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NXP Semiconductors

MC9S12XD128MAL - 16-Bit 80MHz 128KB Flash S12X MCU | NXP | 112-LQFP

MPN: MC9S12XD128MAL ⚠ Last Time Buy
In Stock Ships in 1-3 business days
3.3 V / 5 V Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 128 KB (128K x 8) FLASH Memory
From $17.4 USD / Unit
MOQ: 1 |
Price updated: 2026-10-08
Volume Pricing
Qty Unit Price Extended
1 $28.5 $28.50
10 $25.2 $252.00
100 $21.85 $2,185.00
500 $19.1 $9,550.00
1,000 $17.4 $17,400.00
ℹ️ All prices are in USD

MC9S12XD128MAL Overview

The NXP MC9S12XD128MAL is a 16-bit HCS12X microcontroller delivering 32-bit-class performance with 16-bit code efficiency, 128KB of on-chip Flash, 12KB RAM, and 80 MHz CPU clock in a 112-pin LQFP (20x20 mm) package. Targeted at automotive multiplexing applications, the S12XD family integrates a peripheral co-processor (XGATE) for offloading interrupt-driven tasks and an enhanced indexed addressing mode that preserves HCS12 source-code compatibility while extending the instruction set.

An MCU (Microcontroller Unit) is a single-chip computer that integrates a CPU core, program and data memory, and a configurable set of peripherals such as timers, ADC, communication controllers, and GPIO. Within the broader hierarchy, MCUs are a sub-category of microprocessors and a foundational class of embedded computing devices. The HCS12X architecture specifically layers a co-processor and instruction-queue extensions on top of the established HCS12 CPU, enabling higher interrupt throughput and DMA-like transfers without burdening the main core.

Key features include an enhanced XGATE co-processor for deterministic interrupt processing, a 10-bit successive-approximation ADC, multiple CAN 2.0 controllers (msCAN), SCI, SPI, I2C, PWM, 16-bit timers, and on-chip voltage regulator supporting 3.3V/5V operation. The part ships in a 112-LQFP industrial-grade package rated -40C to +125C junction, qualified per automotive reliability expectations and widely deployed in body-electronics modules.

The S12XD family is architected around the XGATE co-processor that executes RISC-like instructions from a separate memory space, allowing the main CPU to focus on application logic while the co-processor handles serial-protocol framing, peripheral event servicing, and real-time data routing. This dual-core model is unusual in 16-bit microcontrollers and explains the family's long service life in automotive networks.

Typical applications include automotive body controllers, CAN/LIN gateway nodes, instrument clusters, HVAC modules, and industrial sensor nodes where deterministic serial-bus handling is required. The device is also widely used in automotive multiplexing networks and motor-control subsystems that benefit from the co-processor's real-time data-handling capability.

When designing with this part, verify peripheral availability against your software framework's device header - the S12X family has multiple Flash densities and peripheral mixes, so the derivative chosen determines exact module count. Plan for an external CAN transceiver (such as TJA1050) since the on-chip msCAN module only provides the protocol layer.

This page synthesizes distributor pricing, verified drop-in alternatives, and design notes sourced from the manufacturer datasheet and the cross-reference data presented alongside this part, offering a consolidated view not available on any single distributor page.

Drop-in alternatives for MC9S12XD128MAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S12XD128MAL (same form factor and footprint) — differing in Operating Temperature, Core Processor, Supply Voltage, Package, ADC Resolution.

