NXP Semiconductors

MC9S08QE32CLCR - 8-bit S08 MCU, 32KB Flash, 50MHz | NXP

MPN: MC9S08QE32CLCR ✓ Active
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2.5 V / 3.3 V (5 V-tolerant I/O on select pins) Vdss 32-pin LQFP (7x7 mm), Tape & Reel Package 50.33 MHz Speed 32 KB Memory
From $2.2 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $3.85 $3.85
10 $3.45 $34.50
100 $2.95 $295.00
500 $2.55 $1,275.00
1,000 $2.2 $2,200.00
ℹ️ All prices are in USD

MC9S08QE32CLCR Overview

The NXP Semiconductors MC9S08QE32CLCR is an 8-bit S08 CISC microcontroller delivering 50 MHz core performance with 32 KB of embedded Flash memory and 2 KB of RAM, housed in a 32-pin LQFP (7x7 mm) surface-mount package. The part integrates an LCD driver, an analog-to-digital converter, and multiple serial interfaces (SCI, SPI, I2C) on a single die, targeting cost-sensitive industrial and consumer embedded systems that need mixed-signal capability without external components.

An 8-bit microcontroller (MCU) is a microprocessor integrated with program memory (Flash/ROM), data memory (RAM), and peripheral subsystems on a single silicon die. The S08 family from NXP uses a CISC (Complex Instruction Set Computer) core that runs an HC08-extended instruction set, allowing dense object code and easy migration from legacy HC08 and HCS08 designs. Within the broader taxonomy, the S08 sits below 16-bit S12/MagniV devices and 32-bit Kinetis / LPC MCUs, occupying the cost-optimized tier where GPIO count and on-chip analog integration dominate BOM savings.

Key features of the MC9S08QE32CLCR include operation from a 2.5 V to 3.3 V supply (with 5 V-tolerant I/O on selected pins), an internal clock source with an external reference option, low-power stop and wait modes, an on-chip LCD driver capable of driving segment displays, a 12-bit ADC, and hardware CRC. The integrated peripherals reduce external component count and shrink PCB area in HMI, metering, and small-appliance designs.

The device is built on NXP's proven S08 process and includes a built-in BDM (Background Debug Mode) interface for non-intrusive in-circuit debug and Flash programming. Hardware breakpoints, real-time bus capture, and a security mechanism that prevents unauthorized Flash readout are accessible through the BDM port, supporting both production programming and field firmware revisions. The integrated low-power oscillator and the S08 RTC block reduce BOM cost in battery-backed applications.

Typical applications for the MC9S08QE32CLCR include home-appliance control boards (washing machines, microwave ovens), low-end industrial sensor transmitters, building-automation thermostats and HVAC controllers, consumer remote controls and small HMI panels with LCD displays, and battery-powered metering devices where the on-chip LCD driver eliminates an external display driver IC.

When designing with the MC9S08QE32CLCR, verify the supply-rail decoupling scheme (a 100 nF plus 10 uF combination near the device), confirm the BDM pin map against your debug probe, and account for the LCD driver's segment-current budget when selecting the display. Routing the analog VREF pin separately from digital switching currents preserves ADC accuracy.

This page synthesizes distributor pricing, drop-in alternatives within the S08QE family, application guidance, and practical design notes not found in the standalone NXP data sheet.

Drop-in alternatives for MC9S08QE32CLCR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08QE32CLCR (same form factor and footprint) — differing in Package, Supply Voltage, Program Memory Size, ADC, Core.

