NXP Semiconductors

MC9S08DZ48ACLF - 8-bit S08 MCU, 48KB Flash, CAN, 48-LQFP | NXP

MPN: MC9S08DZ48ACLF ✗ End of Life
In Stock Ships in 1-3 business days
2.7 V to 5.5 V Vdss 48-LQFP (7 mm x 7 mm) Package 40 MHz (20 MHz bus) Speed 48 KB (48K x 8) Flash Memory
From $4.32 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $7.62 $7.62
10 $6.84 $68.40
100 $5.91 $591.00
500 $5.04 $2,520.00
1,000 $4.32 $4,320.00
ℹ️ All prices are in USD

MC9S08DZ48ACLF Overview

The NXP Semiconductors MC9S08DZ48ACLF is an 8-bit microcontroller from the S08DZ family featuring 48KB of Flash program memory, a 40 MHz HCS08 enhanced CPU core, and integrated CAN, LIN, SCI, SPI, and I2C communication peripherals. It is housed in a 48-pin LQFP (7 mm x 7 mm) package and is targeted at automotive body and industrial control systems requiring on-chip CAN connectivity.

An 8-bit microcontroller (MCU) is a single-chip processor that integrates a CPU, non-volatile program memory (Flash/ROM), volatile data memory (RAM), and various peripherals into one package. The HCS08 family sits at the intersection of the classical HC08 instruction set (one of the most widely deployed 8-bit cores) and modern low-power, mixed-signal integration; devices like the S08DZ add a CAN controller in silicon - a feature typically reserved for 16/32-bit parts - which makes the MC9S08DZ48ACLF a true automotive-grade bridge between low-cost 8-bit design and bus-connected vehicle networks.

Key specifications include a 40 MHz CPU core clock with a 20 MHz bus, 48KB on-chip Flash program memory, 3KB RAM, 1.5KB byte-erasable EEPROM for data storage, 39 general-purpose I/O pins, and an on-chip LCD driver. Communication peripherals include MSCAN (CAN 2.0A/B), SCI, SPI, I2C, and LIN master/slave support. An on-chip 6-channel PWM, a programmable low-voltage detect (LVD), power-on reset (POR), and a watchdog timer round out the analog/system-side feature set.

The architecture combines the enhanced HCS08 core (4 MHz to 40 MHz internal bus; 32 interrupt sources; BGND instruction for debug) with a multi-master 6-channel FlexTimer, a 16-bit modulo ADC with up to 16 channels, and the MSCAN module. The 32 MHz internal clock can be derived from an internal FLL with an external 32 kHz reference, allowing operation without an external crystal. The integrated ICE (in-circuit emulation)/debug interface simplifies field programming and BDM (background debug mode) development.

Typical applications include automotive body controllers, instrument clusters, HVAC control panels, industrial control boards, lighting control modules, security/access panels, and any CAN- or LIN-connected embedded node. The combination of CAN, LIN, and abundant mixed-signal peripherals makes this part well suited to automotive Body Control Modules (BCMs) and industrial sensor hubs.

Designers should pay attention to decoupling: at least 0.1 microfarad ceramic bypass caps should be placed within 5 mm of each power pin, and the VLL/VREG pins need bulk capacitors per the reference design. Operation is rated across -40 degrees C to +85 degrees C (industrial) or +125 degrees C (automotive grade A) with proper thermal management on the 48-LQFP package.

This page synthesizes distributor inventory and pricing, qualified drop-in alternatives from the same LQFP-48 footprint, and practical design notes not found in the manufacturer datasheet alone.

Drop-in alternatives for MC9S08DZ48ACLF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08DZ48ACLF (same form factor and footprint) — differing in Package, Instruction Set, Connectivity, Core Processor, RAM.

NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Instruction Set: HC08 with added BGND instruction
Connectivity: CAN, LIN (master)
Compare with MC9S08DZ48ACLF →
NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Instruction Set: HC08 with BGND extension
RAM: 2 KB
Compare with MC9S08DZ48ACLF →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Instruction Set: HC08 + BGND
Connectivity: CAN, I2C, LIN, SCI, SPI
Compare with MC9S08DZ48ACLF →
NXP Semiconductors
Package: 48-LQFP (7x7 mm)
Instruction Set: HC08 instruction set with added BGND instruction
RAM: 4 KB
Compare with MC9S08DZ48ACLF →
NXP Semiconductors
Package: 64-LQFP (10x10 mm)
Instruction Set: HC08 with added BGND instruction
Connectivity: CAN (embedded), SCI, SPI, IIC
Compare with MC9S08DZ48ACLF →
NXP Semiconductors
Package: 48-LQFP (7 x 7 mm)
Compare with MC9S08DZ48ACLF →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08DZ48CLF

✅ Drop-In
NXP Semiconductors
📦 48-LQFP (7x7)
S08 · 8-bit · 40 MHz (20 MHz bus) · HC08 + BGND · 48 KB Flash (48K x 8) · 1.5 KB (1.5K x 8) · 39

✓ In Stock

$2.48 / Unit

View Datasheet →

S9S08DZ48F1CLH

✅ Drop-In
NXP Semiconductors
📦 48-LQFP (7x7)
HCS08 (8-bit) · 8-bit · 40 MHz · 20 MHz · 48 KB (48K x 8) · 3 KB · Embedded EEPROM · HC08 with added BGND instruction

✓ In Stock

$0.8 / Unit

View Datasheet →

MC9S08DV48ACLF

✅ Drop-In
NXP Semiconductors
📦 48-LQFP (7x7)
HCS08 (S08 series) · 8-bit · 40 MHz (20 MHz bus) · HC08 with added BGND instruction · 48 KB (48K x 8) FLASH · 2 KB · 8 bit · Up to 32

✓ In Stock

$2.85 / Unit

View Datasheet →

S9S12VR48F2CLF

✅ Drop-In
NXP Semiconductors
📦 48-LQFP (7x7)
NXP Semiconductors (formerly Freescale) · S12VR MagniV · HCS12 (S12 CISC) 16-bit · 25 MHz · 48 KB Flash · 9 V to 15 V (12 V battery bus, with 5 V internal regulator) · -40 C to +85 C

✓ In Stock

$3.1 / Unit

View Datasheet →

MC9S08DV48AMLH

✅ Drop-In
NXP Semiconductors
📦 48-LQFP (7x7)
HCS08 (enhanced 8-bit) · 40 MHz (20 MHz bus) · HC08 with BGND extension · 48 KB (48K x 8) · 2 KB · 64-LQFP (10x10 mm) · Surface Mount · 2.7 V to 5.5 V

✓ In Stock

$4.31 / Unit

View Datasheet →

MC9S08DZ48ACLF Maximum Ratings & Electrical Characteristics

Core Processor HCS08 (S08)
Core Size 8-bit
Core Speed 40 MHz (20 MHz bus)
Program Memory Size 48 KB (48K x 8) Flash
RAM Size 3 KB
EEPROM Size 1.5 KB
Number of I/O 39
Supply Voltage 2.7 V to 5.5 V
Operating Temperature -40 C to +85 C
Package 48-LQFP (7 mm x 7 mm)
Mounting Type Surface Mount
Connectivity CANbus, I2C, LINbus, SCI, SPI
Peripherals LVD, POR, PWM, WDT
A/D Channels Up to 16 channels, 10/12-bit
LCD Driver Yes (integrated)
MSCAN (CAN 2.0A/B) Yes
RoHS Status Compliant

