow connection to sensors, actuators, displays, and external communications hardware. A 32-LQFP package provides a defined PCB footprint with accessible peripheral leads for compact mixed-signal and embedded-control boards.
The S08 architecture uses an 8-bit instruction-oriented embedded platform and an internal bus frequency identified in the supplied comparison data as 20 MHz. At the system level, the MC9S08AC32CFJE provides a practical bridge between low-cost MCU control and external hardware. Firmware can use timers for periodic control, SCI for serial device communication, and SPI for higher-speed peripheral connections, subject to the detailed electrical and pin-level limits in the manufacturer datasheet.
Typical applications include industrial control panels, sensor interfaces, motor-control front ends, consumer appliances, instrumentation, communication modules, and compact embedded systems. The 32-LQFP package is useful when a design needs more accessible I/O than a very small leadless package while retaining a moderate board footprint. The device should be selected only after checking its complete pinout, electrical limits, memory map, peripheral availability, and lifecycle notices.
For design implementation, preserve the recommended power and decoupling arrangement, confirm every exposed connection, and account for signal-level compatibility on SCI and SPI. Do not assume that a competitor with the same nominal pin count is interchangeable: package drawing, pin functions, clock requirements, memory organization, and peripheral behavior must match. Validate the complete operating temperature range and supply tolerances against the manufacturer datasheet before production.
This page consolidates the verified NXP product identity, distributor specifications, package information, lifecycle indication, and practical design context. It also distinguishes verified source data from unavailable details so engineers can locate the authoritative datasheet, confirm pinout information, and validate a replacement before committing a PCB or production build.
Drop-in alternatives for MC9S08AC32CFJE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08AC32CFJE (same form factor and footprint) — differing in Package, Product Type, RoHS Status, Architecture, Lifecycle Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08AC32CFGER
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08PA32AVLC
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08PA32VLC
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08AC32CFJE Maximum Ratings & Electrical Characteristics
| Product Type | 8-bit HCS08 microcontroller |
| CPU Family | S08 |
| Maximum Clock Speed | 40 MHz |
| Internal Bus Frequency | 20 MHz |
| Program Memory | 32 KB Flash |
| RAM | 8 KB |
| Timer | 16-bit timer |
| Serial Interfaces | SCI/SPI |
| Supply Voltage Range | 2.7 V to 5.5 V |
| I/O Ports | 38 |
| Package | 32-LQFP, 7 mm × 7 mm |
| Mounting Type | Surface Mount |
| Lifecycle Stage | NRND |
| RoHS Status | RoHS compliant |
| Core Architecture | 8-bit CISC embedded controller |
| Memory Organization | 32K × 8 Flash |
| Application Class | Cost-effective embedded system design |
MC9S08AC32CFJE 32-lqfp, 7 mm × 7 mm Pin Configuration Guide
Pin configuration for MC9S08AC32CFJE (32-lqfp, 7 mm × 7 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC9S08AC32CFJE.
Refer to the datasheet for full pin configuration.
Typical Applications
MC9S08AC32CFJE is suitable for 6 applications: Industrial Sensor Interface, Appliance Control Board, Compact Motor-Control Front End, Serial Communication Module, Instrumentation and Measurement Front Panel, Low-Cost Embedded Control Module.
Industrial Sensor Interface
The NXP Semiconductors MC9S08AC32CFJE fits compact industrial sensor interfaces because its S08 core reaches 40 MHz, while 8 KB RAM and 32 KB Flash support protocol handling, filtering, and configuration logic. Its SCI interface can connect to serial sensors, and SPI can serve synchronous sensors or register-based peripherals. In a controller, the MCU can acquire measurements, apply thresholds, report status, and drive an alarm or actuator. The 2.7 V to 5.5 V supply range is useful for 3.3 V and 5 V system partitioning. Confirm pin-level voltage limits and timing from the NXP datasheet before connecting field wiring, and provide protection for industrial transients.
Recommended
Appliance Control Board
MC9S08AC32CFJE is suitable for appliance control boards that need deterministic periodic tasks, local buttons, sensors, and serial communication. The 16-bit timer supports timing-oriented control functions, while the 40 MHz S08 processor provides headroom for state machines, debouncing, and display or actuator decisions. SCI can serve external modules, and SPI can support displays or external converters. Its 32-LQFP footprint leaves accessible pins for mixed signal and power-control routing, while the 2.7 V to 5.5 V range supports common embedded rails. Validate reset, power sequencing, watchdog usage, and peripheral limits against the manufacturer documentation.