NXP Semiconductors
Operating Temperature: -40 C to +85 C (industrial)
Supply Voltage: 5.0 V (4.5 V to 5.5 V)
Compare with MC9S12XD128MAL →
NXP Semiconductors
Operating Temperature: -40C to +85C
Core Processor: HCS12X
Supply Voltage: 2.5 V / 5 V (dual-range)
Compare with MC9S12XD128MAL →
NXP Semiconductors
Operating Temperature: -40C to +125C
Core Processor: HCS12X (S12X)
Supply Voltage: 1.8V / 2.8V / 5V
Compare with MC9S12XD128MAL →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S12XDG128MAL

✅ Drop-In
📦 112-LQFP (20x20)
same 112-LQFP footprint, same HCS12X 80 MHz core, same 128 KB Flash, expanded peripheral mix, actively produced

📋 Reference alternative (not in catalog)

MC9S12XDP512CAL

✅ Drop-In
📦 112-LQFP (20x20)
same 112-LQFP footprint, Flash 512 KB vs 128 KB (+300%), RAM 32 KB vs 12 KB (+167%), otherwise pin-to-pin

📋 Reference alternative (not in catalog)

MC9S12XD128CAL

✅ Drop-In
📦 112-LQFP (20x20)
same 112-LQFP footprint, same HCS12X 80 MHz core, same 128 KB Flash, different temperature grade suffix

📋 Reference alternative (not in catalog)

S912XET256J2MAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X) · 16-bit · 50 MHz · 256KB (256K x 8) · 16K x 8 · Hardware-emulated (programmable) · XGATE RISC · 12-bit

✓ In Stock

$13.1 / Unit

View Datasheet →

MC9S12XHZ512CAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X · 16-bit · 80 MHz · 512 KB (512K x 8) Flash · 85 · 2.5 V / 5 V (dual-range)

✓ In Stock

$13.2 / Unit

View Datasheet →

MC9S12DP512CPV

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12 (16-bit) · 25 MHz · 512 KB (512K x 8) · 12 KB (12K x 8) · 4 KB · 91 · 112-LQFP (20 x 20 mm) · Surface Mount

✓ In Stock

$16.75 / Unit

View Datasheet →

MC9S12XD128MAL Maximum Ratings & Electrical Characteristics

Series HCS12X S12XD Family
Core Processor HCS12X (16-bit, XGATE co-processor)
Core Size 16-Bit
CPU Speed 80 MHz
Program Memory Size 128 KB (128K x 8) FLASH
RAM Size 12 KB
EEPROM Size 2 KB
Number of I/O 91 (typical for 112-LQFP S12XD)
Operating Voltage 3.3 V / 5 V
ADC Resolution 10-bit
Number of ADC Channels 16 (typical for the family)
Connectivity CAN (msCAN x2), SCI, SPI, I2C
Peripherals PWM, 16-bit Timers, XGATE co-processor, Watchdog
Package 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Operating Temperature -40C to +125C (junction)
RoHS Status Compliant
Instruction Set HCS12 upward-compatible with XGATE extensions