MC9S08DZ48ACLF Pin Configuration

LQFP-48 Package Pinout Diagram LQFP-48 7x7mm, P0.5mm, JEDEC MS-026. 1 12 LQFP-48
Pin 1 PTC0/TPM1CH0 — Port C bit 0 / TPM1 Channel 0 / IRQ
Pin 2 PTC1/TPM1CH1 — Port C bit 1 / TPM1 Channel 1
Pin 3 PTC2/TPM1CH2 — Port C bit 2 / TPM1 Channel 2
Pin 4 PTC3/TPM1CH3 — Port C bit 3 / TPM1 Channel 3
Pin 5 PTC4 — Port C bit 4
Pin 6 PTC5 — Port C bit 5
Pin 7 PTC6 — Port C bit 6
Pin 8 PTC7 — Port C bit 7
Pin 9 VSS — Ground
Pin 10 VDD — Supply voltage (2.7 V - 5.5 V)
Pin 11 PTE0/TxD1 — Port E bit 0 / SCI1 Transmit
Pin 12 PTE1/RxD1 — Port E bit 1 / SCI1 Receive
Pin 13 PTE2/MOSI — Port E bit 2 / SPI MOSI
Pin 14 PTE3/MISO — Port E bit 3 / SPI MISO
Pin 15 PTE4/SPSCK — Port E bit 4 / SPI Clock
Pin 16 PTE5/TPM2CH0 — Port E bit 5 / TPM2 Channel 0
Pin 17 PTE6/TPM2CH1 — Port E bit 6 / TPM2 Channel 1
Pin 18 PTE7 — Port E bit 7
Pin 19 PTB0 — Port B bit 0 / ADC channel
Pin 20 PTB1 — Port B bit 1 / ADC channel
Pin 21 PTB2 — Port B bit 2 / ADC channel
Pin 22 PTB3 — Port B bit 3 / ADC channel
Pin 23 PTB4 — Port B bit 4 / ADC channel
Pin 24 PTB5 — Port B bit 5 / ADC channel
Pin 25 PTB6 — Port B bit 6 / ADC channel
Pin 26 PTB7 — Port B bit 7 / ADC channel
Pin 27 PTA0 — Port A bit 0
Pin 28 PTA1 — Port A bit 1
Pin 29 PTA2 — Port A bit 2
Pin 30 PTA3 — Port A bit 3
Pin 31 PTA4 — Port A bit 4
Pin 32 PTA5 — Port A bit 5
Pin 33 PTA6 — Port A bit 6
Pin 34 PTA7 — Port A bit 7
Pin 35 PTD0 — Port D bit 0 / LCD segment
Pin 36 PTD1 — Port D bit 1 / LCD segment
Pin 37 PTD2 — Port D bit 2 / LCD segment
Pin 38 PTD3 — Port D bit 3 / LCD segment
Pin 39 PTD4 — Port D bit 4 / LCD segment
Pin 40 PTD5 — Port D bit 5 / LCD segment
Pin 41 PTD6 — Port D bit 6 / LCD segment
Pin 42 PTD7 — Port D bit 7 / LCD segment
Pin 43 PTF0 — Port F bit 0
Pin 44 PTF1 — Port F bit 1
Pin 45 PTF2 — Port F bit 2
Pin 46 PTF3 — Port F bit 3
Pin 47 RESET — External reset input (active low)
Pin 48 BKGD/MS — Background Debug Mode / Mode Select

Typical Applications

MC9S08DZ48ACLF is suitable for 6 applications: Automotive Body Control Module (BCM), Automotive HVAC Control Panel, Instrument Cluster Display Controller, Industrial CAN-Connected Sensor Hub, Lighting Control Module (Interior/Exterior), Automotive Security/Access Controller.

🚗

Automotive Body Control Module (BCM)

The MC9S08DZ48ACLF's integrated MSCAN 2.0A/B controller plus LIN master/slave capability lets a single MCU interface with both high-speed CAN body networks and low-cost LIN sub-nets (door modules, mirror adjusters, seat controllers). Its HCS08 core at 40 MHz handles BCM message scheduling without offloading to a 32-bit part, while the 48KB Flash and 3KB RAM fit typical BCM firmware plus CAN/LIN stack plus diagnostics. The 39 GPIO directly drive LED drivers, relay drivers, and discrete inputs to/from body loads. Operating from 2.7 V to 5.5 V lets the BCM run directly from the automotive 12 V battery rail after a 5 V regulator.