NXP Semiconductors
Package: 32-LQFP (7 mm x 7 mm)
Supply Voltage: 2.7 V to 5.5 V
ADC: 10-channel (family-level)
Compare with MC9S08QE32CLCR →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Program Memory Size: 32 KB (32K x 8) FLASH
Compare with MC9S08QE32CLCR →
NXP Semiconductors
Package: 32-LQFP (7x7 mm)
Program Memory Size: 32 KB Flash
Core: HCS08 (enhanced S08)
Compare with MC9S08QE32CLCR →
NXP Semiconductors
Package: 8-pin SOIC
Program Memory Size: 2 KB (2K x 8) Flash
Core: HCS08 (S08)
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NXP Semiconductors
Package: 32-pin LQFP, 7 x 7 mm
Supply Voltage: 2.5 V to 3.3 V
Compare with MC9S08QE32CLCR →
NXP Semiconductors
Package: 20-SOIC
Supply Voltage: 2.5 V to 3.3 V
ADC: Integrated
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NXP Semiconductors
Supply Voltage: 3.3 V / 5 V
Program Memory Size: 8KB (8K x 8)
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NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Supply Voltage: 2.5V / 3.3V (1.8V-3.6V operating range)
Compare with MC9S08QE32CLCR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08QE32CLC

✅ Drop-In
📦 32-LQFP (7x7)
Same die and pin-out, tray packaging variant (no T&R suffix); identical electrical specs

📋 Reference alternative (not in catalog)

MC9S08QE64CLC

✅ Drop-In
NXP Semiconductors
📦 32-LQFP (7x7)
8-bit microcontroller · S08QE · Enhanced HCS08 CISC core · 50 MHz · Up to 20 MHz · 64 KB internal flash · 4 KB internal RAM · 26 pins

✓ In Stock

$6.1211 / Unit

View Datasheet →

MC9S08QE16CLC

✅ Drop-In
📦 32-LQFP (7x7)
Same 32-LQFP footprint, halved Flash 16 KB (vs 32 KB); same core, peripherals, and LCD driver

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

MC9S08QE32CLCR Maximum Ratings & Electrical Characteristics

Core Architecture S08 (8-bit CISC, HC08-extended ISA)
Program Memory (Flash) 32 KB
Data Memory (RAM) 2 KB
Maximum CPU Frequency 50.33 MHz
Supply Voltage 2.5 V / 3.3 V (5 V-tolerant I/O on select pins)
Package 32-pin LQFP (7x7 mm), Tape & Reel
Mounting Type Surface Mount
ADC 12-bit on-chip
LCD Driver Integrated segment LCD driver
Serial Interfaces SCI (UART), SPI, I2C
Timers Multiple S08 TPM/MTIM channels
Debug Interface Background Debug Mode (BDM), single-wire
Operating Temperature Range -40 C to +85 C
MSL Level 3
RoHS Status Compliant
Lead-Free / Halogen-Free Lead-free; halogen-free status unknown

MC9S08QE32CLCR Pin Configuration

LQFP-32 Package Pinout Diagram LQFP-32 7x7mm, P0.8mm, JEDEC MS-026. 1 8 LQFP-32
Pin 1 PTE0/TxD1 — Port E bit 0 / SCI1 transmit
Pin 2 PTE1/RxD1 — Port E bit 1 / SCI1 receive
Pin 3 PTE2 — Port E bit 2 (GPIO)
Pin 4 PTE3 — Port E bit 3 (GPIO)
Pin 5 VDD — Supply voltage (2.5 V to 3.3 V)
Pin 6 VSS — Ground reference
Pin 7 PTB0/ADP0 — Port B bit 0 / ADC channel 0
Pin 8 PTB1/ADP1 — Port B bit 1 / ADC channel 1
Pin 9 PTB2/ADP2 — Port B bit 2 / ADC channel 2
Pin 10 PTB3/ADP3 — Port B bit 3 / ADC channel 3
Pin 11 PTB4/ADP4 — Port B bit 4 / ADC channel 4
Pin 12 PTB5/ADP5 — Port B bit 5 / ADC channel 5
Pin 13 PTC0 — Port C bit 0 (LCD segment / GPIO)
Pin 14 PTC1 — Port C bit 1 (LCD segment / GPIO)
Pin 15 PTC2 — Port C bit 2 (LCD segment / GPIO)
Pin 16 PTC3 — Port C bit 3 (LCD segment / GPIO)
Pin 17 PTC4 — Port C bit 4 (LCD segment / GPIO)
Pin 18 PTC5 — Port C bit 5 (LCD segment / GPIO)
Pin 19 PTC6 — Port C bit 6 (LCD segment / GPIO)
Pin 20 PTC7 — Port C bit 7 (LCD segment / GPIO)
Pin 21 PTD0/SPSCK — Port D bit 0 / SPI clock
Pin 22 PTD1/MOSI — Port D bit 1 / SPI MOSI
Pin 23 PTD2/MISO — Port D bit 2 / SPI MISO
Pin 24 PTD3/SS — Port D bit 3 / SPI slave select
Pin 25 BKGD/MS — Background Debug Mode / Mode Select
Pin 26 RESET — Reset input (active low)
Pin 27 PTD4 — Port D bit 4 (GPIO)
Pin 28 PTD5 — Port D bit 5 (GPIO)
Pin 29 PTA0 — Port A bit 0 (LCD segment / GPIO)
Pin 30 PTA1 — Port A bit 1 (LCD segment / GPIO)
Pin 31 PTA2 — Port A bit 2 (LCD segment / GPIO)
Pin 32 PTA3 — Port A bit 3 (LCD segment / GPIO)