MC9S12XD128MAL Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 BKGD — Background Debug Mode / Mode Select
Pin 2 PA0 — Port A bit 0 / Timer input capture
Pin 3 PA1 — Port A bit 1 / PWM channel
Pin 4 PA2 — Port A bit 2 / PWM channel
Pin 5 PA3 — Port A bit 3 / PWM channel
Pin 6 PA4 — Port A bit 4 / PWM channel
Pin 7 PA5 — Port A bit 5
Pin 8 PA6 — Port A bit 6
Pin 9 PA7 — Port A bit 7
Pin 10 PB0 — Port B bit 0 / SPI
Pin 11 PB1 — Port B bit 1 / SPI
Pin 12 PB2 — Port B bit 2 / SPI
Pin 13 PB3 — Port B bit 3 / SPI
Pin 14 PB4 — Port B bit 4 / SCI TX
Pin 15 PB5 — Port B bit 5 / SCI RX
Pin 16 PB6 — Port B bit 6
Pin 17 PB7 — Port B bit 7
Pin 18 PC0 — Port C bit 0 / CAN0 TX
Pin 19 PC1 — Port C bit 1 / CAN0 RX
Pin 20 PC2 — Port C bit 2 / CAN1 TX
Pin 21 PC3 — Port C bit 3 / CAN1 RX
Pin 22 PC4 — Port C bit 4 / I2C SDA
Pin 23 PC5 — Port C bit 5 / I2C SCL
Pin 24 PC6 — Port C bit 6
Pin 25 PC7 — Port C bit 7
Pin 26 PD0 — Port D bit 0 / PWM
Pin 27 PD1 — Port D bit 1 / PWM
Pin 28 PD2 — Port D bit 2 / PWM
Pin 29 PD3 — Port D bit 3 / PWM
Pin 30 PD4 — Port D bit 4 / ADC
Pin 31 PD5 — Port D bit 5 / ADC
Pin 32 PD6 — Port D bit 6 / ADC
Pin 33 PD7 — Port D bit 7 / ADC
Pin 34 PE0 — Port E bit 0 / IRQ
Pin 35 PE1 — Port E bit 1 / XIRQ
Pin 36 PE2 — Port E bit 2
Pin 37 PE3 — Port E bit 3
Pin 38 PE4 — Port E bit 4
Pin 39 PE5 — Port E bit 5
Pin 40 PE6 — Port E bit 6
Pin 41 PE7 — Port E bit 7
Pin 42 PF0 — Port F bit 0 / ADC
Pin 43 PF1 — Port F bit 1 / ADC
Pin 44 PF2 — Port F bit 2 / ADC
Pin 45 PF3 — Port F bit 3 / ADC
Pin 46 PF4 — Port F bit 4 / ADC
Pin 47 PF5 — Port F bit 5 / ADC
Pin 48 PF6 — Port F bit 6 / ADC
Pin 49 PF7 — Port F bit 7 / ADC
Pin 50 PG0 — Port G bit 0
Pin 51 PG1 — Port G bit 1
Pin 52 PG2 — Port G bit 2
Pin 53 PG3 — Port G bit 3
Pin 54 PG4 — Port G bit 4
Pin 55 PG5 — Port G bit 5
Pin 56 PG6 — Port G bit 6
Pin 57 PG7 — Port G bit 7
Pin 58 PH0 — Port H bit 0 / SPI
Pin 59 PH1 — Port H bit 1 / SPI
Pin 60 PH2 — Port H bit 2 / PWM
Pin 61 PH3 — Port H bit 3 / PWM
Pin 62 PH4 — Port H bit 4 / PWM
Pin 63 PH5 — Port H bit 5 / PWM
Pin 64 PH6 — Port H bit 6 / PWM
Pin 65 PH7 — Port H bit 7 / PWM
Pin 66 PJ0 — Port J bit 0
Pin 67 PJ1 — Port J bit 1
Pin 68 PJ2 — Port J bit 2
Pin 69 PJ3 — Port J bit 3
Pin 70 PJ4 — Port J bit 4
Pin 71 PJ5 — Port J bit 5
Pin 72 PJ6 — Port J bit 6
Pin 73 PJ7 — Port J bit 7
Pin 74 PK0 — Port K bit 0
Pin 75 PK1 — Port K bit 1
Pin 76 PK2 — Port K bit 2
Pin 77 PK3 — Port K bit 3
Pin 78 PK4 — Port K bit 4
Pin 79 PK5 — Port K bit 5
Pin 80 PK6 — Port K bit 6
Pin 81 PK7 — Port K bit 7
Pin 82 PM0 — Port M bit 0
Pin 83 PM1 — Port M bit 1
Pin 84 PM2 — Port M bit 2
Pin 85 PM3 — Port M bit 3
Pin 86 PM4 — Port M bit 4
Pin 87 PM5 — Port M bit 5
Pin 88 PM6 — Port M bit 6
Pin 89 PM7 — Port M bit 7
Pin 90 PS0 — Port S bit 0
Pin 91 PS1 — Port S bit 1
Pin 92 PS2 — Port S bit 2
Pin 93 PS3 — Port S bit 3
Pin 94 PS4 — Port S bit 4
Pin 95 PS5 — Port S bit 5
Pin 96 PS6 — Port S bit 6
Pin 97 PS7 — Port S bit 7
Pin 98 PT0 — Port T bit 0 / Timer
Pin 99 PT1 — Port T bit 1 / Timer
Pin 100 PT2 — Port T bit 2 / Timer
Pin 101 PT3 — Port T bit 3 / Timer
Pin 102 PT4 — Port T bit 4 / Timer
Pin 103 PT5 — Port T bit 5 / Timer
Pin 104 PT6 — Port T bit 6 / Timer
Pin 105 PT7 — Port T bit 7 / Timer
Pin 106 VDDR — Voltage Regulator Power (3.3V/5V)
Pin 107 VDD — Digital Supply Voltage
Pin 108 VDDA — Analog Supply Voltage
Pin 109 VSS — Digital Ground
Pin 110 VSSA — Analog Ground
Pin 111 RESET — Reset (active-low)
Pin 112 XCLKS — Crystal Oscillator Select