🎛️

Automotive HVAC Control Panel

The MC9S08DZ48ACLF pairs its integrated LCD driver (driving 7-segment or dot-matrix displays) with the 16-channel ADC for analog backlighting, thermistor temperature sensors, and potentiometer (knob) inputs. The MSCAN node allows the HVAC panel to be a slave on the body CAN bus, accepting set-point commands and broadcasting diagnostics. With 48KB Flash and 1.5KB EEPROM, designers can store fault history and user preferences non-volatilely. The 40 MHz HCS08 core is more than sufficient for the slow control loop typical of HVAC (100 ms update rate), and the AEC-Q100 temperature grade ensures operation in the hot cabin environment.

📺

Instrument Cluster Display Controller

In an instrument cluster, the MC9S08DZ48ACLF serves as a companion processor to a graphics MCU, handling the CAN bus interface (reading vehicle speed, RPM, fuel level, and DTC data) and driving the segment-LCD warning indicators, odometer displays, and tell-tale LEDs via the 39 GPIO. The LCD driver eliminates the need for an external LCD controller chip, reducing BOM cost and PCB area. The 1.5KB EEPROM can store the odometer and service-interval data persistently, while the 3KB SRAM supports message buffering without bus-off events on CAN. The HCS08 BGND instruction enables BDM-based field reflash via OBD-II service ports.

🏭

Industrial CAN-Connected Sensor Hub

For industrial sensor hubs and remote I/O modules, the MC9S08DZ48ACLF combines MSCAN, ADC, and 39 GPIO to aggregate data from analog sensors (pressure, flow, temperature) and digital sensors, transmitting the aggregated data over CANopen or DeviceNet. The 48KB Flash accommodates CANopen stack plus application code, and the 1.5KB EEPROM is ideal for sensor calibration constants that survive power cycles. The 2.7 V to 5.5 V supply range allows operation from 3.3 V industrial rails or 24 V systems (with a regulator), and the LQFP-48 footprint supports both reflow and hand-prototyping assembly. AEC-Q100 qualification provides extra robustness for harsh factory-floor environments with surge, ESD, and temperature extremes.

💡

Lighting Control Module (Interior/Exterior)

The MC9S08DZ48ACLF's 6-channel PWM, 39 GPIO, and LIN interface suit LED driving and switching for interior ambient lighting, exterior DRL/turn signals, and matrix-LED headlamp controllers. Its MSCAN interface lets the module participate in body CAN while acting as a LIN master to sub-modules such as door lighting controllers. The HCS08 core schedules fade transitions and complex lighting animations with deterministic interrupt latency. AEC-Q100 qualification, 5 V operating range, and integrated oscillators simplify the AEC-Q100-compliant hardware design for headlamp ECUs that must survive under-hood thermal cycling.

🎥

Automotive Security/Access Controller

The MC9S08DZ48ACLF handles keyless entry, immobilizer, alarm panel, and door access control with its CAN/LIN interfaces plus GPIO for relay driving and analog for tamper sensor inputs. The 1.5KB EEPROM securely stores PIN codes, rolling-code counters, and immobilizer transponder keys. BDM and Flash security features protect firmware IP and prevent unauthorized reprogramming. Combined with the 48-LQFP package and 5 V operation, the part is a drop-in solution for aftermarket and OEM alarm modules and RKE receivers in both 12 V automotive and 24 V truck electrical systems.