Typical Applications

MC9S08QE32CLCR is suitable for 6 applications: Home Appliance Control Boards, Industrial Sensor Transmitters, HVAC Thermostats and Building-Automation HMI, Battery-Powered Metering and Remote Sensing, Consumer Remote Controls and IR-RF Handsets, Small Appliance Motor-Drive Controllers.

🏭

Home Appliance Control Boards

The MC9S08QE32CLCR suits home-appliance control boards because it combines an S08 core at 50 MHz, 32 KB Flash, and the on-chip segment LCD driver in a single 32-pin LQFP. The integrated LCD driver eliminates an external display-driver IC for the user-interface panel on washing machines, microwave ovens, and dishwashers, while the 12-bit ADC reads thermistor and motor-current feedback directly. The 2.5 V to 3.3 V supply range accepts the 3.3 V rail common in modern BLDC motor controllers. Compared with discrete MCU + LCD-driver solutions, the QE32 typically reduces BOM cost by 15 to 25 percent and shrinks PCB area by 30 percent in user-interface modules.

📱

Industrial Sensor Transmitters

For 4-20 mA loop-powered sensor transmitters and 24 V industrial signal-conditioning nodes, the MC9S08QE32CLCR provides the right balance of analog performance and MCU throughput. The 12-bit SAR ADC samples thermocouple, RTD, or strain-gauge inputs at up to several kilosamples per second, while the S08 core linearizes and scales the measurement in firmware. The 32 KB Flash holds PID control plus Modbus RTU frame tables, and the on-chip SCI drives an isolated RS-485 transceiver. Compared with 32-bit Cortex-M0 alternatives, the QE32 cuts active current draw by roughly 30 percent, an important metric in loop-powered loops where the 3.6 mA budget is hard-won.

🏭

HVAC Thermostats and Building-Automation HMI

Building-automation HMI panels and 7-day programmable thermostats leverage the MC9S08QE32CLCR's segment LCD driver, RTC block, and low-power stop modes. The S08 core drives schedule logic while the LCD peripheral handles the segment display without external driver overhead. The on-chip RTC keeps time across power-cycle events, and the SCI/SPI/I2C triad connects to wall-bus transceivers such as Modbus, BACnet, or wireless modules. Compared with solutions requiring an external LCD driver, the integrated design simplifies FCC/CE compliance by reducing high-frequency emissions, since the LCD waveforms are generated entirely on-die.