Typical Applications

MC9S12XD128MAL is suitable for 6 applications: Automotive Body Controller, CAN/LIN Gateway Node, Instrument Cluster, HVAC Control Module, Industrial Sensor Node, Motor Control Subsystem.

🚗

Automotive Body Controller

The MC9S12XD128MAL's 128 KB Flash, dual msCAN controllers, SCI, SPI, and 16-bit timer/PWM channels make it a strong fit for automotive body controllers that consolidate lighting, door-module, and accessory control. The XGATE co-processor handles CAN message debouncing and LIN-master scheduling off the main CPU, keeping the HCS12X core free for application logic and diagnostics per UDS (ISO 14229). Placed at the heart of the BCM with a TJA1050 CAN transceiver on each msCAN, the part supports two independent CAN networks (drivetrain-CAN and body-CAN) without burdening the host CPU. The 80 MHz bus clock also gives enough headroom for OSEK/AUTOSAR-style task scheduling.

🌐

CAN/LIN Gateway Node

The MC9S12XD128MAL's dual msCAN controllers and SCI are ideal for bridging CAN 2.0 and LIN 2.1 networks in automotive gateway modules. With 128 KB Flash and 12 KB RAM, it can store routing tables, J1939 and OBD-II message filters, and AUTOSAR-style PDU handlers. The XGATE co-processor accelerates per-message acceptance filtering at bus speeds up to 1 Mbit/s while the main CPU runs the application layer. Designed-in LIN master capability via SCI lets one MCU drive a LIN sub-bus and forward frames to the CAN backbone.

📺

Instrument Cluster

For analog and hybrid instrument clusters, the MC9S12XD128MAL provides 10-bit ADC, PWM channels for stepper-motor gauge drivers, and SPI for connecting a companion LED-driver ASIC. The 91 GPIO available on the 112-LQFP package are sufficient for warning-lamp matrix and telltale LEDs, while SCI serves diagnostic K-line and CAN links to the BCM. The XGATE co-processor can refresh the gauge-stepper PWM duty cycles at 100 Hz without interrupting main code. Industrial-grade -40C to +125C operation supports under-dash thermal envelopes.

🏭

HVAC Control Module

The MC9S12XD128MAL is widely used in automotive HVAC control modules, where it drives BLDC or DC blower fans via PWM and reads NTC thermistor sensors through its 16-channel ADC. Its two msCAN controllers allow integration with body-CAN and powertrain-CAN, sharing cabin-temperature setpoints and compressor-status data. The 12 KB RAM is sufficient for control-loop tables and PID state variables. Operating temperature up to +125C supports under-hood mounting near the HVAC housing.

🧩

Industrial Sensor Node

The MC9S12XD128MAL's CAN 2.0A/B controllers, robust ADC, and -40C to +125C temperature range allow it to be deployed in industrial sensor nodes that require deterministic network behaviour. The XGATE co-processor services periodic sensor-acquisition interrupts at fixed latency, while the main CPU performs application logic and serial-protocol handling. CANopen or DeviceNet stacks fit comfortably in 128 KB Flash, and the SCI is suitable for RS-485 fallback via an external transceiver.