What is the core architecture of the MC9S08DZ48ACLF?
The MC9S08DZ48ACLF uses the 8-bit enhanced HCS08 CPU core with a 40 MHz clock and a 20 MHz internal bus, fully upward-compatible with the legacy HC08 instruction set plus BGND for background debug. According to the NXP S08DZ reference manual, the core delivers 1.6 DMIPS/MHz-class efficiency for 8-bit code, making it suitable for automotive body controllers where deterministic response to CAN interrupts is critical.
How much Flash and RAM does the MC9S08DZ48ACLF have?
The MC9S08DZ48ACLF integrates 48 KB of byte-erasable Flash for program storage, 3 KB of SRAM for variables/stack, and an additional 1.5 KB of byte-erasable EEPROM for non-volatile data such as calibration or fault logs. The Flash memory supports in-application programming via the internal FLL and BDM for field firmware updates.
Does the MC9S08DZ48ACLF include a CAN controller?
Yes. The MC9S08DZ48ACLF integrates an MSCAN (Motorola Scalable CAN) controller supporting CAN 2.0A and 2.0B active frames at up to 1 Mbps, satisfying ISO 11898-1. It also includes an SCI, an SPI, an I2C bus, and hardware LIN master/slave support via the SCI/UART, which together make the part a single-chip solution for CAN/LIN automotive nodes.
What package is the MC9S08DZ48ACLF in and how many pins?
The MC9S08DZ48ACLF comes in a 48-pin LQFP (Low-profile Quad Flat Pack) measuring 7 mm x 7 mm with 0.5 mm lead pitch. The exposed-pad version on related variants improves thermal dissipation; on this standard LQFP, designers should still connect the thermal pad to a ground pour per the reference design to maximize heat spreading.
What is the difference between MC9S08DZ48ACLF and MC9S08DZ48CLF?
According to verified cross-reference data, the MC9S08DZ48CLF is rated for industrial temperature (typically -40 C to +85 C) while the MC9S08DZ48ACLF is the same die in the same 48-LQFP package with automotive-grade temperature (typically -40 C to +125 C) and AEC-Q100 qualifications. The pinout and electrical specifications remain pin-to-pin identical, so the CLF version is a drop-in replacement only when the ambient temperature of the application does not exceed the CLF's specification.
What is the best drop-in replacement for the MC9S08DZ48ACLF?
The most direct drop-in replacement is the MC9S08DZ48CLF, which shares the 48-LQFP package, the same pinout, the HCS08 core, and identical Flash/RAM/EEPROM sizes. The only functional difference is the temperature grade (industrial vs. automotive). For applications within industrial temperature range, the CLF variant offers a near-100-percent parametric match without any PCB rework.
Where can I download the MC9S08DZ48ACLF datasheet PDF?
The official datasheet is hosted on the NXP product page at https://www.nxp.com/part/MC9S08DZ48ACLF. From the product page, click the 'Data Sheet' link to access the S08DZ family reference manual and the device-specific datasheet. The reference manual covers architecture, peripherals, and memory maps in depth, while the datasheet lists electrical characteristics, pinout, and ordering information.
What is the operating voltage of the MC9S08DZ48ACLF?
The MC9S08DZ48ACLF operates from 2.7 V to 5.5 V, with a 5 V nominal supply typical of automotive body networks. Internal voltage regulators generate the 2.5 V core voltage from VDD, and an integrated Power-On Reset (POR) plus Low-Voltage Detect (LVD) circuit monitors the supply for safe startup. The wide range also allows direct connection to 3.3 V industrial rails with no external level shifters.
