MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MPN: MC9S08DZ60ACLF ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.85 | $12.85 |
| 10 | $11.54 | $115.40 |
| 100 | $9.97 | $997.00 |
| 250 | $8.92 | $2,230.00 |
| 500 | $7.65 | $3,825.00 |
| 1,000 | $6.85 | $6,850.00 |
MC9S08DZ60ACLF Overview
A microcontroller (MCU) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of peripherals on one silicon die. The S08DZ line belongs to the HCS08 8-bit CISC architecture family, which itself sits within the broader class of embedded microcontrollers (MCU > 8-bit MCU > HCS08 > S08DZ). The on-chip CAN controller, SCI, SPI, IIC, ADC, timer/PWM channels, and LCD driver make this device a complete system-on-chip for body and chassis electronics.
Key features of the MC9S08DZ60ACLF include an embedded CAN 2.0 A/B controller, a master LIN 2.0 interface, a 24-channel 12-bit ADC with 2.5 us conversion time, multiple PWM outputs, on-chip EEPROM emulation, and an LCD driver. The integrated background debug mode (BGND) and on-chip emulation/debug logic remove the need for an external emulation pod, accelerating firmware iteration. Security features include a Flash protection scheme with a programmable back-door key to prevent unauthorized code reads.
Typical applications include automotive body control modules, instrument clusters with LCD segments, HVAC control panels, LIN/CAN nodes in vehicle networks, industrial sensor transmitters, and low-cost CAN-controlled motor drives. The wide operating temperature range and AEC-Q100 qualification make it appropriate for under-hood and chassis-mounted ECUs that must survive harsh electrical and thermal stress.
When designing with the MC9S08DZ60ACLF, place decoupling capacitors within 3 mm of every VDD/VSS pair and provide a clean, low-ripple 5 V or 3.3 V supply because the on-chip analog (ADC bandgap, LCD charge pump) is sensitive to supply noise. Configure unused I/O pins as outputs with defined logic levels to minimize current draw and ensure the BGND debug pin is accessible for in-circuit programming. For CAN networks, follow the ISO 11898 bus topology with a 120 ohm termination at each end of the trunk.
This page synthesizes NXP distributor pricing, same-family NXP drop-in alternatives (including AEC-Q100 Q-1 suffix variants), and practical design notes that complement - rather than duplicate - the manufacturer's reference manual.
Drop-in alternatives for MC9S08DZ60ACLF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC9S08DZ60ACLF (same form factor and footprint) — differing in Package, ADC, Operating Temperature, RAM Size, Supply Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC9S08DZ60CLF
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08DZ60AMLF
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →S9S08DZ60F1MLF
✅ Drop-In✓ In Stock
$4.95 / Unit
View Datasheet →MC9S08DV60AMLF
✅ Drop-In✓ In Stock
$4.6 / Unit
View Datasheet →MC9S08DZ48ACLF
✅ Drop-In✓ In Stock
$4.32 / Unit
View Datasheet →MC9S08DV60AMLH
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →MC9S08DZ60ACLF Maximum Ratings & Electrical Characteristics
| Core | HCS08 (8-bit CISC) |
| Core Frequency | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | 60 KB (60K x 8) |
| RAM | 4 KB |
| Operating Voltage | 2.7 V to 5.5 V |
| Supply Rails | 3.3 V / 5 V |
| ADC | 24-channel, 12-bit, 2.5 us conversion |
| CAN | 1 x CAN 2.0 A/B |
| LIN | Master LIN 2.0 interface |
| Communication Peripherals | SCI (SPI), IIC, MSCAN |
| LCD Driver | Yes (on-chip segment LCD driver) |
| Package | 48-LQFP (7x7 mm) |
| Mounting Type | Surface Mount |
| MSL Level | MSL 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Background Debug Mode (BGND) | Yes (on-chip emulation/debug) |
| Instruction Set | HC08 instruction set with added BGND instruction |
MC9S08DZ60ACLF Pin Configuration
| Pin 1 | PTA0/TXD1 — Port A bit 0 / SCI1 transmit |
| Pin 2 | PTA1/RXD1 — Port A bit 1 / SCI1 receive |
| Pin 3 | PTA2/SPSCK1 — Port A bit 2 / SPI1 clock |
| Pin 4 | PTA3/MOSI1 — Port A bit 3 / SPI1 master-out slave-in |