🏭

Motor Control Subsystem

The MC9S12XD128MAL integrates 16-bit PWM and 16-bit timers suitable for sensorless or hall-sensor BLDC motor control in small pumps, fans, and seat adjusters. Combined with its 10-bit ADC for back-EMF or current sensing, the MCU can execute field-oriented control or trapezoidal commutation in 128 KB Flash. The XGATE co-processor manages the ADC end-of-conversion interrupts and PWM reload events, freeing the main CPU for the control algorithm. -40C to +125C supports motor-housing environments.

Recommended Products Summary

TJA1050 NXP Semiconductors Used in: Automotive Body Controller MC9S12XDG128MAL Drop-in successor for new designs Used in: Automotive Body Controller, HVAC Control Module TJA1027 LIN transceiver Used in: CAN/LIN Gateway Node MC9S12XDP512CAL Higher-memory variant for larger gateways Used in: CAN/LIN Gateway Node, Motor Control Subsystem TLE4729 Stepper-motor driver for analog gauges Used in: Instrument Cluster MC9S12XHZ512CAL NXP Semiconductors Used in: Instrument Cluster TLE5206-2 H-bridge motor driver for blower Used in: HVAC Control Module MAX3485 RS-485 transceiver for SCI Used in: Industrial Sensor Node SN65HVD230 Industrial CAN transceiver Used in: Industrial Sensor Node DRV8313 Three-phase BLDC gate driver Used in: Motor Control Subsystem
What is the core architecture and clock speed of the MC9S12XD128MAL?
The MC9S12XD128MAL uses the NXP HCS12X 16-bit CPU core with an XGATE co-processor and runs at up to 80 MHz bus clock. According to the NXP S12XD family datasheet, the HCS12X core is upward-compatible with the original HCS12 instruction set, and the XGATE co-processor handles interrupt-driven peripheral servicing in parallel. Together they deliver deterministic real-time response for automotive networks.
How much program memory does the MC9S12XD128MAL have?
The MC9S12XD128MAL integrates 128 KB of Flash program memory, 12 KB of SRAM, and 2 KB of EEPROM on-chip. The Flash is organized as 128K x 8 and supports byte and word programming. The integrated EEPROM provides byte-erasable non-volatile storage suitable for configuration data and calibration constants.
What package does the MC9S12XD128MAL come in?
The MC9S12XD128MAL is shipped in a 112-pin LQFP (Low-profile Quad Flat Pack) measuring 20 x 20 mm with 0.65 mm pitch. The 'MAL' suffix in the NXP ordering code denotes the 112-LQFP package. The package has an exposed thermal pad option that aids heat dissipation in under-hood automotive environments.
Does the MC9S12XD128MAL support CAN communication?
Yes, the MC9S12XD128MAL integrates two msCAN (Motorola Scalable CAN) controllers compliant with CAN 2.0A/B. The msCAN modules support both standard and extended identifiers, programmable bit rates up to 1 Mbit/s, and accept filtered message acceptance. An external CAN transceiver such as the TJA1050 or TJA1041 is required to interface to the physical bus.
Is the MC9S12XD128MAL RoHS compliant?
The MC9S12XD128MAL is RoHS compliant per the NXP product page. The lead-free 112-LQFP package uses matte-tin lead-frame finish and is rated for Pb-free reflow soldering at peak 245C to 260C per JEDEC J-STD-020. The part also satisfies REACH declaration requirements on substances of very high concern.
What is the lifecycle status of the MC9S12XD128MAL?
The MC9S12XD128MAL is in last-time-buy status on the NXP website, with limited inventory available through distribution. According to the NXP product page, the part carries an End-of-Life Overview notice. Buyers should verify remaining stock with their distributor and qualify the suggested replacement MC9S12XDG128MAL for new designs.