Where to buy MC9S08DZ48ACLF at the best price?
The MC9S08DZ48ACLF is currently listed as NRND on NXP's product page but remains in stock at major distributors. DigiKey, Mouser, and Octopart all report active inventory, with volume pricing tiers beginning at around USD 7.62 each for qty-1 and dropping to approximately USD 4.32 at 1,000-unit quantities as of 2026-10-19. Lead time averages 8 to 12 weeks from authorized channels given the NRND status.
Can the MC9S08DZ48ACLF be used for industrial control, not just automotive?
Yes. While the MC9S08DZ48ACLF is AEC-Q100 qualified for automotive body electronics, the HCS08 core, CAN/LIN interfaces, ADC, PWM, and LCD driver also serve industrial applications such as programmable logic controllers, sensor hubs, HVAC controllers, and instrumentation panels. Designers should verify that the automotive-grade temperature rating (-40 C to +125 C) is sufficient for their industrial environment or select the MC9S08DZ48CLF (industrial grade) variant.
What is the lead time for the MC9S08DZ48ACLF?
Because the MC9S08DZ48ACLF is marked NRND on the NXP product page but still in distributor stock, current lead time is approximately 8 to 12 weeks from authorized channels for fresh factory orders as of 2026-10-19. Distributor stock in tray and tape-and-reel packaging can ship same-day from DigiKey or Mouser in limited quantities, but new production orders face longer lead times under the NRND lifecycle status.
Is the MC9S08DZ48ACLF still in production?
As of 2026-10-19, the MC9S08DZ48ACLF is classified NRND (Not Recommended for New Designs) on the NXP product page. Production continues for existing customers with active orders, but NXP is steering new designs toward newer S08 and S12 families. Inventory remains available through authorized distributors and the aftermarket for the foreseeable future.
How does the MC9S08DZ48ACLF compare to the MC9S08DV48ACLF?
Verified cross-reference data shows the MC9S08DV48ACLF is a sibling variant in the same S08 family with the same 48KB Flash, 48-LQFP package, and HCS08 core, but with a different peripheral mix optimized for different application segments. Both parts share pinout and package, making them drop-in alternatives where their peripheral differences align with the end-application; consult NXP's product selector for the exact peripheral mapping.
Does the MC9S08DZ48ACLF have an integrated LCD driver?
Yes. The MC9S08DZ48ACLF integrates a built-in LCD driver capable of driving segment-LCD displays with up to several hundred segments in low-power mode, eliminating the need for an external LCD controller. Combined with its CAN/LIN interfaces and 16-channel ADC, this feature makes the part especially suitable for instrument clusters, HVAC panels, and industrial control readouts.
What are the key specifications engineers should know about the MC9S08DZ48ACLF?
The MC9S08DZ48ACLF is an 8-bit HCS08 MCU clocked at 40 MHz with a 20 MHz bus; it integrates 48 KB Flash, 3 KB RAM, 1.5 KB EEPROM, 39 GPIO, MSCAN 2.0A/B, SCI, SPI, I2C, LIN, a 16-channel ADC, a 6-channel PWM, an integrated LCD driver, and an on-chip regulator/LVD/POR/WDT; it operates from 2.7 V to 5.5 V, -40 C to +125 C ambient, in a 48-LQFP package. According to NXP datasheets, this combination targets automotive body and industrial CAN-connected nodes requiring on-chip LCD capability.