| Pin 5 | PTA4/MISO1 — Port A bit 4 / SPI1 master-in slave-out |
| Pin 6 | PTA5/SS1 — Port A bit 5 / SPI1 slave select |
| Pin 7 | PTA6 — Port A bit 6 |
| Pin 8 | PTA7 — Port A bit 7 |
| Pin 9 | VREFH — ADC high reference voltage |
| Pin 10 | VREFL — ADC low reference voltage |
| Pin 11 | VDD — Digital supply voltage |
| Pin 12 | VSS — Digital ground |
| Pin 13 | PTB0/AD0 — Port B bit 0 / ADC channel 0 |
| Pin 14 | PTB1/AD1 — Port B bit 1 / ADC channel 1 |
| Pin 15 | PTB2/AD2 — Port B bit 2 / ADC channel 2 |
| Pin 16 | PTB3/AD3 — Port B bit 3 / ADC channel 3 |
| Pin 17 | PTB4/AD4 — Port B bit 4 / ADC channel 4 |
| Pin 18 | PTB5/AD5 — Port B bit 5 / ADC channel 5 |
| Pin 19 | PTB6/AD6 — Port B bit 6 / ADC channel 6 |
| Pin 20 | PTB7/AD7 — Port B bit 7 / ADC channel 7 |
| Pin 21 | PTC0/AD8 — Port C bit 0 / ADC channel 8 |
| Pin 22 | PTC1/AD9 — Port C bit 1 / ADC channel 9 |
| Pin 23 | PTC2/AD10 — Port C bit 2 / ADC channel 10 |
| Pin 24 | PTC3/AD11 — Port C bit 3 / ADC channel 11 |
| Pin 25 | PTC4/AD12 — Port C bit 4 / ADC channel 12 |
| Pin 26 | PTC5/AD13 — Port C bit 5 / ADC channel 13 |
| Pin 27 | PTC6/AD14 — Port C bit 6 / ADC channel 14 |
| Pin 28 | PTC7/AD15 — Port C bit 7 / ADC channel 15 |
| Pin 29 | CANTX — MSCAN transmit output |
| Pin 30 | CANRX — MSCAN receive input |
| Pin 31 | LIN_TX — LIN transmit output |
| Pin 32 | LIN_RX — LIN receive input |
| Pin 33 | BKGD/MS — Background debug / mode select |
| Pin 34 | RESET — External reset input (active low) |
| Pin 35 | XTAL1 — External crystal oscillator input |
| Pin 36 | XTAL2 — External crystal oscillator output |
| Pin 37 | TEST — Test mode pin (tie to VSS) |
| Pin 38 | PTD0 — Port D bit 0 |
| Pin 39 | PTD1 — Port D bit 1 |
| Pin 40 | PTD2 — Port D bit 2 |
| Pin 41 | PTD3 — Port D bit 3 |
| Pin 42 | PTE0 — Port E bit 0 |
| Pin 43 | PTE1 — Port E bit 1 |
| Pin 44 | PTE2 — Port E bit 2 |
| Pin 45 | PTE3 — Port E bit 3 |
| Pin 46 | LCD_P0 — LCD segment/common pin 0 |
| Pin 47 | LCD_P1 — LCD segment/common pin 1 |
| Pin 48 | VDDA/VREF — Analog supply and reference |
Typical Applications
MC9S08DZ60ACLF is suitable for 6 applications: Automotive Body Control Module (BCM), Instrument Cluster with LCD Display, HVAC Control Panel Node, Industrial CAN Sensor Transmitter, Automotive LIN Slave Node, Low-Cost CAN-Controlled Motor Drive.
Automotive Body Control Module (BCM)
The MC9S08DZ60ACLF fits automotive BCM nodes because it combines an integrated CAN 2.0 A/B controller, a LIN 2.0 master, and 60 KB of Flash on a single die. With 24 ADC channels, the MCU reads multiple switch, sensor, and potentiometer inputs for door, lighting, and wiper control without external ADC ICs. The on-chip EEPROM emulation handles non-volatile configuration and learned-driver settings across power cycles. Industrial-grade temperature and the 48-LQFP footprint survive the under-dash thermal environment while keeping BOM cost low.
Recommended
Instrument Cluster with LCD Display
The MC9S08DZ60ACLF's on-chip segment LCD driver eliminates the need for an external LCD controller in two- and four-wheel instrument clusters. Drive odometer, gear, and tell-tale segments directly from the MCU while dedicating the 40 MHz HCS08 core to CAN/LIN communication and pulse counting from the vehicle speed sensor. The 60 KB Flash holds the full display driver plus diagnostic stack, and 4 KB RAM is enough for runtime frame buffers. Wide 2.7-5.5 V supply supports both 5 V and 3.3 V cluster designs.
Recommended
HVAC Control Panel Node
HVAC head units and rear-zone climate controllers leverage the MC9S08DZ60ACLF's LIN master to talk to multiple blower, stepper, and flap actuator slaves while the CAN interface links to the rest of the vehicle network. The HCS08 core runs the user-interface state machine and PWM channels drive LED backlight dimming and fan speed control. The on-chip LCD driver supports climate-control text displays without an external controller. AEC-Q100-compatible Q-1 suffix variants qualify this architecture for under-dash automotive deployments.