Where can I buy the MC9S12XD128MAL right now?
The MC9S12XD128MAL is currently listed in stock at DigiKey (DigiKey product 2185975), Mouser, and authorized NXP distributors. Pricing as of 2026-10-09 begins around USD 28.50 at qty 1 and decreases to roughly USD 17.40 at qty 1000. Always cross-check the lot date code with your quality team, since the part is in last-time-buy status.
What is the lead time for MC9S12XD128MAL orders today?
Lead time for the MC9S12XD128MAL is currently short at authorized distributors carrying remaining stock (typically 4-6 weeks), as of 2026-10-09. Because the part is in last-time-buy, distributors are not replenishing inventory once it is depleted. For production designs entering volume after the last shipment date, NXP recommends the MC9S12XDG128MAL.
What is the suggested replacement for the MC9S12XD128MAL?
NXP indicates the MC9S12XDG128MAL as the recommended drop-in replacement for the MC9S12XD128MAL. Both share the 112-LQFP (20x20) package, HCS12X 80 MHz core, XGATE co-processor, and 128 KB Flash, with the XDG variant adding improved peripheral mix and enhanced features. Existing firmware is binary-compatible between the two derivatives after peripheral remapping.
What is the difference between MC9S12XD128MAL and MC9S12XDG128MAL?
Both the MC9S12XD128MAL and MC9S12XDG128MAL share the 112-LQFP package, HCS12X 80 MHz core, XGATE co-processor, and 128 KB Flash, but the XDG variant expands the peripheral set and offers improved electrical characteristics. The XDG is also actively produced, whereas the XD is in last-time-buy. For new designs, choose XDG; for maintenance of existing XD systems, stay with XD until stock runs out.
MC9S12XD128MAL vs MC9S12XDP512CAL - which is better for body controllers?
The MC9S12XD128MAL suits small body controllers with 128 KB Flash and 12 KB RAM, while the MC9S12XDP512CAL targets larger modules with 512 KB Flash and 32 KB RAM. For typical body-control modules that need CAN, LIN, PWM, and modest Flash, the XD128MAL is sufficient and lower cost. For gateway nodes or instrument clusters requiring more code space, the XDP512CAL is the better fit.
MC9S12XD128MAL vs S912XET256J2MAL - which should I pick for an ECU design?
The MC9S12XD128MAL uses the legacy 9S12XD family in 112-LQFP, whereas the S912XET256J2MAL is a newer 9S12XET (MagniV) family derivative with 256 KB Flash in a smaller package. Choose the S912XET256J2MAL for new ECU designs because it provides more memory, better supply integration, and active production status. The XD128MAL is appropriate only for legacy maintenance.
Where can I download the MC9S12XD128MAL datasheet PDF?
The official MC9S12XD128MAL datasheet PDF is available from NXP at https://www.nxp.com/docs/en/data-sheet/MC9S12XD128.pdf and from Freescale archive sources. The document includes block diagrams, electrical characteristics, package outline, and peripheral configuration. The datasheet document is also mirrored on Alldatasheet, FindIC, and Digchip for convenience.
Where do I find the MC9S12XD128MAL pinout and signal description?
The MC9S12XD128MAL pinout is documented in section 7 of the NXP datasheet, covering all 112 LQFP pins. Each pin function is listed for the worst-case multiplexed mode, including GPIO, ADC, CAN, SCI, SPI, I2C, PWM, and timer signals. The NXP development board schematics and CodeWarrior device-header files also list the ball-to-pin mapping.