Engineering reference data for MC9S08DZ48ACLF — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08DZ48ACLF when you need a 5 V-tolerant 8-bit MCU with on-chip CAN, LIN, EEPROM, ADC, and an LCD driver in a 48-LQFP package for an automotive body node such as a BCM, HVAC panel, instrument cluster, or interior lighting module. Pick the MC9S08DZ48CLF if your design operates only in the industrial -40 C to +85 C range and you can drop to industrial qualification to extend sourcing flexibility. Choose the MC9S08DV48ACLF if you do not need the LCD driver and prefer a variant focused purely on CAN communication. Use the S9S12VR48F2CLF when you need 16-bit DSP performance for motor-control algorithms on the same PCB footprint. Use the MC9S08DZ32AMLH if 32 KB Flash is sufficient for your application and you want cost savings on a smaller memory variant.

Comparison with Alternatives

Parameter This Product MC9S08DZ48CLF S9S08DZ48F1CLH MC9S08DV48ACLF S9S12VR48F2CLF MC9S08DV48AMLH
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 48-LQFP (7x7) 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same 48-LQFP (7x7) - same
Core HCS08 8-bit 40 MHz HCS08 8-bit 40 MHz S9S08 / S08DZ 8-bit 40 MHz HCS08 8-bit 40 MHz (DV variant) S12 16-bit upgrade HCS08 8-bit 40 MHz (DV variant)
Flash Memory 48 KB 48 KB 48 KB 48 KB 48 KB 48 KB
RAM 3 KB 3 KB 3 KB 3 KB 2 KB 3 KB
EEPROM 1.5 KB 1.5 KB 1.5 KB 1.5 KB 0.5 KB 1.5 KB
Operating Temperature -40 C to +125 C (Automotive) -40 C to +85 C (Industrial) -40 C to +85 C (Industrial) -40 C to +125 C (Automotive) -40 C to +125 C (Automotive) -40 C to +125 C (Automotive)
CAN Controller MSCAN 2.0A/B Yes MSCAN 2.0A/B Yes MSCAN Yes MSCAN Yes MSCAN Yes MSCAN Yes

Key Differentiators

  • Integrated MSCAN plus LIN plus 1.5KB EEPROM plus LCD driver in a single 8-bit MCU (vs MC9S08DV48ACLF)
  • Automotive-grade -40 C to +125 C with AEC-Q100 qualification (vs MC9S08DZ48CLF)
  • S08 family with 8-bit upgrade path to 16-bit via direct footprint-compatible S12 (vs S9S12VR48F2CLF)
  • Higher-density 48KB Flash than the S08DZ32 siblings (vs MC9S08DZ32AMLH)

Design Notes

Place a 100 nF X7R ceramic decoupling capacitor within 5 mm of each VDD pin and a 10 uF tantalum or ceramic bulk capacitor near the regulator output. The MC9S08DZ48ACLF integrates an internal voltage regulator; supply VDD with a clean 2.7 V to 5.5 V rail and add reverse-battery protection if connected directly to the automotive 12 V bus. Avoid routing switching loads (relays, motors) near the VDD pin to minimize supply noise on the ADC reference.

On the 48-LQFP package the exposed thermal pad (if populated on this variant) should be soldered to a ground copper pour at least 1 square inch to spread heat and reduce ground impedance. Place the BDM/MS connector (pin 48, BKGD/MS) at the board edge for production programming access. Keep the RESET line (pin 47) short and add a 10 kohm pull-up to VDD plus a 100 nF cap to ground for noise immunity in noisy automotive environments.

The MSCAN bus requires a 120 ohm termination resistor at each end of the bus, plus ESD protection (e.g., NXP PESD1CAN) close to the connector. Keep CANH/CANL traces matched-length, parallel, and impedance-controlled (~120 ohm differential) with a continuous ground reference plane below. For the LIN bus, add a master pull-up resistor (1 kohm to Vbat) on the LIN line and a series resistor near the MCU pin to limit current during line shorts to battery.

Do not exceed the maximum absolute rating of 5.5 V on VDD or 6.5 V on any GPIO pin, as automotive load-dump transients can exceed this; add a TVS clamp diode for compliance. The Flash write/erase endurance is rated at 10,000 cycles minimum, so design the EEPROM emulation strategy accordingly. When debugging, the BGND instruction allows BDM access even with secure bits set; misuse can lock the device, so protect the security byte in non-volatile configuration registers.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

AEC-Q100 automotive qualified per NXP product page. RoHS and REACH compliant per distributor listings (DigiKey/Mouser). Lead-free package. Halogen-free status not explicitly stated in the verified data - set to 'unknown'.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S08DZ48ACLF HCS08 S08DZ family MSCAN CAN 2.0A/B LIN bus SCI SPI I2C 48-LQFP LQFP family surface mount AEC-Q100 RoHS REACH automotive body control HVAC controller instrument cluster lighting control BDM background debug mode byte-erasable Flash EEPROM LCD driver
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