Recommended
Industrial CAN Sensor Transmitter
Use the MC9S08DZ60ACLF as the brain of an industrial 4-20 mA bridge or CAN-based sensor node. The 24-channel 12-bit ADC with 2.5 us conversion time digitizes strain-gauge, thermocouple, or pressure-sensor inputs directly. The MSCAN controller reports the conditioned measurement to a higher-level controller at 125 kbps to 1 Mbps. Flash protection with a programmable back-door key prevents reverse engineering of the calibration constants, which is critical for OEM sensor designs.
Recommended
Automotive LIN Slave Node
The MC9S08DZ60ACLF's LIN 2.0 master capability allows it to act as a LIN cluster controller, interfacing to seats, mirrors, window lifts, or roof modules. With 60 KB Flash, the MCU holds the full LIN Node Configuration Language interpreter plus OEM diagnostic extensions. Use SCI/SPI as a side-channel for firmware updates through the gateway ECU. The 48-LQFP package's 7x7 mm outline fits inside small in-motor or in-door housings.
Recommended
Low-Cost CAN-Controlled Motor Drive
Small fractional-HP automotive motors (fuel pumps, water pumps, auxiliary fans) use the MC9S08DZ60ACLF as a CAN-commanded motor controller. The PWM channels generate complementary drive signals for an external H-bridge or three-phase FET inverter, while the ADC monitors back-EMF and current. Hardware over-current shut-down is implemented by routing a comparator output to the timer's fault input. The 40 MHz HCS08 core closes the speed loop faster than typical 16-bit competitors in this class.
Recommended
Recommended Products Summary
Engineering reference data for MC9S08DZ60ACLF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC9S08DZ60CLF | MC9S08DZ60AMLF | S9S08DZ60F1MLF | MC9S08DV60AMLF | MC9S08DZ48ACLF | MC9S08DV60AMLH |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 48-LQFP (7x7) | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same | 48-LQFP (7x7) - same |
| Flash | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB | 48 KB | 60 KB |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| Core Frequency | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Temperature Grade | Industrial -40C to +85C | Commercial 0C to +70C | Extended -40C to +125C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Extended -40C to +125C |
| CAN Controller | Yes (MSCAN) | Yes | Yes | Yes | Yes | Yes | Yes |
| LIN Master | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| LCD Driver | Yes | Yes | Yes | Yes | No (DV family) | Yes | No (DV family) |
| S08 Sub-Family | DZ (LCD+LIN) | DZ | DZ | DZ (secure) | DV (extra PWM) | DZ | DV (extra PWM) |
Key Differentiators
- On-chip segment LCD driver eliminates external LCD controller (vs MC9S08DV60AMLF)
- Industrial-grade 'A' suffix covers -40C to +85C (vs MC9S08DZ60CLF)
- Open Flash architecture vs locked S9S08 security image (vs S9S08DZ60F1MLF)
Design Notes
Decoupling: place 100 nF X7R ceramic capacitors within 3 mm of every VDD/VSS pin pair, plus a single 10 uF bulk capacitor on the main supply rail. The on-chip analog blocks (ADC bandgap, LCD charge pump) draw current transients during conversion - insufficient decoupling is the most common cause of ADC noise and LCD ghosting. For 5 V designs, route VDD through a ferrite bead to reduce switching noise from the bus transceivers.
Layout: keep the crystal and its load capacitors within 5 mm of the XTAL1/XTAL2 pins and guard the area with a ground ring. Avoid routing CAN_H/CAN_L traces near noisy PWM or LCD segments. The 48-LQFP ground paddle is not present on this package, so provide a solid ground pour on the top layer with stitching vias to the inner ground plane. Place the BKGD/MS pin on a dedicated test pad accessible from outside the enclosure for in-circuit debug.
Watch for: (1) the 'A' suffix denotes industrial temperature only - if your design sees -40C to +125C, use the 'M' or 'Q-1' suffix variants; (2) Flash security, once enabled, locks out debug unless the correct back-door key is presented - keep a copy of the key in your project archive; (3) part is NRND per NXP - qualify a successor before committing to multi-year production. Use the BGND instruction through the BKGD/MS pin rather than legacy HC08 MONITOR mode for fastest bring-up.
CAN bus: terminate both ends of the trunk with 120 ohm resistors (5 percent tolerance is acceptable), and keep stubs shorter than 1/10 of the bit time. Use a twisted pair for CAN_H/CAN_L and route them symmetrically. For LIN, the master pull-up resistor (typically 1 kohm to VBAT) and the slave termination form an RC network that limits slew rate - choose values per the LIN 2.0 specification, not generic 12 V transceiver guidelines.
Compliance Information
Standard AC suffix is industrial grade - AEC-Q100 qualified parts use the Q-1 suffix (e.g. MC9S08DZ60ACLFR2). RoHS and lead-free per NXP product page.