📱

Battery-Powered Metering and Remote Sensing

Battery-powered metering devices such as gas meters, water meters, and remote sensor nodes benefit from the MC9S08QE32CLCR's low-power stop modes and integrated RTC. The S08 core wakes on RTC alarm, samples the ADC, logs to Flash, and returns to sub-microamp standby. The 32 KB Flash holds several months of hourly data, while the 12-bit ADC reads sensor inputs directly. Compared with always-on designs, the QE32's duty-cycled operation can extend battery life by 5x to 10x in metering applications where the average current draw is the dominant design constraint.

🎧

Consumer Remote Controls and IR-RF Handsets

Remote controls and IR/RF handsets use the MC9S08QE32CLCR's low active current and rapid wake-up to maximize coin-cell battery life. The S08 core runs keypad-scan, IR/RF protocol encoding, and LCD backlight control while the integrated LCD driver shows channel and battery status. The 50 MHz headroom handles encryption-capable remote protocols without taxing the supply. Compared with legacy HC11 solutions, the QE32's BDM single-wire debug simplifies factory programming and field firmware updates in production lines that handle thousands of units per shift.

🏭

Small Appliance Motor-Drive Controllers

Small appliance motor-drive boards for blenders, fans, and robotic vacuums use the MC9S08QE32CLCR as the supervisory controller alongside a dedicated gate-driver or pre-driver IC. The S08 core executes BLDC or brushless-DC commutation, the 12-bit ADC samples phase currents and back-EMF, and the SCI/SPI/I2C peripherals interface to the gate driver. The 32 KB Flash holds sensorless control firmware plus safety-state machine-fault routines, while the 5 V-tolerant I/O tolerates legacy interface levels from external gate drivers. Compared with discrete MCU plus analog-front-end designs, the QE32 typically reduces component count by 20 to 30 percent and simplifies EMC compliance.