Recommended
Compact Motor-Control Front End
The MC9S08AC32CFJE can serve as the digital control front end for compact motor systems where a dedicated motor-control peripheral is not required by the verified specification set. Its 40 MHz S08 core and 16-bit timer resources can manage sequencing, speed-reference handling, fault logic, and communications, while SCI/SPI can connect to sensors or a higher-level controller. External MOSFETs, gate drivers, current sensing, and protection remain necessary for power conversion. The LQFP package supports routed signal access and testability, but the designer must verify pin multiplexing, timer channel availability, voltage levels, and thermal performance in the official datasheet.
Recommended
Serial Communication Module
MC9S08AC32CFJE fits cost-sensitive serial communication modules because the device combines 32 KB Flash, 8 KB RAM, SCI/SPI, and a 40 MHz S08 core in a 32-LQFP package. Firmware can implement framing, address handling, diagnostics, and protocol conversion while the SCI interface connects to a host or field link. The 2.7 V to 5.5 V supply range allows integration with common embedded voltage rails, although the exact transceiver, connector, and logic-level requirements are application-specific. Use the datasheet to confirm peripheral multiplexing, interrupt behavior, baud-rate limits, and package pin assignments.
Recommended
Instrumentation and Measurement Front Panel
MC9S08AC32CFJE can be used in instrumentation front panels where a compact controller reads controls, updates indicators, handles timing, and communicates with a measurement engine. The 40 MHz processing capability supports responsive state-machine logic, while SCI/SPI provides paths to displays, data converters, or isolated serial links. Its 32-LQFP package is large enough for accessible routing and probing compared with a very small leadless package. The available verified data does not specify analog inputs, ADC performance, display drivers, or isolation ratings, so designers must add or verify those functions externally and confirm all pin multiplexing in the NXP documentation.
Recommended
Low-Cost Embedded Control Module
The NXP Semiconductors MC9S08AC32CFJE is appropriate for low-cost embedded control modules that need a compact CPU, Flash firmware storage, RAM, timers, and serial connectivity without a larger high-end MCU. A 40 MHz S08 core can execute control loops and communication tasks, while the 32-LQFP package provides a practical surface-mount footprint and accessible test pads. The 2.7 V to 5.5 V range helps integrate with mixed-voltage peripherals, but level shifting and decoupling still require design verification. Because the product is NRND, use it primarily where an existing design is qualified or after checking NXP lifecycle and change notices.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08AC32CFJE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08AC32CFGER | MC9S08PA32AVLC | MC9S08PA32VLC |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP, 7 mm × 7 mm | LQFP-32 | LQFP-32 | LQFP-32 |
Key Differentiators
- Documented 40 MHz S08 processing capability (vs MC9S08PA32AVLC)
- 32 KB Flash with 8 KB RAM (vs MC9S08PA32VLC)
- Explicit SCI/SPI connectivity (vs MC9S08AC32CFGER)
Design Notes
Use the verified 2.7 V to 5.5 V supply range as the design envelope, while checking the NXP datasheet for voltage tolerances, current limits, reset behavior, and absolute maximum ratings. Place local decoupling close to the MCU supply pins and provide clean return paths for serial and timer signals. Estimated power dissipation is not calculated because the verified data does not provide the supply current, core utilization, or operating profile required for a reliable estimate.
Route the LQFP footprint according to the official NXP package drawing rather than relying only on the nominal 32-LQFP name. Preserve access to all programming, reset, clock, power, ground, and peripheral pins. Check pin multiplexing and alternate-function routing before layout because the verified results confirm package size but do not provide the complete numbered pinout. Validate land geometry against the manufacturer’s package dimensions and solder mask requirements.
SCI and SPI traces should be kept short where possible, with continuous ground references and controlled return paths. Confirm signal voltage levels before connecting external devices because the supplied data gives a 2.7 V to 5.5 V device supply range but does not establish every I/O threshold or peripheral timing condition. Use series damping, appropriate pull components, or level translation only after reviewing the relevant datasheet pin specifications.
Do not treat a same-named S08 family device as automatically interchangeable. The alternatives results provide related candidate MPNs, but they do not verify every pin, memory, peripheral, timing, and lifecycle parameter. Before replacing a PCB, compare the official datasheets and package drawings, map every used signal, and perform a hardware bring-up test. For new products, confirm the NXP NRND roadmap and product-change notices.
Compliance Information
The supplied DigiChip result labels the part RoHS compliant. REACH, halogen-free status, conflict-minerals status, and lead-free status are not stated in the verified data. AEC-Q100 is not applicable based on the supplied evidence, which identifies a general embedded MCU rather than an automotive-qualified variant.