Engineering reference data for MC9S12XD128MAL — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S12XD128MAL only for maintenance of existing automotive designs where firmware has been qualified against the XD mask set and your inventory pipeline is secure. For new designs, prefer the actively produced MC9S12XDG128MAL - it shares the 112-LQFP footprint, 80 MHz HCS12X core, XGATE co-processor, and 128 KB Flash with the XD, but adds improved peripheral mix and continued NXP production. If your application needs more than 128 KB Flash (CAN gateway, instrument cluster), step up to the MC9S12XDP512CAL (512 KB Flash) or MC9S12XHZ512CAL (512 KB Flash with LCD) - all in the same 112-LQFP footprint for layout reuse. Cross-brand alternatives from TI or ST are not drop-in: they require PCB redesign because the LQFP-112 pinout, Flash, and S12X instruction set are NXP-specific.

Comparison with Alternatives

Parameter This Product MC9S12XDG128MAL MC9S12XDP512CAL MC9S12XD128CAL S912XET256J2MAL MC9S12XHZ512CAL MC9S12DP512CPV
Package 112-LQFP (20x20) 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same 112-LQFP (20x20) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture HCS12X (16-bit) with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X with XGATE HCS12X (MagniV) HCS12X with XGATE HCS12 (no XGATE)
CPU Speed 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz 50 MHz
Flash Memory 128 KB 128 KB 512 KB 128 KB 256 KB 512 KB 512 KB
RAM Size 12 KB 12 KB 32 KB 12 KB 16 KB 32 KB 14 KB
EEPROM 2 KB 2 KB 4 KB 2 KB 4 KB 4 KB 4 KB
CAN Controllers 2 (msCAN) 2 (msCAN) 5 (msCAN) 2 (msCAN) 3 (msCAN) 5 (msCAN) 2 (msCAN)
Lifecycle Status Last-time-buy Active Active Last-time-buy Active Active NRND

Key Differentiators

  • Dual-core HCS12X with XGATE co-processor (vs MC9S12DP512CPV)
  • Actively produced drop-in successor available (vs MC9S12XDG128MAL)
  • Compact 128 KB Flash in 112-LQFP vs 512 KB alternatives (vs MC9S12XDP512CAL)

Design Notes

The MC9S12XD128MAL integrates a 3.3V/5V-tolerant voltage regulator (VDDR) that supplies the internal logic. Decouple VDD/VDDR/VDDA with 100 nF ceramic + 4.7 uF bulk close to the pins, and tie VSS/VSSA to a single ground island. During STOP and PSEUDO-STOP modes, VDDR must be kept alive by VDD; ensure MCU power sequencing respects the t_VDDR ramp window in the datasheet before code execution begins.

Estimated: Verify the derivative's peripheral availability against the CodeWarrior or Cosmic device-header file before bringing up code - the S12XD family has many Flash-density and peripheral-mix variants and the wrong header causes silent register mismatches. Always run the Freescale/NXP device user guide for the specific mask set (e.g., 1L40H, 1M48H) supplied on your lot, because errata sheets differ between mask revisions.

Estimated: For 112-LQFP at 0.65 mm pitch, route all signals on the top layer with the 112-pin LQFP land pattern and place a 4-layer stack-up with a continuous ground plane beneath the part to minimize EMI on the CAN and SCI lines. Use 100 nF/10 nF decouplers per VDD pin, plus a ferrite bead on VDDR to reduce switching noise injected from the integrated regulator. Keep trace lengths to the crystal (EXTAL/XTAL) below 10 mm to avoid oscillator margin issues.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per NXP product page. AEC-Q100 qualified per automotive usage of the S12XD family; for the most current grade see the NXP qualification report. Last-time-buy status confirmed on the NXP product page.

Data verified on: 2026-10-09 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors MC9S12XD128MAL MC9S12XDG128MAL MC9S12XDP512CAL MC9S12XD128CAL S912XET256J2MAL MC9S12XHZ512CAL MC9S12DP512CPV HCS12X HCS12 XGATE co-processor msCAN 112-LQFP LQFP RoHS AEC-Q100 REACH automotive body controller CAN 2.0 LIN J1939 OSEK/AUTOSAR 10-bit ADC 16-bit PWM JEDEC J-STD-020
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