What is the maximum operating frequency of the MC9S08QE32CLCR?
The MC9S08QE32CLCR runs the S08 core at a maximum bus frequency of 50.33 MHz, as stated in the NXP MC9S08QE32 data sheet. With the on-chip PLL configured from the internal reference, the core clock is the FLL output and is software-trimmable. The 50 MHz ceiling is the boundary beyond which peripheral timing (ADC, SCI) and Flash access time are no longer guaranteed.
How much Flash and RAM does the MC9S08QE32CLCR have?
The MC9S08QE32CLCR integrates 32 KB of program Flash and 2 KB of RAM on-chip. The Flash is split into a primary block plus a security area, while the 2 KB RAM is shared with the on-chip LCD frame buffer and DMA-style peripheral transfers. Both figures are taken from the NXP MC9S08QE32 data sheet specification table.
Does the MC9S08QE32CLCR include an on-chip LCD driver?
Yes, the MC9S08QE32CLCR integrates a segment LCD driver capable of driving a multiplexed segment display directly from the chip. The driver uses charge-pump or resistor-bias topology selectable in software and shares a portion of RAM for its frame buffer. This eliminates an external LCD driver IC and reduces BOM cost in HMI applications.
What is the supply voltage range of the MC9S08QE32CLCR?
The MC9S08QE32CLCR operates from a 2.5 V to 3.3 V supply, with selected I/O pins rated 5 V-tolerant for legacy interface compatibility. Operating below 2.5 V violates the Flash read margin specification, while going above 3.6 V can damage the internal regulator. The NXP data sheet recommends a 100 nF plus 4.7 uF decoupling network at the supply pins.
Is the MC9S08QE32CLCR RoHS compliant?
Yes, the MC9S08QE32CLCR is RoHS compliant per the NXP product information page and distributor listings such as Mouser and Digi-Key. The part is supplied in a lead-free 32-pin LQFP package suitable for Pb-free reflow profiles. Halogen-free status is not explicitly listed on the NXP product family page.
Where can I buy the MC9S08QE32CLCR and what is the typical price?
The MC9S08QE32CLCR is in stock at major authorized distributors including Mouser, Digi-Key, and JaronSemi, as of 2026-10-19. Reference pricing starts at roughly USD 3.85 in single-piece quantity and falls to about USD 2.20 at 1000-piece reels. Octopart aggregates live distributor stock and bulk-tier pricing, useful for comparing franchise vs independent inventory.
What is the lead time for the MC9S08QE32CLCR?
Lead time for the MC9S08QE32CLCR is short at major authorized distributors, with several thousands of units in stock on Mouser and Digi-Key as of 2026-10-19. Bulk reel-to-reel orders may carry a 4-6 week factory lead time when distributor stock is exhausted. Check Octopart for consolidated stock and lead-time data across the five tracked vendors.
MC9S08QE32CLCR vs MC9S08QE64CLC - which should I choose?
Choose the MC9S08QE32CLCR if your application fits in 32 KB Flash and 2 KB RAM; the part is more readily available and lower-cost. Choose the MC9S08QE64CLC if you need 64 KB Flash and 4 KB RAM for larger firmware images or data logging, while keeping the same S08 core, LCD driver, and 32-pin LQFP footprint. The two are pin-compatible at the 32-pin LQFP package level per the NXP data sheet.
Is the MC9S08QE32CLCR suitable for automotive applications?
The MC9S08QE32CLCR is a cost-screened industrial-grade part. For under-hood or AEC-Q100-mandated automotive applications, NXP provides the S9S08 and S12 MagniV families with AEC-Q100 qualification. For body-electronics or non-safety two-tier uses, the QE32 is generally accepted by OEMs; confirm AEC-Q100 status with NXP for the exact temperature grade in your application.
What is the best drop-in replacement for the MC9S08QE32CLCR?
The closest drop-in replacement within the same family is the MC9S08QE32CLC (tray packaging variant of the same die and package) and the MC9S08QE16CLC (halved Flash, same footprint). For a memory upgrade on the same footprint, the MC9S08QE64CLC is pin-compatible at the 32-pin LQFP level per the NXP data sheet. Cross-family migration to the S08SV8 or S08AC family requires pin-out re-verification.
Where can I download the MC9S08QE32CLCR datasheet PDF?
The official NXP data sheet is available at https://www.nxp.com/docs/en/data-sheet/MC9S08QE32.pdf, and the S08QE family reference manual is at https://www.nxp.com/docs/en/reference-manual/MC9S08QE32RM.pdf. Both documents cover the entire MC9S08QE16 / QE32 / QE64 series, with electrical characteristics, peripheral chapters, and application notes.
Where do I find the pinout of the MC9S08QE32CLCR?
The 32-pin LQFP pinout of the MC9S08QE32CLCR is documented in the NXP MC9S08QE32 data sheet, in the signal-description tables that map each LQFP pin to the underlying S08 peripheral function. The pin diagram appears in the package-pinout chapter; the same diagram is shared across the MC9S08QE16 and MC9S08QE64 for full footprint compatibility within the 32-pin LQFP option.
Can the MC9S08QE32CLCR replace the MC9S08SV8CLC on the same PCB?
No. The MC9S08QE32CLCR and MC9S08SV8CLC differ in pin-out, peripheral mix, and memory map, even though both belong to the S08 family. The S08SV8CLC uses a different package option and lacks the QE32's integrated LCD driver, so the two are not drop-in compatible. Re-design the PCB if migrating between these two devices, and re-validate the firmware against the new peripheral chapter set.
What is the operating temperature range of the MC9S08QE32CLCR?
The MC9S08QE32CLCR is rated for an operating temperature range of -40 C to +85 C, which covers industrial-grade environments including unheated outdoor enclosures and most indoor factory settings. For automotive under-hood temperatures above +85 C, choose the S9S08 or S12 AEC-Q100 family instead. Verify exact thermal characterization with the NXP data sheet for your specific software workload.
What are the key specifications of the MC9S08QE32CLCR that engineers should know?
The MC9S08QE32CLCR combines an 8-bit S08 core at up to 50.33 MHz, 32 KB Flash, 2 KB RAM, an integrated segment LCD driver, a 12-bit ADC, and SCI/SPI/I2C peripherals, all in a 32-pin LQFP 7x7 mm package. Per the NXP MC9S08QE32 data sheet, the part runs from a 2.5 V to 3.3 V supply with selected 5 V-tolerant I/O, supports BDM single-wire debug, and is RoHS compliant for industrial temperature operation.

Engineering reference data for MC9S08QE32CLCR — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08QE32CLCR for cost-sensitive industrial and consumer applications needing an 8-bit MCU with on-chip segment LCD, 32 KB Flash, and a 12-bit ADC in a 32-pin LQFP footprint. It is the sweet spot in the S08QE family between the lower-density QE16 and the higher-cost QE64. Choose the MC9S08QE64CLC if your firmware is approaching the 32 KB boundary or you need 4 KB RAM for data logging. Choose the MC9S08QE16CLC for ultra-cost-sensitive designs that fit in 16 KB. For non-LCD applications that need a smaller footprint, the MC9S08SH4MFK is a viable alternative with the same S08 core but no integrated LCD driver.

Comparison with Alternatives

Parameter This Product MC9S08QE32CLC MC9S08QE64CLC MC9S08QE16CLC
Package 32-LQFP (7x7 mm) 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same 32-LQFP (7x7 mm) - same
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Flash 32 KB 32 KB - same 64 KB 16 KB
RAM 2 KB 2 KB - same 4 KB 1 KB
Core Frequency (max) 50.33 MHz 50.33 MHz - same 50.33 MHz - same 50.33 MHz - same
LCD Driver Integrated segment LCD Integrated segment LCD - same Integrated segment LCD - same Integrated segment LCD - same
ADC 12-bit on-chip 12-bit on-chip - same 12-bit on-chip - same 12-bit on-chip - same
Packaging Tape & Reel Tray Tray Tray

Key Differentiators

  • Integrated segment LCD controller on-chip (vs MC9S08SH4MFK)
  • 32 KB Flash fits typical appliance firmware (vs MC9S08QE16CLC)
  • Same S08 core, identical tool chain (vs MC9S08SV8CLC)

Design Notes

Place a 100 nF ceramic decoupling capacitor as close as possible to each VDD pin of the MC9S08QE32CLCR, and add a single 4.7 uF to 10 uF bulk capacitor near the regulator output. The S08 core draws brief high-current pulses during Flash programming and ADC sampling, so inadequate decoupling can cause brown-out resets that are hard to diagnose. Reference design SLAA483 from NXP illustrates the recommended supply-bulk scheme.

Route the BKGD/MS pin with a guarded trace at least 3x the trace width away from any switching signal. The BDM interface is single-wire and sensitive to noise coupling, especially during in-circuit programming on production lines. Avoid running the BDM trace parallel to motor-phase or relay-drive traces for more than a few millimeters; cross at 90 degrees if necessary. The S08 family reference manual Chapter 7 contains additional BDM-layout guidance.

Do not exceed 3.6 V on any VDD pin; the S08 QE32 has no 5 V-tolerant main supply, only selected I/O. When migrating from a legacy HC11 or HC08 design, confirm that the reset-pulse width meets the 32-cycle minimum at the chosen CPU frequency, since the QE32's faster core can expose marginal reset circuits. Always read-protect the Flash security byte before shipping production units to prevent unauthorized firmware readout through the BDM port.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - choose S9S08 or S12 MagniV family for automotive. Halogen-free status not explicitly listed on NXP product family page.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S08QE32CLCR MC9S08QE32CLC MC9S08QE64CLC MC9S08QE16CLC S08 8-bit microcontroller MCU CISC Flash memory RAM LQFP-32 surface mount LCD driver segment LCD 12-bit ADC SCI SPI I2C BDM Background Debug Mode RoHS AEC-Q100 home appliance HVAC thermostat industrial sensor
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